CN219761707U - Inverter underframe heat radiation structure and inverter - Google Patents
Inverter underframe heat radiation structure and inverter Download PDFInfo
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- CN219761707U CN219761707U CN202223170313.0U CN202223170313U CN219761707U CN 219761707 U CN219761707 U CN 219761707U CN 202223170313 U CN202223170313 U CN 202223170313U CN 219761707 U CN219761707 U CN 219761707U
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- bottom plate
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- side wall
- plate heat
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- 230000005855 radiation Effects 0.000 title claims description 35
- 230000017525 heat dissipation Effects 0.000 claims abstract description 197
- 230000000694 effects Effects 0.000 abstract description 10
- 210000003205 muscle Anatomy 0.000 description 7
- 230000002349 favourable effect Effects 0.000 description 6
- 230000001771 impaired effect Effects 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 208000033999 Device damage Diseases 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
Abstract
The utility model is applicable to the technical field of heat dissipation devices, and provides an inverter underframe heat dissipation structure and an inverter, wherein the inverter underframe heat dissipation structure comprises: a bottom frame body; a bottom plate heat dissipation structure arranged on the bottom plate of the bottom frame main body; and a side wall heat dissipation structure disposed on a side wall of the bottom frame body; wherein, the bottom plate inboard of underframe main part is provided with the inner chamber that holds components and parts. According to the utility model, the bottom plate radiating structure is arranged on the bottom plate of the bottom frame main body of the inverter, and the side wall radiating structure is arranged on the side wall, so that the radiating area is increased, the radiating of heat in the inner cavity is facilitated, the damage of components caused by the overhigh temperature of the inner cavity of the inverter is avoided, the radiating effect is enhanced, the surface of the bottom frame main body is fully utilized for radiating, and the space required by the radiating of the inverter is saved.
Description
Technical Field
The utility model belongs to the technical field of heat dissipation devices, and particularly relates to an inverter bottom frame heat dissipation structure and an inverter.
Background
The inverter is a converter for converting direct current energy into alternating current with fixed frequency and fixed voltage or frequency and voltage. Inverters are often used in various contexts, especially for some contexts where high power inverters are required, such as solar energy, wind energy, etc., and for some applications in desert-like environments, the heat dissipation requirements for the inverter may be very stringent. In the conventional heat dissipation structure of an inverter, a heat dissipation structure is generally disposed on a bottom plate of a bottom frame of the inverter, and auxiliary heat dissipation is performed by combining air flow generated by a fan inside the bottom frame. However, in order to achieve a higher heat dissipation effect, only the heat dissipation structure is arranged on the bottom plate in combination with the air flow generated by the fan to assist heat dissipation, so that the heat dissipation capacity is limited, the condition that the internal environment temperature of the inverter does not reach the standard may occur, and even the components are damaged. Therefore, the existing inverter heat dissipation structure has the problem of poor heat dissipation effect.
Disclosure of Invention
The utility model provides an inverter bottom frame heat dissipation structure, which aims to solve the problem that the existing inverter heat dissipation structure is poor in heat dissipation effect.
The utility model is realized in such a way that an inverter bottom frame heat dissipation structure is provided, comprising:
a bottom frame body;
a bottom plate heat dissipation structure arranged on the bottom plate of the bottom frame main body; and
a side wall heat dissipation structure arranged on the side wall of the bottom frame main body;
wherein, the bottom plate inboard of underframe main part is provided with the inner chamber that holds components and parts.
Further, a side wall heat dissipation area is arranged on at least one side wall of the bottom frame body, and the side wall heat dissipation structure is arranged in the side wall heat dissipation area.
Further, the side wall heat dissipation structure comprises a plurality of side wall heat dissipation ribs which are arranged at equal intervals, and the side wall heat dissipation ribs which are arranged at equal intervals are arranged in the side wall heat dissipation area.
Further, the width of the side wall heat dissipation ribs near one end of the bottom plate is wider than that of the cavity mouth near the inner cavity.
Still further, a bottom plate heat dissipation area is provided on the bottom plate of the bottom frame body, and the bottom plate heat dissipation structure is provided in the bottom plate heat dissipation area.
Further, the bottom plate heat dissipation area includes a first bottom plate heat dissipation area and a second bottom plate heat dissipation area, and the first bottom plate heat dissipation area and the second bottom plate heat dissipation area respectively correspond to different component positions in the inner cavity.
Still further, the bottom plate heat radiation structure includes many bottom plate heat radiation muscle, the bottom plate heat radiation muscle includes many equidistant first bottom plate heat radiation muscle of arranging and equidistant second bottom plate heat radiation muscle of arranging, first bottom plate heat radiation muscle sets up first bottom plate heat radiation area, second bottom plate heat radiation muscle sets up second bottom plate heat radiation area.
Further, the first base plate heat dissipating ribs provided in the first base plate heat dissipating region have a lower height than the second base plate heat dissipating ribs provided in the second base plate heat dissipating region.
Further, the spacing between the second base plate heat dissipation ribs is larger than the spacing between the first base plate heat dissipation ribs.
The utility model also provides an inverter, which comprises the inverter bottom frame heat dissipation structure in any embodiment.
The utility model has the beneficial effects that: the utility model provides a heat dissipation structure of an inverter bottom frame, which comprises a bottom frame main body; a bottom plate heat dissipation structure arranged on the bottom plate of the bottom frame main body; and a side wall heat dissipation structure disposed on a side wall of the bottom frame body; wherein, the bottom plate inboard of underframe main part is provided with the inner chamber that holds components and parts. Because the bottom plate radiating structure is arranged on the bottom plate of the bottom frame main body of the inverter, the heat is radiated through the bottom plate radiating structure; and also set up the lateral wall heat radiation structure on the lateral wall, increase heat radiating area, be favorable to the radiating of inner chamber heat, avoid leading to the components and parts impaired because of the inverter inner chamber high temperature, strengthened the radiating effect, and make full use of the surface of underframe main part dispels the heat, practiced thrift the required space of inverter heat dissipation.
Drawings
Fig. 1 is a schematic structural diagram of a heat dissipation structure of an inverter chassis according to the present utility model;
fig. 2 is a sectional view of a heat dissipation structure of an inverter chassis provided by the present utility model;
fig. 3 is a top view of a heat dissipation structure of an inverter chassis provided by the present utility model;
wherein, 1, a bottom frame main body, 11, an inner cavity, 12, a side wall heat dissipation area, 13, side wall heat dissipation ribs, 14 and a first bottom plate heat dissipation area, 15, a second bottom plate heat dissipation area, 16, a first bottom plate heat dissipation rib, 17 and a second bottom plate heat dissipation rib.
Detailed Description
The present utility model will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present utility model more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.
In a conventional inverter heat dissipation structure, a heat dissipation structure is generally provided on a bottom plate of an inverter bottom frame to dissipate heat. The utility model is to arrange a bottom plate radiating structure on a bottom plate of a bottom frame main body of an inverter, and radiate heat through the bottom plate radiating structure; and also set up the lateral wall heat radiation structure on the lateral wall, increase heat radiating area, be favorable to the radiating of inner chamber heat, avoid leading to the components and parts impaired because of the inverter inner chamber high temperature, strengthened the radiating effect, and make full use of the surface of underframe main part dispels the heat, practiced thrift the required space of inverter heat dissipation.
Example 1
Referring to fig. 1, fig. 1 is a schematic structural diagram of a heat dissipation structure of an inverter chassis according to an embodiment of the present utility model. An inverter chassis heat dissipation structure, comprising:
a bottom frame body 1;
a bottom plate heat radiation structure arranged on the bottom plate of the bottom frame main body 1; and
a side wall heat radiation structure arranged on the side wall of the bottom frame main body 1;
wherein, the inner side of the bottom plate of the bottom frame main body 1 is provided with an inner cavity 11 for accommodating components.
Specifically, the inverter bottom frame heat dissipation structure is used for dissipating heat when an inverter works. Various components of the inverter can be arranged in the bottom frame body 1, and as shown in fig. 1-2, the bottom frame body 1 comprises a bottom plate and four side walls on the periphery, the side walls and the bottom plate are combined to form an inner cavity 11, and various components of the inverter can be arranged in the inner cavity 11. The components may include a transistor, a power inductor, etc., where the transistor and the power inductor are attached to the bottom plate in the inner cavity 11, and the attaching position may have high heat generation and needs to dissipate heat. In addition, a fan for heat dissipation may be provided in the inner chamber 11.
More specifically, set up the bottom plate heat radiation structure on the bottom plate of underframe main part 1, the bottom plate heat radiation structure is mainly to power inductance in the inner chamber, transistor conduct heat dissipation with the heat through bottom plate heat radiation structure discharge, reduces the temperature of power inductance, transistor, prevents the device damage.
More specifically, a side wall heat dissipation structure is further arranged on the side wall of the bottom frame main body 1, the side wall where the side wall heat dissipation structure is located can be a heat field concentration area close to the inner cavity 11, the side wall heat dissipation structure can increase the whole heat dissipation area, and the side wall heat dissipation structure is matched with a fan in the inner cavity 11 to dissipate heat, so that heat of the inner cavity 11 is dissipated, and a better temperature environment is provided for components in the inner cavity 11. And the bottom plate heat radiation structure and the side wall heat radiation structure are arranged on the bottom frame main body 1 of the inverter, and other heat radiation structures are not required to be independently arranged, so that redundant space is temporarily used.
In the present embodiment, there is provided an inverter bottom frame heat dissipation structure by which heat is dissipated due to a bottom plate heat dissipation structure provided on a bottom plate of a bottom frame main body 1 of an inverter; and also set up the lateral wall heat radiation structure on the lateral wall, increase heat radiating area, the fan heat dissipation of cooperation dress at inner chamber 11 is favorable to the radiating of inner chamber 11 heat, avoids leading to the components and parts impaired because of inverter inner chamber 11 high temperature, has strengthened the radiating effect, and make full use of underframe main part 1's surface dispels heat, has practiced thrift the required space of inverter heat dissipation.
Example two
The bottom frame body 1 provided in this embodiment is provided with a side wall heat dissipation area 12 on at least one side wall, and the side wall heat dissipation structure is disposed in the side wall heat dissipation area 12.
Specifically, the bottom frame body 1 includes 4 sides, and whole can present rectangle structure, connects through the fillet between the adjacent side. The heat field concentration area of the inner cavity 11 may be located on a long side wall, so at least one side wall heat dissipation area 12 is disposed on a side wall of the inner cavity 11 on the side of the heat field concentration area, and a side wall heat dissipation structure is disposed in the side wall heat dissipation area 12, so as to increase heat dissipation area and speed up heat dissipation of the inner cavity 11. Of course, the side wall heat dissipation area 12 may be provided on other side walls, and the side wall heat dissipation structure may be mounted, so that the heat dissipation area may be increased. A plurality of side wall heat dissipation areas 12 may be provided on the same side wall, and side wall heat dissipation structures may be mounted respectively. The side wall provided with the side wall heat dissipation structure can be further provided with a mounting hole, and the mounting hole can be connected with other external structures.
Example III
The side wall heat dissipation structure provided in this embodiment includes a plurality of side wall heat dissipation ribs 13 arranged at equal intervals, and the plurality of side wall heat dissipation ribs 13 arranged at equal intervals are disposed in the side wall heat dissipation area 12.
Specifically, as shown in fig. 1-2, the side wall heat dissipation structure may be configured as a plurality of side wall heat dissipation ribs 13 arranged at equal intervals and disposed in the side wall heat dissipation area 12, so as to achieve uniform heat dissipation. The side wall heat radiation ribs 13 protrude outward from the side wall and are disposed perpendicularly to the side wall.
Example IV
The width of the side wall heat dissipation rib 13 near the end of the bottom plate is wider than the width of the cavity mouth near the inner cavity 11.
Specifically, with continued reference to fig. 1, the width of the side wall heat dissipation rib 13 near the bottom plate end may be wider than the width of the cavity mouth end near the inner cavity 11, and the temperature near the bottom plate area is higher, so that heat dissipation at the bottom plate end is facilitated.
Example five
In this embodiment, a bottom plate heat dissipation area is provided on the bottom plate of the bottom frame body 1, and a bottom plate heat dissipation structure is provided in the bottom plate heat dissipation area.
Specifically, as shown in fig. 3, a bottom plate heat dissipation area may be provided on the bottom plate of the bottom frame body 1, and a bottom plate heat dissipation structure may be provided in the bottom plate heat dissipation area. The heat dissipation area of the base plate can be set according to the positions of the components.
Example six
The bottom plate heat dissipation area provided in this embodiment includes a first bottom plate heat dissipation area 14 and a second bottom plate heat dissipation area 15, where the first bottom plate heat dissipation area 14 and the second bottom plate heat dissipation area 15 respectively correspond to different component positions in the inner cavity 11.
Specifically, in this embodiment, as shown in fig. 3, the heat dissipation area of the bottom plate may be divided into a first heat dissipation area of the bottom plate 14 and a second heat dissipation area of the bottom plate 15, where the first heat dissipation area of the bottom plate 14 may refer to the heat dissipation area of the position where the transistor is located, and the second heat dissipation area of the bottom plate 15 may refer to the heat dissipation area of the position where the power inductor is located, and separate the heat dissipation areas for different components with different heat dissipation requirements and heat dissipation capacities, which is more beneficial for the components in the inner cavity 11 to achieve the purpose of respectively dissipating heat.
Example seven
The bottom plate heat dissipation structure provided in this embodiment includes a plurality of bottom plate heat dissipation ribs, the bottom plate heat dissipation ribs include a plurality of first bottom plate heat dissipation ribs 16 arranged at equal intervals and second bottom plate heat dissipation ribs 17 arranged at equal intervals, the first bottom plate heat dissipation ribs 16 are disposed in the first bottom plate heat dissipation area 14, and the second bottom plate heat dissipation ribs 17 are disposed in the second bottom plate heat dissipation area 15.
Specifically, referring to fig. 3, the bottom plate heat dissipation structure includes a plurality of bottom plate heat dissipation ribs, and dissipates heat to different components according to the difference of heat dissipation areas where the bottom plate heat dissipation ribs are located, and includes a first bottom plate heat dissipation rib 16 and a second bottom plate heat dissipation rib 17 respectively, and the first bottom plate heat dissipation ribs 16 and the second bottom plate heat dissipation ribs 17 are arranged at equal intervals, so as to achieve uniform heat dissipation. The spacing between the second base plate heat dissipation ribs 17 may be set to be larger than the spacing between the first base plate heat dissipation ribs 16 based on the difference in heat dissipation requirements of the components. The first bottom plate heat dissipation rib 16 is arranged in the first bottom plate heat dissipation area 14, and the second bottom plate heat dissipation rib 17 is arranged in the second bottom plate heat dissipation area 15, so that partition heat dissipation is realized.
Wherein, the shape of the second bottom plate heat dissipation rib 17 can be right trapezoid, one end close to the bottom plate edge is right angle, and the other end is oblique angle. The second floor ribs 17 may be provided in different lengths. Because of the structure of the power inductor, the first base plate heat dissipation area 14 may include several annular structures arranged continuously and irregularly, and the first base plate heat dissipation ribs 16 are disposed on the several annular structures at equal intervals, so that for better heat dissipation, the first base plate heat dissipation ribs 16 may also include different lengths.
Example eight
The height of the first base plate heat dissipating ribs 16 provided in the first base plate heat dissipating region 14 is lower than the height of the second base plate heat dissipating ribs 17 provided in the second base plate heat dissipating region 15.
Specifically, the height of the first bottom plate heat dissipation rib 16 opposite to the power inductor is lower than the height of the second bottom plate heat dissipation rib 17 opposite to the transistor, wherein the first bottom plate heat dissipation rib 16 and one end, connected with the bottom plate, of the second bottom plate heat dissipation rib 17 are not level with the bottom plate. The first bottom plate heat dissipation ribs 16 and the second bottom plate heat dissipation ribs 17 with different heights are arranged according to different component heat dissipation requirements, so that the bottom plate heat dissipation is facilitated.
Example nine
The embodiment also provides an inverter, which comprises the inverter bottom frame heat dissipation structure in any one of the embodiments.
Specifically, the inverter provided in this embodiment includes an inverter bottom frame heat dissipation structure in the foregoing embodiments, and the bottom plate of the bottom frame body 1 is provided with a bottom plate heat dissipation structure, so that heat is dissipated through the bottom plate heat dissipation structure; and also set up the lateral wall heat radiation structure on the lateral wall, increase heat radiating area, the fan heat dissipation of cooperation dress at inner chamber 11 is favorable to the radiating of inner chamber 11 heat, avoid leading to the components and parts impaired because of inverter inner chamber 11 high temperature, the radiating effect has been strengthened, and make full use of underframe main part 1's surface dispels heat, the required space of inverter heat dissipation has been practiced thrift, consequently the inverter that this embodiment provided can realize above-mentioned each embodiment equally and reach corresponding technological effect, let the inverter have stronger heat dispersion, be favorable to satisfying the high-power inverter of higher heat dissipation demand.
In the embodiment of the utility model, a plurality of first bottom plate heat dissipation ribs 16 and a plurality of second bottom plate heat dissipation ribs 17 are arranged on the bottom plate of the bottom frame main body 1 of the inverter, and heat dissipation is carried out for different components respectively. And set up many equidistant side wall heat dissipation muscle 13 on the lateral wall, increased except that the radiating area of bottom plate heat dissipation, be favorable to the radiating of inner chamber 11 heat, avoid leading to the components and parts impaired because of inverter inner chamber 11 high temperature, strengthened the radiating effect, and make full use of the surface of underframe main part 1 dispels the heat, need not to provide other independent heat radiation structure, practiced thrift the required space of inverter heat dissipation.
The terms first, second and the like in the description and in the claims or in the above-described figures, are used for distinguishing between different objects and not necessarily for describing a sequential or chronological order. Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the utility model. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.
The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the utility model.
Claims (5)
1. An inverter underframe heat radiation structure, which is characterized by comprising:
a bottom frame body;
a bottom plate heat dissipation structure arranged on the bottom plate of the bottom frame main body; and
a side wall heat dissipation structure arranged on the side wall of the bottom frame main body;
wherein, the inner side of the bottom plate of the bottom frame main body is provided with an inner cavity for accommodating components;
the bottom frame comprises a bottom frame body, wherein at least one side wall of the bottom frame body is provided with a side wall heat dissipation area, the side wall heat dissipation structure is arranged in the side wall heat dissipation area and comprises a plurality of side wall heat dissipation ribs which are arranged at equal intervals, and the side wall heat dissipation ribs which are arranged at equal intervals are arranged in the side wall heat dissipation area;
the bottom plate of the bottom frame main body is provided with a bottom plate heat dissipation area, the bottom plate heat dissipation structure is arranged in the bottom plate heat dissipation area, the bottom plate heat dissipation area comprises a first bottom plate heat dissipation area and a second bottom plate heat dissipation area, and the first bottom plate heat dissipation area and the second bottom plate heat dissipation area respectively correspond to different component positions in the inner cavity;
the bottom plate heat radiation structure comprises a plurality of bottom plate heat radiation ribs, the bottom plate heat radiation ribs comprise a plurality of first bottom plate heat radiation ribs which are arranged at equal intervals and second bottom plate heat radiation ribs which are arranged at equal intervals, the first bottom plate heat radiation ribs are arranged in the first bottom plate heat radiation area, and the second bottom plate heat radiation ribs are arranged in the second bottom plate heat radiation area.
2. The inverter chassis heat dissipation structure of claim 1, wherein the side wall heat sink rib has a wider width at an end near the bottom plate than at an end near the mouth of the cavity.
3. The inverter chassis heat dissipation structure of claim 1, wherein the first chassis heat dissipation ribs disposed in the first chassis heat dissipation area have a lower height than the second chassis heat dissipation ribs disposed in the second chassis heat dissipation area.
4. The inverter chassis heat dissipation structure of claim 1, wherein the spacing between the second chassis heat dissipation ribs is greater than the spacing between the first chassis heat dissipation ribs.
5. An inverter comprising an inverter chassis heat dissipation structure as claimed in any one of claims 1 to 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223170313.0U CN219761707U (en) | 2022-11-28 | 2022-11-28 | Inverter underframe heat radiation structure and inverter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223170313.0U CN219761707U (en) | 2022-11-28 | 2022-11-28 | Inverter underframe heat radiation structure and inverter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219761707U true CN219761707U (en) | 2023-09-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223170313.0U Active CN219761707U (en) | 2022-11-28 | 2022-11-28 | Inverter underframe heat radiation structure and inverter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219761707U (en) |
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2022
- 2022-11-28 CN CN202223170313.0U patent/CN219761707U/en active Active
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