CN219774794U - Special-shaped sealing piece applied to semiconductor equipment - Google Patents
Special-shaped sealing piece applied to semiconductor equipment Download PDFInfo
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- CN219774794U CN219774794U CN202320937886.7U CN202320937886U CN219774794U CN 219774794 U CN219774794 U CN 219774794U CN 202320937886 U CN202320937886 U CN 202320937886U CN 219774794 U CN219774794 U CN 219774794U
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- special
- lip
- sealing piece
- shaped
- valve plate
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- 238000007789 sealing Methods 0.000 title claims abstract description 51
- 239000004065 semiconductor Substances 0.000 title claims abstract description 23
- 238000007906 compression Methods 0.000 abstract description 8
- 230000006835 compression Effects 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 6
- 239000000463 material Substances 0.000 abstract description 5
- 238000011084 recovery Methods 0.000 abstract description 3
- 230000007774 longterm Effects 0.000 description 4
- 239000007789 gas Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
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- Gasket Seals (AREA)
Abstract
The special-shaped sealing piece for the semiconductor equipment is provided by the utility model, and the special-shaped sealing piece is arranged to replace the original gate valve plate or pendulum valve plate to finish sealing, so that the special-shaped sealing piece can be more suitable for the working condition of a small cavity or a designed mature cavity valve plate; the lip-shaped edge is adopted to effectively prolong the service life of the sealing element in the process of frequently opening and closing the cavity door; meanwhile, the material is made of perfluororubber with low compression set, and the recovery deformation is good after compression; the clamping groove boss is additionally arranged at the outer circle of the product, so that the problem that the large ring can collapse in the middle after being installed is solved, and the sealing ring is ensured to be uniformly pressed everywhere after being installed.
Description
Technical Field
The utility model relates to the field of sealing, in particular to a special-shaped sealing piece applied to semiconductor equipment.
Background
A cavity door connecting sealing structure is arranged between a reaction cavity and a transmission cavity of the semiconductor device, and the cavity door connecting sealing structure mainly adopts a gate valve plate or a pendulum valve plate.
The inventor of the utility model discovers that when the pendulum valve is installed, the sealing surface needs to extend out of the valve block, and the occupied space is larger; the valve plate of the gate valve also needs to extend out of the valve block to form a sealing surface, so that the occupied space is larger; in the working condition of the small cavity or the designed mature cavity valve plate, the gate valve plate or the pendulum valve plate occupies a large space, so that the normal pendulum valve plate and the gate valve plate cannot be normally installed and used once the space is limited or interference with other components is needed to be avoided. Therefore, it is necessary to develop a profile seal applied to a semiconductor device.
Disclosure of Invention
The utility model aims to solve the problems and provide the special-shaped sealing piece for the semiconductor equipment, and the special-shaped sealing piece is arranged to replace the original gate valve plate or pendulum valve plate to finish sealing, so that the special-shaped sealing piece can be more suitable for the working condition of a small cavity or a designed mature cavity valve plate.
In order to achieve the above purpose, the present utility model adopts the following technical scheme.
The special-shaped sealing piece applied to the semiconductor equipment comprises a sealing piece body, wherein a clamping groove boss is arranged at one end of the sealing piece body, and a lip-shaped edge is arranged at the other end of the sealing piece body; the sealing element body adopts a perfluorinated rubber element.
Further, the clamping groove boss is matched with a clamping groove of a cavity.
Further, the direction of the projection of the clamping groove boss is opposite to the direction of the opening of the lip-shaped edge.
Further, the thickness of the lip-shaped edge on the side close to the clamping groove boss is larger than that of the lip-shaped edge on the side far away from the clamping groove boss.
Further, the seal body is annular.
Further, the included angle of the lip-shaped edge is 30-120 degrees.
Further, the included angle of the lip edge is 72 degrees.
The special-shaped sealing piece applied to the semiconductor equipment has the positive effects that:
(1) The special-shaped sealing piece is arranged to replace the original gate valve plate or pendulum valve plate to finish sealing, so that the utility model can be more suitable for the working condition of a small cavity or a designed mature cavity valve plate.
(2) The lip-shaped edge is adopted, so that the service life of the sealing element can be effectively prolonged in the process of frequently opening and closing the cavity door; meanwhile, the material is made of perfluororubber with low compression set, and the recovery deformation is good after compression; the clamping groove boss is added at the outer circle of the product, so that the problem that the large ring can collapse in the middle after being installed is solved, the sealing ring is ensured to be uniformly pressed everywhere after being installed, and the problem that collapse or uneven pressing can not occur at individual positions is avoided; meanwhile, the sealing ring made of the perfluorinated material ensures that various special gases and special liquids in various semiconductor devices cannot influence the surface of the rubber part in the long-term use process, and the long-term service life and excellent appearance performance are met.
Drawings
Fig. 1 is a schematic diagram provided by an embodiment of the present utility model.
Fig. 2 is a usage state diagram provided in an embodiment of the present utility model.
The reference numerals in the figures are respectively:
1. a seal body; 2. a clamping groove boss; 3. a lip edge; 4. an inner cavity; 5. an outer opening and closing door; 6. and (3) mounting a plate.
Detailed Description
Specific embodiments of the present utility model applied to a profile seal for a semiconductor device are given below with reference to the accompanying drawings, but it should be noted that: the embodiments are not intended to limit the practice of the utility model. All similar structures and similar variations using the present utility model should be included in the scope of the present utility model. The following description of the embodiments refers to the accompanying drawings, which illustrate specific embodiments in which the utility model may be practiced. The directional terms mentioned in the embodiments, such as "up", "down", "front", "back", "left", "right", "top", "bottom", etc., refer only to the directions of the attached drawings. Accordingly, directional terminology is used to describe and understand the utility model and is not limiting of the utility model.
See fig. 1 and 2. The special-shaped sealing element applied to the semiconductor equipment comprises a sealing element body 1, wherein a clamping groove boss 2 is arranged at one end of the sealing element body 1, and a lip-shaped edge 3 is arranged at the other end of the sealing element body 1; the sealing element body 1 is made of perfluororubber. The seal body 1 is annular.
The protruding direction of the clamping groove boss 2 is opposite to the opening direction of the lip-shaped edge 3, and the thickness of one side of the lip-shaped edge 3, which is close to the clamping groove boss 2, is larger than the thickness of one side of the lip-shaped edge 3, which is far away from the clamping groove boss 2. The included angle of the lip-shaped edge 3 is 30-120 degrees, and in this embodiment, the included angle of the lip-shaped edge 3 is 72 degrees; in practice, the angle of the lip 3 is dependent on the situation.
The left side is inboard cavity 4, and the right side is outside door 5 that opens and shuts, and the inboard cavity 4 is close to the one side of outside door 5 that opens and shuts and is provided with the draw-in groove, draw-in groove boss 2 and the draw-in groove cooperation on the inboard cavity 4. In this embodiment, the special-shaped sealing member applied to the semiconductor device is fixed by the threaded connection between the mounting plate 6 and the inner cavity 4, and in a specific implementation, other manners may be adopted to fix the special-shaped sealing member applied to the semiconductor device on the inner cavity 4.
In the use process, the outer opening and closing door 5 moves to the inner cavity 4, and the lip-shaped edge 3 is pressed to form a sealing structure. The special-shaped sealing element applied to the semiconductor equipment has the functions of resisting various inflowing gases and liquids, keeping good elasticity for a long time use and the like, wherein the sealing element body 1 is made of low-compression permanent deformation perfluororubber, and has high temperature resistance and good rebound under a long-time compression state; the groove boss can ensure that the sealing element body 1 is uniformly pressed at the installation position. The lip 3 maximally ensures that the limited rebound time is prolonged under the installation of long-time high frequency.
The special-shaped sealing piece is arranged to replace the original gate valve plate or pendulum valve plate to finish sealing, so that the special-shaped sealing piece is more suitable for the working condition of a small cavity or a designed mature cavity valve plate, and the lip-shaped edge 3 is used for effectively prolonging the service life of the sealing piece in the process of frequently opening and closing the cavity door; meanwhile, the material is made of perfluororubber with low compression set, and the recovery deformation is good after compression; the clamping groove boss 2 is added at the outer circle of the product, so that the problem that the large ring collapses in the middle after being installed is solved, the sealing ring is ensured to be uniformly pressed everywhere after being installed, and the problem that collapse or uneven pressing occurs at individual positions is avoided; meanwhile, the sealing ring made of the perfluorinated material ensures that various special gases and special liquids in various semiconductor devices cannot influence the surface of the rubber part in the long-term use process, and the long-term service life and excellent appearance performance are met.
Claims (7)
1. The special-shaped sealing piece applied to the semiconductor equipment is characterized by comprising a sealing piece body, wherein one end of the sealing piece body is provided with a clamping groove boss, and the other end of the sealing piece body is provided with a lip-shaped edge; the sealing element body adopts a perfluorinated rubber element.
2. The shaped seal for use in a semiconductor device as defined in claim 1, wherein the slot boss mates with a slot of a cavity.
3. The shaped seal for use in a semiconductor device as claimed in claim 1, wherein the direction of the projection of the detent boss is opposite to the direction of the lip opening.
4. The profiled seal for semiconductor devices as defined in claim 1, wherein the lip has a greater thickness on a side of the lip proximate the slot boss than on a side of the lip distal from the slot boss.
5. The shaped seal for use in a semiconductor device as defined in claim 1, wherein the seal body is annular.
6. The shaped seal for use in a semiconductor device as claimed in claim 1, wherein the lip has an included angle of 30-120 degrees.
7. The shaped seal for use in a semiconductor device as defined in claim 6, wherein the lip has an included angle of 72 degrees.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202320937886.7U CN219774794U (en) | 2023-04-24 | 2023-04-24 | Special-shaped sealing piece applied to semiconductor equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202320937886.7U CN219774794U (en) | 2023-04-24 | 2023-04-24 | Special-shaped sealing piece applied to semiconductor equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
CN219774794U true CN219774794U (en) | 2023-09-29 |
Family
ID=88106267
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202320937886.7U Active CN219774794U (en) | 2023-04-24 | 2023-04-24 | Special-shaped sealing piece applied to semiconductor equipment |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN219774794U (en) |
-
2023
- 2023-04-24 CN CN202320937886.7U patent/CN219774794U/en active Active
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