CN219786977U - Semiconductor laser high-speed engraving device - Google Patents
Semiconductor laser high-speed engraving device Download PDFInfo
- Publication number
- CN219786977U CN219786977U CN202223607286.9U CN202223607286U CN219786977U CN 219786977 U CN219786977 U CN 219786977U CN 202223607286 U CN202223607286 U CN 202223607286U CN 219786977 U CN219786977 U CN 219786977U
- Authority
- CN
- China
- Prior art keywords
- semiconductor laser
- base
- laser
- speed engraving
- sliding seat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 27
- 230000005540 biological transmission Effects 0.000 claims abstract description 15
- 238000001816 cooling Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 description 6
- 230000033001 locomotion Effects 0.000 description 4
- 230000005855 radiation Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010147 laser engraving Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Laser Beam Processing (AREA)
Abstract
The utility model discloses a semiconductor laser high-speed engraving device, which comprises a base, a laser transmitter, a beam adjusting unit and a transmission unit, wherein the beam adjusting unit comprises a sliding seat, a reflecting mirror and a focusing mirror, wherein the reflecting mirror and the focusing mirror are arranged on the sliding seat; the transmission unit comprises a closed transmission belt, a motor for driving the closed transmission belt to reciprocate, and a sliding rail fixed on the base, wherein the sliding seat is assembled on the sliding rail, and one surface of the sliding seat is contacted with the closed transmission belt. The laser transmitter is fixed and does not need to move, so that the moving speed of the laser beam is not influenced, and the engraving efficiency is not influenced.
Description
Technical Field
The utility model relates to the technical field of laser engraving, in particular to a semiconductor laser high-speed engraving device.
Background
When semiconductor laser is used for carving (hereinafter referred to as laser), the laser is scanned back and forth on the surface of an object, and patterns are formed by linear movement carving. In order to realize the carving of laser on an object in the left-right direction (called X axis), a laser transmitter is usually directly arranged on a sliding block driven by a motor to realize the laser reciprocating motion. When it is necessary to increase the engraving efficiency, the laser transmitter power must be increased, so that as the power of the laser transmitter increases, its weight and volume also increase, and in the case of constant motor power, the reciprocating speed is inversely proportional thereto. Therefore, only a larger power motor can be used to solve the defect of speed, and the production cost of enterprises is greatly influenced. If the laser engraving speed can be made higher and faster without increasing the power of the motor, the cost of high-speed engraving can be reduced.
Disclosure of Invention
The utility model aims to overcome the defect that the cost of enterprises is increased because the power of a motor needs to be increased when the carving efficiency of the laser carving device is to be improved in the prior art, and provides a semiconductor laser high-speed carving device which can perform laser carving at high speed without adopting a high-power motor and has high carving efficiency.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
compared with the prior art, the utility model has the beneficial effects that:
a semiconductor laser high-speed engraving device, comprising:
and (2) a base: for providing support;
laser emitter: for emitting a laser beam;
a light beam adjustment unit: the laser beam laser device comprises a sliding seat, a reflecting mirror and a focusing mirror, wherein the reflecting mirror is arranged on the sliding seat and is used for reflecting a laser beam to a carving surface, the focusing mirror is positioned between the reflecting mirror and the carving surface, and the focusing mirror focuses the laser beam reflected by the reflecting mirror to the carving surface;
a transmission unit: the sliding seat is assembled on the sliding rail, and one surface of the sliding seat is contacted with the closed conveying belt.
Further, the base is U-shaped, a strip-shaped opening is formed in the bottom of the base, and the bottom of the sliding seat extends out of the lower portion of the strip-shaped opening.
Further, a cover plate is arranged at the top of the base, and the cover plate is a filter plate.
Further, the light outlet of the laser transmitter faces the reflector.
Further, the semiconductor laser high-speed engraving device of the utility model also comprises a cooling fan arranged on the laser emitter.
Further, the mirror reflects the laser beam perpendicularly onto the engraved surface.
Further, the sliding seat comprises a sliding block and a seat body which are fixedly connected, the sliding block is in sliding connection with the sliding rail, and the seat body is provided with a reflector frame and a focusing mirror frame.
Further, the reflector frame is obliquely arranged at 45-60 degrees, and the focusing lens frame is positioned vertically below the reflector frame.
Further, the light beam adjusting unit further comprises a light tube, a jack is arranged below the focusing lens frame on the base body, and the light tube is inserted into the jack.
Further, the reflector frame and the focusing frame are both arranged inside the base, and the light tube extends out of the base.
Compared with the prior art, the utility model has the beneficial effects that:
the semiconductor laser high-speed engraving device adopts the beam adjusting unit to adjust and change the direction of the laser beam, and adopts the transmission unit to drive the beam adjusting unit to move back and forth, so that the engraving of patterns on the engraving surface is realized.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a semiconductor laser high-speed engraving device according to an embodiment of the present utility model;
FIG. 2 is an exploded view of the structure of a semiconductor laser high-speed engraving device according to an embodiment of the present utility model;
FIG. 3 is an internal structural diagram of a semiconductor laser high-speed engraving device according to an embodiment of the present utility model;
wherein:
10. a base; 11. a cover plate; 20. a laser emitter; 21. a heat radiation fan; 30. a motor; 31. closing the conveyor belt; 32. a slide rail; 41. a reflector, 42, a focusing mirror; 43. a light tube; 441. a slide block; 442. a base; 442a, a reflector holder; 442b, focusing frame; 50. a work piece; 51. and carving the surface.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
It should be noted that the terms "first," "second," "third," "fourth," and the like in the description and in the claims of the present utility model are used for distinguishing between different objects and not necessarily for describing a particular sequential or chronological order. The terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed or inherent to such process, method, article, or apparatus.
Referring to fig. 1 to 3, a structure of a semiconductor laser high-speed engraving device according to an embodiment of the present utility model is disclosed. In this embodiment, the semiconductor laser high-speed engraving device includes a base 10, a laser emitter 20, a beam adjustment unit, and a transmission unit. The base 10 is used for supporting the whole device, the base is made into a U-shaped shape by adopting a section bar, the top of the base is provided with an opening, and the laser emitter 20, the light beam adjusting unit and the transmission unit are all arranged in the base 10.
The laser transmitter 20 is for transmitting a laser beam. The laser transmitter 20 is fixedly installed in one end of the base 10, and the light outlet of the laser transmitter 20 faces the inside of the base 10. Further, the semiconductor laser high-speed engraving device of this embodiment further includes a heat radiation fan 21 mounted on the laser emitter 20. The heat radiation fan 21 can cool the laser emitter 20 because heat is generated during the operation of the laser emitter 20 to raise the temperature.
The beam adjustment unit includes a slide mount, a mirror 41 mounted on the slide mount, and a focusing mirror 42. A work piece 50 to be engraved is placed under the base 10 with the engraved surface 51 of the work piece facing said base 10. The reflector 41 is used for reflecting the laser beam onto the carving surface 51, the focusing mirror 42 is located between the reflector 41 and the carving surface 51, and the focusing mirror 42 focuses the laser beam reflected by the reflector 41 onto the carving surface 51 for carving.
The transmission unit is used for driving the light beam adjusting unit to move back and forth in the left-right direction (namely the X-axis direction), so that the light beam adjusting unit can complete carving work. Specifically, the conveying unit includes a closing conveying belt 31, a motor 30 driving the closing conveying belt 31 to reciprocate, and a slide rail 32 fixed on the base 10. The sliding seat of the beam adjusting unit is mounted on the sliding rail 32 and one surface of the sliding seat is in contact with the closing conveying belt 31. Therefore, in the process of driving the closing conveying belt 31 to move in a transmission way by the motor 30, the sliding seat is driven to move back and forth along the sliding rail 32. The motor 30 drives the closed conveyer belt 31 to move in the following manner: the driven wheel is fixed on the base, one end of the closed transmission belt 31 is sleeved on the output shaft of the motor 30, the other end is sleeved on the driven wheel, and the output shaft of the motor 30 drives the closed transmission belt 31 to transmit motion when rotating. Of course, a guide wheel can be arranged between the output shaft and the driven wheel, so that the closed conveying belt is ensured to move in a conveying way according to a preset track.
In this embodiment, the sliding seat includes a sliding block 441 and a seat 442 fixedly connected. The sliding block 441 is slidably connected to the sliding rail 32, and the base 442 is provided with a reflector 442a and a focusing lens 442b. The reflector 442a is disposed at an angle of 45 ° to 60 °, and the focusing lens 442b is disposed vertically below the reflector 442 a. The mirror 41 is fixedly mounted in the mirror holder 442 a. The focusing mirror 42 is fixedly mounted in the focusing frame 442b. Further, the beam adjusting unit further includes a light tube 43, and a receptacle is disposed on the base 442 below the focusing lens holder 442b, and the light tube 43 is inserted into the receptacle.
The laser beam is usually a light wave with a short wavelength, with a wavelength around 455NM, visible light, blue light, and damage to the eye for a long time. Therefore, the embodiment enables the laser beam to be in a closed environment, so that the laser cannot damage eyes due to strong light in operation. Specifically: a cover plate 11 is arranged at the top of the base 10, and the cover plate 11 is a filter plate and can filter blue light; the reflector 442a and the focusing lens 442b are disposed inside the base, the light outlet of the laser transmitter 20 faces the reflector, and the light tube 43 extends out of the base. The laser beam is thus inside the closed base 10, avoiding damage to the human eye. A bar-shaped opening is formed in the bottom of the base 10, and the bottom of the sliding seat extends out of the lower portion of the bar-shaped opening, so that the light cylinder 43 can extend out of the lower portion of the bar-shaped opening, and the carving surface 51 is carved. Because the base 10 in this embodiment has a closed structure, the light tube 43 is only opened at the bottom to be convenient for carving, the heat dissipation fan 21 carried on the laser emitter 20 will form a positive wind pressure, and finally flows out from the strip-shaped opening of the base 10 to protect the carved surface 51.
The semiconductor laser high-speed engraving device of this embodiment adopts the light beam adjustment unit to adjust, change the direction of laser beam to adopt transmission unit to drive light beam adjustment unit back and forth movement, thereby engrave the pattern on carving surface, compare and carry out the sculpture through removing laser emitter among the prior art, this embodiment is that remove light beam adjustment unit and carve, the weight of light beam adjustment unit is fixed, lighter, the more easy removal of weight than laser emitter, even adopt high-power laser emitter, because laser emitter is fixed, need not remove, therefore do not influence laser beam's moving speed, do not influence sculpture efficiency, satisfy high-speed sculpture demand.
The foregoing has described in detail a semiconductor laser high-speed engraving device disclosed in the embodiments of the present utility model, and specific examples have been applied herein to illustrate the principles and embodiments of the present utility model, and the above description of the embodiments is only for aiding in understanding the method and core idea of the present utility model; meanwhile, as those skilled in the art will vary in the specific embodiments and application scope according to the idea of the present utility model, the present disclosure should not be construed as limiting the present utility model in summary.
Claims (10)
1. A semiconductor laser high-speed engraving device, characterized by comprising:
and (2) a base: for providing support;
laser emitter: for emitting a laser beam;
a light beam adjustment unit: the laser beam laser device comprises a sliding seat, a reflecting mirror and a focusing mirror, wherein the reflecting mirror is arranged on the sliding seat and is used for reflecting a laser beam to a carving surface, the focusing mirror is positioned between the reflecting mirror and the carving surface, and the focusing mirror focuses the laser beam reflected by the reflecting mirror to the carving surface;
a transmission unit: the sliding seat is assembled on the sliding rail, and one surface of the sliding seat is contacted with the closed conveying belt.
2. The semiconductor laser high-speed engraving apparatus of claim 1, characterized in that: the base is U-shaped, a strip-shaped opening is formed in the bottom of the base, and the bottom of the sliding seat extends out of the lower portion of the strip-shaped opening.
3. The semiconductor laser high-speed engraving apparatus of claim 2, characterized in that: the top of base is equipped with the apron, the apron is the filter plate.
4. The semiconductor laser high-speed engraving apparatus of claim 1, characterized in that: and the light outlet of the laser transmitter faces the reflector.
5. The semiconductor laser high-speed engraving apparatus of claim 4, characterized in that: and the laser transmitter also comprises a cooling fan arranged on the laser transmitter.
6. The semiconductor laser high-speed engraving apparatus of claim 4, characterized in that: the mirror reflects the laser beam vertically onto the engraved facet.
7. The semiconductor laser high-speed engraving apparatus of claim 5, characterized in that: the sliding seat comprises a sliding block and a seat body which are fixedly connected, wherein the sliding block is in sliding connection with the sliding rail, and the seat body is provided with a reflector frame and a focusing mirror frame.
8. The semiconductor laser high-speed engraving apparatus of claim 7, characterized in that: the reflector frame is obliquely arranged at 45-60 degrees, and the focusing lens frame is positioned under the reflector frame.
9. The semiconductor laser high-speed engraving apparatus of claim 8, characterized in that: the light beam adjusting unit further comprises a light cylinder, a jack is arranged below the focusing lens frame on the base body, and the light cylinder is inserted into the jack.
10. The semiconductor laser high-speed engraving apparatus of claim 9, characterized in that: the reflector frame and the focusing frame are both arranged inside the base, and the light cylinder extends out of the base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223607286.9U CN219786977U (en) | 2022-12-30 | 2022-12-30 | Semiconductor laser high-speed engraving device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223607286.9U CN219786977U (en) | 2022-12-30 | 2022-12-30 | Semiconductor laser high-speed engraving device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219786977U true CN219786977U (en) | 2023-10-03 |
Family
ID=88178931
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223607286.9U Active CN219786977U (en) | 2022-12-30 | 2022-12-30 | Semiconductor laser high-speed engraving device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219786977U (en) |
-
2022
- 2022-12-30 CN CN202223607286.9U patent/CN219786977U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN218362721U (en) | Dynamic focusing laser marking machine capable of monitoring in real time | |
| CN219786977U (en) | Semiconductor laser high-speed engraving device | |
| CN110976431A (en) | Laser cleaning device | |
| CN116652413A (en) | Ceramic copper-clad carrier plate cutting and coding integrated equipment | |
| CN111716000A (en) | Laser welding device | |
| CN208391269U (en) | A kind of round-trip double-station Three-Dimensional Dynamic CO2 laser marking machine | |
| CN219026370U (en) | Ultraviolet laser processing equipment | |
| CN116174455A (en) | VBG recovery device and recovery method for wavelength-locked fiber laser module | |
| CN214815685U (en) | Laser light path switching device | |
| CN211247615U (en) | Laser cleaning device | |
| CN108526709A (en) | A kind of round-trip double-station Three-Dimensional Dynamic CO2Laser marking machine | |
| CN219362382U (en) | Processing equipment for light guide plate | |
| CN211073906U (en) | Automatic hot cutting machine | |
| CN220971111U (en) | Cantilever type laser cutting machine | |
| CN211490123U (en) | Laser engraving and cutting device | |
| CN218476166U (en) | Two-shaft translation mechanism for laser engraving machine | |
| CN219503939U (en) | Laser peeler | |
| CN212019762U (en) | Low-loss refraction cutting system | |
| CN214927202U (en) | Double-station welding equipment suitable for plastic product laser welding | |
| CN212526518U (en) | Double-drive linear module laser die cutting machine | |
| CN217781419U (en) | Integral lifting device for reflector of laser bag opening machine | |
| CN219336426U (en) | Fiber laser pipe cutting machine with protective equipment | |
| KR20000054977A (en) | Apparatus for cutting a glass | |
| CN2302143Y (en) | Laser rose engine | |
| CN220427135U (en) | Double-head desktop vibrating mirror engraving and cutting double-focusing equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |