CN219787921U - Grinding mechanism for semiconductor grinding machine - Google Patents
Grinding mechanism for semiconductor grinding machine Download PDFInfo
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- CN219787921U CN219787921U CN202321175224.7U CN202321175224U CN219787921U CN 219787921 U CN219787921 U CN 219787921U CN 202321175224 U CN202321175224 U CN 202321175224U CN 219787921 U CN219787921 U CN 219787921U
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- grinder
- negative pressure
- grinding
- adsorption
- repairing
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- 230000007246 mechanism Effects 0.000 title claims abstract description 55
- 239000004065 semiconductor Substances 0.000 title claims abstract description 24
- 238000001179 sorption measurement Methods 0.000 claims abstract description 38
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000007777 multifunctional material Substances 0.000 claims abstract description 20
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 10
- 238000005498 polishing Methods 0.000 claims description 21
- 229910001873 dinitrogen Inorganic materials 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 10
- 239000000463 material Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000004146 energy storage Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
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Abstract
The utility model discloses a grinding mechanism for a semiconductor grinder, which comprises a mechanism main body and a grinding disc, wherein a repairing grinder and an adsorption negative pressure grinder are arranged at the lower end of the mechanism main body, the repairing grinder and the adsorption negative pressure grinder are positioned above the grinding disc, the bottom of the grinding disc is connected with a servo motor, a bottom plate is positioned at the bottom of the mechanism main body, a sliding seat is positioned at the rear end of the mechanism main body, a sliding rail is arranged on the sliding seat, a nitrogen control box is arranged in the mechanism main body, and a second driving cylinder and a first driving cylinder are positioned and installed on the bottom plate. The grinding mechanism for the semiconductor grinder is provided with the multifunctional material suction port and electromagnetic valve switching structure, so that the adsorption feeding and negative pressure grinding switching operation can be conveniently carried out on parts during grinding, the parts are taken and positioned, the grinding stability is improved, and the grinding effect is more excellent.
Description
Technical Field
The utility model relates to the field of grinding mechanisms, in particular to a grinding mechanism for a semiconductor grinder.
Background
The grinding mechanism is a turntable mechanism for polishing the surface of a part, when the surface of the part is polished, the surface of the part is rapidly rubbed by a high-speed turntable, the polishing and rust removing effects are achieved, a semiconductor material is used as an important link on the upstream of a semiconductor industrial chain, a key effect is achieved in the production and manufacturing process of a chip, in addition, the semiconductor material is applied to a photovoltaic energy storage system, a grinding mode is often adopted when the semiconductor is processed, and along with the continuous development of technology, the requirements of people on the manufacturing process of the grinding mechanism are higher and higher.
The existing grinding mechanism has certain defects when in use, firstly, when in use, the grinding mechanism has single grinding operation structure, the grinding mechanism has poor stability, the grinding effect cannot well meet the requirements, the use of people is not facilitated, and the grinding mechanism cannot conveniently and rapidly perform the material sucking and taking operation during grinding, so that certain adverse effects are brought to the actual use process.
Disclosure of Invention
The technical problems to be solved are as follows: aiming at the defects of the prior art, the utility model provides the grinding mechanism for the semiconductor grinder, which can conveniently carry out adsorption feeding and negative pressure grinding switching operation on parts during grinding, take and position the parts, increase the grinding stability, and have more excellent grinding effect.
The technical scheme is as follows: in order to achieve the above purpose, the technical scheme adopted by the utility model is as follows: the utility model provides a semiconductor grinds machine grinds mechanism, includes mechanism main part and grinding disc, the lower extreme of mechanism main part is provided with restoration grinder and absorption negative pressure grinder, restoration grinder, absorption negative pressure grinder are located the top of grinding disc, the bottom of grinding disc is connected with servo motor, the bottom of mechanism main part is located the bottom plate, the rear end of mechanism main part is located the slide, the slide rail has been seted up on the slide, the inside of mechanism main part is provided with nitrogen gas control box.
Preferably, the second driving cylinder and the first driving cylinder are installed on the bottom plate in a positioning mode, a second driving shaft is connected with the end portion of the second driving cylinder, a first driving shaft is connected with the end portion of the first driving cylinder, the second driving shaft is connected with the position of the repairing grinder, the first driving shaft is connected with the position of the adsorbing negative pressure grinder, a second rotating shaft is connected between the repairing grinder and the second driving shaft, and a first rotating shaft is connected between the adsorbing negative pressure grinder and the first driving shaft.
Preferably, the middle part of adsorbing the negative pressure grinder is provided with a multifunctional material sucking port, the first driving cylinder is connected with a negative pressure electromagnetic valve and an adsorption electromagnetic valve, and the negative pressure electromagnetic valve, the adsorption electromagnetic valve and the nitrogen control box are connected with the positions of the multifunctional material sucking port on the adsorption negative pressure grinder.
Preferably, the bottom plate is fixed with the second driving cylinder and the first driving cylinder through bolts, the second driving cylinder drives the second driving shaft and drives the repairing grinder to rotate through the second rotating shaft, and the first driving cylinder drives the first driving shaft and drives the adsorbing negative pressure grinder to rotate through the first rotating shaft.
Preferably, the adsorption negative pressure grinder and the multifunctional material suction port are integrally formed, and the nitrogen control box, the negative pressure electromagnetic valve and the adsorption electromagnetic valve control the positions of the multifunctional material suction port on the adsorption negative pressure grinder to perform adsorption and negative pressure switching operation.
Preferably, the positions of the repairing grinder, the adsorption negative pressure grinder and the grinding disc reversely rotate at a high speed, the grinding disc is driven to rotate by a servo motor, and the mechanism main body transversely moves through the sliding seat and the sliding rail.
The beneficial effects are that: compared with the prior art, the utility model provides a grinding mechanism for a semiconductor grinder, which has the following beneficial effects: this grinding mechanism for semiconductor grinder can conveniently adsorb material loading and negative pressure grinding switching operation when carrying out the grinding through multi-functional material absorbing mouth and solenoid valve switch structure, get material and location to the spare part, increase the stability of grinding, the grinding effect is more excellent, the second drive cylinder is rotatory at a high speed with the position that first drive cylinder drive was restoreed grinder and was adsorbed negative pressure grinder, the position of servo motor drive grinding disc is rotatory at a high speed, and the grinding disc is rotatory with the back between restoration grinder and the negative pressure grinder, the position of adsorbing negative pressure grinder can adsorb the material and the negative pressure location through multi-functional material absorbing mouth, set up two sets of grinders, one of them is adsorbed material loading and negative pressure grinding, another is to the grinding disc is restoreed, guarantee the precision, whole grinding mechanism simple structure, convenient operation, the effect of using is better for traditional mode.
Drawings
Fig. 1 is a schematic view showing the overall structure of a polishing mechanism for a semiconductor polishing machine according to the present utility model.
Fig. 2 is a schematic view showing the overall internal structure of a polishing mechanism for a semiconductor polishing machine according to the present utility model.
Fig. 3 is a schematic view showing the structure of a drive shaft in a polishing mechanism for a semiconductor polishing machine according to the present utility model.
Fig. 4 is a schematic view showing the structure of a polishing disc in a polishing mechanism for a semiconductor polishing machine according to the present utility model.
In the figure: 1. a mechanism body; 2. a second rotating shaft; 3. repairing the grinder; 4. a grinding disc; 5. a servo motor; 6. an adsorption negative pressure grinder; 7. a first rotating shaft; 8. a nitrogen control box; 9. a bottom plate; 10. a slide; 11. a slide rail; 12. a second driving cylinder; 13. a first driving cylinder; 14. a negative pressure electromagnetic valve; 15. an adsorption electromagnetic valve; 16. multifunctional material sucking port; 17. a second drive shaft; 18. a first drive shaft.
Detailed Description
The technical solution of the present utility model will be clearly and completely described below with reference to the accompanying drawings and detailed description, but it will be understood by those skilled in the art that the examples described below are some, but not all, examples of the present utility model, and are intended to be illustrative of the present utility model only and should not be construed as limiting the scope of the present utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model. The specific conditions are not noted in the examples and are carried out according to conventional conditions or conditions recommended by the manufacturer. The reagents or apparatus used were conventional products commercially available without the manufacturer's attention.
In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
As shown in fig. 1-4, a grinding mechanism for a semiconductor grinding machine comprises a mechanism main body 1 and a grinding disc 4, wherein a repairing grinder 3 and an adsorption negative pressure grinder 6 are arranged at the lower end of the mechanism main body 1, the repairing grinder 3 and the adsorption negative pressure grinder 6 are positioned above the grinding disc 4, a servo motor 5 is connected to the bottom of the grinding disc 4, a bottom plate 9 is positioned at the bottom of the mechanism main body 1, a sliding seat 10 is positioned at the rear end of the mechanism main body 1, a sliding rail 11 is arranged on the sliding seat 10, a nitrogen control box 8 is arranged in the mechanism main body 1, a multifunctional material absorbing port and electromagnetic valve switching structure is arranged, the material absorbing and feeding and negative pressure grinding switching operation can be conveniently carried out on parts during grinding, the materials are taken and positioned, the grinding stability is improved, the grinding effect is more excellent, two groups of grinders are arranged, one group is used for absorbing the material feeding and the negative pressure grinding, and the other group is used for repairing the grinding disc, and the precision is ensured.
Further, a second driving cylinder 12 and a first driving cylinder 13 are positioned and installed on the bottom plate 9, a second driving shaft 17 is connected to the end portion of the second driving cylinder 12, a first driving shaft 18 is connected to the end portion of the first driving cylinder 13, the second driving shaft 17 is connected to the position of the repairing grinder 3, the first driving shaft 18 is connected to the position of the adsorbing negative pressure grinder 6, a second rotating shaft 2 is connected between the repairing grinder 3 and the second driving shaft 17, and a first rotating shaft 7 is connected between the adsorbing negative pressure grinder 6 and the first driving shaft 18.
Further, a multifunctional material sucking port 16 is formed in the middle of the adsorption negative pressure grinder 6, a negative pressure electromagnetic valve 14 and an adsorption electromagnetic valve 15 are connected to the first driving cylinder 13, and the negative pressure electromagnetic valve 14, the adsorption electromagnetic valve 15 and the nitrogen control box 8 are connected to the positions of the multifunctional material sucking port 16 on the adsorption negative pressure grinder 6.
Further, the bottom plate 9 is fixed with the second driving cylinder 12 and the first driving cylinder 13 through bolts, the second driving cylinder 12 drives the second driving shaft 17 and drives the repairing grinder 3 to rotate through the second rotating shaft 2, and the first driving cylinder 13 drives the first driving shaft 18 and drives the adsorbing negative pressure grinder 6 to rotate through the first rotating shaft 7.
Further, the adsorption negative pressure grinder 6 and the multifunctional material suction port 16 are integrally formed, and the nitrogen control box 8, the negative pressure electromagnetic valve 14 and the adsorption electromagnetic valve 15 control the position of the multifunctional material suction port 16 on the adsorption negative pressure grinder 6 to perform adsorption and negative pressure switching operation.
Further, the repairing grinder 3, the suction negative pressure grinder 6 and the grinding disc 4 are reversely rotated at a high speed, the grinding disc 4 is driven to rotate by the servo motor 5, and the mechanism main body 1 is transversely moved by the sliding seat 10 and the sliding rail 11.
Working principle: the utility model comprises a mechanism main body 1, a second rotating shaft 2, a repairing grinder 3, a grinding disc 4, a servo motor 5, an adsorption negative pressure grinder 6, a first rotating shaft 7, a nitrogen control box 8, a bottom plate 9, a sliding seat 10, a sliding rail 11, a second driving cylinder 12, a first driving cylinder 13, a negative pressure electromagnetic valve 14, an adsorption electromagnetic valve 15, a multifunctional material absorbing port 16, a second driving shaft 17 and a first driving shaft 18, wherein when the repairing grinder is used, the second driving cylinder 12 and the first driving cylinder 13 drive the positions of the repairing grinder 3 and the adsorption negative pressure grinder 6 to rotate at a high speed, the servo motor 5 drives the positions of the grinding disc 4 to rotate at a high speed, the positions of the grinding disc 4, the repairing grinder 3 and the adsorption negative pressure grinder 6 can adsorb and position the materials through the multifunctional material absorbing port 16, the multifunctional material absorbing port and the electromagnetic valve switching structure is arranged, the adsorption material and the negative pressure grinding operation can be conveniently carried out on parts when the parts are ground, the parts are taken and positioned, the stable performance of grinding is increased, the grinding effect is ensured, the grinding accuracy is improved, one grinding disc is provided with two groups of grinding discs, and the other grinding disc is provided with the other grinding disc.
It should be noted that in this document, relational terms such as first and second (first and second), and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The foregoing has shown and described the basic principles and main features of the present utility model and the advantages of the present utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims.
Claims (6)
1. The utility model provides a grinding mechanism for semiconductor grinder, includes mechanism main part (1) and grinding disc (4), its characterized in that: the mechanism is characterized in that a repairing grinder (3) and an adsorption negative pressure grinder (6) are arranged at the lower end of the mechanism main body (1), the repairing grinder (3) and the adsorption negative pressure grinder (6) are located above the grinding disc (4), a servo motor (5) is connected to the bottom of the grinding disc (4), a bottom plate (9) is positioned at the bottom of the mechanism main body (1), a sliding seat (10) is positioned at the rear end of the mechanism main body (1), a sliding rail (11) is arranged on the sliding seat (10), and a nitrogen control box (8) is arranged inside the mechanism main body (1).
2. The polishing mechanism for a semiconductor polishing machine as recited in claim 1, wherein: the utility model discloses a vacuum pump, including bottom plate (9), first driving cylinder (12), second driving cylinder (13), end connection of second driving cylinder (12) has second drive shaft (17), end connection of first driving cylinder (13) has first drive shaft (18), the position of repairing grinder (3) is connected to second drive shaft (17), the position of adsorbing negative pressure grinder (6) is connected to first drive shaft (18), be connected with second pivot (2) between repairing grinder (3) and second drive shaft (17), be connected with first pivot (7) between adsorbing negative pressure grinder (6) and first drive shaft (18).
3. The polishing mechanism for a semiconductor polishing machine as recited in claim 2, wherein: the middle part of adsorbing negative pressure grinder (6) has seted up multi-functional material mouth (16) that inhale, be connected with negative pressure solenoid valve (14) and adsorption solenoid valve (15) on first actuating cylinder (13), and the position of multi-functional material mouth (16) on negative pressure grinder (6) is connected to negative pressure solenoid valve (14), adsorption solenoid valve (15), nitrogen gas control box (8).
4. A polishing mechanism for a semiconductor polishing machine as recited in claim 3, wherein: the bottom plate (9) is fixed with the second driving air cylinder (12) and the first driving air cylinder (13) through bolts, the second driving air cylinder (12) drives the second driving shaft (17) and drives the repairing grinder (3) to rotate through the second rotating shaft (2), and the first driving air cylinder (13) drives the first driving shaft (18) and drives the adsorbing negative pressure grinder (6) to rotate through the first rotating shaft (7).
5. The polishing mechanism for a semiconductor polishing machine as recited in claim 4, wherein: the adsorption negative pressure grinder (6) and the multifunctional material sucking port (16) are integrally formed, and the nitrogen control box (8), the negative pressure electromagnetic valve (14) and the adsorption electromagnetic valve (15) control the positions of the multifunctional material sucking port (16) on the adsorption negative pressure grinder (6) to perform adsorption and negative pressure switching operation.
6. The polishing mechanism for a semiconductor polishing machine as recited in claim 5, wherein: the repairing grinder (3), the adsorption negative pressure grinder (6) and the grinding disc (4) rotate at a high speed in a reverse direction, the grinding disc (4) is driven to rotate by a servo motor (5), and the mechanism main body (1) transversely moves through a sliding seat (10) and a sliding rail (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321175224.7U CN219787921U (en) | 2023-05-16 | 2023-05-16 | Grinding mechanism for semiconductor grinding machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321175224.7U CN219787921U (en) | 2023-05-16 | 2023-05-16 | Grinding mechanism for semiconductor grinding machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219787921U true CN219787921U (en) | 2023-10-03 |
Family
ID=88180793
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321175224.7U Active CN219787921U (en) | 2023-05-16 | 2023-05-16 | Grinding mechanism for semiconductor grinding machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219787921U (en) |
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2023
- 2023-05-16 CN CN202321175224.7U patent/CN219787921U/en active Active
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