CN219798589U - Locomotive brake cylinder air pressure monitoring sensor - Google Patents

Locomotive brake cylinder air pressure monitoring sensor Download PDF

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Publication number
CN219798589U
CN219798589U CN202321281601.5U CN202321281601U CN219798589U CN 219798589 U CN219798589 U CN 219798589U CN 202321281601 U CN202321281601 U CN 202321281601U CN 219798589 U CN219798589 U CN 219798589U
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capacitor
resistor
pin
pressure
chip
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田振忠
鲁宁
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TIANJIN HANGLIAN TIKE SCIENTIFIC & TECHNICAL CO LTD
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TIANJIN HANGLIAN TIKE SCIENTIFIC & TECHNICAL CO LTD
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Abstract

The utility model discloses a locomotive brake cylinder air pressure monitoring sensor, which comprises a programmable reference source, a sensor and a sensor, wherein the programmable reference source is used for providing a stable reference voltage source; the power supply management circuit is used for supplying power to the locomotive brake cylinder air pressure monitoring sensor; a pressure sensitive element connected to a programmable reference source; the first programmable operational amplifier is connected with the power management circuit and the pressure sensitive element; the 24-bit pressure AD conversion unit is connected with the power management circuit and the first programmable operational amplifier; the control unit is connected with the power management circuit and the 24-bit pressure AD conversion unit; the DA conversion unit is connected with the power management circuit and the control unit; the current conversion output unit is connected with the power supply management circuit and the DA conversion unit; the locomotive brake cylinder air pressure monitoring sensor starts from a signal processing source, ensures high accuracy with high resolution, provides necessary conditions for subsequent detailed processing, and is specially configured with a power management circuit so that output current and a complete machine circuit are more stable.

Description

Locomotive brake cylinder air pressure monitoring sensor
Technical Field
The utility model relates to the technical field of pressure sensors, in particular to a locomotive brake cylinder air pressure monitoring sensor.
Background
Most of the existing pressure transmitters in the market are analog quantity sensors, and are composed of traditional special devices or general operational amplifiers in the industry, so that weak signals output by a pressure core body are simply processed, and a temperature compensation function is not provided, or only simple single-point compensation is provided. This way of application presents a number of practical problems in manufacturing and application, embodied in several ways:
1. the chips in the special industry are mostly imported products, and the goods sources are unstable.
2. The common operational amplifier is used for realizing signal adjustment, has the advantages of single function, difficulty in realizing wide temperature compensation and linear compensation, lower precision, larger zero drift phenomenon along with the change of the use temperature, great increase of cost, volume and power consumption if the temperature and the linear compensation are added, and repeated calibration and debugging are required during production.
3. The pressure sensor designed by adopting the analog devices is mainly reserved and debugged with the adjustable potentiometer. When the temperature change of the use environment is large, the potentiometer parameters are extremely unstable. Besides the error generated by the fact that the signal drift of the pressure core body cannot be compensated, the error can be amplified due to the fact that the potentiometer is influenced by the change of the ambient temperature.
Disclosure of Invention
Aiming at the defects existing in the prior art, the utility model aims to provide the locomotive brake cylinder air pressure monitoring sensor which can overcome the defects of inconvenience and large temperature drift in manufacturing and use, and uses a domestic chip, so that the manufacturing cost is stable, and the supply period is short.
In order to achieve the above object, the present utility model provides the following technical solutions:
a locomotive brake cylinder air pressure monitoring sensor, comprising: a programmable reference source for providing a stable reference voltage source; the power supply management circuit is used for supplying power to the locomotive brake cylinder air pressure monitoring sensor; the pressure sensitive element is connected with the programmable reference source and is used for converting pressure into an electric signal; the first programmable operational amplifier is connected with the power management circuit and the pressure sensitive element and is used for amplifying an electric signal output by the pressure sensitive element; the 24-bit pressure AD conversion unit is connected with the power management circuit and the first programmable operational amplifier and is used for converting a signal output by the first programmable operational amplifier into a digital signal; the control unit is connected with the power management circuit and the 24-bit pressure AD conversion unit and is used for carrying out linear correction, temperature compensation and fault tolerance analysis on the signals representing the pressure; the DA conversion unit is connected with the power management circuit and the control unit and is used for converting digital signals into analog signals; and the current conversion output unit is connected with the power management circuit and the DA conversion unit and is used for outputting a current signal in a standard range.
In the present utility model, preferably, the programmable reference source, the power management circuit, the first programmable op-amp, the 24-bit pressure AD conversion unit, the control unit, the DA conversion unit, and the current conversion output unit are all integrated on the same chip.
In the present utility model, preferably, the pressure sensitive element is a diffusion silicon pressure core.
In the utility model, preferably, the model of the chip is NSA2860, and the locomotive brake cylinder air pressure monitoring sensor further includes a resistor R1, a resistor R2, a resistor R3, a resistor R4, a resistor R5, a resistor R6, a resistor R11, a capacitor C1, a capacitor C2, a capacitor C3, a capacitor C4, a capacitor C5, a capacitor C6, a capacitor C10, a capacitor C14, a capacitor C15, a capacitor C16, a triode Q1, a triode Q2 and a zener diode D1; the VGATE pin of the chip is connected with the base electrode of the triode Q1, the AVDD pin is connected with the power supply VDD, the VDDV pin is grounded through the capacitor C1, the DVDD pin is grounded through the capacitor C2, the VREFP pin is connected with the power supply VREFP, the OWI pin is connected with the first end of the resistor R2, the GND pin is grounded, the OUT pin is connected with the first end of the resistor R3, the FBN pin is grounded, the FILTER pin is grounded through the capacitor C4, and the LOOPN pin is connected with the anode of the zener diode ZD 1; the positive end of the power supply of the diffusion silicon pressure core body is connected with an IEXC1 pin of the chip, the negative end of the power supply is grounded, the positive end of the output of the diffusion silicon pressure core body is connected with a VIP pin of the chip through a resistor R1, the negative end of the output of the diffusion silicon pressure core body is connected with a VIN pin through a resistor R11, or the positive end of the output of the diffusion silicon pressure core body is connected with the VIN pin of the chip through a resistor R1, and the negative end of the output of the diffusion silicon pressure core body is connected with the VIP pin through a resistor R11; the second end of the resistor R2 is connected with the positive electrode of the diode D1 through the capacitor C3, the second end of the resistor R3 is connected with the base electrode of the triode Q2, the first end of the resistor R4 is connected with the emitter electrode of the triode Q2, the second end of the resistor R5 is grounded, the first end of the resistor R5 is connected with the positive electrode of the zener diode ZD1, and the first end of the resistor R6 is connected with the base electrode of the triode Q1 and the second end of the resistor R6 is connected with the collector electrode of the triode Q1; the first end of the capacitor C5 is connected with the base electrode of the triode Q2, the second end of the capacitor C5 is connected with the emitter electrode of the triode Q2, the first end of the capacitor C6 is connected with the emitter electrode of the triode Q1, the second end of the capacitor C6 is connected with the anode electrode of the diode D1, the second end of the capacitor C10 is connected with the anode electrode of the diode ZD1, the first end of the capacitor C14 is connected with the anode electrode of the diode D1 and the second end of the capacitor C15 is grounded, the second end of the capacitor C15 is connected with the anode electrode of the diode ZD1, and the first end of the capacitor C16 is connected with the anode electrode of the diode D1 and the anode electrode of the diode ZD 1; the collector of the triode Q1 is connected with the cathode of the diode D1, the emitter is connected with the cathode of the voltage stabilizing diode ZD1, the collector of the triode Q2 is connected with the cathode of the diode D1, and the cathode of the voltage stabilizing diode is connected with the VDDH pin of the chip.
In the utility model, the capacitor C7, the capacitor C8 and the capacitor C9 are preferably further included, wherein the first end of the capacitor C7 is grounded, the second end of the capacitor C7 is grounded, the first end of the capacitor C8 is connected with the VIP pin of the chip, the second end of the capacitor C8 is connected with the VIN pin of the chip, and the first end of the capacitor C9 is grounded.
In the utility model, preferably, the device further comprises an inductor L1, an inductor L2 and a bidirectional voltage stabilizing diode TVS, wherein a first end of the inductor L1 is connected with the anode of the diode D1, and a second end of the inductor L1 is connected with a first end of the bidirectional voltage stabilizing diode TVS; the first end of the inductor L2 is connected to the positive electrode of the zener diode ZD1, and the second end of the inductor L2 is connected to the second end of the bidirectional zener diode TVS.
In the present utility model, preferably, the method further comprises: the temperature sensitive element is connected with the programmable reference source and is used for converting temperature into an electric signal; the second programmable operational amplifier is connected with the power management circuit and the temperature sensitive element and is used for amplifying the electric signal output by the temperature sensitive element; and the 24-bit temperature AD conversion unit is connected with the power management circuit and the second programmable operational amplifier and is used for converting a signal output by the second programmable operational amplifier into a digital signal.
In the present utility model, preferably, the second programmable op-amp and the 24-bit temperature AD conversion unit are integrated on the chip, the temperature sensitive element is a thermistor RT1, and a first end of the thermistor RT1 is connected to a TEMP pin of the chip, and a second end of the thermistor RT1 is grounded.
In the present utility model, preferably, the device further comprises a regulating element BC1 formed by connecting two resistors with the same resistance in series, for standby regulation of the pressure core driving current, wherein the first end of the regulating element BC1 is connected with the IEXC1 pin of the chip, the middle point is connected with the IEXC2 pin of the chip, and the second end is connected with the first end of the thermistor RT1.
In the utility model, preferably, the device further comprises a shell, wherein the front end of the shell is fixedly connected with a pressure chamber, the rear end of the shell is fixedly connected with an aviation socket, and the front end of the pressure chamber is provided with a pressure interface communicated with the outside; the chip, the resistor R1, the resistor R2, the resistor R3, the resistor R4, the resistor R5, the resistor R6, the resistor R11, the capacitor C1, the capacitor C2, the capacitor C3, the capacitor C4, the capacitor C5, the capacitor C6, the capacitor C10, the capacitor C14, the capacitor C15, the capacitor C16, the triode Q1, the triode Q2, the zener diode D1, the capacitor C7, the capacitor C8, the capacitor C9, the inductor L1, the inductor L2, the bidirectional zener diode TVS, the thermistor RT1, and the adjusting element BC1 are all integrated on the same functional circuit board; the diffusion silicon pressure core body is fixed in the pressure chamber, the functional circuit board is fixed in the shell, and the functional circuit board is electrically connected with the aviation socket.
Compared with the prior art, the utility model has the beneficial effects that:
1. the core device comprises two independent 24-bit weak signal input channels and is used for sampling the ambient temperature and the pressure; starting from the signal processing source, high resolution is used for ensuring high precision, and necessary conditions are provided for subsequent detailed processing; after the pressure and temperature signals are sampled, carrying out software processing on the digital signals, wherein the software processing comprises linear correction, temperature compensation, fault tolerance analysis, DA conversion and current output conversion; the power management circuit is specially configured, so that the output current and the whole circuit are more stable.
2. The calibration and the debugging of the locomotive brake cylinder air pressure monitoring sensor are completed through the HART bus, so that the temperature drift and the parameter migration caused by the traditional potentiometer type debugging are reduced.
3. The adoption of software data processing has a larger range of adjustable range, can reduce the preparation of various materials for coping with various ranges in the traditional production, and can effectively reduce the variety and quantity of stock raw materials.
4. The domestic micro-processing chip is selected, so that the manufacturing cost is stable, and the supply period is shortened; most of the functional components are integrated on a chip, and only a small number of elements are arranged on the periphery of the chip, so that the circuit volume is reduced.
Drawings
FIG. 1 is a schematic diagram of a brake cylinder air pressure monitoring sensor of an embodiment of a locomotive according to the present utility model.
Fig. 2 is a circuit diagram of a brake cylinder air pressure monitoring sensor according to another embodiment of the present utility model.
Fig. 3 is a circuit diagram of a brake cylinder air pressure monitoring sensor according to another embodiment of the present utility model.
Fig. 4 is a schematic structural view of a brake cylinder air pressure monitoring sensor according to another embodiment of the present utility model.
Fig. 5 is a circuit diagram of a brake cylinder air pressure monitoring sensor according to another embodiment of the present utility model.
Fig. 6 is a circuit diagram of a brake cylinder air pressure monitoring sensor according to another embodiment of the present utility model.
Fig. 7 is a schematic hardware configuration of a brake cylinder air pressure monitoring sensor according to another embodiment of the present utility model.
In the accompanying drawings: the device comprises a 1-programmable reference source, a 2-power management circuit, a 3-pressure sensitive element, a 4-first programmable operational amplifier, a 5-24-bit pressure AD conversion unit, a 6-control unit, a 7-DA conversion unit, an 8-current conversion output unit, a 9-temperature sensitive element, a 10-second programmable operational amplifier, an 11-24-bit temperature AD conversion unit, a 12-shell, a 13-pressure chamber, a 14-navigation socket and a 15-functional circuit board.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When a component is considered to be "connected" to another component, it can be directly connected to the other component or intervening components may also be present. When an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1, a preferred embodiment of the present utility model provides a sensor for monitoring air pressure of a brake cylinder of a locomotive, comprising: the voltage-converting circuit comprises a programmable reference source 1, a power management circuit 2, a pressure sensitive element 3, a first programmable operational amplifier 4, a 24-bit pressure AD conversion unit 5, a control unit 6, a DA conversion unit 7 and a current conversion output unit 8.
The programmable reference source 1 is used for providing a stable reference voltage source for each unit circuit. The power management circuit 2 is specially configured to ensure the stability of the output current and the stability of the power consumption of the whole machine. The power management circuit 2 is used for supplying power to the locomotive brake cylinder air pressure monitoring sensor. The pressure sensitive element 3 is connected to a programmable reference source 1 for converting pressure into an electrical signal. The first programmable operational amplifier 4 is connected with the power management circuit 2 and the pressure sensitive element 3, and is used for amplifying the electric signal output by the pressure sensitive element 3. The pressure sensitive element 3 and the first programmable operational amplifier 4 are used as pressure acquisition components together, and the pressure sensitive element 3 outputs a weak signal representing pressure to enter the first programmable operational amplifier 4 for full amplification. Preferably, the pressure sensitive element 3 may be a diffusion silicon pressure core. The 24-bit pressure AD conversion unit 5 is connected to the power management circuit 2 and the first programmable op-amp 4, and is configured to convert a signal output by the first programmable op-amp 4 into a digital signal. The pressure signal amplified by the first programmable operational amplifier 4 enters the 24-bit pressure AD conversion unit 5 corresponding to the pressure, and the resolution of the digital signal is 24 bits, so that the relatively accurate signal processing requirement can be met. The control unit 6 is connected to the power management circuit 2 and the 24-bit pressure AD conversion unit 5, and is used for performing linear correction, temperature compensation and fault tolerance analysis on the signal representing the pressure, i.e. the digital signal is sent to the control unit 6 (CPU) to perform a series of corrections, so that the pressure value reflected by the digital signal is more accurate. The DA conversion unit 7 is connected to the power management circuit 2 and the control unit 6, and converts the digital signal into an analog signal. The current conversion output unit 8 is connected with the power management circuit 2 and the DA conversion unit 7 and is used for outputting a current signal in a standard range, and the output current signal range is usually 4-20mA, so that the signal can be conveniently used by a subsequent circuit.
The core device of the locomotive brake cylinder air pressure monitoring sensor comprises a 24-bit weak signal input channel, which is used for sampling the ambient temperature and the pressure; starting from the signal processing source, high resolution is used for ensuring high precision, and necessary conditions are provided for subsequent detailed processing; after the pressure signal is sampled, performing software processing on the digital signal, wherein the software processing comprises linear correction, temperature compensation, fault tolerance analysis, DA conversion and current output conversion; the power management circuit is specially configured, so that the output current and the whole circuit are more stable; the adoption of software data processing has a larger range of adjustable range, can reduce the preparation of various materials for coping with various ranges in the traditional production, and can effectively reduce the variety and quantity of stock raw materials.
In a preferred embodiment of the present utility model, the programmable reference source 1, the power management circuit 2, the first programmable op-amp 4, the 24-bit pressure AD conversion unit 5, the control unit 6, the DA conversion unit 7 and the current conversion output unit 8 are all integrated on the same chip, and the type of the chip may be NSA2860. In order to match the operation of the circuits on the chip, the circuit is further provided with a resistor R1, a resistor R2, a resistor R3, a resistor R4, a resistor R5, a resistor R6, a resistor R11, a capacitor C1, a capacitor C2, a capacitor C3, a capacitor C4, a capacitor C5, a capacitor C6, a capacitor C10, a capacitor C14, a capacitor C15, a capacitor C16, a triode Q1, a triode Q2, a zener diode D1 and other components. The resistor R1 and the resistor R11 are impedance matching resistors, the capacitor C4, the capacitor C5, the resistor R3, the resistor R4, the resistor R5 and the triode Q2 are external matching elements of the current transmission output unit, the resistor R2 and the capacitor C3 are HART bus signal channels, the capacitor C6, the capacitor C1, the triode Q1, the resistor R6, the capacitor C2, the capacitor C10, the diode D1, the capacitor C16, the capacitor C14 and the capacitor C15 are external matching elements of a power supply, and therefore the acquisition of a pressure signal by a diffusion silicon pressure core body and the follow-up signal conversion and processing results can be ensured to be accurate.
Specifically, as shown in fig. 2, PSENSOR1 is a pressure diffusion silicon pressure core. The VGATE pin of the chip is connected with the base electrode of the triode Q1, the AVDD pin is connected with the power supply VDD, the VDDH pin is grounded through the capacitor C1, the DVDD pin is grounded through the capacitor C2, the VREFP pin is connected with the power supply VREFP, the OWI pin is connected with the first end of the resistor R2, the GND pin is grounded, the OUT pin is connected with the first end of the resistor R3, the FBN pin is grounded, the FILTER pin is grounded through the capacitor C4, and the LOOPN pin is connected with the anode of the zener diode ZD 1; the positive end of the power supply of the diffusion silicon pressure core body is connected with an IEXC1 pin of the chip, the negative end of the power supply is grounded, the positive end of the output of the diffusion silicon pressure core body is connected with a VIP pin of the chip through a resistor R1, the negative end of the output of the diffusion silicon pressure core body is connected with a VIN pin through a resistor R11, or the positive end of the output of the diffusion silicon pressure core body is connected with the VIN pin of the chip through a resistor R1, and the negative end of the output of the diffusion silicon pressure core body is connected with the VIP pin through a resistor R11; the second end of the resistor R2 is connected with the positive electrode of the diode D1 through the capacitor C3, the second end of the resistor R3 is connected with the base electrode of the triode Q2, the first end of the resistor R4 is connected with the emitter electrode of the triode Q2, the second end of the resistor R5 is grounded, the first end of the resistor R5 is connected with the positive electrode of the zener diode ZD1, and the first end of the resistor R6 is connected with the base electrode of the triode Q1 and the second end of the resistor R6 is connected with the collector electrode of the triode Q1; the first end of the capacitor C5 is connected with the base electrode of the triode Q2, the second end of the capacitor C5 is connected with the emitter electrode of the triode Q2, the first end of the capacitor C6 is connected with the emitter electrode of the triode Q1, the second end of the capacitor C6 is connected with the anode electrode of the diode D1, the second end of the capacitor C10 is connected with the anode electrode of the diode ZD1, the first end of the capacitor C14 is connected with the anode electrode of the diode D1 and the second end of the capacitor C15 is grounded, the second end of the capacitor C15 is connected with the anode electrode of the diode ZD1, and the first end of the capacitor C16 is connected with the anode electrode of the diode D1 and the anode electrode of the diode ZD 1; the collector of the triode Q1 is connected with the cathode of the diode D1, the emitter is connected with the cathode of the voltage stabilizing diode ZD1, the collector of the triode Q2 is connected with the cathode of the diode D1, and the cathode of the voltage stabilizing diode is connected with the VDDH pin of the chip.
The calibration and the debugging of the locomotive brake cylinder air pressure monitoring sensor are completed through the HART bus, so that the temperature drift and the parameter migration caused by the traditional potentiometer type debugging are reduced; most of the functional components are integrated on a chip, and only a small number of elements are arranged on the periphery of the chip, so that the circuit volume is reduced; the domestic micro-processing chip is selected, the manufacturing cost is stable, and the supply period is shortened.
In a preferred embodiment of the utility model, the locomotive brake cylinder air pressure monitoring sensor further comprises a capacitor C7, a capacitor C8, a capacitor C9, an inductor L1, an inductor L2 and a bidirectional voltage stabilizing diode TVS, wherein the capacitor C7, the capacitor C8 and the capacitor C9 are hardware filtering elements and mainly serve as anti-interference elements, and the inductor L1, the inductor L2 and the bidirectional voltage stabilizing diode TVS are anti-interference elements and surge eliminating elements. Because the electric wave impurities often exist in the environment where the circuit is located and some energy is high, the electric wave impurities possibly enter the circuit to interfere signal transmission and processing of the sensor, so that accuracy of a measurement result can be affected, and the anti-interference capability of the sensor can be improved by introducing the components. As shown in fig. 3, the specific connection method is as follows: the first end of the capacitor C7 is grounded, the second end of the capacitor C8 is grounded, the first end of the capacitor C8 is grounded, the second end of the capacitor C8 is grounded, and the first end of the capacitor C9 is grounded; the first end of the inductor L1 is connected with the positive electrode of the diode D1, the second end of the inductor L1 is connected with the first end of the bidirectional voltage stabilizing diode TVS, the first end of the inductor L2 is connected with the positive electrode of the voltage stabilizing diode ZD1, and the second end of the inductor L2 is connected with the second end of the bidirectional voltage stabilizing diode TVS.
According to the embodiment, the anti-interference capability of the locomotive brake cylinder air pressure monitoring sensor is improved by adding the hardware filtering element and the anti-interference and surge eliminating element, so that the accuracy of an output result is higher.
In a preferred embodiment of the utility model, the locomotive brake cylinder air pressure monitoring sensor further comprises a temperature sensitive element 9, a second programmable operational amplifier 10 and a 24-bit temperature AD conversion unit 11. As shown in fig. 4, a temperature sensitive element 9 is connected to the programmable reference source 1 for converting temperature into an electrical signal; the second programmable operational amplifier 10 is connected with the power management circuit 2 and the temperature sensitive element 9 and is used for amplifying the electric signal output by the temperature sensitive element 9; the 24-bit temperature AD conversion unit 11 is connected to the power management circuit 2 and the second programmable op-amp 10, and is configured to convert a signal output by the second programmable op-amp 10 into a digital signal. Further, the second programmable operational amplifier 10 and the 24-bit temperature AD conversion unit 11 are integrated on a chip, and the temperature sensitive element 9 is a thermistor RT1. The NSA2860 chip itself has an internal circuit for measuring temperature, that is, the second programmable op-amp 10 and the 24-bit temperature AD conversion unit 11 are integrated in the NSA2860 chip, so that the temperature measurement can be performed by only grounding the TEMP pin and the second terminal of the first terminal chip of the thermistor RT1, as shown in fig. 5. The temperature sensing function of the locomotive brake cylinder air pressure monitoring sensor is realized by arranging a plurality of rows of elements for temperature transmission, and the functions of the locomotive brake cylinder air pressure monitoring sensor are enriched.
In a preferred embodiment of the utility model, the locomotive brake cylinder air pressure monitoring sensor is further provided with a pressure core driving current standby adjusting element, namely an adjusting element BC1 formed by connecting two resistors with the same resistance in series, for standby adjusting the pressure core driving current. As shown in fig. 6, the first terminal of the conditioning element BC1 is connected to the IEXC1 pin of the chip, the middle terminal is connected to the IEXC2 pin of the chip, and the second terminal is connected to the first terminal of the thermistor RT1. By arranging the adjusting element BC1, different driving currents can be provided for the pressure sensitive element 3, so that the circuit of the locomotive brake cylinder air pressure monitoring sensor can be suitable for the pressure sensitive elements 3 with different specifications and models.
In a preferred embodiment of the utility model, the air pressure monitoring sensor of the locomotive brake cylinder further comprises a shell 12, wherein the front end of the shell 12 is fixedly connected with a pressure chamber 13, the rear end of the shell is fixedly connected with a navigation socket 14, and the front end of the pressure chamber 13 is provided with a pressure interface communicated with the outside. The housing 12 is preferably a stainless steel housing 12. The chip, resistor R1, resistor R2, resistor R3, resistor R4, resistor R5, resistor R6, resistor R11, capacitor C1, capacitor C2, capacitor C3, capacitor C4, capacitor C5, capacitor C6, capacitor C10, capacitor C14, capacitor C15, capacitor C16, transistor Q1, transistor Q2, zener diode D1, capacitor C7, capacitor C8, capacitor C9, inductor L1, inductor L2, zener diode TVS, thermistor RT1, and adjusting element BC1 are all integrated on the same functional circuit board 15. As shown in fig. 7, the diffusion silicon pressure core is fixed in the pressure chamber 13 through an annular jackscrew, a functional circuit board 15 is installed at the rear end of the annular jackscrew, the functional circuit board 15 is fixed in the shell 12, the functional circuit board 15 is followed by a navigation socket 14, the functional circuit board 15 is electrically connected with the navigation socket 14, and the navigation socket 14 is connected to the stainless steel shell 12 through a welding mode. The shell 12, the pressure chamber 13, the aviation socket 14 and the like are arranged, so that the air pressure monitoring sensor of the locomotive brake cylinder can be protected, and the locomotive brake cylinder can be applied to various specific pressure measuring environments.
The foregoing description is directed to the preferred embodiments of the present utility model, but the embodiments are not intended to limit the scope of the utility model, and all equivalent changes or modifications made under the technical spirit of the present utility model should be construed to fall within the scope of the present utility model.

Claims (10)

1. A locomotive brake cylinder air pressure monitoring sensor, comprising:
a programmable reference source for providing a stable reference voltage source;
the power supply management circuit is used for supplying power to the locomotive brake cylinder air pressure monitoring sensor;
the pressure sensitive element is connected with the programmable reference source and is used for converting pressure into an electric signal;
the first programmable operational amplifier is connected with the power management circuit and the pressure sensitive element and is used for amplifying an electric signal output by the pressure sensitive element;
the 24-bit pressure AD conversion unit is connected with the power management circuit and the first programmable operational amplifier and is used for converting a signal output by the first programmable operational amplifier into a digital signal;
the control unit is connected with the power management circuit and the 24-bit pressure AD conversion unit and is used for carrying out linear correction, temperature compensation and fault tolerance analysis on the signals representing the pressure;
the DA conversion unit is connected with the power management circuit and the control unit and is used for converting digital signals into analog signals;
and the current conversion output unit is connected with the power management circuit and the DA conversion unit and is used for outputting a current signal in a standard range.
2. The locomotive brake cylinder air pressure monitoring sensor of claim 1, wherein the programmable reference source, the power management circuit, the first programmable op-amp, the 24-bit pressure AD conversion unit, the control unit, the DA conversion unit, and the current conversion output unit are all integrated on the same chip.
3. The locomotive brake cylinder pressure monitoring sensor of claim 2 wherein the pressure sensitive element is a diffused silicon pressure core.
4. The sensor of claim 3, wherein the die is NSA2860, and further includes resistor R1, resistor R2, resistor R3, resistor R4, resistor R5, resistor R6, resistor R11, capacitor C1, capacitor C2, capacitor C3, capacitor C4, capacitor C5, capacitor C6, capacitor C10, capacitor C14, capacitor C15, capacitor C16, transistor Q1, transistor Q2, and zener diode D1;
the VGATE pin of the chip is connected with the base electrode of the triode Q1, the AVDD pin is connected with the power supply VDD, the VDDV pin is grounded through the capacitor C1, the DVDD pin is grounded through the capacitor C2, the VREFP pin is connected with the power supply VREFP, the OWI pin is connected with the first end of the resistor R2, the GND pin is grounded, the OUT pin is connected with the first end of the resistor R3, the FBN pin is grounded, the FILTER pin is grounded through the capacitor C4, and the LOOPN pin is connected with the anode of the zener diode ZD 1;
the positive end of the power supply of the diffusion silicon pressure core body is connected with an IEXC1 pin of the chip, the negative end of the power supply is grounded, the positive end of the output of the diffusion silicon pressure core body is connected with a VIP pin of the chip through a resistor R1, the negative end of the output of the diffusion silicon pressure core body is connected with a VIN pin through a resistor R11, or the positive end of the output of the diffusion silicon pressure core body is connected with the VIN pin of the chip through a resistor R1, and the negative end of the output of the diffusion silicon pressure core body is connected with the VIP pin through a resistor R11;
the second end of the resistor R2 is connected with the positive electrode of the diode D1 through the capacitor C3, the second end of the resistor R3 is connected with the base electrode of the triode Q2, the first end of the resistor R4 is connected with the emitter electrode of the triode Q2, the second end of the resistor R5 is grounded, the first end of the resistor R5 is connected with the positive electrode of the zener diode ZD1, and the first end of the resistor R6 is connected with the base electrode of the triode Q1 and the second end of the resistor R6 is connected with the collector electrode of the triode Q1;
the first end of the capacitor C5 is connected with the base electrode of the triode Q2, the second end of the capacitor C5 is connected with the emitter electrode of the triode Q2, the first end of the capacitor C6 is connected with the emitter electrode of the triode Q1, the second end of the capacitor C6 is connected with the anode electrode of the diode D1, the second end of the capacitor C10 is connected with the anode electrode of the diode ZD1, the first end of the capacitor C14 is connected with the anode electrode of the diode D1 and the second end of the capacitor C15 is grounded, the second end of the capacitor C15 is connected with the anode electrode of the diode ZD1, and the first end of the capacitor C16 is connected with the anode electrode of the diode D1 and the anode electrode of the diode ZD 1;
the collector of the triode Q1 is connected with the cathode of the diode D1, the emitter is connected with the cathode of the voltage stabilizing diode ZD1, the collector of the triode Q2 is connected with the cathode of the diode D1, and the cathode of the voltage stabilizing diode is connected with the VDDH pin of the chip.
5. The sensor of claim 4, further comprising a capacitor C7, a capacitor C8, and a capacitor C9, wherein the first terminal of the capacitor C7 is grounded, the VIP pin of the second terminal chip, the VIP pin of the first terminal chip of the capacitor C8, the VIN pin of the second terminal chip, and the VIN pin of the first terminal chip and the second terminal of the capacitor C9 are grounded.
6. The sensor for monitoring the air pressure of a locomotive brake cylinder according to claim 5, further comprising an inductor L1, an inductor L2 and a TVS,
the first end of the inductor L1 is connected with the anode of the diode D1, and the second end of the inductor L1 is connected with the first end of the bidirectional voltage stabilizing diode TVS;
the first end of the inductor L2 is connected to the positive electrode of the zener diode ZD1, and the second end of the inductor L2 is connected to the second end of the bidirectional zener diode TVS.
7. The locomotive brake cylinder pressure monitoring sensor of claim 6, further comprising:
the temperature sensitive element is connected with the programmable reference source and is used for converting temperature into an electric signal;
the second programmable operational amplifier is connected with the power management circuit and the temperature sensitive element and is used for amplifying the electric signal output by the temperature sensitive element;
and the 24-bit temperature AD conversion unit is connected with the power management circuit and the second programmable operational amplifier and is used for converting a signal output by the second programmable operational amplifier into a digital signal.
8. The sensor of claim 7, wherein the second programmable op-amp and the 24-bit temperature AD conversion unit are integrated on the chip, the temperature sensitive element is a thermistor RT1, and a first terminal of the thermistor RT1 is connected to a TEMP pin of the chip, and a second terminal of the thermistor RT1 is grounded.
9. The locomotive brake cylinder pressure monitoring sensor of claim 8, further comprising a regulator BC1 formed of two resistors of equal resistance in series for standby regulation of pressure core drive current, a first terminal of the regulator BC1 connected to the IEXC1 pin of the chip, a middle terminal connected to the IEXC2 pin of the chip, and a second terminal connected to the first terminal of the thermistor RT1.
10. The locomotive brake cylinder air pressure monitoring sensor according to claim 9, further comprising a housing, wherein the front end of the housing is fixedly connected with a pressure chamber, the rear end of the housing is fixedly connected with an aviation socket, and the front end of the pressure chamber is provided with a pressure interface communicated with the outside;
the chip, the resistor R1, the resistor R2, the resistor R3, the resistor R4, the resistor R5, the resistor R6, the resistor R11, the capacitor C1, the capacitor C2, the capacitor C3, the capacitor C4, the capacitor C5, the capacitor C6, the capacitor C10, the capacitor C14, the capacitor C15, the capacitor C16, the triode Q1, the triode Q2, the zener diode D1, the capacitor C7, the capacitor C8, the capacitor C9, the inductor L1, the inductor L2, the bidirectional zener diode TVS, the thermistor RT1, and the adjusting element BC1 are all integrated on the same functional circuit board;
the diffusion silicon pressure core body is fixed in the pressure chamber, the functional circuit board is fixed in the shell, and the functional circuit board is electrically connected with the aviation socket.
CN202321281601.5U 2023-05-25 2023-05-25 Locomotive brake cylinder air pressure monitoring sensor Active CN219798589U (en)

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Application Number Priority Date Filing Date Title
CN202321281601.5U CN219798589U (en) 2023-05-25 2023-05-25 Locomotive brake cylinder air pressure monitoring sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202321281601.5U CN219798589U (en) 2023-05-25 2023-05-25 Locomotive brake cylinder air pressure monitoring sensor

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CN219798589U true CN219798589U (en) 2023-10-03

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