CN219761414U

CN219761414U - Thin display module

Info

Publication number: CN219761414U
Application number: CN202320292001.2U
Authority: CN
Inventors: 詹俊彬
Original assignee: Truly Opto Electronics Ltd
Current assignee: Truly Opto Electronics Ltd
Priority date: 2023-02-21
Filing date: 2023-02-21
Publication date: 2023-09-26
Anticipated expiration: 2033-02-21

Abstract

The utility model discloses a thin display module, which comprises a cover plate, wherein an OCA layer is arranged at the lower part of the cover plate, a POL layer is arranged at the lower part of the OCA layer, a display screen is arranged at the lower part of the POL layer, a foam layer is arranged at the lower part of the display screen, an FPC component is arranged at the lower part of the foam layer, a main board layer is arranged at the lower part of the FPC component, the FPC component comprises an FPC substrate, a second bending section which is bent upwards is arranged at the left side of the FPC substrate, a double-sided adhesive is arranged on the upper surface of the tail end of the second bending section, and a connector and an FPC component are arranged on the lower surface of the tail end of the second bending section.

Description

Thin display module

Technical Field

The utility model relates to a display module, in particular to a thin display module.

Background

Along with the improvement of living standard, intelligent wearing equipment, such as products like a bracelet and a watch are more and more popular, the competition of the products is more and more vigorous, moreover, the pursuit of consumers on the thickness and standby time of the products is higher and higher, especially for sports wearing products, the whole machine manufacturer hopes to make the display screen thinner, so that more space can be reserved for the whole machine battery, and the standby time of the products is improved.

As shown in fig. 9 and 10, the conventional display module comprises a cover plate 1A, an OCA layer 2A is disposed at the lower part of the cover plate 1A, a POL layer 3A is disposed at the lower part of the OCA layer 2A, a display screen 4A is disposed at the lower part of the POL layer 3A, a foam layer 5A is disposed at the lower part of the display screen 4A, an FPC assembly 6A is disposed at the lower part of the foam layer 5A, and a main board layer 7A is disposed at the lower part of the FPC assembly 6A. The FPC assembly 6A includes an FPC substrate 61A, and a bent section 600A bent upward is provided on the right side of the FPC substrate 61A, and the end of the bent section 600A is connected to the upper surface of the display screen 4 through a conductive adhesive 62A.

A connector 63A and an FPC component 64A are provided on the lower surface of the FPC substrate 61. Obviously, since the FPC component 64A has a certain height, the distance between the foam layer 5A and the motherboard layer 7A is limited, and it is difficult to continue to be thin and lightweight.

The chinese patent document CN103792729B discloses a display module, comprising: a backlight module, comprising: the light guide plate is provided with a light incident surface, a light emergent surface, a light guide inclined surface, a bottom surface and a side surface, wherein the light guide inclined surface is connected with the light incident surface and the light emergent surface, the bottom surface is connected with the light incident surface and the side surface, and the side surface is connected with the light emergent surface and the bottom surface, wherein the light incident surface, the light guide inclined surface and part of the bottom surface form a wedge-shaped part, and the light emergent surface, the side surface and the other part of the bottom surface form a plate body part; the light source module is arranged on the light incident surface and generates light rays to be incident into the wedge-shaped part; the display panel is arranged on the light guide plate and comprises a first substrate, a second substrate and a display medium layer which are clamped between the first substrate and the second substrate, and one side surface of the first substrate and one side surface of the second substrate which are positioned on the same side are used for forming a side edge, and the vertical projection of the side edge on the backlight module falls into the light guide inclined plane or the plate body part; and a frame including a frame body and a supporting table.

Obviously, in the technical solution disclosed in this patent, the problem of the height of the FPC component is not considered.

Disclosure of Invention

Based on the above, it is necessary to provide a thin display module, which includes a cover plate, an OCA layer is disposed on the lower portion of the cover plate, a POL layer is disposed on the lower portion of the OCA layer, a display screen is disposed on the lower portion of the POL layer, a foam layer is disposed on the lower portion of the display screen, an FPC assembly is disposed on the lower portion of the foam layer, and a main board layer is disposed on the lower portion of the FPC assembly. The FPC assembly comprises an FPC substrate, a first bending section which is bent upwards is arranged on the right side of the FPC substrate, the tail end of the first bending section is connected with the upper surface of the display screen through conductive adhesive, a second bending section which is bent upwards is arranged on the left side of the FPC substrate, a double-sided adhesive tape is arranged on the upper surface of the tail end of the second bending section, and a connector and an FPC component are arranged on the lower surface of the tail end of the second bending section. Because the FPC components and parts of this FPC subassembly set up the terminal lower surface of second crooked section to directly bond at the lower surface of apron through the double faced adhesive tape, utilized the vertical space that original connector took up ingeniously, effectively shortened the interval of bubble cotton layer and main plate layer, can effectively promote the battery capacity of complete machine, reduced the thickness of whole product.

In order to solve the technical problems, the utility model adopts the following technical scheme:

a thin display module is characterized by comprising a cover plate, wherein the lower part of the cover plate is provided with an OCA layer, the lower part of the OCA layer is provided with a POL layer, the lower part of the POL layer is provided with a display screen, the lower part of the display screen is provided with a foam layer, the lower part of the foam layer is provided with an FPC component, the lower part of the FPC component is provided with a main board layer,

the FPC assembly comprises an FPC substrate, a first bending section which is bent upwards is arranged on the right side of the FPC substrate, the tail end of the first bending section is connected with the upper surface of the display screen through conductive adhesive,

the left side of the FPC substrate is provided with a second bending section which is bent upwards, the upper surface of the tail end of the second bending section is provided with double-sided adhesive tape, the lower surface of the tail end of the second bending section is provided with a connector and an FPC component,

the connector is connected with the upper surface of the main board layer.

As a preferred implementation mode of the thin display module provided by the utility model, the OCA layer is in bonding connection with the lower surface of the cover plate, the POL layer is in bonding connection with the OCA layer, the display screen is in bonding connection with the POL layer, the foam layer is in bonding connection with the display screen, and the double faced adhesive tape is in bonding connection with the lower surface of the cover plate.

As a preferred embodiment of the thin display module provided by the utility model, the FPC component is separated from the main board layer by a preset isolation distance.

As an preferable implementation mode of the thin display module provided by the utility model, the display screen is a TFT display screen.

As a preferred embodiment of the thin display module provided by the utility model, the display screen is an AMOLED display screen.

As a preferable implementation mode of the thin display module provided by the utility model, the cross section of the main board layer is L-shaped.

As a preferable implementation mode of the thin display module provided by the utility model, the cross section of the main board layer is concave.

As a preferred embodiment of the thin display module provided by the utility model, the lower surface of the double faced adhesive tape is provided with a plurality of heat conducting grooves which are arranged in parallel.

As a preferred embodiment of the thin display module provided by the utility model, the heat conducting groove is semicircular.

As an optimal implementation mode of the thin display module provided by the utility model, a plurality of heat conduction channels which are arranged in parallel and penetrate through are arranged in the double faced adhesive tape.

Compared with the prior art, the utility model has the following beneficial effects:

the utility model provides a thin display module, because the FPC component of the FPC assembly is arranged on the lower surface of the tail end of the second bending section and is directly adhered on the lower surface of the cover plate through double faced adhesive tape, the longitudinal space occupied by the original connector is skillfully utilized, and the distance between the foam layer and the main board layer is effectively shortened. Compared with the existing display module, the thin display module can at least compress the space of about 1mm for the whole machine of the client, can effectively improve the battery capacity of the whole machine and reduce the thickness of the whole product.

In addition, can set up a plurality of parallel arrangement's heat conduction recess or be equipped with a plurality of parallel arrangement's heat conduction passageway that runs through in the inside of double faced adhesive tape at the lower surface of double faced adhesive tape, can derive the heat of FPC components and parts product fast through air convection, prevent that heat from piling up at FPC components and parts to provide the stability of display module assembly.

Drawings

In order to more clearly illustrate the solution of the present utility model, a brief description will be given below of the drawings required for the description of the embodiments, it being obvious that the drawings in the following description are some embodiments of the present utility model, and that other drawings may be obtained from these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of a thin display module according to the present utility model;

FIG. 2 is a schematic structural view of the FPC assembly of the thin display module of FIG. 1;

FIG. 3 is a schematic structural view of another embodiment of a double sided adhesive tape of the FPC assembly of the thin display module of FIG. 2;

FIG. 4 is a schematic structural view of a double-sided adhesive tape of the FPC assembly of the thin display module of FIG. 3, showing another view angle;

fig. 5 is an enlarged detail schematic view of a region a of a structural schematic view of a double sided adhesive tape of the FPC assembly of the thin display module of fig. 4;

FIG. 6 is a schematic structural view of a further embodiment of a double sided adhesive tape of the FPC assembly of the thin display module of FIG. 2;

FIG. 7 is an enlarged detail view of area B of a structural schematic of a double sided adhesive tape of the FPC assembly of the thin display module of FIG. 6;

FIG. 8 is a schematic structural view of another embodiment of a main board layer of the FPC assembly of the thin display module of FIG. 2;

FIG. 9 is a schematic diagram of a hierarchical structure of a display module according to the prior art;

fig. 10 is a schematic structural view of the FPC assembly of the display module of fig. 9.

The labels in the figures are illustrated below:

1. a cover plate; 2. an OCA layer; 3. a POL layer; 4. a display screen; 5. a foam layer; 6. an FPC assembly; 61. an FPC substrate; 611. a first curved section; 612. a second curved section; 62. conducting resin; 65. a connector; 66. FPC components; 67. double faced adhesive tape; 671. a heat conducting groove; 672. a heat conduction channel; 7. a main board layer; D. isolation distance.

Detailed Description

In order that those skilled in the art will better understand the present utility model, a technical solution in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present utility model without making any inventive effort, shall fall within the scope of the present utility model.

As described in the background art, the prior art cannot solve the technical problem of further thinning the display module.

In order to solve the technical problem, the utility model provides a thin display module, which comprises a cover plate 1, wherein an OCA layer 2 is arranged at the lower part of the cover plate 1, a POL layer 3 is arranged at the lower part of the OCA layer 2, a display screen 4 is arranged at the lower part of the POL layer 3, a foam layer 5 is arranged at the lower part of the display screen 4, an FPC assembly 6 is arranged at the lower part of the foam layer 5, and a main board layer 7 is arranged at the lower part of the FPC assembly 6. The FPC assembly 6 includes an FPC substrate 61, and a first bending section 611 bent upward is disposed on the right side of the FPC substrate 61, and the end of the first bending section 611 is connected to the upper surface of the display screen 4 through a conductive adhesive 62. The left side of the FPC substrate 61 is provided with a second bending section 612 that is bent upward, a double-sided tape 67 is provided on the upper surface of the end of the second bending section 612, and a connector 65 and an FPC component 66 are provided on the lower surface of the end of the second bending section 612.

Through above-mentioned structural design, because the FPC components and parts setting of this FPC subassembly is at the terminal lower surface of second crooked section to directly bond at the lower surface of apron through the double faced adhesive tape, utilized the longitudinal space that original connector occupied ingeniously, effectively shortened the interval of bubble cotton layer and main plate layer. Compared with the existing display module, the thin display module can at least compress the space of about 1mm for the whole machine of the client, can effectively improve the battery capacity of the whole machine and reduce the thickness of the whole product.

In order to better understand the solution of the present utility model, the following detailed description will describe the solution of the embodiment of the present utility model with reference to the accompanying drawings, so that the advantages and features of the present utility model can be more easily understood by those skilled in the art, and thus the protection scope of the present utility model is more clearly and definitely defined.

It should be noted that, under the condition of no conflict, the embodiments of the present utility model and the features and technical solutions in the embodiments may be combined with each other.

It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.

Example 1

As shown in fig. 1 and 2, the thin display module comprises a cover plate 1, an OCA layer 2 is disposed at the lower part of the cover plate 1, a POL layer 3 is disposed at the lower part of the OCA layer 2, a display screen 4 is disposed at the lower part of the POL layer 3, a foam layer 5 is disposed at the lower part of the display screen 4, an FPC assembly 6 is disposed at the lower part of the foam layer 5, and a main board layer 7 is disposed at the lower part of the FPC assembly 6.

As shown in fig. 2, the FPC assembly 6 includes an FPC substrate 61, and a first bending section 611 bent upward is disposed on the right side of the FPC substrate 61, and the end of the first bending section 611 is connected to the upper surface of the display screen 4 through a conductive adhesive 62.

The left side of the FPC substrate 61 is provided with a second bending section 612 that is bent upward, a double-sided tape 67 is provided on the upper surface of the end of the second bending section 612, and a connector 65 and an FPC component 66 are provided on the lower surface of the end of the second bending section 612.

The connector 65 is connected to the upper surface of the motherboard layer 7.

In addition, the OCA layer 2 is adhesively connected with the lower surface of the cover plate 1, the POL layer 3 is adhesively connected with the OCA layer 2, the display screen 4 is adhesively connected with the POL layer 3, the foam layer 5 is adhesively connected with the display screen 4, and the double faced adhesive tape 67 is adhesively connected with the lower surface of the cover plate 1.

Note that, the FPC component 66 is separated from the motherboard layer 7 by a predetermined separation distance D. The separation distance D ensures that the FPC component 66 does not push up against the lower motherboard layer 7 and allows the heat dissipated by the FPC component 66 to be released.

In addition, the display screen 4 is a TFT display screen or an AMOLED display screen.

The main board layer 7 has an L-shaped cross section. The OCA layer 2, POL layer 3, display screen 4, foam layer 5 and FPC assembly 6 constitute a stacked structure that is adapted to the cross section of the motherboard layer 7.

Because the FPC component 66 of the FPC assembly 6 is arranged on the lower surface of the tail end of the second bending section 612 and is directly adhered to the lower surface of the cover plate 1 through the double faced adhesive tape 67, the longitudinal space occupied by the original connector is skillfully utilized, and the distance between the foam layer and the main plate layer is effectively shortened. Compared with the existing display module, the thin display module can at least compress the space of about 1mm for the whole machine of the client, can effectively improve the battery capacity of the whole machine and reduce the thickness of the whole product.

Example 2

Further optimizing the thin display module provided in embodiment 1, specifically, as shown in fig. 3, 4 and 5, a plurality of heat conducting grooves 671 are disposed in parallel on the lower surface of the double sided tape 67. The heat conductive groove 671 is semicircular.

By utilizing the heat conducting grooves 671, heat of a product of the FPC component 66 can be rapidly conducted out through air convection, and heat accumulation on the FPC component 66 is prevented, so that stability of the display module is provided.

Example 3

Further optimizing the thin display module provided in embodiment 1, specifically, as shown in fig. 6 and 7, a plurality of heat conducting channels 672 extending through and disposed in parallel are disposed inside the double sided tape 67.

By utilizing the heat conducting channels 672, heat produced by the FPC component 66 can be rapidly conducted out through air convection, and heat accumulation on the FPC component 66 is prevented, so that the stability of the display module is provided.

In addition, these hollow heat conducting channels 672 also have a certain damping effect, so that the anti-seismic performance of the display module is improved.

Example 4

The thin display module provided in embodiment 1 is further optimized, specifically, as shown in fig. 8, the cross section of the main board layer 7 is concave.

The concave-shaped main board can effectively accommodate a stacked structure formed by the OCA layer 2, the POL layer 3, the display screen 4, the foam layer 5 and the FPC component 6, so that the anti-seismic performance and the overall strength of the display module are improved.

In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

It is apparent that the above-described embodiments are only some embodiments of the present utility model, but not all embodiments, and the preferred embodiments of the present utility model are shown in the drawings, which do not limit the scope of the patent claims. This utility model may be embodied in many different forms, but rather, embodiments are provided in order to provide a thorough and complete understanding of the present disclosure. Although the utility model has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing description, or equivalents may be substituted for elements thereof. All equivalent structures made by the content of the specification and the drawings of the utility model are directly or indirectly applied to other related technical fields, and are also within the scope of the utility model.

Claims

1. A thin display module is characterized by comprising a cover plate (1), wherein an OCA layer (2) is arranged at the lower part of the cover plate (1), a POL layer (3) is arranged at the lower part of the OCA layer (2), a display screen (4) is arranged at the lower part of the POL layer (3), a foam layer (5) is arranged at the lower part of the display screen (4), an FPC (flexible printed circuit) component (6) is arranged at the lower part of the foam layer (5), a main board layer (7) is arranged at the lower part of the FPC component (6),

the FPC assembly (6) comprises an FPC substrate (61), a first bending section (611) which is bent upwards is arranged on the right side of the FPC substrate (61), the tail end of the first bending section (611) is connected with the upper surface of the display screen (4) through a conductive adhesive (62),

the left side of the FPC substrate (61) is provided with a second bending section (612) which is bent upwards, the upper surface of the tail end of the second bending section (612) is provided with a double-sided adhesive tape (67), the lower surface of the tail end of the second bending section (612) is provided with a connector (65) and an FPC component (66),

the connector (65) is connected with the upper surface of the main board layer (7).

2. The thin display module set according to claim 1, wherein the OCA layer (2) is adhesively connected to the lower surface of the cover plate (1), the POL layer (3) is adhesively connected to the OCA layer (2), the display screen (4) is adhesively connected to the POL layer (3), the foam layer (5) is adhesively connected to the display screen (4), and the double-sided adhesive tape (67) is adhesively connected to the lower surface of the cover plate (1).

3. The thin display module according to claim 1, wherein the FPC component (66) is separated from the main board layer (7) by a predetermined separation distance (D).

4. The thin display module according to claim 1, wherein the display screen (4) is a TFT display screen.

5. The thin display module according to claim 1, wherein the display screen (4) is an AMOLED display screen.

6. The thin display module according to claim 1, wherein the main board layer (7) has an L-shaped cross section.

7. The thin display module according to claim 1, wherein the cross section of the main board layer (7) is concave.

8. The thin display module according to claim 1, wherein a plurality of heat conducting grooves (671) are arranged in parallel on the lower surface of the double-sided adhesive tape (67).

9. The thin display module according to claim 8, wherein the heat conductive groove (671) is semicircular.

10. The thin display module according to claim 1, wherein a plurality of heat conducting channels (672) are provided in parallel in the double-sided tape (67).