CN219778843U - Wafer etching pretreatment device - Google Patents
Wafer etching pretreatment device Download PDFInfo
- Publication number
- CN219778843U CN219778843U CN202321248844.9U CN202321248844U CN219778843U CN 219778843 U CN219778843 U CN 219778843U CN 202321248844 U CN202321248844 U CN 202321248844U CN 219778843 U CN219778843 U CN 219778843U
- Authority
- CN
- China
- Prior art keywords
- rotating disc
- wafer
- negative pressure
- motor
- water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000005530 etching Methods 0.000 title claims abstract description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 52
- 230000007246 mechanism Effects 0.000 claims abstract description 32
- 238000005507 spraying Methods 0.000 claims abstract description 14
- 238000001179 sorption measurement Methods 0.000 claims abstract description 5
- 235000012431 wafers Nutrition 0.000 claims description 51
- 239000007921 spray Substances 0.000 claims description 9
- 230000003044 adaptive effect Effects 0.000 claims 1
- 238000007781 pre-processing Methods 0.000 claims 1
- 238000004140 cleaning Methods 0.000 description 9
- 239000007788 liquid Substances 0.000 description 6
- 230000009471 action Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The utility model relates to the technical field of wafer pretreatment, and provides a wafer etching pretreatment device, which comprises a collecting box, wherein the top of the collecting box is arranged in an open manner, and the wafer etching pretreatment device further comprises: the adsorption mechanism comprises a fixed plate, a rotating disc, a first motor, a negative pressure machine and a connecting pipe, wherein the fixed plate is longitudinally and fixedly arranged at the top of the collecting box, the rotating disc is longitudinally arranged and is rotationally connected with the fixed plate, a cavity is formed in the rotating disc, a plurality of negative pressure holes communicated with the cavity are formed in the outer surface of the rotating disc, the first motor is used for controlling the rotating disc to rotate, the negative pressure machine is arranged on the ground, a first end of the connecting pipe is communicated with a negative pressure port of the negative pressure machine, and a second end of the connecting pipe is communicated with the cavity; the grinding mechanism is used for grinding the surface of the wafer; and the water spraying mechanism is used for spraying water to the surface of the wafer.
Description
Technical Field
The utility model relates to the technical field of wafer pretreatment, in particular to a wafer etching pretreatment device.
Background
The wafer needs to be pre-processed before etching. The most important pretreatment is grinding and cleaning of the wafer. The Chinese patent with the publication number of CN210837700U discloses a wafer etching pretreatment device which can grind and clean a wafer at the same time, thereby saving the time consumed by pretreatment. However, the cleaning solution cannot be discharged when the device is used, and is easily accumulated on the surface of the wafer, so that the wafer is inconvenient to take out by a worker.
Disclosure of Invention
In view of the defects in the prior art, the utility model aims to provide a wafer etching pretreatment device, which can save the time consumed by pretreatment and prevent cleaning liquid from accumulating on the surface of a wafer.
In order to achieve the above object, the present utility model is realized by the following technical scheme: the wafer etching pretreatment device comprises a collection box, wherein the top of the collection box is provided with an opening, and the wafer etching pretreatment device further comprises:
the adsorption mechanism comprises a fixed plate, a rotating disc, a first motor, a negative pressure machine and a connecting pipe, wherein the fixed plate is longitudinally and fixedly arranged at the top of the collecting box, the rotating disc is longitudinally arranged and is rotationally connected with the fixed plate, a cavity is formed in the rotating disc, a plurality of negative pressure holes communicated with the cavity are formed in the outer surface of the rotating disc, the first motor is used for controlling the rotating disc to rotate, the negative pressure machine is arranged on the ground, a first end of the connecting pipe is communicated with a negative pressure port of the negative pressure machine, and a second end of the connecting pipe is communicated with the cavity;
the grinding mechanism is used for grinding the surface of the wafer; and
and the water spraying mechanism is used for spraying water on the surface of the wafer.
Further, the grinding mechanism comprises a guide rod, a sliding block, a screw rod, a second motor, a mounting plate, a grinding disc and a third motor;
the guide rod is arranged transversely and fixedly connected with the fixing plate, the sliding block is arranged on the guide rod and is in sliding connection with the guide rod, the screw rod transversely penetrates through the sliding block transversely and is rotationally connected with the fixing plate at two ends, the screw rod is in threaded connection with the sliding block, the second motor is used for controlling the screw rod to rotate, the mounting plate is arranged transversely and is fixedly connected with the sliding block, the grinding disc is arranged on the inner side of the mounting plate and is rotationally connected with the mounting plate, and the third motor is used for controlling the grinding disc to rotate.
Further, the water spraying mechanism comprises a fixed pipe, a water tank and a water pump, wherein the fixed pipe is transversely arranged and fixedly connected with the collecting box, a plurality of spray heads are fixedly installed on the fixed pipe, the spray heads face the rotating disc, the water tank is arranged on the ground, the water pump is fixedly installed on the water tank, a water inlet of the water pump is communicated with the water tank, and a water outlet of the water pump is communicated with the fixed pipe.
Further, the surface of the rotating disc is fixedly provided with a plurality of positioning columns which are arranged at intervals along the circumferential direction, a plurality of spacing spaces are formed between the positioning columns and the rotating disc, and the spacing spaces are adapted to the wafers.
Further, a sponge cushion is sleeved on the positioning column.
Further, the number of the positioning columns is 15.
The utility model has the beneficial effects that: the wafer etching pretreatment device provided by the utility model can grind and clean the wafer at the same time, so that the time consumed by pretreatment can be saved. And because the wafer is adsorbed on the rotating disc through the negative pressure port, the wafer always keeps a vertical state, so that cleaning liquid can fall into the collecting tank and cannot be accumulated on the surface of the wafer.
Drawings
FIG. 1 is a schematic perspective view of the present utility model at a first viewing angle;
FIG. 2 is an enlarged schematic view of the portion A in FIG. 1;
FIG. 3 is a schematic perspective view of the present utility model at a second view angle;
fig. 4 is a schematic elevational view of the present utility model.
Reference numerals: 10-collecting box, 20-adsorption mechanism, 21-fixed plate, 22-rotating disk, 23-first motor, 24-negative pressure machine, 25-connecting pipe, 26-reference column, 27-negative pressure port, 30-grinding mechanism, 31-guide bar, 32-slide block, 33-lead screw, 34-second motor, 35-mounting plate, 36-grinding disk, 37-third motor, 40-water spraying mechanism, 41-fixed pipe, 42-water tank, 43-water pump, 44-first pipeline, 45-second pipeline, 46-shower nozzle.
Detailed Description
The utility model is further described in connection with the following detailed description, in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the utility model easy to understand.
In the present utility model, unless explicitly specified and limited otherwise, the terms "connected," "fixed" and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
In the description of the present utility model, it should be understood that the terms "longitudinal," "transverse," "horizontal," "top," "bottom," "upper," "lower," "inner" and "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate description of the present utility model and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. In the description of the present utility model, the meaning of "plurality" is two or more unless specifically defined otherwise.
As shown in fig. 1 to 4, the present utility model provides a wafer etching pretreatment device, which comprises a collecting box 10, wherein the top of the collecting box 10 is arranged in an open manner, and further comprises an adsorption mechanism 20, a grinding mechanism 30 and a water spraying mechanism 40.
The suction mechanism 20 includes a fixed plate 21, a rotary plate 22, a first motor 3423, a negative pressure machine 24, and a connection pipe 25. The fixing plate 21 is fixedly installed at the top of the collecting tank 10 in the longitudinal direction. The rotating disk 22 is disposed longitudinally and is rotatably connected to the fixed plate 21. The rotary disc 22 has a cavity formed therein, and the outer surface of the rotary disc 22 is provided with a plurality of negative pressure holes communicating with the cavity. The first motor 3423 is fixedly installed on the fixed plate 21 for controlling the rotation of the rotating disc 22, and the first motor 3423 is electrically connected with the external control cabinet. The negative pressure machine 24 is disposed on the ground and electrically connected to an external control cabinet. The first end of the connecting pipe 25 is communicated with a negative pressure port 27 of the negative pressure machine 24, and the second end of the connecting pipe 25 is communicated with the cavity.
The polishing mechanism 30 is used for polishing the wafer surface.
The water spraying mechanism 40 is used to spray water onto the wafer surface.
The device comprises the following specific use processes: firstly, a worker controls the negative pressure machine 24 to start through an external control cabinet, the negative pressure machine 24 forms negative pressure at the negative pressure port 27 through the connecting pipe 25 and the cavity, and the worker can place the wafer on the rotating disc 22 at the moment. Then, the worker controls the first motor 3423, the grinding mechanism 30 and the water spraying mechanism 40 to start simultaneously through the external control cabinet, the first motor 3423 drives the rotating disc 22 and the wafer to rotate, the grinding mechanism 30 grinds the surface of the wafer in the rotating process, and the water spraying mechanism 40 cleans the surface of the ground wafer.
After the use is finished, the external control cabinet controls each part to reset.
The device can grind and clean the wafer at the same time, so that the time consumed by pretreatment can be saved. And because the wafer is adsorbed on the rotating disc 22 through the negative pressure port 27, the wafer always keeps a vertical state, so that under the action of gravity, the cleaning liquid sprayed by the cleaning mechanism falls into the collecting tank 10 and cannot be accumulated on the surface of the wafer.
In one embodiment, the grinding mechanism 30 includes a guide bar 31, a slider 32, a screw 33, a second motor 34, a mounting plate 35, a grinding disk 36, and a third motor 37.
The guide rod 31 is provided at one side of the rotating disc 22 in the lateral direction, and both ends are fixedly connected with the fixing plate 21. The slider 32 is provided on the guide bar 31 and slidably connected to the guide bar 31. The screw 33 passes through the slider 32 in the transverse direction, both ends of the screw 33 are rotatably connected with the fixed plate 21, and the screw 33 is in threaded connection with the slider 32 and is kept parallel with the guide rod 31. A second motor 34 is fixedly mounted on the fixed plate 21 for controlling the rotation of the screw 33. The mounting plate 35 is disposed transversely and fixedly connected to the slider 32. The grinding disk 36 is disposed inside the mounting plate 35 in the longitudinal direction and is rotatably connected to the mounting plate 35. A third motor 37 is fixedly mounted on the mounting plate 35 for controlling rotation of the grinding disc 36, the third motor 37 being electrically connected to an external control cabinet.
In the initial state, the slider 32 and the abrasive disk 36 are away from the rotating disk 22.
When the grinding mechanism 30 is started, a worker controls the third motor 37 to start through the external control cabinet, and the third motor 37 drives the grinding disc 36 to rotate. Then the second motor 34 is controlled by the external control cabinet to start, the second motor 34 drives the screw rod 33 to rotate, and under the action of the guide rod 31, the sliding block 32 and the grinding disc 36 are close to the rotating disc 22, so that the wafer adsorbed on the rotating disc 22 is ground.
The grinding mechanism 30 is simple in structure and convenient to produce and manufacture.
In one embodiment, the water spray mechanism 40 includes a stationary pipe 41, a water tank 42, and a water pump 43. The fixed pipe 41 is arranged transversely and fixedly connected with the collecting box 10, and a plurality of spray heads 46 which are obliquely arranged are fixedly arranged on the fixed pipe 41, and the spray heads 46 face the rotating disc 22. The water tank 42 is disposed on the floor, and the cleaning liquid is contained in the water tank 42. The water pump 43 is fixedly mounted on the water tank 42. The water inlet of the water pump 43 is communicated with the water tank 42 through a first pipeline 44, and the water outlet of the water pump 43 is communicated with the fixed pipe 41 through a second pipeline 45.
When the water spraying mechanism 40 is started, a worker controls the water pump 43 to start through the external control cabinet, the water pump 43 pumps the cleaning liquid in the water tank 42 into the fixed pipe 41, and then the cleaning liquid is sprayed onto the wafer through the plurality of spray heads 46, so that the wafer is cleaned.
In one embodiment, the surface of the rotating disc 22 is fixedly provided with a plurality of positioning columns 26 which are arranged at intervals along the circumferential direction, and a limiting space is formed between the positioning columns 26 and the rotating disc 22 and is suitable for the wafer. The length of the fixed column is smaller than the thickness of the wafer.
The positioning posts 26 are designed to facilitate the alignment of the wafer with the vacuum port 27 by a worker to thereby attach the wafer to the turntable 22. On the other hand can also support the wafer, further prevent that the wafer from dropping.
In one embodiment, the positioning posts 26 are sleeved with foam pads to protect the wafer.
In one embodiment, the number of positioning posts 26 is 15.
While the fundamental and principal features of the utility model and advantages of the utility model have been shown and described, it will be apparent to those skilled in the art that the utility model is not limited to the details of the foregoing exemplary embodiments, but may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art.
Claims (6)
1. The utility model provides a wafer etching preprocessing device, includes the collecting box, the open setting in top of collecting box, its characterized in that: further comprises:
the adsorption mechanism comprises a fixed plate, a rotating disc, a first motor, a negative pressure machine and a connecting pipe, wherein the fixed plate is longitudinally and fixedly arranged at the top of the collecting box, the rotating disc is longitudinally arranged and is rotationally connected with the fixed plate, a cavity is formed in the rotating disc, a plurality of negative pressure holes communicated with the cavity are formed in the outer surface of the rotating disc, the first motor is used for controlling the rotating disc to rotate, the negative pressure machine is arranged on the ground, a first end of the connecting pipe is communicated with a negative pressure port of the negative pressure machine, and a second end of the connecting pipe is communicated with the cavity;
the grinding mechanism is used for grinding the surface of the wafer; and
and the water spraying mechanism is used for spraying water on the surface of the wafer.
2. A wafer etching pretreatment device according to claim 1, wherein: the grinding mechanism comprises a guide rod, a sliding block, a screw rod, a second motor, a mounting plate, a grinding disc and a third motor;
the guide rod is arranged transversely and fixedly connected with the fixing plate, the sliding block is arranged on the guide rod and is in sliding connection with the guide rod, the screw rod transversely penetrates through the sliding block transversely and is rotationally connected with the fixing plate at two ends, the screw rod is in threaded connection with the sliding block, the second motor is used for controlling the screw rod to rotate, the mounting plate is arranged transversely and is fixedly connected with the sliding block, the grinding disc is arranged on the inner side of the mounting plate and is rotationally connected with the mounting plate, and the third motor is used for controlling the grinding disc to rotate.
3. A wafer etching pretreatment device according to claim 1, wherein: the water spraying mechanism comprises a fixed pipe, a water tank and a water pump, wherein the fixed pipe is transversely arranged and fixedly connected with the collecting box, a plurality of spray heads are fixedly installed on the fixed pipe, the spray heads face the rotating disc, the water tank is arranged on the ground, the water pump is fixedly installed on the water tank, a water inlet of the water pump is communicated with the water tank, and a water outlet of the water pump is communicated with the fixed pipe.
4. A wafer etching pretreatment device according to claim 1, wherein: the surface of the rotating disc is fixedly provided with a plurality of positioning columns which are arranged at intervals along the circumferential direction, a plurality of positioning columns and the rotating disc are provided with limiting spaces, and the limiting spaces are adaptive to the wafers.
5. The wafer etching pretreatment device according to claim 4, wherein: and the locating column is sleeved with a sponge cushion.
6. The wafer etching pretreatment device according to claim 4, wherein: the number of the positioning columns is 15.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321248844.9U CN219778843U (en) | 2023-05-23 | 2023-05-23 | Wafer etching pretreatment device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321248844.9U CN219778843U (en) | 2023-05-23 | 2023-05-23 | Wafer etching pretreatment device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219778843U true CN219778843U (en) | 2023-09-29 |
Family
ID=88109298
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321248844.9U Active CN219778843U (en) | 2023-05-23 | 2023-05-23 | Wafer etching pretreatment device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219778843U (en) |
-
2023
- 2023-05-23 CN CN202321248844.9U patent/CN219778843U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN210704035U (en) | Toughened glass edging equipment | |
| CN219778843U (en) | Wafer etching pretreatment device | |
| CN210173218U (en) | Grinding device is used in flange production | |
| CN207736047U (en) | A kind of stripping aspherical lens polishing machine | |
| CN217016761U (en) | A grinder for soil sample analysis | |
| JP4728977B2 (en) | Substrate double-side polishing machine with surface plate cleaning device | |
| CN212944288U (en) | Fixing device for cleaning rectifying tube seat of automobile | |
| CN217194365U (en) | Semiconductor silicon wafer grinding device | |
| CN212238281U (en) | Fire hose cleaning equipment convenient to adjust | |
| CN213383028U (en) | Printing head cleaning device for ink-jet 3D printer | |
| CN208451340U (en) | A kind of Combined polisher | |
| CN209717337U (en) | A kind of burnishing device of large-scale spiral pipe end | |
| CN210386753U (en) | Stainless steel ice cube strorage device | |
| CN221135434U (en) | Polishing device for castings | |
| CN214817601U (en) | Safety protection type burnishing device is used in image shell processing of backing a car | |
| CN207629790U (en) | A kind of quartzite slate surface grinding device | |
| CN214135214U (en) | Centerless grinding machine for machining precision bearing | |
| CN218747012U (en) | Grinding fluid spraying device for semiconductor wafer grinding machine | |
| CN219170585U (en) | Grinding pad trimming equipment | |
| CN211099364U (en) | Vertical sand mill of circulation improved generation | |
| CN218397408U (en) | Horizontal glass straight edge grinding machine | |
| CN210452337U (en) | Liquid scraping device of double-sided grinding machine | |
| CN215588734U (en) | Surface polishing device for processing conical pressure head of hardness tester | |
| CN213702747U (en) | External steel structure grinding device for storage tank | |
| CN215239754U (en) | Outer circle small grinding machine for producing rubber ring frame |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |