CN219800720U

CN219800720U - Luminous keyboard, backlight module and luminous lamp panel

Info

Publication number: CN219800720U
Application number: CN202320678602.7U
Authority: CN
Inventors: 黃恒儀; 何信政
Original assignee: Huaian Darfon Electronics Co ltd; Darfon Electronics Corp
Current assignee: Huaian Darfon Electronics Co ltd; Darfon Electronics Corp
Priority date: 2022-04-08
Filing date: 2023-03-31
Publication date: 2023-10-03
Anticipated expiration: 2033-03-31
Also published as: CN117727587A; CN117727588A; CN116895485A; CN220208801U; CN220041672U

Abstract

The utility model provides a luminous keyboard, a backlight module and a luminous lamp panel, wherein the backlight module comprises a luminous unit, a light guide plate and the lamp panel; the light guide plate is provided with a light guide plate hole for accommodating the light-emitting unit; the lamp panel is provided with a pair of bonding pads which are respectively connected with the light-emitting units, and comprises a first reflecting layer which surrounds the light-emitting units and at least partially covers the bonding pads; each of the pair of bonding pads is provided with a plurality of branch wires and at least one hollow area, and the at least one hollow area is overlapped with at least one part of the light-emitting unit. The utility model can realize the high homogenization of the luminous brightness in the range of a single key and a whole keyboard.

Description

Luminous keyboard, backlight module and luminous lamp panel

Technical Field

The present utility model relates to a light emitting keyboard, a backlight module, and a light emitting lamp panel, and more particularly to a light emitting keyboard, a backlight module, and a light emitting lamp panel capable of improving the uniformity of overall light emission.

Background

Along with the development of technology, the design of keyboards is becoming more and more diversified. When a user selects a keyboard, the keyboard should have basic input functions, and the visual effect of the keyboard is also valued by the user. Currently, a luminous keyboard is proposed in the market, and the luminous keyboard can be used at night or in places with insufficient light besides generating visual attraction to users. The prior art light emitting keyboard uses low brightness light emitting diodes to illuminate each square key, and thus, the following problems occur: 1) The main symbol above the light emitting diode is too bright, while the corner symbol of the key cap is too dark; 2) The brightness of the peripheral light of the keycap is inconsistent; 3) The overall lighting of a single key and multiple keys is inconsistent.

Disclosure of Invention

The utility model provides a luminous keyboard, a backlight module and a luminous lamp panel which can improve the consistency of overall luminescence so as to solve the technical problems.

In order to achieve the above objective, the present utility model provides a backlight module for illuminating at least one key cap, the backlight module comprising a light emitting unit, a light guide plate and a lamp plate; the light guide plate is provided with a light guide plate hole for accommodating the light-emitting unit; the lamp panel is provided with a pair of bonding pads which are respectively connected with the light-emitting units, and comprises a first reflecting layer which surrounds the light-emitting units and at least partially covers the bonding pads; each bonding pad of the pair of bonding pads is respectively provided with a plurality of branch wires and at least one hollow area, and the at least one hollow area is overlapped with at least one part of the light-emitting unit.

As an optional technical solution, the first reflective layer has an inner ring portion, and the inner ring portion at least partially covers the plurality of branch lines and the at least one hollow area, and the inner ring portion reflects and diffuses the light emitted by the light emitting unit.

As an optional solution, the light panel further includes a pair of microstructure areas spaced from each other, the pair of microstructure areas are located on the first reflective layer, the pair of microstructure areas jointly surround the pair of bonding pads, and the pair of microstructure areas reflect and diffuse the light transmitted by the light emitting unit through the light guide plate.

As an optional technical solution, the lamp panel further includes a pair of microstructure areas and two wires spaced apart from each other, the pair of microstructure areas are located on the first reflective layer, the two wires are electrically connected to the pair of bonding pads respectively, and the pair of microstructure areas do not overlap with the two wires.

As an alternative solution, at least one of the plurality of branch lines of each bonding pad is not completely covered by the first reflective layer to form an exposed portion, and the exposed portion reflects and diffuses the light emitted from the light emitting unit.

As an optional solution, at least a portion of the first reflective layer is located in the light guide plate hole.

As an optional technical solution, the backlight module further includes a light shielding plate, and the light shielding plate includes an internal reflection portion, where the internal reflection portion overlaps the first reflection layer.

As an alternative solution, the plurality of branch lines of each of the pair of pads form a pair of parallel flat sides, and the width of the short side of the light emitting unit is smaller than the width of the pair of flat sides.

As an alternative solution, at least one of the plurality of branch lines of each pad surrounds at least a portion of the light guide plate hole.

As an alternative solution, the first reflective layer has a reflective layer hole, and the at least one hollowed-out area of each pad of the pair of pads surrounds the reflective layer hole and/or the at least one hollowed-out area of each pad of the pair of pads overlaps the reflective layer hole.

As an alternative technical solution, the first reflective layer has a reflective layer hole, and the reflective layer hole is located between the light emitting unit and the light guide plate hole.

Alternatively, the first reflective layer has a reflective layer hole, and a portion of the first reflective layer overlapping the pair of pads is located between the reflective layer hole and the light guide plate hole.

As an alternative solution, the light emitting unit includes three dies to provide three colors of light, and the three dies are arranged with their short sides aligned in succession.

As an alternative solution, the lamp panel has two wires, the two wires are electrically connected to the pair of bonding pads, and the first reflective layer covers the two wires.

Alternatively, the lamp panel further includes a pair of microstructure areas spaced apart from each other, the pair of microstructure areas being located on the first reflective layer, and the two wires being located between the pair of microstructure areas.

As an alternative technical scheme, the lamp panel has two sub-wires, the two sub-wires are respectively electrically connected with the pair of bonding pads, and the lamp panel also has two main wires, and the two main wires are respectively electrically connected with the two sub-wires.

As an alternative solution, the lamp panel further includes a pair of outer microstructure areas spaced from each other, the pair of outer microstructure areas being located on the first reflective layer, and the pair of outer microstructure areas being located outside the two main wires respectively.

In addition, the utility model also provides a backlight module for illuminating at least one key cap, the backlight module comprises a light guide plate, a light emitting unit and a lamp panel, wherein the backlight module defines a plurality of light homogenizing areas for homogenizing light rays emitted by the light emitting unit, the light homogenizing areas comprise a first area and a second area, the first area surrounds the light emitting unit, the first area comprises an inner ring part of a first reflecting layer and a pair of bonding pads, the pair of bonding pads are positioned on the lamp panel to be connected with the light emitting unit, the inner ring part of the first reflecting layer at least partially covers the pair of bonding pads, and the inner ring part of the first reflecting layer reflects and diffuses the light rays emitted by the light emitting unit; the second region surrounds the first region, the second region comprises a pair of microstructure areas which are spaced from each other, the pair of microstructure areas are positioned on the first reflecting layer, the pair of microstructure areas jointly surround the pair of bonding pads, and the pair of microstructure areas reflect and diffuse light transmitted by the light emitting unit through the light guide plate.

In addition, the utility model also provides a luminous keyboard which comprises a plurality of keys and the backlight module. The plurality of keys are provided with key caps; the backlight module is positioned below the plurality of keys.

In addition, the utility model also provides a light-emitting lamp panel, which comprises two non-intersecting wires, a plurality of microstructure areas, a light-emitting unit and a pair of bonding pads, wherein two of the microstructure areas are separated from each other at intervals, and two of the microstructure areas are not overlapped with the two non-intersecting wires; the light emitting unit is positioned between two of the microstructure areas; the pair of bonding pads are respectively and electrically connected with the two non-intersecting wires and the light-emitting unit, each bonding pad of the pair of bonding pads is respectively provided with at least one branch line to form a pair of parallel flat edges, each bonding pad of the pair of bonding pads is respectively provided with at least one hollow area, and the light-emitting unit is overlapped with at least one part of the at least one hollow area of the pair of bonding pads.

The utility model provides a luminous keyboard, a backlight module and a luminous lamp panel, wherein a protruding structure is formed between two non-intersecting wires or a plurality of microstructure areas, and the position of the protruding structure corresponds to the position of a luminous unit, so that the light quantity of light rays emitted by the luminous unit entering a light guide plate can be increased, and the light rays are recycled or auxiliary light rays are emitted by utilizing the microstructure areas specially configured on the luminous lamp panel, so that the consistency of overall luminescence is improved. In addition, the utility model solves the problem of connection stability of the light-emitting unit and the problem of excessive concentration of light emitted by the adjacent area of the light-emitting unit. Besides ensuring that the light-emitting units can be smoothly connected when the workpiece is offset by arranging the bonding pad with the hollowed-out area, the bonding pad and the hollowed-out area are matched with the first reflecting layer to form a light homogenization design of the first area; in addition, the utility model provides different light uniformizing schemes of different blocks along the outward light path of the light-emitting unit to match each other, so that the utility model can achieve high uniformity in the range of a single key and a whole keyboard.

The following describes the embodiments of the present utility model in further detail with reference to the drawings.

Drawings

FIG. 1 is a schematic diagram of a light emitting keyboard according to an embodiment of the present utility model;

FIG. 2 is a partial top view of the illuminated keyboard of FIG. 1;

FIG. 3 is a partial exploded view of the illuminated keyboard of FIG. 1;

FIG. 4 is a partial cross-sectional view of the illuminated keyboard of FIG. 1;

FIG. 5 is a partial top view of a light emitting keyboard according to another embodiment of the present utility model;

FIG. 6 is a partial cross-sectional view of the illuminated keyboard of FIG. 5;

FIG. 7 is a partial cross-sectional view of a light emitting keyboard according to another embodiment of the present utility model;

FIG. 8 is a partial cross-sectional view of a light emitting keyboard according to another embodiment of the present utility model;

FIG. 9 is a partial cross-sectional view of a light emitting keyboard according to another embodiment of the present utility model;

FIG. 10 is another partial top view of the illuminated keyboard of FIG. 1;

FIG. 11 is another partial top view of the illuminated keyboard of FIG. 1;

FIG. 12A is a schematic top view of an end-to-end connection of (sub) conductors of a light emitting lamp panel with bonding pads and light emitting cells according to another embodiment of the present utility model;

FIG. 12B is an enlarged partial schematic view of the embodiment of FIG. 12A;

FIG. 12C is a schematic top view of the side connection of the embodiment of FIG. 12A;

Fig. 13A to 13F are schematic top views of connection structures between a (sub) wire and two pads of a light-emitting lamp panel and a light-emitting unit according to different embodiments of the present utility model;

FIG. 14A is a schematic top view of a portion of an optical structure of a backlight module in a surrounding area of a light emitting unit according to another embodiment of the utility model;

FIG. 14B is a schematic view of a portion of the backlight module of the embodiment of FIG. 14A;

FIG. 14C is a schematic top view of a portion of an optical structure of a backlight module in a surrounding area of a light emitting unit according to another embodiment of the utility model;

fig. 14D is a schematic top view of a portion of an optical structure of the backlight module according to the derivative embodiment of fig. 14A.

Detailed Description

In order to more clearly illustrate the present utility model, the present utility model will be further described with reference to preferred embodiments and the accompanying drawings. Like parts in the drawings are denoted by the same reference numerals. It is to be understood by persons skilled in the art that the following detailed description is illustrative and not restrictive, and that this utility model is not limited to the details given herein.

The backlight module adopts a low-power light-emitting unit, such as Mini LED or Micro LED, so that the power consumption can be reduced, the total heat generated by the backlight module can be reduced, the overall thickness of the backlight module can be reduced, and the further thinning of the overall light-emitting keyboard is facilitated. However, the highly limited light emitting range of Mini LEDs or Micro LEDs presents a significant challenge for both single bond and full disk range uniformity of light emission of the light emitting keyboard. The embodiment of the utility model focuses on how to achieve the aim that the light rays of the light-emitting unit enter the light guide plate in a large proportion to carry out transverse transmission, and how to effectively recycle the light rays which penetrate out of the light guide plate in the transverse transmission process into the light guide plate for reuse.

Referring to fig. 1, fig. 1 is a schematic diagram of a light emitting keyboard LKB according to an embodiment of the utility model. As shown in fig. 1, the light emitting keyboard LKB includes a backlight module BLM and a plurality of keys KS. The backlight module BLM is provided with a bottom plate SUP, and a plurality of keys KS are disposed on the bottom plate SUP. Generally, the plurality of keys KS may include a square key and a multiple key (e.g., a blank key). It should be noted that the number, size and arrangement of the keys KS may be determined according to practical applications, and are not limited to the embodiment shown in the drawings.

The backlight module BLM includes a light-emitting panel LCB, a light guide plate LGP, and a light shielding plate SS. The light guide plate LGP is disposed on the light emitting lamp plate LCB, and the light shielding plate SS is disposed on the light guide plate LGP. At least one light emitting unit (e.g., light emitting diode) on the light emitting lamp panel LCB of the backlight module BLM corresponds to each key KS on the light emitting keyboard LKB.

Referring to fig. 2 to 4, fig. 2 is a partial top view of the light emitting keyboard LKB in fig. 1, fig. 3 is a partial exploded view of the light emitting keyboard LKB in fig. 1, and fig. 4 is a partial cross-sectional view of the light emitting keyboard LKB in fig. 1. As shown in fig. 2 to 4, the light-emitting lamp panel LCB includes two non-intersecting wires LT, HT, two other non-intersecting wires STa, STb, a light-emitting unit LED, a first reflective layer RL1, and a plurality of microstructure areas MS. The light panel LCB may be a light circuit board (lighting circuit board). The light emitting unit LED is connected between the two non-intersecting wires STa, STb, and the light emitting unit LED is connected between the two non-intersecting wires LT, HT via the two non-intersecting wires STa, STb. In the present embodiment, two non-intersecting wires LT, HT are main driving lines of the light emitting unit LED, and two non-intersecting wires STa, STb are sub driving lines of the light emitting unit LED, wherein the wire LT may be a low potential wire and the wire HT may be a high potential wire. The light emitting unit LED may be a white light emitting diode or a combination of red, green and blue light emitting diodes, and may be determined according to practical applications. Generally, the two non-intersecting conductive lines LT, HT are main conductive lines with larger cross-sectional areas, and may span across the plurality of keys KS, where the two non-intersecting conductive lines LT, HT do not intersect at least in the single key KS, or in the adjacent plurality of keys KS and the larger continuous area covering the key gaps. The pair of non-intersecting wires STa, STb disposed within each single key KS are sub-wires having a smaller cross-sectional area, and although they may be positioned on the same straight line, the ends of the two non-intersecting wires STa, STb are connected to the two electrodes of the light emitting unit LED, respectively, so that the two non-intersecting wires STa, STb do not overlap.

The first reflective layer RL1 is disposed on two non-intersecting conductive lines LT, HT and the other two non-intersecting conductive lines STa, STb. A plurality of microstructure areas MS are formed on the first reflective layer RL1. In the present embodiment, the microstructure area MS may be a concave-convex structure formed on the first reflective layer RL1. For example, the light-emitting lamp panel LCB may be formed of a flexible circuit board, and a copper mesh (copper mesh) is often used to enhance the supporting strength of the circuit board. The first reflective layer RL1 may be formed by spraying reflective paint or coating reflective film on the surface of the flexible circuit board (including the copper mesh surface). The grid structure of the copper mesh can make the first reflective layer RL1 form regular pits (grid points) and lands (grid lines) with a reflective function, which can reflect light back to the light guide plate LGP; in practical applications, the copper wire region (two non-intersecting wires LT, HT and the other two non-intersecting wires STa, STb) may also be a convex linear reflective region. The copper mesh is not overlapped with the two non-intersecting wires LT, HT on the flexible circuit board in principle, and is not electrically connected to the two non-intersecting wires STa, STb, but in practical application, the copper mesh has a radio frequency interference shielding effect, so that the copper mesh may be connected to the ground (ground) of the driving circuit. However, in practical applications, not all the reflective layers are covered on the copper mesh and the circuit to produce a concave-convex reflective structure. If the first reflective layer RL1 is a separate thin film element, the thickness of the first reflective layer RL1 must be thin enough, for example, lower than the thickness of the copper foil substrate (including the copper mesh and copper wire regions that are tiled adjacent to each other), and the first reflective layer RL1 needs to have high plasticity to form the rugged microstructure in the copper mesh and copper wire regions when covering the copper foil substrate. If the first reflective layer RL1 is formed by ink coating, for example, the coating thickness, the ink consistency, the coating area control, etc. must be strictly controlled, otherwise, the hollowed-out portion of the copper foil substrate is easily filled with ink by flowing, so as to reduce the depth of the reflective microstructure and the reflective diffusion effect.

In addition, even if the circuit of the light-emitting lamp panel LCB is not a copper foil substrate, the copper circuit with higher thickness is not provided, and the copper mesh is not matched to strengthen the structural strength of the light-emitting lamp panel LCB, and the microstructure with the diffusion effect can be formed on the first reflecting layer RL 1. For example, printing a micro-dot ink on the first reflective layer RL1 to form concave/convex areas as the microstructure areas MS; alternatively, ink with larger-sized reflective particles is selected, and concave/convex areas are synchronously formed as the microstructure area MS when the first reflective layer RL1 is sprayed or printed; alternatively, if the first reflective layer RL1 is a reflective film, the surface of the reflective film selected may be a reflective surface having a concave-convex uneven surface as long as it is a reflective particle having a medium-low flatness.

In the present embodiment, in the single key KS range, the plurality of microstructure areas MS includes two inner microstructure areas IMS and two outer microstructure areas OMS, wherein the two inner microstructure areas IMS are located between the two non-intersecting wires LT, HT, and the two outer microstructure areas OMS are located outside the two non-intersecting wires LT, HT. The pattern of the two inner microstructure areas IMS may be different from the pattern of the two outer microstructure areas OMS, but is not limited thereto. The light emitting unit LED is located between the plurality of microstructure areas MS, that is to say, the light emitting unit LED is located between the two inner microstructure areas IMS and also between the two outer microstructure areas OMS.

In this embodiment, the two non-intersecting wires STa, STb divide the two internal microstructure areas IMS, so the two non-intersecting wires STa, STb are also located between the two internal microstructure areas IMS; similarly, the two non-intersecting wires LT, HT divide one outer microstructure area OMS and two inner microstructure areas IMS, respectively, so it can be said that the two non-intersecting wires LT, HT are located between one outer microstructure area OMS and two inner microstructure areas IMS, respectively. In some embodiments, the plurality of microstructure areas MS, whether the outer microstructure areas OMS or the inner microstructure areas IMS, do not overlap with the two non-intersecting wires LT, HT, nor with the two non-intersecting wires STa, STb; this is the case, for example, when the wiring of the light-emitting lamp panel LCB is copper wire-bonded to a copper mesh. If the microstructure area MS on the first reflective layer RL1 is only surface treated and not formed from the underlying copper mesh or other substrate, it is possible that the plurality of microstructure areas MS/OMS/IMS overlap with the two non-intersecting wires LT, HT or with the two non-intersecting wires STa, STb. The light guide plate LGP has a light guide plate hole L0, and the light emitting unit LED is located in the light guide plate hole L0. The top surface of the light guide plate LGP near the light guide plate hole L0 may have an adhesive surrounding the light guide plate hole L0 to adhere the light shielding plate SS, and/or the bottom surface of the light guide plate LGP near the light guide plate hole L0 may have an adhesive surrounding the light guide plate hole L0 to adhere the light emitting lamp plate LCB. In addition, the light guide plate LGP also has a plurality of micro-structural areas LMS, and the micro-structural areas LMS of the light guide plate LGP correspond to the positions of the inner holes Sc and the peripheral holes SUPH of the bottom plate SUP so as to guide the light transmitted in the light guide plate LGP to be emitted upwards. Under the orthographic projection of the peripheral holes SUPH of the bottom plate SUP, the microstructure area LMS of the light guide plate LGP may at least partially overlap with the microstructure areas MS of the first reflective layer RL1 of the light emitting lamp panel LCB, and especially may increase the light emitting effect of the through holes Sc and the peripheral holes SUPH, and improve the brightness of the corner symbol (the external light transmitting area KC 1) of the key cap KCC. The inner microstructure area IMS of the first reflective layer RL1 of the light-emitting lamp panel LCB, which is close to the light-emitting unit LED, can be used as an optical adjustment means, when the light emitted from the vicinity of the light-emitting unit LED is excessively weakened, for example, the area of the inner mask portion ML0 of the mask layer ML of the light shielding sheet SS is excessively large, or the light transmittance of the inner reflective portion RL0 of the second reflective layer RL2 is excessively low, at this time, the light-emitting effect of the inner light-transmitting area KC0 penetrating the inner hole Sc or the key cap KCC can be improved by the inner microstructure area IMS of the first reflective layer RL1 of the light-emitting lamp panel LCB, which is close to the light-emitting unit LED.

Preferably, the two non-intersecting wires STa, STb and the other two non-intersecting wires LT, HT are all arranged as overlapping any rib area or frame area (such as the annular rib Sr0, the bridging rib Sr1, the supporting frame Sf) of the bottom plate SUP as much as possible, so that the micro-structure areas MS/OMS/IMS can correspond to the micro-structure area LMS of the light guide plate LGP, the peripheral holes SUPH or the inner holes Sc of the bottom plate SUP, and the inner transparent areas KC0 and the outer transparent areas KC1 of the key caps KCC. In addition, the plurality of micro-structural areas MS/OMS/IMS may overlap with the annular rib Sr0, the bridging rib Sr1 or the support frame Sf of the bottom plate SUP, and although these positions cannot emit light, the micro-structural areas MS/OMS/IMS may assist in redirecting the light emitted from the light guide plate LGP into the light guide plate LGP for recycling, which may help the subsequent light emitting effect of the further outside or even adjacent another key KS. Of course, the microstructure area MS/OMS/IMS may also overlap the second reflective layer RL2 of the light-shielding plate SS, including overlapping the inner reflective portion RL0 and the outer frame portion of the second reflective layer RL2, to facilitate light recovery into the light-guiding plate LGP.

The light shielding plate SS is disposed over the plurality of microstructure areas MS. The light shielding plate SS includes a mask layer ML, a second reflective layer RL2, and a protective layer PL, wherein the mask layer ML, the second reflective layer RL2, and the protective layer PL may be stacked on each other in various ways. For example, any one of the mask layer ML, the second reflective layer RL2 and the protective layer PL may be stacked on top of, in the middle of or at the bottom of the light shielding plate SS to form the light shielding plate SS. The mask layer ML is opaque. The second reflective layer RL2 may have both reflective and translucent properties, that is, the second reflective layer RL2 may reflect a portion of light and allow a portion of light to pass through. The mask layer ML may be black paint, and the second reflective layer RL2 may be white paint, but is not limited thereto. In the present embodiment, the mask layer ML has a mask layer hole MLH and an inner mask portion ML0 located in the mask layer hole MLH, and the second reflective layer RL2 has a reflective layer hole RLH and an inner reflective portion RL0 located in the reflective layer hole RLH. The mask layer holes MLH may be greater than, equal to, or less than the reflective layer holes RLH, and the inner mask portion ML0 may be greater than, equal to, or less than the inner reflective portion RL0, depending on the desired light emitting effect. The inner shielding portion ML0 and the inner reflecting portion RL0 are both located above the light emitting unit LED. In the present embodiment, the inner shielding portion ML0 and/or the inner reflecting portion RL0 above the light emitting unit LED are at least partially projected between the two non-intersecting wires LT, HT or the two non-intersecting wires STa, STb.

Each key KS comprises a portion of the base plate SUP. In the present embodiment, the bottom plate SUP has an inner hole Sc, an annular rib Sr0, a plurality of bridging ribs Sr1, and a supporting frame Sf, wherein the annular rib Sr0 surrounds the inner hole Sc, and the plurality of bridging ribs Sr1 connect the annular rib Sr0 and the supporting frame Sf. In addition, a plurality of peripheral holes SUPH are provided between the bridging rib Sr1, the annular rib Sr0, and the support frame Sf. In this embodiment, the two inner microstructure areas IMS overlap at least partially with the projections of the inner bore Sc, the annular rib Sr0, the plurality of bridging ribs Sr1 and/or the support frame Sf. Furthermore, the two outer microstructure areas OMS overlap at least partially with projections of the annular rib Sr0, the plurality of bridging ribs Sr1 and/or the support frame Sf.

The key KS comprises a key cap KCC, a support means SSR, a circuit board MEM and a base plate SUP. The key cap KCC is arranged opposite to the base plate SUP. The key cap KCC has an inner transparent region KC0 and a plurality of outer transparent regions KC1, wherein the peripheries of the inner transparent region KC0 and the plurality of outer transparent regions KC1 are the opaque regions KC2. The positions of the inner transparent region KC0 and the plurality of outer transparent regions KC1 correspond to the positions of the inner hole Sc and the plurality of peripheral holes SUPH of the bottom plate SUP, respectively, so that the light emitted from the light emitting unit LED can be projected from the inner transparent region KC0 and the plurality of outer transparent regions KC1 of the key cap KC through the light guide plate LGP, the light shielding plate SS, the inner hole Sc and the plurality of peripheral holes SUPH of the bottom plate SUP. The support device SSR is disposed between the key cap KCC and the base plate SUP. When the key cap KCC is pressed, the key cap KCC is vertically moved along with the support device SSR toward the bottom plate SUP. In addition, a reset member (not shown), such as a rubber washer (not shown), is disposed between the key cap KCC and the bottom plate SUP. The circuit board MEM has a switch, such as a membrane switch (membrane switch) or other toggle switch, corresponding to the key KS.

From a top view, the light emitting unit LED, the light guide plate hole L0, the internal reflection portion RL0, the internal mask portion ML0, the internal hole Sc, the internal light transmitting region KC0, and the adhesive around the light guide plate hole L0 may be located between the two non-intersecting wires LT, HT and/or the two non-intersecting wires STa, STb. In other words, the light emitting unit LED, the light guide plate hole L0, the internal reflection portion RL0, the internal mask portion ML0, the internal hole Sc, the internal light transmitting region KC0, and the adhesive around the light guide plate hole L0 may be located between the two internal microstructure regions IMS.

As shown in fig. 4, the backlight module BLM further includes a protruding structure BP, wherein the position of the protruding structure BP corresponds to the position of the light emitting unit LED, and the protruding structure BP is located between the two non-intersecting wires LT, HT. Furthermore, the protruding structures BP are also located between the plurality of microstructure areas MS, that is to say the protruding structures BP are located between the two inner microstructure areas IMS and also between the two outer microstructure areas OMS. In this embodiment, the protruding structure BP is formed on the light-emitting lamp panel LCB, and the protruding structure BP forms a groove IP to accommodate the light-emitting unit LED, so that the upper surface of the light-emitting unit LED is flush with the upper surface of the light-guiding plate LGP or the upper surface of the light-emitting unit LED is lower than the upper surface of the light-guiding plate LGP and higher than the lower surface of the light-guiding plate LGP. Since the light shielding plate SS is disposed on the light guide plate LGP, the upper surface of the light emitting unit LED is flush with or lower than the lower surface of the light shielding plate SS, so that the light shielding plate SS can be kept flat and is not pushed by the light emitting unit LED to enter the inner hole Sc of the bottom plate SUP. Therefore, the light quantity of the light emitted by the LED of the light emitting unit entering the LGP can be increased, and the consistency of overall light emission is further improved. Further, the circuit board MEM may have a switch disposed in correspondence with the inner hole Sc of the board SUP so that the switch may partially enter the inner hole Sc of the board SUP without interfering with the SS light shielding plate and the light emitting unit LED thereunder.

Referring to fig. 5 and fig. 6, fig. 5 is a partial top view of a light emitting keyboard LKB according to another embodiment of the utility model, and fig. 6 is a partial cross-sectional view of the light emitting keyboard LKB in fig. 5. As shown in fig. 5 and 6, the bottom plate SUP may not have the inner hole Sc described above. At this time, the light shielding plate SS remains flat and is not pushed by the light emitting unit LED. When the bottom plate SUP does not have the inner hole Sc, the key cap KCC may have no inner light-transmitting region KC0. However, if the key cap KCC has the inner transparent region KC0, the light can be emitted from the inner transparent region KC0 without the inner hole Sc by using the peripheral holes SUPH around the central region of the key cap KCC. In this embodiment, the two non-intersecting conductive lines HT, LT may overlap with the projection of at least one of the at least one external light-transmitting region KC 1. As long as the two non-intersecting wires HT, LT satisfy at least one of the following three conditions, the two non-intersecting wires HT, LT do not affect the light emission of the outer light transmitting region KC1 of the key cap KCC. Condition 1: the two non-intersecting conductors HT, LT overlap with the projections of the annular rib Sr0, the bridging rib Sr1 and/or the support frame Sf of the bottom plate SUP. Condition 2: the two non-intersecting wires HT, LT overlap with projections of the mask layer ML and/or the second reflective layer RL2 of the light shielding plate SS. Condition 3: the two non-intersecting wires HT, LT overlap with the projection of the opaque region KC2 of the key cap KCC.

Referring to fig. 7, fig. 7 is a partial cross-sectional view of a light emitting keyboard LKB according to another embodiment of the utility model. As shown in fig. 7, the protrusion structure SP of the backlight module BLM may be formed on the light shielding plate SS, wherein the light emitting unit LED is positioned below the protrusion structure SP. The position of the protruding structure SP corresponds to the position of the light emitting unit LED, and the protruding structure SP is located between the two non-intersecting wires LT, HT. Furthermore, the protruding structures SP are also located between the plurality of microstructure areas MS, that is to say the protruding structures SP are located between the two inner microstructure areas IMS and also between the two outer microstructure areas OMS. In the present embodiment, the protruding structure SP may be lower than or slightly enter the inner hole Sc of the bottom plate SUP, and the upper surface of the light emitting unit LED is flush with the upper surface of the light guide plate LGP or the upper surface of the light emitting unit LED is lower than the lower surface of the light shielding plate SS. It should be noted that the protruding structures SP may be pressed back so that the top of the light shielding plate SS below the bottom plate SUP has a flat surface. In fig. 7, the effect of the protrusion structure SP formed on the light shielding plate SS may be derived from that the internal reflection portion RL0 of the light shielding plate SS above the light emitting unit LED is formed with an arc surface or an inclined surface due to the protrusion structure SP; because the flat internal reflection portion RL0 provides a smaller reflection angle, it is more difficult to guide the light irradiated upward to directly enter from the hole wall of the light guide plate hole L0 of the light guide plate LGP.

Referring to fig. 8, fig. 8 is a partial cross-sectional view of a light emitting keyboard LKB according to another embodiment of the utility model. As shown in fig. 8, the upper surface of the light emitting unit LED may be higher than the upper surface of the light guide plate LGP and lower than the lower surface of the light shielding plate SS, that is, the upper surface of the light emitting unit LED may be located between the upper surface of the light guide plate LGP and the lower surface of the light shielding plate SS. In other words, if necessary, the upper surface of the light emitting unit LED may also exceed the upper surface of the light guide plate LGP, for example, the protruding structure SP protrudes upward to give up the thickness of the light shielding plate SS and the thicknesses of the upper and lower adhesive layers of the light shielding plate SS, so as to provide a space for accommodating the light emitting unit LED; at this time, the upper surface of the light emitting unit LED may be located between the lower surface of the bottom plate SUP and the upper surface of the light guide plate LGP. Thereby, when the upper surface of the light emitting unit LED is higher than the upper surface of the light guide plate LGP, the protrusion structure SP may provide a space to accommodate the light emitting unit LED to prevent the light emitting unit LED from interfering with the light shielding plate SS.

Referring to fig. 9, fig. 9 is a partial cross-sectional view of a light emitting keyboard LKB according to another embodiment of the utility model. As shown in fig. 9, the light emitting keyboard LKB may not include the protruding structure BP shown in fig. 4 or the protruding structure SP shown in fig. 7. In the present embodiment, the upper surface of the light emitting unit LED is flush with the upper surface of the light guide plate LGP or the upper surface of the light emitting unit LED is lower than the upper surface of the light guide plate LGP and higher than the lower surface of the light guide plate LGP. Therefore, the light quantity of the light emitted by the LED of the light emitting unit entering the LGP can be increased, and the consistency of overall light emission is further improved.

Referring to fig. 10, fig. 10 is another partial top view of the light emitting keyboard LKB in fig. 1. As shown in fig. 10, the outer microstructure areas OMS and the inner microstructure areas IMS at least partially overlap with projections of the gaps Gx and Gy between any two adjacent keys KS1, KS2 and KS 3. The three adjacent keys KS1, KS2, KS3 may have three adjacent outer microstructure areas OMS, wherein the three adjacent outer microstructure areas OMS are joined together in the X and Y directions. The two outer microstructure areas OMS outside the two non-intersecting wires of the light emitting light panel LCB disposed under one key KS may have the same pattern, which may have the same size, the same shape, and the same distance (outside the wires) in the two same areas. Within the projection of a single key KS (e.g., a square key), the two outer microstructure areas OMS may have different patterns defined by the key KS. For two keys KS adjacent in the Y-direction, the two adjacent outer microstructure areas OMS may have different patterns defined by the two adjacent keys KS.

Referring to fig. 11, fig. 11 is another partial top view of the light emitting keyboard LKB in fig. 1. As shown in fig. 11, a hole BH may be formed in the light-emitting lamp panel LCB, where the hole BH is used for fixing or dissipating heat. A shielding part MP may be disposed on the light emitting lamp panel LCB, wherein the shielding part MP surrounds the plate hole BH to shield and absorb light, and prevent light from leaking from the plate hole BH. In practical applications, the mask portion MP may be a light-absorbing or opaque substrate from the light-emitting panel LCB, that is, the first reflective layer RL1, the circuit layer, and the insulating layer (if necessary) above the light-emitting panel LCB substrate are all provided with holes larger than the hole BH, so as to expose the mask portion MP around the hole BH. In another practical implementation, a mask portion MP is coated on the upper surface of the first reflective layer RL1 of the light-emitting panel LCB to surround the plate hole BH, and the hole size of the first reflective layer RL1 is similar to the plate hole BH. The hole BH and the mask MP on the light-emitting lamp panel LCB may correspond to the hole and the mask MP on the light-shielding plate SS (not shown). The hole adhesive HA on the light-emitting lamp panel LCB may be disposed on the mask portion MP and surrounds the hole BH. The apertures HC do not overlap with the outer microstructure area OMS or any microstructures. An aperture HC without the first reflective layer RL1 may be defined between the first reflective layer RL1 and the plate aperture BH. A pore HC without adhesive may be defined between the pore adhesive HA and the plate hole BH. The internal microstructure area IMS (between the two non-intersecting wires HT, LT and/or between the two non-intersecting wires STa, STb) does not overlap the plate holes BH, the paste HA and/or the apertures HC. The plurality of keys KS1, KS2, KS3 adjacent in the X and/or Y direction may have adjacent outer microstructure areas OMS that collectively surround the mask portion MP, the plate holes BH, the paste HA and/or the apertures HC. The mask portion MP, the plate hole BH, the hole adhesive HA and/or the aperture HC are located between the two non-intersecting conductive lines HT, LT corresponding to the key KS1 and the two non-intersecting conductive lines HT, LT corresponding to the keys KS2, KS 3. Further, the mask portion MP, the plate hole BH, the paste HA and/or the aperture HC may be located between the conductive line LT corresponding to the key KS1 and the conductive lines HT corresponding to the keys KS2 and KS 3. It should be noted that the mask portion MP, the sealant HA and the aperture HC are schematically shown in the same position in fig. 11. However, the definitions of the mask portion MP, the paste HA and the aperture HC are clear from the above description.

In summary, the utility model can recover light or assist light emission by using the specially configured microstructure areas on the light-emitting panel by making the microstructure areas on the light-emitting panel not overlap with the two non-intersecting wires, so as to improve the consistency of overall light emission. In addition, although the technical scheme of the utility model starts to solve the application problem of the low-power light-emitting unit, the utility model is also applicable to the application of the medium-high-power light-emitting unit in the backlight module.

Furthermore, since the size of the low-power light-emitting unit is too small, when the light-emitting unit is mounted on the light-emitting lamp panel, the solder paste is melted to easily cause the position deviation of the light-emitting unit, so that the light-emitting unit and the circuit of the light-emitting lamp panel cannot be electrically connected smoothly. The embodiments of the present utility model introduce a plurality of technical schemes, and through special pad designs, it is ensured that the light emitting units can still be smoothly connected when the workpiece is shifted, and meanwhile, the homogenization of light is realized.

Referring to fig. 12A, 12B and 12C, fig. 12A is a schematic top view illustrating end-to-end connection of (sub) wires, bonding pads and light emitting units of a light emitting lamp panel according to another embodiment of the present utility model, fig. 12B is a schematic enlarged partial view of the embodiment of fig. 12A, and fig. 12C is a schematic top view illustrating side connection of the embodiment of fig. 12A.

In fig. 12A and 12B, two (sub) wires STa/STb (see the foregoing embodiment and fig. 3/8/9) extend in the wire direction Dt, respectively, and the ends of the two (sub) wires STa/STb have pads FP, respectively, with a pad gap FG between the two pads FP. Each pad FP may be directly formed integrally with the circuit of the light-emitting lamp panel LCB (e.g., the wire HT/LT/STa/STb) by printing a conductive wire, or may be formed integrally with the circuit of the light-emitting lamp panel LCB by a copper foil substrate etching process; however, each pad FP may be overmolded or made of a different material than the circuit of the light emitting panel LCB. The two pads FP are respectively terminated by the intersection end points IE, and the distance between the two intersection end points IE is also the nearest distance between the two pads FP. The pad gap FG between the two intersection points IE is smaller than the long side width of the light emitting unit LED, for example, the gap between the two intersection points IE is close to 0.5 times the long side width of the light emitting unit LED or less. The intersection end point IE may be the final point of the adjacent ends of the two pads FP, or may be the geometric center point of the adjacent ends of the two pads FP. The two pads FP of the present utility model have at least two branch lines Br (branch) respectively, which extend outwardly from the intersection end point IE, thereby defining at least one hollowed-out area Ha/Hb. In fig. 12A and 12B, each pad FP has three branch lines Br, respectively, wherein the middle branch line Br extends straight outward from the intersection point IE to the connection (sub) wire STa/STb, and left and right branch lines Br also connect the (sub) wire STa/STb after extending an L-shaped path outward from the intersection point IE. The three branch lines Br of each pad FP together define two hollowed-out areas Ha/Hb, the boundary (border) of which extends with the middle branch line Br.

The positive and negative electrodes of the light emitting unit LED are electrically connected to the two pads FP through the conductive layer CL, respectively, and the connection positions are located at the two intersection points IE or adjacent areas thereof. The conductive layer CL is implemented, for example, with solder paste or an alternative material thereof, and the thickness and area of the conductive layer CL affect the degree of deflection of the light emitting unit LED during the mounting, so that the printing of the conductive layer CL must be concentrated as much as possible at the intersection point IE of the two pads FP, and with the branch line Br extending to a limited extent. The connecting line direction of the positive electrode and the negative electrode of the light emitting unit LED or the long side of the light emitting unit LED is parallel to the wire direction Dt. The width of the (flat or straight) sides of the two pads FP may be set to be at least 0.8 to 1.5 times or more the width of the short sides of the light emitting unit LED, and if the light emitting unit LED is offset in the normal direction Dn of the wires STa/STb or in the short side direction of the light emitting unit LED, there is still a considerable opportunity for the positive and negative electrodes of the light emitting unit LED to ensure electrical connection of the two pads FP. If the light emitting unit LED is shifted in the wire direction Dt of the wire STa/STb or in the long side direction of the light emitting unit LED, it is necessary to shift more than 0.5 times the long side length of the light emitting unit LED so that the light emitting unit LED cannot be electrically connected to both pads FP at the same time. Regardless of how the light emitting unit LED is offset, the light emitting unit LED overlaps at least partially one of the hollowed-out areas Ha or Hb of one of the pads FP, e.g. the corner or one side of the light emitting unit LED overlaps at least one of the hollowed-out areas Ha or Hb. The overall dimensions of the two pads FP (including the hollowed-out areas Ha or Hb, the branch lines Br, and the pad gaps FG) may be set to be at least 1.2 times or more larger than the LED size of the light emitting unit; alternatively, the two pads FP each have at least one branch line Br constituting a pair of flat sides, and the short sides of the light emitting unit LEDs are preferably smaller than the widths of the pair of parallel flat sides of the two pads FP. In one embodiment, the pair of flat edges is a pair of parallel flat edges. In this way, even in the case of the maximum offset, the light emitting unit LED (either side) does not exceed the outermost periphery of either pad FP. In an ideal case without a beat shift, all 4 corners of the light emitting unit LED may overlap with the hollowed-out area Ha or Hb, respectively. However, on the premise of high stability of the process parameters, the flat edge of the bonding pad FP may be smaller than or equal to the short edge of the light emitting unit LED; even so, at least the light emitting unit LED (e.g., a side or corner) should overlap the hollowed-out area Ha/Hb to maintain a basic offset prevention mechanism.

The first meaning of the presence of the hollowed-out areas Ha/Hb is to provide each pad FP with at least two branch lines Br, which can be used to connect the positive/negative electrodes of the light emitting cells LED. Secondly, the intersection end IE of the intersection point of the branch lines Br (or the intersection end of the two hollow areas Ha/Hb) can be used as a positioning point of the light emitting unit LED in an automatic process. Furthermore, the conductive layer CL flows along the branch line Br easily when melting, and the existence of the hollowed-out region Ha/Hb prevents the conductive layer CL from flowing toward the hollowed-out region Ha/Hb to a considerable extent when melting. Further, each branch line Br may have a width of only 0.5 times or less the width of the short side of the light emitting unit LED so as to limit the range/angle of the melt flow of the conductive layer CL from spreading, and may further limit the angle/path of the light emitting unit LED offset. Thus, it is ensured that the light emitting unit LED is shifted along the branch line Br, and the yield of the light emitting unit LED electrically connecting the two pads FP and the two wires STa/STb is improved.

Referring to fig. 12A, 12B and 12C, in fig. 12A and 12B, the wires STa/STb are in end-to-end opposite state, and the two hollowed-out areas Ha and Hb are arranged perpendicular to the wire direction Dt. In fig. 12C, the wires STa/STb are partially overlapped in the vertical wire direction Dt and are opposite side to side, so that the positions of the two pads FP are rotated by 90 degrees, and the two hollowed-out areas Ha and Hb are arranged along the wire direction Dt. The hollowed-out area Ha/Hb and the branch line Br of the bonding pads FP can effectively improve the yield of the light emitting unit LED for electrically connecting the two bonding pads FP and the two leads STa/STb no matter end-to-end or edge-to-edge connection.

Please refer to fig. 13A to 13F, and also refer to fig. 12A to 12C. Fig. 13A to 13F are schematic top views showing the connection structures between the (sub) wires STa/STb and the two pads FP and the light emitting unit LED of the light emitting panel LCB according to the different embodiments of the present utility model.

In fig. 12A, 12B and 12C, three branch lines Br form a T-shape, and each branch line Br is at least partially parallel to the short side and the long side of the light emitting unit LED, but the utility model is not limited thereto. In fig. 13A, only two branch lines Br of each pad FP extend obliquely outward from the intersection point IE, and the two branch lines Br of each pad FP form an obtuse angle, and finally define a hollowed-out area Ha/Hb with the two wires STa/STb, respectively. Although the light emitting unit LED in fig. 13A still overlaps the hollowed-out areas Ha and/or Hb at least partially, the distance between the two branch lines Br on the same side of the different pads FP is larger and larger when the light emitting unit LED is shifted left and right along the normal direction Dn, so that the obtuse angle between the two branch lines Br of each pad FP should not be too small, for example, between 150 degrees and 180 degrees, to avoid the light emitting unit LED from shifting beyond the width of the two electrodes. In a preferred embodiment similar to fig. 13A but shown in fig. 13B, the bonding pads FP are also similar to triangles, and the flat sides formed by the two corner-shaped branch lines Br are opposite to the flat sides formed by the branch lines Br of the other bonding pad FP, so that the problem of the variation of the pitches of the two branch lines Br on the same side of the different bonding pads FP does not occur when the light emitting unit LEDs are shifted. In addition, the width of the conductive wires STa/STb in fig. 13B is narrower (e.g., copper wires etched from a copper foil substrate), compared to the width of the conductive wires STa/STb in fig. 13A (e.g., printed from a metal paste having conductivity lower than that of the etched copper wires), which have no direct effect on the electrical connection effect of the pads FP and the light emitting unit LEDs.

In fig. 13C, both pads FP have three branch lines Br, and the configuration is also similar to fig. 12A, 12B. Wherein the middle branch line Br extends straight outwards from the intersection end point IE to the connecting (sub) wire STa/STb, and the left and right branch lines Br also connect the (sub) wires STa/STb after extending outwards from the intersection end point IE in a U-shaped path. The width of the conductive wire STa/STb in fig. 13C is narrower than that of the conductive wire STa/STb in fig. 12A and 12B, but as described above, the width of the conductive wire STa/STb has little effect on the electrical connection effect of the pad FP and the light emitting unit LED.

In fig. 13D, both pads FP have three branch lines Br, and the configuration is also similar to fig. 13C. In fig. 13D, the middle branch line Br extends straight outward from the intersection point IE to the connection (sub) wire STa/STb, and the left and right branch lines Br also connect the (sub) wires STa/STb after extending the U-shaped path outward from the intersection point IE. The difference is that the shape of the pad FP in fig. 13D is closer to a semicircle, that is, the left and right branch lines Br in fig. 13D have arc-shaped lead angles, which correspond to more arcs of the light guide plate hole L0 in fig. 3 or the following fig. 14, so that the side light entering amount of the light guide plate LGP can be better matched and improved. In fig. 13E, each of the pads FP has a plurality of branch lines Br extending outward from the intersection point IE to be flat, but only the central branch line Br is connected to the (sub) wire STa/STb, and the left and right branch lines Br extend outward from the intersection point IE to a straight line path in the normal direction Dn, and do not extend to the (sub) wire STa/STb nor connect to the wire STa/STb. However, the central branch line Br and the left branch line Br and the right branch line Br define the hollowed areas Ha/Hb in pairs, so that the light emitting unit LED is at least partially overlapped with one of the hollowed areas Ha/Hb.

Fig. 13F is similar to the pad FP of fig. 13D, but with few intermediate branch lines Br, only the left and right branch lines Br extend outward from the intersection point IE in a U-shaped path and are also connected to the (sub) wires STa/STb. The two pads FP and the branch lines Br of fig. 13F also form a pair of parallel flat sides, and each of the two pads FP has only one hollowed-out area Ha/Hb, so that the light emitting unit LED overlaps at least partially with at least one of the (two short sides) hollowed-out areas Ha/Hb. The two short sides of the light emitting unit LED in fig. 13F cross over the hollowed-out area Ha/Hb respectively, and are similar to the triangular pad FP in fig. 13A and 13B, but the pad FP and hollowed-out area Ha/Hb of fig. 13F are larger than those in fig. 13A and 13B. Furthermore, although each pair of pads FP in fig. 13A to 13F is configured to connect the light emitting units LEDs in an end-to-end configuration, in practical applications, the different types of pads FP in fig. 13A to 13F can be applied to an edge-to-edge side-to-side connection configuration similar to fig. 12C based on the description of the foregoing embodiments.

In addition, the area with highest brightness is arranged around the adjacent low-power light-emitting unit, and the expansion of the light reflection angle in the area is the key for increasing the light inlet quantity of the side face of the light guide plate, improving the transverse transmission proportion and promoting the light-emitting uniformity. However, the physical connection area of the light emitting unit LED and the light emitting panel LCB circuit is adjacent to the periphery of the light emitting unit, and how to electrically connect the light emitting unit LED and the light emitting panel LCB circuit and expand the light reflection angle is a big issue of the design of the light emitting unit LED electrical connection structure.

Referring to fig. 14A to 14D, fig. 14A is a schematic partial top view illustrating an optical structure of a backlight module in a surrounding area of a light emitting unit according to another embodiment of the utility model. Fig. 14B is a schematic partial cross-sectional view of the backlight module of the embodiment of fig. 14A. Fig. 14C is a schematic top view illustrating a portion of an optical structure of a backlight module in a surrounding area of a light emitting unit according to another embodiment of the utility model. Fig. 14D is a schematic top view of a portion of an optical structure of the backlight module according to the derivative embodiment of fig. 14A.

In fig. 14A and 14B, the height difference between 6 branch lines Br and 4 hollowed-out areas Ha/Hb of the two pads FP generates a concave-convex structure, and the reflective first reflective layer RL1 is covered, so that the entire area of each pad FP can form a core microstructure area cMS surrounding at least a part of the light emitting unit LED, wherein both the concave area (hollowed-out area Ha/Hb) and the convex area (branch line Br) can respectively play the role of the microstructure area MS. These pads FP and the core microstructure area cMS are located below the reflective portion RL0 inside the light shielding plate SS. Even without the special pad FP and the hollowed areas Ha/Hb and the branch lines Br thereof, the core microstructure area cMS can be formed around the light emitting unit LED as long as the first reflective layer RL1 covered around the light emitting unit LED has the foregoing concave-convex structure. Therefore, the one or more core microstructure areas cMS surrounding the light emitting unit LED can further reflect and diffuse the light reflected downward by the internal reflection portion RL0 of the light shielding plate SS upward, so as to increase the lateral light entering the light guiding plate hole L0, thereby improving the lateral transmission ratio and the overall light emitting uniformity of the key KS and the light emitting keyboard LKB.

In terms of the overall architecture, the backlight module BLM according to the embodiment of the utility model provides a plurality of light-equalizing areas for achieving the effect of light-equalizing, and the light-equalizing areas of the backlight module BLM at least include a first area Z1 and a second area Z2. The first zone Z1 surrounds the light emitting unit LED, the first zone Z1 includes an inner ring portion RL1i of the first reflective layer RL1 and a pair of pads FP located on the light emitting lamp panel LCB to connect the light emitting unit LED, and the inner ring portion RL1i of the first reflective layer RL1 at least partially covers the pair of pads FP, so that the inner ring portion RL1i of the first reflective layer RL1 reflects and diffuses light emitted from the light emitting unit LED. The second zone Z2 surrounds the first zone Z1, the second zone Z2 comprises a pair of microstructure areas MS spaced apart from each other, the pair of microstructure areas MS being located on the first reflective layer RL1, the pair of microstructure areas MS collectively surrounding the pair of pads FP, the pair of microstructure areas MS reflecting and diffusing light transmitted by the light emitting unit LED through the first zone Z1.

The first zone Z1 closest to the light emitting unit LED is provided with one or more nuclear microstructure areas cMS around the light emitting unit LED through two bonding pads FP and a first reflecting layer RL1 on the light emitting lamp panel LCB, and the first zone Z1 is provided with a concave-convex structure through the collocation of branch lines Br and hollowed-out areas Ha/Hb. Since the pad FP and the core microstructure area cMS thereof are at least partially overlapped with the internal reflection portion RL0 of the light shielding plate SS in the Z direction, they can be used to reflect, diffuse and open the angle of the light from the internal reflection portion RL0 and are incident toward the side of the light guiding plate hole L0. In the first region Z1, the reflective layer hole RLH1 may overlap the two pads FP and the hollowed regions Ha/Hb thereof, the branch line Br and the core microstructure region cMS, and the light guide plate hole L0 may also overlap the two pads FP and the hollowed regions Ha/Hb thereof, the branch line Br and the core microstructure region cMS.

Second, the second region Z2 surrounds the light emitting unit LED at a further distance, and also surrounds the light guide plate hole L0 and the reflective layer hole RLH1. The second zone Z2 comprises two inner microstructure areas IMS (see also the previous embodiments and fig. 3/10/11) separated by a pair of disjoint (sub-) conductors STa/STb on the light-emitting lamp panel LCB, which are located on the upper surface of the first reflective layer RL1 and together enclose at least a part of the first zone Z1. Although the two inner micro-structure regions IMS may only partially overlap the inner reflection portion RL0 of the light shielding plate SS, less light directly from the inner reflection portion RL0 reaches the inner micro-structure regions IMS, but in the process of transmitting the light laterally through the light guide plate LGP, light smaller than the critical angle cannot continue to totally reflect inside the light guide plate LGP and penetrate out of the lower surface of the light guide plate LGP, and the penetrated light can be recovered by the two inner micro-structure regions IMS, and then is incident into the light guide plate LGP to continue to transmit laterally through reflection and diffusion.

Furthermore, the backlight module BLM may further include a third region Z3 between the first region Z1 and the second region Z2, and the third region Z3 may overlap with the first region Z1 and/or the second region Z2 in the Z direction, respectively. The third zone Z3 mainly includes a glue layer Ah (e.g., glue layers Ah1 and/or Ah2 of fig. 14B) disposed above the light-emitting lamp panel LCB of fig. 14A. Although the backlight module BLM has a requirement of using adhesive for positioning between layers, the adhesive should also be taken into consideration in optical design; firstly, the adhesive layer Ah1/Ah2 is made of an adhesive material which can transmit light and has good optical coupling effect. Although the excessive concentration of light around the light emitting unit LED is an original problem of the low-brightness light emitting unit, the implementation process may also be overclear, for example, the light emitting of the internal light transmitting area KC0 in fig. 3 closer to the center of the key cap KCC is insufficient, and the light emitting intensity can be finely increased by using the adhesive layer Ah1/Ah2 as a means for post-correction. Specifically, the adhesive layer Ah1 may surround the light guide plate hole L0, the reflective layer hole RLH1, and the light emitting unit LED and be disposed on the upper surface of the light guide plate LGP (or between the light guide plate LGP and the light shielding plate SS), and the adhesive layer Ah2 may surround the light guide plate hole L0, the reflective layer hole RLH1, and the light emitting unit LED and be disposed on the lower surface of the light guide plate LGP (or between the light guide plate LGP and the light emitting lamp plate LCB).

The adhesive layer Ah/Ah1/Ah2 is not suitable for being excessively close to the light emitting unit LED, firstly, the light emitting unit LED can be too concentrated to diffuse due to the optical coupling effect of the adhesive layer Ah/Ah1/Ah2, and secondly, the adhesive layer Ah/Ah1/Ah2 may cause the light emitting unit LED to be peeled off if contacting the light emitting unit LED due to reasons in the process. Therefore, the adhesive layer Ah/Ah1/Ah2 must be used under proper control, including setting the adhesive-free area CA or reducing the adhesive layer width. The non-adhesive area CA can be arranged between the adhesive layer Ah/Ah1/Ah2 and the light guide plate hole L0, and also can be arranged between the adhesive layer Ah/Ah1/Ah2 and the reflecting layer hole RLH 1. In the Z direction, the non-adhesive area CA may be disposed on the upper surface of the light guide plate LGP (or between the light guide plate LGP and the light shielding plate SS), or may be disposed on the lower surface of the light guide plate LGP (or between the light guide plate LGP and the light emitting lamp plate LCB). In practical applications, the adhesive layers Ah1/Ah2 may be alternatively or simultaneously set. The gel gap AP is another adjusting means using the gel layer Ah1/Ah 2. If there is a need to increase the brightness of the outline halo of the key cap KCC or the outside character (the external light-transmitting area KC 1) in a certain direction, a colloid gap AP may be formed in the adhesive layer Ah1/Ah2, where the colloid gap AP corresponds to the required direction or light-transmitting area, and the colloid gap AP may allow more light to continue to be transmitted laterally outwards smoothly, so as to improve the brightness of the light emitted in the direction.

In the whole, the first zone Z1, the second zone Z2 and the third zone Z3 respectively cover different areas and different areas of the light emitting unit LED in the 360 ° range when seen from the Z direction, and the upward light output amounts of the first zone Z1/the second zone Z2/the third zone Z3 can be relatively close according to different configurations of the optical elements. In addition, other components can be used as adjustment means. For example, the microstructure area MS on the surface of the light guide plate LGP can be used with the core microstructure area cMS, the inner microstructure area IMS, the outer microstructure area oMS, etc. of the first reflective layer RL1 of the light emitting lamp panel LCB, so as to increase the reflection and diffusion effects. In addition, the inner reflection part RL0 of the light shielding plate SS is used for covering the adhesive layer Ah1/Ah2, so that the light loss caused by the adhesive layer Ah1/Ah2 can be reduced and the light can be recovered.

In fig. 14A and 14B, the light guide plate hole L0 is larger than the reflective layer hole RLH1 of the first reflective layer RL1 when viewed in the Z direction, and the reflective layer hole RLH1 is larger than the light emitting unit LED, that is, the hole wall of the reflective layer hole RLH1 surrounds the light emitting unit LED and does not completely cover the two pads FP. Alternatively, the reflective layer hole RLH1 is located between the light emitting unit LED and the light guide plate hole L0, and the first reflective layer RL1 has a portion (the innermost annular region) located between the reflective layer hole RLH1 and the light guide plate hole L0. In this way, the two pads FP are at least partially exposed in the reflective layer hole RLH 1. The exposure range of the bonding pads FP directly affects the range that the light emitting unit LED can be smoothly connected when being shifted, so that the more bonding pads FP are exposed, the smooth connection between the light emitting unit LED and the bonding pads FP can be ensured. Meanwhile, exposing the pad FP means that no first reflective layer RL1 provides reflection, but this does not mean that no reflection-diffusion effect is provided in the reflective layer hole RLH 1. First, since the pads FP are copper or copper alloy (or other alternative metal), the reflective diffusion effect in the light guide plate hole L0 can be provided by the branch line Br segments (located between the light emitting unit LED and the reflective layer hole RLH 1) exposed by the two pads FP in the reflective layer hole RLH 1. Secondly, the hollowed-out portions (including hollowed-out portions Ha/Hb and pad gaps FG) of the exposed areas of the two pads FP are usually substrates (under the wires and pads FP) of the light-emitting lamp panel LCB, so long as the exposed upper surfaces of the substrates can reflect light, whether the upper surfaces of the substrates can reflect light, or the exposed upper surfaces of the substrates are provided with metal solder/conductive layers, or the exposed upper surfaces of the substrates are provided with colloid for ensuring the fixation of the light-emitting units LED, so that the reflective diffusion effect can be provided.

Referring to fig. 14C, the equivalent yield has stabilized, and a smaller reflective layer hole RLH1 may be used when the die accuracy, die temperature, conductive layer flow, die offset of the light emitting unit LED are well controlled. The smaller the reflective layer hole RLH1 is, even when the four sides of the light emitting unit LED encircle the wall of the reflective layer hole RLH1, the first reflective layer RL1 can cover the light emitting lamp panel LCB of the light guide plate hole L0 range in a nearly full area, without exposing any part of the bonding pad FP. At this time, the two bonding pads FP are covered completely, and the branch lines Br and the hollow areas Ha/Hb thereof can form a plurality of microstructure areas with complete shape and larger area, so as to form a core microstructure area cMS surrounding the light emitting unit LED. The larger the area of the core microstructure region cMS is, the more light can be diffused in the initial stage, so that the more light can smoothly enter from the side wall of the light guide plate hole L0. The core microstructure region cMS may be located locally within the range of the light guide plate hole L0 and locally outside the hole wall of the light guide plate hole L0. Of course, the reflective layer hole RLH1 may have a similar size and shape to or slightly larger than the light emitting unit LED, and may achieve a similar effect.

Based on the foregoing embodiment configuration, in fig. 14A to 14C, a part of the plurality of branch lines Br of the two pads FP collectively surrounds at least a part of the light guide plate hole L0; the plurality of hollowed areas Ha/Hb of the two bonding pads FP jointly surround the reflecting layer hole RLH1 and/or the plurality of hollowed areas Ha/Hb of the two bonding pads FP are overlapped with the reflecting layer hole RLH 1; the inner ring portions RL1i of a portion of the first reflective layer RL1 located between the reflective layer hole RLH0 and the light guide plate hole L0 overlap at least a portion of the two pads FP, respectively, so that the partial first reflective layer RL1 exposed in the light guide plate hole L0 may form a concave-convex reflective diffusion structure together with the partial pads FP, for example, the core microstructure region cMS. Finally, although each pad FP of the embodiments of the present utility model is exemplified by the connection (sub) wire STa/STb, each pad FP may be selectively and directly connected to the (main) wire HT/LT of the previous embodiments and fig. 2 to 11 as required in practical applications.

Referring to fig. 14D, the light emitting unit LED packages three color dies to provide three color light (e.g., red, green, and blue). In order to achieve a good light mixing effect of the three-color dies of the light emitting unit LED, the core microstructure area cMS surrounding the light emitting unit LED is also formed on the inner ring portion RL1i of the first reflective layer RL1 (regardless of the presence or absence of the pad FP or the pad FP pattern), so as to increase the light mixing effect of the three-color dies of the light emitting unit LED by improving the reflection and diffusion effects. In addition, the arrangement mode of the three-color crystal grains can be sequentially arranged from long side to long side, and has the advantages that the LED of the light emitting unit is shorter, the offset of the printed part is less likely to interfere with the light guide plate hole L0 with small size, but the disadvantage is poor light mixing effect; because the long sides of the grains with larger light output are shielded by the long sides of the adjacent grains, different colored lights are not easy to be transmitted in a staggered way. Alternatively, as shown in fig. 14D, each long side of the three-color die is parallel to the long side of the whole light emitting unit LED, that is, each long side of the three-color die is aligned along the Y direction, or the three-color die is aligned with its short side to short side. Therefore, the long sides of the crystal grains with larger light output and larger light output range are overlapped and staggered towards the X direction in the figure, and the light mixing effect of two large fan-shaped ranges in the X direction can be better; meanwhile, the short sides of the crystal grains are adjacent in the Y direction, so that the light quantity and the light emitting range of the short sides of the crystal grains are small, the light shielded by the short sides of the crystal grains is also small, and the polarization problem is also small.

In summary, the present utility model provides a light emitting keyboard, a backlight module and a light emitting lamp panel, so as to solve the problem of connection stability of a light emitting unit and the problem of excessive concentration of light emitted from an area adjacent to the light emitting unit. Besides ensuring that the light-emitting units can be smoothly connected when the workpiece is offset by arranging the bonding pad with the hollowed-out area, the bonding pad and the hollowed-out area are matched with the first reflecting layer to form a light homogenization design of the first area; in addition, the utility model provides different light-uniformizing schemes of different blocks along the outward light path of the light-emitting unit to match each other by matching the light panel in the inner microstructure area of the second area, the glue layer of the third area and the glue-free area, so that the character brightness and the keycap halation of a single key can be highly uniform even in the whole keyboard range.

It should be understood that the foregoing examples of the present utility model are provided merely for clearly illustrating the present utility model and are not intended to limit the embodiments of the present utility model, and that various other changes and modifications may be made therein by one skilled in the art without departing from the spirit and scope of the present utility model as defined by the appended claims.

Claims

1. The utility model provides a backlight unit for at least one key cap is shone to this backlight unit, its characterized in that includes:

a light emitting unit;

a light guide plate having a light guide plate hole for accommodating the light emitting unit; and

a lamp panel having a pair of pads respectively connected to the light emitting units, the lamp panel including a first reflective layer surrounding the light emitting units and at least partially covering the pair of pads;

each bonding pad of the pair of bonding pads is respectively provided with a plurality of branch wires and at least one hollow area, and the at least one hollow area is overlapped with at least one part of the light-emitting unit.

2. The backlight module as claimed in claim 1, wherein the first reflective layer has an inner ring portion, the inner ring portion at least partially covers the plurality of branch lines and the at least one hollow area, and the inner ring portion reflects and diffuses the light emitted from the light emitting unit.

3. The backlight module of claim 1, wherein the lamp panel further comprises a pair of micro-structural regions spaced apart from each other, the pair of micro-structural regions being disposed on the first reflective layer, the pair of micro-structural regions collectively surrounding the pair of bonding pads, the pair of micro-structural regions reflecting and diffusing light transmitted from the light emitting unit through the light guide plate.

4. The backlight module of claim 1, wherein the lamp panel further comprises a pair of micro-structural regions and two wires spaced apart from each other, the pair of micro-structural regions are disposed on the first reflective layer, the two wires are electrically connected to the pair of bonding pads, respectively, and the pair of micro-structural regions do not overlap the two wires.

5. The backlight module of claim 1, wherein at least one of the plurality of branch lines of each bonding pad is not completely covered by the first reflective layer to form an exposed portion, and the exposed portion reflects and diffuses the light emitted from the light emitting unit.

6. The backlight module of claim 1, wherein at least a portion of the first reflective layer is disposed in the light guide plate hole.

7. The backlight module of claim 1, further comprising a light shielding plate comprising an internal reflection portion overlapping the first reflection layer.

8. The backlight module according to claim 1, wherein the plurality of branch lines of each of the pair of pads form a pair of parallel flat sides, and a width of a short side of the light emitting unit is smaller than a width of the pair of flat sides.

9. The backlight module of claim 1, wherein at least one of the plurality of branch lines of each pad surrounds at least a portion of the light guide plate hole.

10. The backlight module of claim 1, wherein the first reflective layer has a reflective layer hole, and the at least one hollowed-out area of each of the pair of pads surrounds the reflective layer hole and/or the at least one hollowed-out area of each of the pair of pads overlaps the reflective layer hole.

11. The backlight module of claim 1, wherein the first reflective layer has a reflective layer hole, and the reflective layer hole is located between the light emitting unit and the light guide plate hole.

12. The backlight module of claim 1, wherein the first reflective layer has a reflective layer aperture, and a portion of the first reflective layer overlapping the pair of pads is located between the reflective layer aperture and the light guide plate aperture.

13. The backlight module of claim 1, wherein the light emitting unit comprises three dies for providing three colors of light, the three dies being arranged with their shorter sides aligned consecutively.

14. The backlight module as claimed in claim 1, wherein the lamp panel has two wires electrically connected to the pair of bonding pads, respectively, and the first reflective layer covers the two wires.

15. The backlight module of claim 14, wherein the lamp panel further comprises a pair of micro-structured areas spaced apart from each other, the pair of micro-structured areas being located on the first reflective layer, the two wires being located between the pair of micro-structured areas.

16. The backlight module of claim 1, wherein the lamp panel has two sub-wires electrically connected to the pair of bonding pads, and two main wires electrically connected to the two sub-wires.

17. The backlight module of claim 16, wherein the lamp panel further comprises a pair of outer micro-structured areas spaced apart from each other, the pair of outer micro-structured areas being located on the first reflective layer, the pair of outer micro-structured areas being located outside the two main wires, respectively.

18. The utility model provides a backlight unit for at least a key cap is shone to the illumination, its characterized in that, this backlight unit includes light guide plate, light-emitting unit and lamp plate, and wherein this backlight unit defines a plurality of light homogenizing areas in order to homogenize the light that this light-emitting unit sent, and these a plurality of light homogenizing areas include:

a first region surrounding the light emitting unit, the first region including an inner ring portion of a first reflective layer and a pair of bonding pads on the lamp panel to connect the light emitting unit, the inner ring portion of the first reflective layer at least partially covering the pair of bonding pads, the inner ring portion of the first reflective layer reflecting and diffusing light emitted from the light emitting unit; and

And a second region surrounding the first region, the second region including a pair of microstructure areas spaced apart from each other, the pair of microstructure areas being located on the first reflective layer, the pair of microstructure areas collectively surrounding the pair of pads, the pair of microstructure areas reflecting and diffusing light transmitted from the light emitting unit through the light guide plate.

19. A luminescent keyboard, comprising:

a plurality of keys having key caps; and

the backlight module according to any one of claims 1 to 18, wherein the backlight module is located under the plurality of keys.

20. A luminescent light panel, comprising:

two non-intersecting wires;

a plurality of microstructure areas, two of the plurality of microstructure areas being spaced apart from each other and two of the plurality of microstructure areas not overlapping the two non-intersecting wires;

a light emitting unit located between two of the plurality of microstructure areas; and

the pair of bonding pads are respectively and electrically connected with the two non-intersecting wires and the light-emitting unit, each bonding pad in the pair of bonding pads is respectively provided with at least one branch line to form a pair of parallel flat sides, each bonding pad in the pair of bonding pads is also respectively provided with at least one hollow area, and the light-emitting unit is overlapped with at least one part of the at least one hollow area of each bonding pad in the pair of bonding pads.