CN219766633U - IC chip shaping machine - Google Patents
IC chip shaping machine Download PDFInfo
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- CN219766633U CN219766633U CN202320640553.8U CN202320640553U CN219766633U CN 219766633 U CN219766633 U CN 219766633U CN 202320640553 U CN202320640553 U CN 202320640553U CN 219766633 U CN219766633 U CN 219766633U
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- plate
- fixed
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- shaping
- chip
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- 238000007493 shaping process Methods 0.000 title claims abstract description 44
- 230000000149 penetrating effect Effects 0.000 claims 1
- 230000000630 rising effect Effects 0.000 claims 1
- 239000000725 suspension Substances 0.000 claims 1
- 229920001821 foam rubber Polymers 0.000 description 6
- 230000006378 damage Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000001174 ascending effect Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses an IC chip shaping machine, which comprises a base, a supporting plate, a top plate, a shaping assembly, a first telescopic rod, a placing assembly and a plurality of positioning and clamping devices, wherein the positioning and clamping devices are arranged on the base; the supporting plate is fixed at the right end of the top of the base, and the top plate is fixed at the top of the supporting plate and corresponds to the base; the first telescopic rod is fixed at the top of the base and drives the placing component to move up and down, and the positioning clamping devices are hinged at the top of the placing component. According to the utility model, pins are extruded when the clamping plates are deformed, and meanwhile, the plurality of clamping plates form a cylinder shape, so that the IC pins can be ensured not to deviate, meanwhile, the manpower factor is avoided, and the shaping efficiency is improved; the clamping plate is extruded through the descending of the lifting plate, so that the clamping plate can reshape the IC pins, and meanwhile, when the lifting plate ascends, the clamping plate can be opened to enlarge the space, so that the IC pins can be conveniently inserted.
Description
Technical Field
The utility model relates to the technical field of IC chip production shaping, in particular to an IC chip shaping machine.
Background
Since the IC pins are too many and are typically made of copper, they are relatively soft and a slight lack of care may cause the pins to be bumped and bent, thereby affecting proper use. Therefore, pins need to be trimmed before use of the IC to ensure that they are parallel to each other. In the traditional production process, a person I is required to sort the IC pins by using the pin comb, so that tin coating, assembly and other works of the IC pins in subsequent operation are facilitated.
The hand I finishing has the defects of more human factors, low yield and the like, and meanwhile, the IC pins are easy to damage, so that the IC chip shaping machine is provided.
Disclosure of Invention
The utility model aims to solve the defects in the prior art and provides an IC chip shaper.
In order to achieve the above purpose, the present utility model adopts the following technical scheme:
an IC chip shaping machine comprises a base, a supporting plate, a top plate, a shaping assembly, a first telescopic rod, a placing assembly and a plurality of positioning and clamping devices;
the supporting plate is fixed at the right end of the top of the base, and the top plate is fixed at the top of the supporting plate and corresponds to the base;
the first telescopic rod is fixed at the top of the base and drives the placement component to move up and down, the positioning clamping devices are hinged at the top of the placement component and are divided into two groups, and the two groups of positioning clamping devices are symmetrically arranged with the central axis of the placement component, so that a structure is formed that the placement component pulls the positioning clamping devices to clamp other IC chips when ascending;
the shaping component is fixed at the bottom of the top plate and corresponds to the middle part of the placing component.
Preferably, the placement component comprises an upper frame, a plurality of hanging plates, a bottom plate and a plurality of hinging devices; the bottom plate is fixed at the top of first telescopic link, and a plurality of hanger plate is fixed at the top of bottom plate and divide into two sets of symmetry setting, go up the frame and fix at the top of hanger plate, the spacing through-hole that link up from top to bottom has been seted up at the middle part of going up the frame, a plurality of hinge means all fix at the top of last frame and with location clamping device one-to-one.
Preferably, the hinge device comprises a hinge head and a coil spring, wherein the hinge head is fixed at the top of the upper frame and hinged with the positioning and clamping device, and the coil spring is fixed at the hinged position of the hinge head and the positioning and clamping device.
Preferably, the positioning and clamping device comprises a swing rod, a foam-rubber cushion and a pull rope, wherein the swing rod is hinged on the hinged head and is fixedly connected with the coil spring, the foam-rubber cushion is fixed at one end of the swing rod far away from the hinged head, and the pull rope is fixed at the bottom of the swing rod and downwards extends to penetrate through the upper frame and the bottom plate to be fixedly connected with the base.
Preferably, the shaping assembly comprises a bearing plate, a plurality of clamping plates and a shaping device; the bearing plates are fixed at the bottom of the top plate, the clamping plates are fixed at the bottom of the bearing plates in an annular array, and the shaping device is fixed at the bottom of the top plate and sleeved on the outer side of the clamping plates.
Preferably, the shaping device comprises a second telescopic rod and a lifting plate, wherein the second telescopic rod is fixed on the top plate, the lifting plate is fixed at the bottom of the second telescopic rod and is driven by the second telescopic rod to lift and slide, and a shaping through hole which is vertically communicated is formed in the lifting plate.
Preferably, the thickness of the clamping plate is sequentially thickened from top to bottom, and when the lifting plate descends, the inner wall of the shaping through hole extrudes the clamping plate, so that the clamping plate shapes pins of the IC chip.
The beneficial effects of the utility model are as follows:
1. the pins are extruded through the clamping plates when the clamping plates are deformed, and meanwhile, the clamping plates form a cylinder shape, so that the IC pins can be prevented from deviation, manpower factors are avoided, and shaping efficiency is improved; the clamping plate is extruded through the descending of the lifting plate, so that the clamping plate shapes the IC pins, and meanwhile, when the lifting plate ascends, the clamping plate can be opened, so that the space is enlarged, and the IC pins can be conveniently inserted;
2. the IC chip is clamped and fixed through the swing of the swing rod, so that the IC chip is prevented from swinging during shaping, and bending of the IC chip after shaping is prevented; the clamping damage of the IC chip caused by the swing rod can be avoided through the arrangement of the foam-rubber cushion, and the safety of the IC chip is improved.
Drawings
Fig. 1 is a schematic structural diagram of an IC chip shaper according to the present utility model;
fig. 2 is a schematic diagram of an upper frame structure of an IC chip shaper according to the present utility model;
fig. 3 is a schematic diagram of a coil spring structure of an IC chip shaper according to the present utility model.
In the figure: 1. a base; 2. a support plate; 3. a top plate; 4. a first telescopic rod; 5. an upper frame; 6. a hanger plate; 7. a bottom plate; 8. limiting through holes; 9. a hinge joint; 10. a coil spring; 11. swing rod; 12. a sponge cushion; 13. a pull rope; 14. a receiving plate; 15. a clamping plate; 16. a second telescopic rod; 17. a lifting plate; 18. and shaping the through holes.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.
Embodiment 1, refer to fig. 1 to 3, an IC chip shaper, which comprises a base 1, a support plate 2, a top plate 3, a shaping assembly, a first telescopic rod 4, a placement assembly, and a plurality of positioning and clamping devices;
the supporting plate 2 is fixed at the right end of the top of the base 1, and the top plate 3 is fixed at the top of the supporting plate 2 and corresponds to the base 1;
the first telescopic rod 4 is fixed at the top of the base 1 and drives the placement component to move up and down, the plurality of positioning clamping devices are hinged at the top of the placement component and are divided into two groups, and the two groups of positioning clamping devices are symmetrically arranged with the central axis of the placement component, so that a structure is formed that the placement component pulls the positioning clamping devices to clamp other IC chips when ascending;
the shaping assembly is fixed at the bottom of the top plate 3 and corresponds to the middle part of the placing assembly.
In the embodiment, the fixing of the top plate 3 can be ensured through the arrangement of the supporting plate 2, the top plate 3 is prevented from falling or shaking when being stressed, and the top plate 3 can ensure the installation fixing and the height of the shaping assembly;
the height of the placing component can be adjusted through the arrangement of the first telescopic rod 4, and the positioning and clamping device can be driven to rotate when the placing component is lifted.
In some embodiments of the utility model, the placement assembly comprises an upper frame 5, a plurality of hanger plates 6, a bottom plate 7, a plurality of hinge devices; the bottom plate 7 is fixed at the top of the first telescopic rod 4, the plurality of hanging plates 6 are fixed at the top of the bottom plate 7 and are divided into two groups which are symmetrically arranged, the upper frame 5 is fixed at the top of the hanging plates 6, the middle part of the upper frame 5 is provided with a limiting through hole 8 which is penetrated up and down, and the plurality of hinging devices are fixed at the top of the upper frame 5 and correspond to the positioning and clamping devices one by one;
the hinge device comprises a hinge head 9 and a coil spring 10, wherein the hinge head 9 is fixed at the top of the upper frame 5 and hinged with the positioning and clamping device, and the coil spring 10 is fixed at the hinged position of the hinge head 9 and the positioning and clamping device.
In the embodiment, the IC chip can normally pass through the upper frame 5 and the limiting through hole 8, and the passing IC chip is limited;
the fixing of the bottom plate 7 can be ensured through the arrangement of the hanging plate 6, so that the bottom plate 7 can support the IC chip, and the IC chip can be normally placed;
the normal installation and rotation of the positioning and clamping device can be guaranteed through the arrangement of the hinge joint 9, and meanwhile, the coil spring 10 can drive the positioning and clamping device to reset quickly after the tensile force applied to the positioning and clamping device disappears, so that the positioning of the IC chip is relieved.
In some embodiments of the present utility model, the positioning and clamping device comprises a swing rod 11, a foam-rubber cushion 12 and a pull rope 13, wherein the swing rod 11 is hinged on the hinge 9 and is fixedly connected with the coil spring 10, the foam-rubber cushion 12 is fixed at one end of the swing rod 11 far away from the hinge 9, and the pull rope 13 is fixed at the bottom of the swing rod 11 and extends downwards to penetrate through the upper frame 5 and the bottom plate 7 to be fixedly connected with the base 1.
In the embodiment, the IC chip is clamped and fixed through the swing of the swing rod 11, so that the IC chip is prevented from swinging during shaping, and bending of the IC chip after shaping is prevented; the foam-rubber cushion 12 can prevent the swing rod 11 from causing clamping injury of the IC chip, so that the safety of the IC chip is improved;
the swing rod 11 can be driven to rotate when the swing rod 11 ascends through the arrangement of the pull rope 13, meanwhile, the coil spring 10 is driven to rotate for accumulating force, and the pull rope 13 also has certain elastic capability.
In some embodiments of the utility model, the shaping assembly comprises a receiving plate 14, a plurality of clamping plates 15, a shaping device; the bearing plate 14 is fixed at the bottom of the top plate 3, the plurality of clamping plates 15 are fixed at the bottom of the bearing plate 14 in an annular array, and the shaping device is fixed at the bottom of the top plate 3 and sleeved at the outer sides of the clamping plates 15;
the shaping device comprises a second telescopic rod 16 and a lifting plate 17, wherein the second telescopic rod 16 is fixed on the top plate 3, the lifting plate 17 is fixed at the bottom of the second telescopic rod 16 and driven by the second telescopic rod 16 to lift and slide, and a shaping through hole 18 which penetrates up and down is formed in the lifting plate 17;
the thickness of the clamping plate 15 is sequentially increased from top to bottom, and when the lifting plate 17 descends, the inner wall of the shaping through hole 18 extrudes the clamping plate 15, so that the pins of the IC chip are shaped by the clamping plate 15.
In the embodiment, pins are extruded through the clamping plates 15 when being deformed, and meanwhile, the plurality of clamping plates 15 form a cylinder, so that the IC pins can be prevented from being deviated, and meanwhile, the manpower factor is avoided, and the shaping efficiency is improved; the clamping plate 15 is extruded through the descending of the lifting plate 17, so that the clamping plate 15 shapes the IC pins, and meanwhile, when the lifting plate 17 ascends, the clamping plate 15 opens, so that the space is enlarged, and the IC pins are conveniently inserted;
the second telescopic rod 16 can ensure the normal lifting of the lifting plate 17; the mounting and fixing of the clamping plate 15 can be ensured by the arrangement of the receiving plate 14.
The working principle of the embodiment is as follows: when the IC chip is used, firstly, the IC chip is placed on the bottom plate 7, then the first telescopic rod 4 is started, the first telescopic rod 4 drives the upper frame 5 and the bottom plate 7 to ascend, the swing rod 11 is far away from the base 1 when the upper frame 5 ascends, the pull rope 13 drives the swing rod 11 to rotate, the coil spring 10 is driven to store force, the swing rod 11 clamps and fixes the IC chip, pins of the IC chip are driven to be inserted into the clamping plate 15, then the second telescopic rod 16 is started, the second telescopic rod 16 drives the lifting plate 17 to descend and extrudes the clamping plate 15, and the clamping plate 15 shapes the pins of the IC chip;
after the shaping is completed, the lifting plate 17 is driven to rise, the upper frame 5 is lowered, the tension applied to the swing rod 11 disappears, and the swing rod 11 can relax the clamping force on the IC chip under the driving of the coil spring 10.
The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.
Claims (7)
1. The IC chip shaping machine comprises a base (1), a supporting plate (2) and a top plate (3), and is characterized by further comprising a shaping assembly, a first telescopic rod (4), a placing assembly and a plurality of positioning and clamping devices;
the supporting plate (2) is fixed at the right end of the top of the base (1), and the top plate (3) is fixed at the top of the supporting plate (2) and corresponds to the base (1);
the first telescopic rod (4) is fixed at the top of the base (1) and drives the placement component to move up and down, the positioning and clamping devices are hinged at the top of the placement component and are divided into two groups, and the two groups of positioning and clamping devices are symmetrically arranged with the central axis of the placement component, so that a structure is formed that the placement component pulls the positioning and clamping devices to clamp other IC chips when rising;
the shaping component is fixed at the bottom of the top plate (3) and corresponds to the middle part of the placing component.
2. An IC chip shaper according to claim 1, wherein the placement assembly comprises an upper frame (5), a plurality of suspension boards (6), a bottom board (7), a plurality of hinge means; the bottom plate (7) is fixed at the top of first telescopic link (4), a plurality of hanger plate (6) are fixed at the top of bottom plate (7) and divide into two sets of symmetry setting, go up frame (5) and fix at the top of hanger plate (6), limit through-hole (8) that link up from top to bottom have been seted up at the middle part of last frame (5), a plurality of hinge means all fix at the top of last frame (5) and with location clamping device one-to-one.
3. An IC chip shaper according to claim 2, characterized in that the hinge means comprise a hinge head (9), a coil spring (10), the hinge head (9) being fixed on top of the upper frame (5) and being hinged to the positioning and clamping means, the coil spring (10) being fixed at the hinge of the hinge head (9) to the positioning and clamping means.
4. The IC chip shaping machine according to claim 1, wherein the positioning and clamping device comprises a swinging rod (11), a sponge pad (12) and a pull rope (13), the swinging rod (11) is hinged on the hinge joint (9) and is fixedly connected with the coil spring (10), the sponge pad (12) is fixed at one end of the swinging rod (11) far away from the hinge joint (9), and the pull rope (13) is fixed at the bottom of the swinging rod (11) and extends downwards to penetrate through the upper frame (5), and the bottom plate (7) is fixedly connected with the base (1).
5. An IC chip shaper according to claim 4, wherein the shaper assembly comprises a socket plate (14), a plurality of clamping plates (15), a shaping device; the bearing plates (14) are fixed at the bottom of the top plate (3), the clamping plates (15) are fixed at the bottom of the bearing plates (14) in an annular array, and the shaping device is fixed at the bottom of the top plate (3) and sleeved on the outer side of the clamping plates (15).
6. The IC chip shaping machine according to claim 5, wherein the shaping device comprises a second telescopic rod (16) and a lifting plate (17), the second telescopic rod (16) is fixed on the top plate (3), the lifting plate (17) is fixed at the bottom of the second telescopic rod (16) and is driven by the second telescopic rod (16) to lift and slide, and a shaping through hole (18) penetrating up and down is formed in the lifting plate (17).
7. The IC chip shaper according to claim 5, wherein the thickness of the clamping plate (15) is sequentially increased from top to bottom, and when the lifting plate (17) descends, the inner wall of the shaping through hole (18) presses the clamping plate (15), so that the clamping plate (15) shapes pins of the IC chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320640553.8U CN219766633U (en) | 2023-03-28 | 2023-03-28 | IC chip shaping machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320640553.8U CN219766633U (en) | 2023-03-28 | 2023-03-28 | IC chip shaping machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219766633U true CN219766633U (en) | 2023-09-29 |
Family
ID=88108385
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320640553.8U Active CN219766633U (en) | 2023-03-28 | 2023-03-28 | IC chip shaping machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219766633U (en) |
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2023
- 2023-03-28 CN CN202320640553.8U patent/CN219766633U/en active Active
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