CN219778095U

CN219778095U - Leveling mechanism and leveling laminating device

Info

Publication number: CN219778095U
Application number: CN202320967378.3U
Authority: CN
Inventors: 郑吉龙; 钟夏华; 魏纯; 洪彪
Original assignee: Silicon Electric Semiconductor Equipment Shenzhen Co ltd
Current assignee: Silicon Electric Semiconductor Equipment Shenzhen Co ltd
Priority date: 2023-04-18
Filing date: 2023-04-18
Publication date: 2023-09-29
Anticipated expiration: 2033-04-18

Abstract

The utility model discloses a leveling mechanism and a leveling attaching device, wherein the leveling mechanism comprises a base, a wafer bearing table, a radial spherical plain bearing and a connecting piece; the base is formed with the holding tank towards the one end of holding piece platform, and radial joint bearing installs in the holding tank with sealing, and radial joint bearing is formed with the cavity with the bottom of holding tank, and the gas sucking hole intercommunication cavity has been seted up to the base, and the movable part and the radial joint bearing sealing connection of stretching into radial joint bearing of one end of connecting piece, the other end and the holding piece platform of connecting piece are connected. The leveling mechanism can finish leveling alignment with high precision and high efficiency, does not hurt a substrate and a mask plate in the leveling process, and ensures stable and high-quality exposure effect.

Description

Leveling mechanism and leveling laminating device

Technical Field

The utility model relates to the technical field of contact type exposure machine equipment, in particular to a leveling mechanism and a leveling and attaching device.

Background

In contact exposure, the leveling and attaching device for the substrate gluing surface and the mask pattern surface is a core component of equipment, and requires that the substrate and the mask are tightly attached, and the equipment can finish leveling and aligning with high precision and high efficiency, and does not damage the substrate and the mask in the leveling process.

Currently, three-point leveling mechanisms and air-float bowl leveling mechanisms exist in existing leveling mechanisms in contact exposure equipment. The three-point leveling mechanism needs to be adjusted repeatedly point by point, so that the leveling difficulty is high, the leveling efficiency is low, and the precision is not high; while the air-float bowl leveling mechanism has high leveling efficiency, when the air-float bowl leveling mechanism is switched to negative pressure, the leveling precision is not high easily because the air flow is unstable or the center of mass of the ball bowl is not in the center of the ball bowl.

In view of the foregoing, it is desirable to provide a new leveling mechanism and leveling attachment device that address or at least alleviate the above-mentioned drawbacks.

Disclosure of Invention

The utility model mainly aims to provide a leveling mechanism and a leveling attaching device, and aims to solve the technical problems of lower leveling efficiency and poorer precision in the prior art.

In order to achieve the above object, according to one aspect of the present utility model, there is provided a leveling mechanism for placing a substrate to level with a reticle, the leveling mechanism including a base, a wafer support, a radial spherical plain bearing, and a connecting member; the base is towards the one end of carrying the piece platform is formed with the holding tank, the radial spherical plain bearing install in with being sealed in the holding tank, the radial spherical plain bearing with the bottom of holding tank is formed with the cavity, the gas vent intercommunication has been seted up to the base the cavity, the one end of connecting piece stretches into the movable part of radial spherical plain bearing with radial spherical plain bearing sealing connection, the other end of connecting piece with the carrying piece platform is connected.

In an embodiment, the radial spherical plain bearing further comprises a fixing portion, an outer wall surface of the fixing portion and an inner wall surface of the accommodating groove are arranged in a sealing mode, an inward concave arc surface is formed on the fixing portion, the movable portion is rotatably arranged in the fixing portion, and the outer wall surface of the movable portion and the arc surface are in sealing fit with each other.

In an embodiment, the radial spherical plain bearing further comprises a sealing ring, the outer wall surface of the fixing portion is provided with an annular sealing groove, the sealing ring is partially clamped into the sealing groove, and the other end of the sealing ring is abutted against the inner wall surface of the accommodating groove.

In an embodiment, the connecting piece includes interconnect's stretching into portion and butt portion, the movable part is formed with the mounting hole, stretch into the portion and keep away from the one end of butt portion stretches into the mounting hole, the diameter of butt portion is greater than stretch into the diameter of portion, the butt portion deviate from stretch into one side of portion with the spangle table is connected.

In an embodiment, the leveling mechanism further comprises a limiting ring, the limiting rings are arranged on the periphery of the extending portion at intervals, the lower side of each limiting ring is connected with the upper end face of the base, and a rotating gap is formed between each limiting ring and the corresponding abutting portion.

In an embodiment, the leveling mechanism further comprises a sealing seat, the sealing seat is arranged in the cavity, the diameter of the sealing seat is larger than that of the mounting hole, and the sealing seat is in sealing connection with the movable portion.

In an embodiment, the wafer carrying platform is provided with a plurality of air holes, and the air holes are used for being connected with an air blowing source or a vacuum generator so as to blow or adsorb the substrate placed on the wafer carrying platform.

In an embodiment, the leveling mechanism further comprises a pressure sensor, and the pressure sensor is arranged on one side of the base, which is away from the wafer carrying table, and is connected with the base.

In an embodiment, the pressure sensor is provided with a sensing sub-piece and an external connector, the sensing sub-piece is abutted with the base, and the external connector is in communication connection with the sensing sub-piece.

According to another aspect of the utility model, the utility model further provides a leveling and attaching device, which comprises the leveling mechanism, a lifting mechanism and a mask plate, wherein the mask plate is fixedly arranged above the wafer bearing table, and the lifting mechanism is connected with the leveling mechanism to drive the leveling mechanism to ascend or descend.

According to the technical scheme, the radial spherical plain bearing is connected with the wafer carrying platform through the connecting piece, under the action of external force, the radial spherical plain bearing can rotate and drive the wafer carrying platform to rotate at any angle, the mask plate is fixed above the wafer carrying platform, the substrate is placed on the wafer carrying platform, and the substrate is driven to approach the mask plate and gradually contact with the mask plate through driving the leveling mechanism to integrally move upwards; in the contact process, the angle of the wafer bearing table is automatically and continuously adjusted by the radial spherical plain bearing according to the pressure applied on the substrate, and finally the substrate is parallel to and closely contacted with the mask plate; and then the external vacuum generator is connected with the air suction hole, the cavity where the centripetal joint bearing is positioned is vacuumized, the movable part inside the centripetal joint bearing is pulled downwards, a certain retaining force is formed by friction force, the rotation of the centripetal joint bearing is limited, and the leveling action is finished, so that the parallel adjustment of the substrate and the mask plate is quickly and effectively realized. The utility model can finish leveling alignment with high precision and high efficiency, does not hurt the substrate and the mask plate in the leveling process, and ensures stable and high-quality exposure effect.

Drawings

In order to more clearly illustrate the embodiments of the utility model or the technical solutions of the prior art, the following brief description will be given of the drawings required for the description of the embodiments or the prior art, it being obvious that the drawings in the following description are only some embodiments of the utility model, and that other drawings may be obtained from the structures shown in these drawings without the need for inventive effort for a person skilled in the art.

FIG. 1 is a schematic perspective view of a leveling mechanism according to an embodiment of the present utility model;

FIG. 2 is an exploded view of a leveling mechanism according to an embodiment of the present utility model;

figure 3 is a cross-sectional view of a leveling mechanism, substrate and reticle in accordance with an embodiment of the utility model.

Reference numerals illustrate:

the achievement of the objects, functional features and advantages of the present utility model will be further described with reference to the accompanying drawings, in conjunction with the embodiments.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

It should be noted that all directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present utility model are merely used to explain the relative positional relationship, movement, etc. between the components in a particular posture (as shown in the drawings), and if the particular posture is changed, the directional indicator is changed accordingly.

Furthermore, descriptions such as those referred to as "first," "second," and the like, are provided for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implying an order of magnitude of the indicated technical features in the present disclosure. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present utility model, the meaning of "plurality" is at least two groups, for example, two groups, three groups, etc., unless explicitly specified otherwise.

In the present utility model, unless specifically stated and limited otherwise, the terms "connected," "affixed," and the like are to be construed broadly, and for example, "affixed" may be a fixed connection, a removable connection, or an integral body; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or in communication with each other within two sets of elements or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In addition, the technical solutions of the embodiments of the present utility model may be combined with each other, but it is necessary to be based on the fact that those skilled in the art can implement the technical solutions, and when the technical solutions are contradictory or cannot be implemented, the combination of the technical solutions should be considered as not existing, and not falling within the scope of protection claimed by the present utility model.

Referring to fig. 1 to 3, according to an aspect of the present utility model, a leveling mechanism 100 is provided for placing a substrate 110 to level with a reticle 120, the leveling mechanism 100 includes a base 1, a wafer carrier 2, a radial spherical plain bearing 3, and a connecting member 4; one end of the base 1 facing the wafer bearing platform 2 is provided with a containing groove 11, the radial spherical plain bearing 3 is hermetically arranged in the containing groove 11, the radial spherical plain bearing 3 and the bottom of the containing groove 11 are provided with a cavity 12, the base 1 is provided with an air suction hole 13 communicated with the cavity 12, one end of the connecting piece 4 stretches into a movable part 31 of the radial spherical plain bearing 3 to be hermetically connected with the radial spherical plain bearing 3, and the other end of the connecting piece 4 is connected with the wafer bearing platform 2.

In the above embodiment, the radial spherical plain bearing 3 is connected with the wafer carrying platform 2 through the connecting piece 4, under the action of external force, the radial spherical plain bearing 3 can rotate and drive the wafer carrying platform 2 to rotate at any angle, the mask plate 120 is fixed above the wafer carrying platform 2, the substrate 110 is placed on the wafer carrying platform 2, and the substrate 110 is driven to approach the mask plate 120 and gradually contact with the mask plate 120 by driving the leveling mechanism 100 to move upwards integrally; in the contact process, the angle of the wafer bearing table 2 is automatically and continuously adjusted by the radial spherical plain bearing 3 according to the pressure applied on the substrate 110, and finally the substrate 110 is parallel to and closely contacted with the mask 120; and then the external vacuum generator is connected with the air suction hole 13, the cavity 12 where the radial joint bearing 3 is positioned is vacuumized, the movable part 31 inside the radial joint bearing 3 is pulled downwards, a certain retaining force is formed by friction force, the rotation of the radial joint bearing 3 is limited, and the leveling action is finished, so that the parallel adjustment of the substrate 110 and the mask 120 is quickly and effectively realized. The embodiment can finish leveling alignment with high precision and high efficiency, does not damage the substrate 110 and the mask 120 during leveling, and ensures stable and high-quality exposure effect. Specifically, the wafer support 2 is provided with a plurality of air holes 21, and the air holes 21 are used for connecting an air blowing source or a vacuum generator to blow or adsorb the substrate 110 placed on the support. When in operation, the substrate 110 is placed on the leveled substrate carrying table 2, and the substrate 110 placed on the substrate carrying table 2 is adsorbed in vacuum through the air holes 21, so that the placement is more stable; then, after the mask plate 120 and the mark point of the substrate 110 are aligned and matched through the camera (namely, datum points), the leveling mechanism 100 and the substrate 110 placed on the substrate carrying platform 2 are driven to integrally move upwards, and after the substrate 110 is attached to the mask plate 120, the substrate carrying platform 2 blows air to enable the substrate 110 to be attached to the mask plate 120 more closely.

In one embodiment, the leveling mechanism 100 further includes a pressure sensor 6, where the pressure sensor 6 is disposed on a side of the base 1 facing away from the wafer carrier 2 and is connected to the base 1. The pressure sensor 6 may be used to connect with a lifting mechanism, and the lifting mechanism drives the pressure sensor 6 to rise or fall, so as to realize the automatic lifting of the whole leveling mechanism 100. Specifically, the pressure sensor 6 is provided with a sensor sub-member 62 and an external connection joint 63, the sensor sub-member 62 is abutted against the base 1, and the external connection joint 63 is in communication connection with the sensor sub-member 62. The bonding pressure between the substrate 110 and the wafer support 2 reaches a preset pressure value by adjusting the height of the wafer support 2 and the feedback information of the sensor sub-assembly 62.

In an embodiment, referring to fig. 2 and 3, the radial spherical plain bearing 3 further includes a fixing portion 32, an outer wall surface of the fixing portion 32 is sealed with an inner wall surface of the accommodating groove 11, the fixing portion 32 is formed with an inner concave arc surface, the movable portion 31 is rotatably disposed in the fixing portion 32, and the outer wall surface of the movable portion 31 and the arc surface are sealed and adhered to each other. The movable portion 31 can rotate within the fixed portion 32 by any angle, so that the carrier 2 and the substrate 110 can rotate to an angle flat against the reticle 120. Typically, the reticle 120 is positioned horizontally above the leveling mechanism 100.

In one embodiment, referring to fig. 2, in order to improve the sealing performance between the fixing portion 32 and the accommodating groove 11, the radial spherical plain bearing 3 further includes a seal ring 33, an annular seal groove 321 is formed on an outer wall surface of the fixing portion 32, the seal ring 33 is partially engaged in the seal groove 321, and the other end of the seal ring 33 abuts against an inner wall surface of the accommodating groove 11.

In an embodiment, referring to fig. 2 and 3, the connecting member 4 includes an extending portion 41 and an abutting portion 42 connected to each other, the movable portion 31 is formed with a mounting hole, one end of the extending portion 41 away from the abutting portion 42 extends into the mounting hole, the diameter of the abutting portion 42 is larger than that of the extending portion 41, and one side of the abutting portion 42 away from the extending portion 41 is connected to the carrying platform 2. The extending portion 41 is connected with the mounting hole in a sealing manner, and the abutting portion 42 is used for reducing the pressure applied when the wafer carrying platform 2 is contacted with the mask 120.

Specifically, the leveling mechanism 100 further includes a stop collar 51, the stop collar 51 is disposed at intervals on the outer periphery of the extending portion 41, and does not interfere with deflection of the extending portion 41, and the lower side of the stop collar 51 is connected with the upper end face of the base 1, and a rotation gap is formed between the stop collar 51 and the abutting portion 42. The limiting ring 51 is configured to cooperate with the abutment 42, so as to limit the excessive rotation angle of the abutment 42.

In an embodiment, the leveling mechanism 100 further includes a sealing seat 52, the sealing seat 52 is disposed in the cavity 12, the diameter of the sealing seat 52 is larger than the diameter of the mounting hole, and the sealing seat 52 is in sealing connection with the movable portion 31. The sealing seat 52 is used for sealing the lower end of the radial spherical plain bearing 3, so that the sealing performance of the cavity 12 is better, vacuum can be formed, and the position of the flat-attached wafer bearing table 2 is fixed more accurately. The extending portion 41 and the sealing seat 52 may be screwed (fastening manner similar to a screw and a nut), and the extending portion 41 is fixed on the movable portion 31 by the sealing seat 52 screwed thereto.

According to another aspect of the present utility model, the present utility model further provides a leveling and attaching device, where the leveling and attaching device includes the leveling mechanism 100 as above, and further includes a lifting mechanism and a mask 120, where the mask 120 is fixedly disposed above the wafer carrier 2, and the lifting mechanism is connected to the leveling mechanism 100 to drive the leveling mechanism 100 to rise or fall. The specific structure of the leveling mechanism 100 refers to the above embodiment, and since the leveling attaching device adopts all the technical solutions of the above embodiment, the leveling attaching device has at least all the beneficial effects brought by the technical solutions of the above embodiment, and will not be described in detail herein.

The foregoing description of the preferred embodiments of the present utility model should not be construed as limiting the scope of the utility model, but rather should be understood to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the utility model as defined by the following description and drawings or any application directly or indirectly to other relevant art(s).

Claims

1. The leveling mechanism is used for placing the substrate to level with the mask plate and is characterized by comprising a base, a wafer bearing table, a centripetal joint bearing and a connecting piece; the base is towards the one end of carrying the piece platform is formed with the holding tank, the radial spherical plain bearing install in with being sealed in the holding tank, the radial spherical plain bearing with the bottom of holding tank is formed with the cavity, the gas vent intercommunication has been seted up to the base the cavity, the one end of connecting piece stretches into the movable part of radial spherical plain bearing with radial spherical plain bearing sealing connection, the other end of connecting piece with the carrying piece platform is connected.

2. The leveling mechanism according to claim 1, wherein the radial spherical plain bearing further comprises a fixing portion, an outer wall surface of the fixing portion is in sealing arrangement with an inner wall surface of the accommodating groove, the fixing portion is formed with an inward concave arc surface, the movable portion is rotatably arranged in the fixing portion, and the outer wall surface of the movable portion and the arc surface are in sealing fit with each other.

3. The leveling mechanism as recited in claim 2 wherein said radial spherical plain bearing further comprises a seal ring, an annular seal groove is provided on an outer wall surface of said fixing portion, said seal ring is partially engaged in said seal groove, and the other end of said seal ring abuts against an inner wall surface of said receiving groove.

4. The leveling mechanism of claim 1, wherein the connecting member comprises an extending portion and an abutting portion which are connected with each other, the movable portion is formed with a mounting hole, one end of the extending portion away from the abutting portion extends into the mounting hole, the diameter of the abutting portion is larger than that of the extending portion, and one side of the abutting portion away from the extending portion is connected with the carrying platform.

5. The leveling mechanism of claim 4, further comprising a stop ring, wherein the stop ring is disposed at intervals on the outer periphery of the extending portion, the lower side of the stop ring is connected with the upper end surface of the base, and a rotation gap is formed between the stop ring and the abutting portion.

6. The leveling mechanism of claim 5, further comprising a seal seat disposed within the cavity, the seal seat having a diameter greater than the diameter of the mounting hole, and the seal seat being in sealing connection with the movable portion.

7. The leveling mechanism as claimed in any one of claims 1 to 6, wherein a plurality of air holes are formed in the wafer carrier, and the air holes are used for connecting an air blowing source or a vacuum generator to blow or adsorb a substrate placed on the wafer carrier.

8. The leveling mechanism of any one of claims 1 to 6, further comprising a pressure sensor disposed on a side of the base facing away from the wafer carrier and coupled to the base.

9. The leveling mechanism of claim 8, wherein the pressure sensor is provided with a sensing subassembly that abuts the base and an external connector that is communicatively coupled to the sensing subassembly.

10. The leveling and attaching device is characterized by comprising the leveling mechanism as claimed in any one of claims 1-9, and further comprising a lifting mechanism and a mask plate, wherein the mask plate is fixedly arranged above the wafer carrying table, and the lifting mechanism is connected with the leveling mechanism to drive the leveling mechanism to ascend or descend.