CN219761142U

CN219761142U - Vehicle-mounted camera

Info

Publication number: CN219761142U
Application number: CN202320682929.1U
Authority: CN
Inventors: 麦福利; 罗小平
Original assignee: Shenzhen Longhorn Automotive Electronic Equipment Co Ltd
Current assignee: Shenzhen Longhorn Automotive Electronic Equipment Co Ltd
Priority date: 2023-03-27
Filing date: 2023-03-27
Publication date: 2023-09-26
Anticipated expiration: 2033-03-27

Abstract

The embodiment of the utility model provides a vehicle-mounted camera which comprises a shell, a lens assembled in the shell, a PCB (printed circuit board) and a bracket, wherein the outer end of the lens extends out of the shell, the PCB is assembled in the shell, a photosensitive chip is arranged on one side of the PCB, the bracket is fixed on the inner wall of the shell, welding pins and lens fixing holes are respectively arranged at the opposite ends of the bracket, the PCB and the fixed lens are correspondingly welded, and the lens is positioned through an active focusing process, so that an imaging center point of the photosensitive chip on the PCB is positioned at a focus position of the lens, and an optical axis of the lens coincides with a principal ray of the photosensitive chip. According to the embodiment of the utility model, the lens and the PCB with high requirements on assembly precision and connection stability are separated from the shell, and the corresponding support structure is used for relative fixation, so that the modularization of the lens and the PCB is realized to ensure the installation precision of the PCB and the lens, wherein the PCB is in welded connection with the support, the stability is high, the correspondence between the photosensitive chip and the lens is ensured, and the influence of temperature change on the shooting performance of the camera is reduced.

Description

Vehicle-mounted camera

Technical Field

The embodiment of the utility model relates to the technical field of automobile accessories, in particular to a vehicle-mounted camera.

Background

The existing vehicle-mounted camera generally comprises a shell, a lens and a PCB (printed circuit board), wherein the end face of the shell is provided with a mounting hole, the lens is correspondingly assembled in the mounting hole, the outer end of the lens extends out of the shell, the PCB is assembled in the shell, a photosensitive chip on the PCB is just opposite to the inner end of the lens, the center point of the photosensitive chip is located on the optical axis of the lens, a mounting step is correspondingly arranged in the shell, and the PCB is locked on the mounting step through a screw so as to ensure that the imaging center point of the photosensitive chip can be located on the optical axis of the lens.

However, the internal stress of the PCB is easily generated due to inconsistent screwing degree of each screw in the screw locking process, and the phenomenon of heating of the PCB can also occur in the working process, so that the structural stability of the PCB is reduced due to heating, and in addition, long-time stress accumulation is also caused, the deformation of the PCB is easily caused, so that the imaging center point of the photosensitive chip deviates from the optical axis or the focal position of the lens, and the imaging quality of the vehicle-mounted camera is further influenced.

Disclosure of Invention

The technical problem to be solved by the embodiment of the utility model is to provide the vehicle-mounted camera so as to improve the installation accuracy of the PCB and the lens and reduce the influence of temperature change on the shooting performance of the camera.

In order to solve the technical problems, the embodiment of the utility model provides the following technical scheme: the vehicle-mounted camera comprises a shell, a lens and a PCB (printed circuit board), wherein the shell is provided with a mounting hole at one end, the lens is assembled in the mounting hole, the outer end of the lens extends out of the shell, the PCB is assembled in the shell, a photosensitive chip is arranged on one side of the surface of the PCB, a bracket is further arranged at the opposite ends of the bracket, welding feet and lens fixing holes are respectively arranged at the opposite ends of the bracket, the PCB is correspondingly welded and fixed with the welding feet of the bracket, the photosensitive chip faces the lens fixing holes, the inner end of the lens is inserted into the lens fixing holes of the bracket and is positioned with the bracket through an active focusing process and is adhered by glue, so that an imaging center point of the photosensitive chip, which is fixed on the PCB of the bracket in advance, is positioned at a focus position of the lens, and an optical axis of the lens coincides with a principal ray of the photosensitive chip; the support is correspondingly and fixedly assembled on the inner wall of the shell.

Further, the PCB board includes control mainboard and with the optical circuit board that control mainboard links to each other, optical circuit board includes again that first metal base plate and one end are as photosensitive sub-circuit board adhesion in on a metal base plate side face and the relative other end is as switching sub-circuit board with the flexible line way board that control mainboard is connected, photosensitive chip set up in on the face of photosensitive sub-circuit board, be provided with first connector on the switching sub-circuit board, and be provided with on the control mainboard be used for with the second connector of first connector correspondence grafting.

Further, the optical circuit board further comprises a second metal substrate, the adapter sub-circuit board is correspondingly adhered to one side surface of the second metal substrate, the first connector and the second connector are in butt joint and plug connection in a direction perpendicular to the second metal substrate surface, and the other side surface of the second metal substrate is correspondingly abutted against the inner wall of the shell.

Further, a perforation is further arranged beside the second connector on the control main board, the photosensitive sub-circuit board and the second connector are respectively located on two opposite sides of the control main board, and the middle section of the flexible circuit board passes through the perforation.

Further, a welding edge for corresponding to the welding leg of the bracket to be welded and fixed is reserved around the photosensitive subcircuit board on the first metal substrate.

Further, the support comprises a mounting cylinder with a through middle part and a mounting substrate correspondingly protruding from the outer side wall of the mounting cylinder, an inner hole of the mounting cylinder forms the lens fixing hole, one end of the mounting cylinder, which is close to the PCB, correspondingly forms the welding leg, and the mounting substrate is correspondingly fixed on the inner wall of the shell.

Further, a positioning ring surrounding an optical axis is arranged on the outer side wall of the middle part of the lens, and the positioning ring correspondingly abuts against the end face of one side of the mounting cylinder far away from the photosensitive chip and is adhered to the mounting cylinder by means of glue.

Further, a positioning platform is correspondingly arranged on the inner wall of the shell at a position close to the mounting hole, and the mounting substrate is attached to the positioning platform to be positioned and locked on the positioning platform by means of screws.

Further, a positioning hole and a screw hole are formed in the positioning platform, a positioning column and a through hole are correspondingly formed in the mounting substrate, the positioning column is correspondingly inserted into the positioning hole, and the screw penetrates through the through hole and is screwed and fixed in the screw hole.

Further, the outer surface of the shell is also integrally formed with a plurality of radiating fins which correspondingly protrude from the outer surface of the shell.

After the technical scheme is adopted, the embodiment of the utility model has at least the following beneficial effects: according to the embodiment of the utility model, the lens and the PCB with high requirements on assembly precision and connection stability on the vehicle-mounted camera are separated from the shell, and the corresponding bracket structure is used for relative fixation, so that the modularization of the lens and the PCB is realized, and the installation precision of the PCB and the lens is ensured; specifically, the support is welded and fixed with the PCB board through the welding leg arranged at one end, the photosensitive chip on the PCB board is guaranteed to be just opposite to the lens fixing hole at the other end of the support, the stability of welded connection is good, stress is not generated on the PCB board, the stability of the PCB board structure and performance is improved, then the active focusing technology is adopted to achieve accurate positioning of the lens at the mounting position in the lens fixing hole and is adhered and fixed through glue, the active focusing technology can ensure that the imaging center point of the photosensitive chip is located at the focus position of the lens and the optical axis of the lens coincides with the principal ray of the photosensitive chip, the technology is relatively simple and mature, the production efficiency is guaranteed, after the support, the lens and the PCB board are assembled, the support is assembled on the inner wall of the shell, the complete vehicle-mounted camera can be assembled, the stability of the welded connection of the PCB board and the support is strong, the correspondence between the photosensitive chip and the lens can be guaranteed to a certain extent, and the influence of temperature change on the shooting performance of the camera is reduced.

Drawings

Fig. 1 is a schematic overall perspective view of an alternative embodiment of the vehicle camera of the present utility model.

Fig. 2 is a schematic perspective view of an alternative embodiment of the vehicle camera of the present utility model in a disassembled state along a central axis of the lens.

Fig. 3 is a schematic diagram of a split state structure of a lens, a bracket and a PCB in an alternative embodiment of the vehicle-mounted camera of the present utility model.

Fig. 4 is a schematic perspective view of a stand in an alternative embodiment of the vehicle camera according to the present utility model.

Fig. 5 is a schematic perspective view of a housing in an alternative embodiment of the vehicle camera according to the present utility model.

Fig. 6 is a cross-sectional view of an alternative embodiment of the in-vehicle camera of the present utility model taken along the central axis of the lens.

Detailed Description

The utility model will be described in further detail with reference to the drawings and the specific examples. It should be understood that the following exemplary embodiments and descriptions are only for the purpose of illustrating the utility model and are not to be construed as limiting the utility model, and that the embodiments and features of the embodiments of the utility model may be combined with one another without conflict.

As shown in fig. 1-6, an alternative embodiment of the present utility model provides a vehicle-mounted camera, including a housing 1 with a mounting hole 10 at one end, a lens 2 assembled in the mounting hole 10 and having an outer end extending out of the housing 1, a PCB 3 assembled in the housing 1 and having a photosensitive chip 3030 on a surface of a PCB 3, and a bracket 4, wherein two opposite ends of the bracket 4 are respectively provided with a soldering leg 41 and a lens 2 fixing hole 43, the PCB 3 is welded and fixed to the soldering leg 41 of the bracket 4 in correspondence with the photosensitive chip 3030 and faces the lens 2 fixing hole 43, and an inner end of the lens 2 is inserted into the lens 2 fixing hole 43 of the bracket 4 and is positioned and adhered to the bracket 4 by an active focusing process with glue 23, so that an imaging center point of the photosensitive chip 3030 pre-fixed to the PCB 3 of the bracket 4 is located at a focal position of the lens 2 and an optical axis of the lens 2 coincides with a main light of the photosensitive chip 3030; the bracket 4 is correspondingly and fixedly assembled on the inner wall of the shell 1.

According to the embodiment of the utility model, the lens 2 and the PCB 3 with high requirements on assembly precision and connection stability on the vehicle-mounted camera are separated from the shell 1, and the corresponding bracket 4 structure is used for relative fixation, so that the modularization of the lens 2 and the PCB 3 is realized to ensure the installation precision of the PCB 3 and the lens 2; specifically, the bracket 4 is welded and fixed with the PCB 3 by the solder fillets 41 disposed at one end and ensures that the photosensitive chip 3030 on the PCB 3 is just opposite to the lens 2 fixing hole 43 at the other end of the bracket 4, the stability of the welded connection is good and no stress is generated on the PCB 3, the stability of the structure and performance of the PCB 3 is correspondingly better, then the active focusing process is adopted to realize the precise positioning of the mounting position of the lens 2 in the lens 2 fixing hole 43 and the adhesive fixation by the glue 23, the active focusing process can ensure that the imaging center point of the photosensitive chip 3030 is located at the focus position of the lens 2 and the optical axis of the lens 2 coincides with the principal ray of the photosensitive chip 3030, the process is relatively simple and mature, the production efficiency is ensured, after the bracket 4, the lens 2 and the PCB 3 are assembled, the bracket 4 can be assembled on the inner wall of the housing 1 to complete the complete vehicle-mounted camera, the stability of the welded connection of the PCB 3 and the bracket 4 is strong, the correspondence between the photosensitive chip 3030 and the lens 2 can be ensured to a certain extent, thereby reducing the influence of the temperature change on the photographing performance of the camera.

In yet another alternative embodiment of the present utility model, as shown in fig. 2, 3 and 6, the PCB 3 includes a control main board 32 and an optical circuit board 30 connected to the control main board 32, the optical circuit board 30 further includes a first metal substrate 301, and a flexible circuit board having one end adhered to a side surface of the first metal substrate 301 as a photo-receiving sub-circuit board 303 and the opposite end connected to the control main board 32 as a transfer sub-circuit board 305, the photo-receiving chip 3030 is disposed on the side surface of the photo-receiving sub-circuit board 303, the transfer sub-circuit board 305 is provided with a first connector 3050, and the control main board 32 is provided with a second connector 321 for corresponding plugging with the first connector 3050. In this embodiment, the PCB 3 is divided into the control main board 32 and the optical circuit board 30, the optical circuit board 30 having a high-precision installation position relationship with the lens 2 is detached, so that the overall assembly difficulty of the PCB 3 is reduced, one end of the optical circuit board 30 is assembled with the photosensitive chip 3030 as the photosensitive sub-circuit board 303, and the opposite end is connected with the control main board 32 to serve as the switching sub-circuit board 305, and a side surface of the photosensitive sub-circuit board 303, which is away from the photosensitive chip 3030, is adhered with the first metal substrate 301, so that the heat dissipation performance of the photosensitive sub-circuit board 303 is enhanced, the thermal expansion effect of the photosensitive sub-circuit board 303 is reduced, and the imaging quality of the camera is ensured; the adaptor sub-circuit board 305 is designed as a flexible circuit board, has light weight, thin thickness and easy bending, is more convenient for the connection operation with the control main board 32, and the adaptor sub-circuit board 305 is correspondingly connected with the second connector 321 on the control main board 32 in a plugging manner through the first connector 3050 thereon, thus the operation is simple and the connection is stable.

In yet another alternative embodiment of the present utility model, as shown in fig. 2 and 6, the optical circuit board 30 further includes a second metal substrate 307, the adaptor sub circuit board 305 is correspondingly adhered to one side surface of the second metal substrate 307, the first connector 3050 and the second connector 321 are in butt connection in a direction perpendicular to the second metal substrate 307, and the other side surface of the second metal substrate 307 is correspondingly abutted against the inner wall of the housing 1. In this embodiment, the second metal substrate 307 is adhered to one side of the board surface of the adaptor sub-circuit board 305, so as to enhance the rigidity of the board surface of the adaptor sub-circuit board 305, facilitate the plugging operation of the first connector 3050 and the second connector 321, and the first connector 3050 and the second connector 321 are plugged in a direction perpendicular to the board surface of the second metal substrate 307, while the second metal substrate 307 is disposed opposite to the side board surface of the adaptor sub-circuit board 305 and is attached to the inner wall of the housing 1, so that on one hand, the heat generated on the adaptor sub-circuit board 305 is transferred to the outside of the housing 1 by the second metal substrate 307, and on the other hand, the abutting force of the housing 1 to the second metal substrate 307 is perpendicular to the board surface of the second metal substrate 307 and is consistent with the plugging direction of the first connector 3050 and the second connector 321, so as to correspondingly enhance the stability of the plugging connection of the first connector 3050 and the second connector 321.

In yet another alternative embodiment of the present utility model, as shown in fig. 2-3, a through hole 323 is further disposed on the control motherboard 32 beside the second connector 321, the photosensitive sub-circuit board 303 and the second connector 321 are respectively located on two opposite sides of the control motherboard 32, and a middle section of the flexible circuit board passes through the through hole 323. In this embodiment, the through holes 323 are formed on the control motherboard 32, and the middle section of the flexible circuit board correspondingly passes through the through holes 323 to be electrically connected with the control motherboard 32, and the photosensitive sub-circuit board 303 and the second connector 321 are respectively arranged on two opposite sides of the control motherboard 32, so as to reduce the density of electrical elements in the space, slow down the heat accumulation, and avoid overheating of the PCB 3.

In yet another alternative embodiment of the present utility model, as shown in fig. 2 to 4, a soldering edge 3010 for soldering and fixing with respect to the soldering leg 41 of the support 4 is reserved around the photosensitive sub-circuit board 303 on the first metal substrate 301. In this embodiment, the welding edge 3010 is reserved on the first metal substrate 301 around the periphery of the photosensitive sub-circuit board 303, and the welding edge 3010 is used to be correspondingly welded with the welding leg 41 on the support 4, so that the welding process is not limited by the material and structure of the photosensitive sub-circuit board 303, the welding operation is more convenient, and more types of photosensitive sub-circuit boards 303 can be compatible correspondingly. In addition, it can be understood that the welding connection between the PCB 3 and the bracket 4 can be ensured as long as the welding edge 3010 and the solder leg 41 are made of a material capable of being welded together; in a specific implementation process, the photosensitive sub-circuit board 303 may be adhered to the first metal substrate 301 by glue or a sticker.

In yet another alternative embodiment of the present utility model, as shown in fig. 3 to 4, the bracket 4 includes a mounting cylinder 45 having a through-hole formed therein and a mounting base plate 47 protruding from an outer side wall of the mounting cylinder 45, wherein an inner hole of the mounting cylinder 45 forms the lens 2 fixing hole 43, one end of the mounting cylinder 45, which is adjacent to the PCB 3, forms the soldering leg 41, and the mounting base plate 47 is fixed to an inner wall of the housing 1. The bracket 4 in the embodiment comprises a mounting cylinder 45 and a mounting substrate 47 correspondingly protruding from the outer side wall of the mounting cylinder 45, wherein an inner hole of the mounting cylinder 45 forms a lens 2 fixing hole 43 which is fixedly connected with the lens 2, and one end, close to the PCB 3, forms a welding leg 41 which is convenient to weld and fix with the PCB, and the bracket is simple in structural design and convenient to open the die for manufacturing; during specific assembly, only the mounting substrate 47 is correspondingly fixed on the inner wall of the shell 1, so that the relative fixation of the lens 2, the PCB 3 and the shell 1 can be realized at the same time, and the assembly operation is simplified.

In yet another alternative embodiment of the present utility model, as shown in fig. 2, 3 and 6, the outer side wall of the middle portion of the lens 2 is provided with a positioning ring 21 surrounding the optical axis, and the positioning ring 21 is correspondingly abutted against the end surface of the side of the mounting cylinder 45 away from the photosensitive chip 3030 and is adhered to the mounting cylinder 45 by means of glue 23. According to the embodiment, the positioning ring 21 surrounding the optical axis is arranged on the outer side wall of the middle of the lens 2, one end of the lens 2 extends into the mounting cylinder 45 and abuts against the corresponding end face of the mounting cylinder 45 through the positioning ring 21, cementing of the lens 2 is achieved by means of glue 23, operation is simple and quick, and production efficiency is guaranteed. In the specific implementation process, the position of the positioning ring 21 relative to the mounting cylinder 45 is determined through active focusing, then the UV glue is filled between the positioned positioning ring 21 and the end face of the mounting cylinder 45, and the assembly and the fixation of the lens 2 are completed after the UV glue is solidified.

In yet another alternative embodiment of the present utility model, as shown in fig. 3-5, a positioning platform 12 is correspondingly disposed on the inner wall of the housing 1 at a position close to the mounting hole 10, and the mounting substrate 47 is attached to the positioning platform 12 for positioning and is locked to the positioning platform 12 by means of screws 14. In this embodiment, the positioning platform 12 for attaching and fixing the mounting substrate 47 is disposed on the inner wall of the housing 1, and the mounting substrate 47 is locked on the positioning platform 12 by using the screws 14, so that the lens 2 and the PCB 3 are mounted and fixed in the housing 1, and the operation is simple and convenient.

In yet another alternative embodiment of the present utility model, as shown in fig. 3-5, the positioning platform 12 is provided with a positioning hole 121 and a screw hole 123, the mounting substrate 47 is correspondingly provided with a positioning post 470 and a through hole 472, the positioning post 470 is correspondingly inserted into the positioning hole 121, and the screw 14 passes through the through hole 472 and is screwed and fixed in the screw hole 123. In this embodiment, the positioning holes 121 and the screw holes 123 are formed on the positioning platform 12, the positioning posts 470 and the through holes 472 are correspondingly formed on the mounting substrate 47, and when the mounting substrate 47 is assembled, the positioning posts 470 are inserted into the positioning holes 121 to pre-position the locking position of the mounting substrate 47, and then the screws 14 are screwed and locked into the screw holes 123 through the through holes 472 to fix the mounting substrate 47, so that the accuracy of assembling the bracket 4 in the housing 1 is improved.

In yet another alternative embodiment of the present utility model, as shown in fig. 1 and 2, the outer surface of the housing 1 is further integrally formed with a plurality of heat dissipating fins 16 correspondingly protruding from the outer surface of the housing 1. According to the embodiment, the plurality of radiating fins 16 are integrally formed on the outer surface of the shell 1, so that the radiating efficiency of the vehicle-mounted camera is further improved, the thermal expansion effect of optical components inside the shell 1 is reduced, and the performance stability of a product is enhanced.

The embodiments of the present utility model have been described above with reference to the accompanying drawings, but the present utility model is not limited to the above-described embodiments, which are merely illustrative and not restrictive, and many changes may be made by those having ordinary skill in the art without departing from the spirit of the present utility model and the scope of the claims, which are all within the scope of the present utility model.

Claims

1. The vehicle-mounted camera comprises a shell, a lens and a PCB (printed circuit board), wherein the shell is provided with a mounting hole at one end, the lens is assembled in the mounting hole, the outer end of the lens extends out of the shell, and the PCB is assembled in the shell, and a photosensitive chip is arranged on one side of the surface of the PCB; the support is correspondingly and fixedly assembled on the inner wall of the shell.

2. The vehicle-mounted camera as claimed in claim 1, wherein the PCB comprises a control main board and an optical circuit board connected to the control main board, the optical circuit board further comprises a first metal substrate and a flexible circuit board, one end of the flexible circuit board is adhered to a side plate surface of the first metal substrate as a photosensitive sub-circuit board, the opposite end of the flexible circuit board is connected to the control main board as a switching sub-circuit board, the photosensitive chip is arranged on the plate surface of the photosensitive sub-circuit board, a first connector is arranged on the switching sub-circuit board, and a second connector for correspondingly plugging with the first connector is arranged on the control main board.

3. The vehicle-mounted camera of claim 2, wherein the optical circuit board further comprises a second metal substrate, the adapter sub-circuit board is correspondingly adhered to one side surface of the second metal substrate, the first connector and the second connector are in butt joint connection in a direction perpendicular to the second metal substrate surface, and the other side surface of the second metal substrate is correspondingly abutted against the inner wall of the shell.

4. A vehicle-mounted camera as claimed in claim 2 or 3, wherein the control main board is further provided with a perforation beside the second connector, the photosensitive sub-circuit board and the second connector are respectively located at two opposite sides of the control main board, and the middle section of the flexible circuit board passes through the perforation.

5. The vehicle-mounted camera of claim 2, wherein a welding edge for corresponding welding and fixing with the welding leg of the bracket is reserved on the first metal substrate around the photosensitive subcircuit board.

6. The vehicle-mounted camera as claimed in claim 1, wherein the bracket includes a mounting cylinder penetrating in a middle portion thereof and a mounting base plate protruding from an outer side wall of the mounting cylinder, an inner hole of the mounting cylinder forms the lens fixing hole, one end of the mounting cylinder, which is close to the PCB board, forms the soldering leg, and the mounting base plate is fixed to the inner wall of the housing.

7. The vehicle-mounted camera as claimed in claim 6, wherein a positioning ring surrounding the optical axis is arranged on the outer side wall of the middle part of the lens, and the positioning ring is correspondingly abutted against the end face of one side of the mounting cylinder far away from the photosensitive chip and is adhered to the mounting cylinder by means of glue.

8. The vehicle-mounted camera of claim 6, wherein a positioning platform is correspondingly arranged on the inner wall of the shell at a position close to the mounting hole, and the mounting substrate is attached to the positioning platform for positioning and is locked on the positioning platform by means of screws.

9. The vehicle-mounted camera of claim 8, wherein the positioning platform is provided with a positioning hole and a screw hole, the mounting substrate is correspondingly provided with a positioning column and a through hole, the positioning column is correspondingly inserted into the positioning hole, and the screw passes through the through hole and is screwed and fixed in the screw hole.

10. The vehicle-mounted camera of claim 8, wherein the outer surface of the housing is further integrally formed with a plurality of heat sinks correspondingly protruding from the outer surface of the housing.