CN219786874U - Quick welding device for integrated circuit on circuit board - Google Patents
Quick welding device for integrated circuit on circuit board Download PDFInfo
- Publication number
- CN219786874U CN219786874U CN202320623819.8U CN202320623819U CN219786874U CN 219786874 U CN219786874 U CN 219786874U CN 202320623819 U CN202320623819 U CN 202320623819U CN 219786874 U CN219786874 U CN 219786874U
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- CN
- China
- Prior art keywords
- integrated circuit
- welding
- channel
- tin
- heating base
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000003466 welding Methods 0.000 title claims abstract description 50
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 64
- 238000010438 heat treatment Methods 0.000 claims abstract description 30
- 238000002844 melting Methods 0.000 claims abstract description 19
- 230000008018 melting Effects 0.000 claims abstract description 19
- 238000005476 soldering Methods 0.000 claims abstract description 18
- 230000001681 protective effect Effects 0.000 claims description 15
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 239000000155 melt Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 239000007788 liquid Substances 0.000 description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000006872 improvement Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 206010053615 Thermal burn Diseases 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model relates to the field of integrated circuits, in particular to a rapid welding device for an integrated circuit on a circuit board. The device comprises a heating base and a tin melting tank arranged in the heating base, wherein a channel is formed in the heating base and is communicated with the tin melting tank; and during welding, the channel is filled with molten tin, and when the pins of the integrated circuit are inserted into the lower end of the channel, the tin flows out from the inner edge pins of the channel, so that the welding of the pins of the integrated circuit is realized. The utility model solves the problems of inconvenient operation, low working efficiency, uneven tin adhesion on pins, virtual soldering and adhesive soldering of the existing integrated circuit in the welding technology on the circuit board, and the device has the advantages of simple structure, low manufacturing cost, convenient operation and good popularization and use values.
Description
Technical Field
The utility model relates to the field of integrated circuits, in particular to a rapid welding device for an integrated circuit on a circuit board.
Background
Along with the development of technology, electronic products are more advanced and smaller, and the root of the development of the electronic products is that integrated circuits are used in large quantities, the pins of the integrated circuits are more and dense, a small integrated circuit has dozens or even hundreds of pins, and the welding difficulty is high. At present, the welding device for welding integrated circuits on the market is inconvenient to weld synchronously with multiple pins in the use process, occupies more welding space while being poor in efficiency, and is inconvenient for a user to fill and weld tin materials in the welding process. For example, the most electric soldering iron used at present is not only in a spot welding, drag welding or pull welding mode, but also in a use process, two hands are occupied, one hand holds the electric soldering iron, the other hand is used for feeding soldering tin, the soldering tin needs to be repeatedly coated on the soldering bit, the operation is very inconvenient, the working efficiency is low, sometimes the soldering tin on the pins is uneven, and the cold welding and the sticking welding are possible. Therefore, we propose a new welding device for integrated circuits, which can improve welding quality and working efficiency.
Disclosure of Invention
The utility model aims to provide a rapid welding device for an integrated circuit on a circuit board, which can weld a plurality of pins of the integrated circuit at one time by utilizing a method of simultaneously welding the plurality of pins so as to solve the problems of low welding efficiency, poor welding quality and the like of the integrated circuit in the prior art.
In order to achieve the above object, the present utility model provides the following solutions:
the quick welding device for the integrated circuit on the circuit board comprises a heating base and a tin melting tank arranged in the heating base, wherein a channel is formed in the heating base and is communicated with the tin melting tank; and during welding, the channel is filled with molten tin, and when the pins of the integrated circuit are inserted into the lower end of the channel, the tin flows out from the inner edge pins of the channel, so that the welding of the pins of the integrated circuit is realized.
The heating base is further improved to be composed of a first part and a second part, and the first part and the second part are spliced or integrally connected; during welding, the lower opening of the channel is contacted with a welding hole at the pin of the integrated circuit, and the size of a welding spot can be controlled by controlling the contact time.
In a further improvement, the first part of the heating base is provided with a tin melting tank downwards along the upper surface, the bottom area range of the tin melting tank covers the upper openings of all the channels, the solder paste is melted in the tin melting tank and then flows into the channels, and the solder liquid cannot flow out of the channels due to the action of tension.
The bottom of the tin melting tank is inwards provided with inclined planes from two sides, and the intersection line of the two inclined planes coincides with the central axis transversely connected with all the channels, so that the tin liquid is easy to flow out and no tin liquid remains.
The tin melting tank is characterized by further comprising a protective cover plate, wherein the protective cover plate is fixed on the heating base and covers one part of the tin melting tank, the protective cover plate prevents tin liquid from obliquely flowing out, and the part which is not covered is used for conveniently adding soldering tin.
Still further improvement is, be provided with two handles on the protection apron, the handle is fixed in protection apron both sides, the handle adopts the insulating material preparation, can not cause the scald during the operation.
The technical scheme of the utility model has the beneficial effects that: (1) the rapid welding device for the integrated circuit on the circuit board replaces the soldering bit in the prior art, realizes synchronous welding of multiple pins of the integrated circuit, improves the welding efficiency, and is simple and convenient to operate; (2) the rapid welding device has the function of storing tin liquid, can finish welding a plurality of integrated circuits by melting tin once, does not need to repeatedly apply tin when in use, and can realize high-quality and high-efficiency welding by only inserting pins into the channels; (3) the tin-out speed of the quick welding device is consistent, and the size of a welding spot can be controlled by controlling the contact time of a pin and a channel; (4) the rapid welding device has the advantages of simple structure, popular and easily understood manufacturing principle and obvious beneficial effect.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions of the prior art, the drawings that are needed in the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a perspective view of a device for quick soldering an integrated circuit to a circuit board according to the present utility model;
fig. 2 is a front view of a device for rapid soldering of an integrated circuit on a circuit board according to the present utility model;
FIG. 3 is a top view of a device for quick soldering an integrated circuit to a circuit board without a protective cover plate according to the present utility model;
FIG. 4 is a side cross-sectional view of a device for rapid bonding of an integrated circuit to a circuit board according to the present utility model;
fig. 5 is an enlarged view at I in fig. 1.
Reference numerals:
1. a second portion; 2. a first portion; 3. a bolt; 4. a protective cover plate; 5. a bolt; 6. a handle; 7. a tin melting tank; 8. a channel; 9. a heating core; 10. a heat insulating mat; 11. the susceptor is heated.
Description of the embodiments
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art without creative efforts, are within the scope of the present utility model based on the embodiments of the present utility model.
In order that the above-recited objects, features and advantages of the present utility model will become more readily apparent, a more particular description of the utility model will be rendered by reference to the appended drawings and appended detailed description.
As shown in fig. 1-5, a rapid soldering device for an integrated circuit on a circuit board comprises a heating base 11 and a tin melting tank 7 arranged in the heating base 11, wherein a channel 8 is formed on the heating base 11, and the channel 8 is communicated with the tin melting tank 7; during welding, molten tin is filled in the channel 8, and when pins of the integrated circuit are inserted into the lower end of the channel 8, the tin flows out from the inner edge pins of the channel 8, so that the welding of the pins of the integrated circuit is realized.
In an alternative embodiment, the heating base 11 is composed of a first part 2 and a second part 1, the first part 2 is in a cube structure, the second part 1 is a plurality of cylinders, and the first part 2 and the second part 1 are connected in a spliced or integrated manner; the first part 2 and the second part 1 are both made of red copper material; the structure from the opening of the lower surface of the second part 1 to the bottom of the tin melting tank 7 is the channel 8, the channel 8 is not limited to a cylindrical hole or a cubic hole, and the inner surface of the channel 8 is smooth; the diameter or side length of the channel 8 is slightly larger than that of the pins of the integrated circuit, so that the pins can be conveniently connected into the channel 8 to contact with tin liquid; during welding, the lower opening of the channel 8 is contacted with a welding hole at the pin of the integrated circuit, the pin of the integrated circuit is quickly welded with the circuit board by means of the adhesion force of the soldering flux at the welding hole and the tin liquid to the pin, and the size of a welding spot can be controlled by controlling the contact time. The heating base 11 further comprises a heating core 9, the heating core 9 is buried in the heating base 11, and after being electrified and heated, heat is transferred to the heating base 11, so that the heating base 11 can work after being preheated.
It should be noted that, the first portion 2 of the heating base 11 is provided with a molten tin bath 7 downward along the upper surface, the solder melts into molten tin in the molten tin bath 7, the bottom area range of the molten tin bath 7 covers all the upper openings of the channels 8, so that all the channels 8 are filled with molten tin, the channels 8 are communicated with the molten tin bath 7, the molten tin flows into the channels 8 from the molten tin bath 7 due to the gravity and the pressure above, and the molten tin in the channels 8 does not flow out from the channels 8 due to the tension under the condition that no pin is attracted.
As shown in fig. 3 to 4, the bottom of the molten tin bath 7 is respectively and inwardly provided with an inclined plane from two sides, the intersection line of the two inclined planes coincides with the central axes transversely connected with all the channels 8, when the welding work is about to end, the molten tin is less, the arrangement of the inclined planes ensures that the residual molten tin can be converged at the junction of the bottom so as to completely flow into the channels 8, and the molten tin is easy to flow out and has the effect of not remaining molten tin, so that the molten tin is saved and is not wasted.
In an alternative embodiment, the device further comprises a protective cover plate 4, wherein the protective cover plate 4 is fixed on the heating base 11 and covers a part of the tin melting tank 7, the protective cover plate 4 plays a role in protecting, so that the tin liquid is prevented from obliquely flowing out, and a part of the tin melting tank 7 is left uncovered, thereby facilitating the addition of the tin; four bolt holes are formed in the heating base 11, and the protective cover plate 4 is fixedly connected with the heating base 11 through bolts 3; the protective cover plate 4 is made of a high-temperature-resistant heat-insulating material; the two handles 6 are arranged on the protective cover plate 4, the handles 6 are fixed on two sides of the protective cover plate 4, and the handles 6 are made of heat insulation materials and cannot scald hands during operation; the protection cover plate 4 is provided with a bolt hole, a heat insulation pad 10 is arranged in the bolt hole, the handle 6 is fixedly connected with the protection cover plate 4 through a bolt 5, and the heat insulation pad 10 is used for preventing heat from being conducted to the handle 6 through the bolt 5, so that the temperature of the handle 6 is increased, and the operation is inconvenient.
In the description of the present utility model, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "transverse," "longitudinal," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present utility model, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present utility model.
In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; the specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art in a specific case.
In the description of the present utility model, it should be understood that, for convenience of description, the terms "device", "soldering device" and "soldering device of an integrated circuit on a circuit board" as used in the specification are all "a device for quick soldering of an integrated circuit on a circuit board" according to the subject matter of the present utility model.
The above embodiments are only illustrative of the preferred embodiments of the present utility model and are not intended to limit the scope of the present utility model, and various modifications and improvements made by those skilled in the art to the technical solutions of the present utility model should fall within the protection scope defined by the claims of the present utility model without departing from the design spirit of the present utility model.
Claims (6)
1. The quick welding device for the integrated circuit on the circuit board is characterized by comprising a heating base and a tin melting tank arranged in the heating base, wherein a channel is formed in the heating base and is communicated with the tin melting tank; and during welding, the channel is filled with molten tin, and when the pins of the integrated circuit are inserted into the lower end of the channel, the tin flows out from the inner edge pins of the channel, so that the welding of the pins of the integrated circuit is realized.
2. The device of claim 1, wherein the heating base is composed of a first part and a second part, and the first part and the second part are spliced or integrally connected; during welding, the lower opening of the channel is contacted with the welding hole at the pin of the integrated circuit.
3. The device of claim 2, wherein the first portion of the heating base has a molten tin bath extending downwardly along the upper surface, wherein the molten tin bath has a bottom area that covers the upper openings of all of the channels, and wherein solder melts in the molten tin bath and flows into the channels.
4. A device for rapid soldering of an integrated circuit on a circuit board according to claim 3, wherein the bottom of the molten tin bath is provided with inclined surfaces from both sides inwards, and the intersection lines of the two inclined surfaces coincide with the central axes of all the channels which are transversely connected, so that the molten tin is easy to flow out and no molten tin remains.
5. The device of claim 1, further comprising a protective cover plate secured to the heating base and covering a portion of the molten tin bath.
6. The device of claim 5, wherein two handles are provided on the protective cover, and the handles are fixed to two sides of the protective cover.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320623819.8U CN219786874U (en) | 2023-03-27 | 2023-03-27 | Quick welding device for integrated circuit on circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320623819.8U CN219786874U (en) | 2023-03-27 | 2023-03-27 | Quick welding device for integrated circuit on circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219786874U true CN219786874U (en) | 2023-10-03 |
Family
ID=88156551
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320623819.8U Active CN219786874U (en) | 2023-03-27 | 2023-03-27 | Quick welding device for integrated circuit on circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219786874U (en) |
-
2023
- 2023-03-27 CN CN202320623819.8U patent/CN219786874U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |