CN219758504U

CN219758504U - Photosensitive chip assembly, laser radar receiver, laser radar and carrier system

Info

Publication number: CN219758504U
Application number: CN202320879687.5U
Authority: CN
Inventors: 梁巍; 杜奔; 严少诚; 孙恒; 李凡; 覃洁琼
Original assignee: Tudaton Intelligent Technology Suzhou Co ltd
Current assignee: Tudaton Intelligent Technology Suzhou Co ltd
Priority date: 2023-04-19
Filing date: 2023-04-19
Publication date: 2023-09-26
Anticipated expiration: 2033-04-19

Abstract

There is provided a photosensitive chip assembly, a laser radar receiver, a laser radar and a carrier system, wherein the laser radar receiver includes: a housing having an accommodating space formed therein, the housing being provided with a window for allowing the detection light to enter; at least one sensitization chip subassembly sets up inside accommodation space, and wherein, every sensitization chip subassembly includes: the photosensitive chip is provided with a first surface facing the window and a second surface deviating from the window, the first surface and the second surface respectively form a first pole and a second pole of the photosensitive chip, and a photosensitive area for receiving detection light is formed on the first surface; and the optical filter is arranged on the first surface of the photosensitive chip in a bonding way and is used for filtering stray light incident into the photosensitive area.

Description

Photosensitive chip assembly, laser radar receiver, laser radar and carrier system

Technical Field

The disclosure relates to the technical field of lidar, and in particular relates to the technical field of lidar packaging. In particular, the present disclosure relates to a photosensitive chip assembly, a lidar receiver, a lidar, and a carrier system.

Background

The laser radar is a light detection system for detecting the position, speed and other characteristic quantities of a target by emitting laser beams. The working principle is that a detection laser beam is emitted to a target, then a received target echo reflected from the target is compared with an emission signal, and after proper processing, relevant information of the target, such as parameters of the target, such as distance, azimuth, altitude, speed, gesture, even shape, and the like, can be obtained, so that the targets of an airplane, a vehicle, surrounding buildings and the like are detected, tracked and identified. The laser radar consists of a laser radar transmitter, a laser radar receiver and the like, wherein the laser transmitter converts electric pulses into optical pulses to be transmitted, and the laser radar receiver receives the optical pulses reflected from the target and then restores the optical pulses into the electric pulses. The core component of the laser radar receiver is a laser photosensitive chip, and is called a photodiode due to photoelectric conversion characteristics, and is called PD for short.

Disclosure of Invention

According to one aspect of the present disclosure, a photosensitive chip assembly for a lidar is provided. The photosensitive chip assembly includes: a photosensitive chip having a first face and a second face, and a photosensitive region for receiving light is formed on the first face; and the light filtering part is arranged on the first surface of the photosensitive chip in a bonding way and is used for filtering stray light incident into the photosensitive area.

According to yet another aspect of the present disclosure, a lidar receiver is provided. The laser radar receiver comprises a shell, at least one photosensitive chip component and an optical filter. An accommodating space is formed inside the shell, and a window is formed in the shell to allow detection light to enter. At least one above-mentioned sensitization chip subassembly sets up inside accommodation, and wherein, every sensitization chip subassembly includes: the photosensitive chip is provided with a first surface facing the window and a second surface deviating from the window, the first surface and the second surface respectively form a first pole and a second pole of the photosensitive chip, and a photosensitive area for receiving detection light is formed on the first surface. The optical filter is attached to the first surface of the photosensitive chip and is used for filtering stray light incident to the photosensitive area.

According to still another aspect of the present disclosure, there is also provided a laser radar including: at least one lidar transmitter for transmitting detection light to an external environment; and at least one lidar receiver according to the above, for detecting the detection light emitted and returned by the at least one lidar transmitter.

According to yet another aspect of the present disclosure, there is also provided a vehicle system including the above laser radar.

According to the photosensitive chip assembly and the laser radar receiver, the optical filter is attached to the first face of the photosensitive chip, the interval distance between the optical filter and the photosensitive chip can be reduced as much as possible, and good anti-crosstalk effect of each channel is achieved.

Drawings

In the drawings, the same reference numerals refer to the same or similar parts or elements throughout the several views unless otherwise specified. The figures are not necessarily drawn to scale. It is appreciated that these drawings depict only some embodiments according to the disclosure and are not therefore to be considered limiting of its scope.

FIG. 1 illustrates a top view of a photosensitive chip assembly according to an embodiment of the present disclosure;

fig. 2 shows a schematic perspective view of a lidar receiver according to an embodiment of the disclosure;

FIG. 3 shows a schematic diagram of the internal structure of a lidar receiver according to an embodiment of the disclosure;

FIG. 4 shows a top view of the internal structure shown in FIG. 3;

fig. 5 shows a close-up view of one of the photo-sensing chip assemblies in the lidar receiver shown in fig. 4.

Detailed Description

Hereinafter, only certain exemplary embodiments are briefly described. As will be recognized by those of skill in the pertinent art, the described embodiments may be modified in various different ways without departing from the spirit or scope of the present disclosure. Accordingly, the drawings and description are to be regarded as illustrative in nature and not as restrictive.

Typical PDs in lidar are APD (avalanche photodiode), SAPD (single photon avalanche diode) and SiPM (silicon photodiode). Lidar receivers often have a plurality of light-sensitive chips inside that form an array. Each photo-sensing chip (also called as 'each channel') receives the laser light individually, and cannot be cross-linked by other external optical signals, and cannot form cross-linking between channels. In order to avoid the optical crosstalk, a reasonable solution is to add an optical filter above the photosensitive chip.

The photosensitive chip assembly 10 and the lidar receiver 1 of the embodiment of the present disclosure will be described in detail below with reference to fig. 1 to 5.

Fig. 1 illustrates a top view of a photosensitive chip assembly 10 according to an embodiment of the present disclosure. As shown in fig. 1, the photosensitive chip assembly 10 includes: a photosensitive chip 210 and a filter 220. The photosensitive chip 210 has a first face (upper face in fig. 1) and a second face, and a photosensitive region (indicated by a broken line circle in the figure) for receiving light is formed on the first face. The filter 220 is disposed on the first surface of the photosensitive chip 210 in a bonding manner, and is used for filtering out stray light incident on the photosensitive area. The first face is also formed with a photosensitive region for receiving detection light (not shown in the figure because the photosensitive region is blocked by the filter portion in fig. 1). The photosensitive region is located in the middle of the first face, and the photosensitive region may be made of a photosensitive material. In some embodiments, the photosensitive chip 210 may be rectangular, and the first surface and the second surface thereof are rectangular surfaces, and the photosensitive area is a circular area located in the middle of the rectangular first surface. The filter 220 is disposed on the first surface of the photosensitive chip 210 in a bonding manner, and is used for filtering out stray light incident to the photosensitive area, such as an optical signal of crosstalk caused by the outside or other channels. The light filtering part 220 may entirely cover the photosensitive region to perform parasitic light filtering with respect to the entire photosensitive region. The filter part 220 may filter out light within a preset wavelength range, and the wavelength of the detection light of the lidar is outside the preset wavelength range, so that the filter part 220 may allow the detection light to enter the photosensitive region.

In the related art, a bracket is generally disposed above the first surface of the photosensitive chip 210, and the filter part 220 is disposed on the bracket, so that there will be a certain interval between the filter part 220 and the photosensitive chip 210. However, the inventors of the present disclosure found that the farther the filter portion 220 is from the photo-sensing chip 210, the worse the anti-crosstalk effect of the lidar receiver 1, particularly the crosstalk between channels, from the practical point of view. It is necessary to shorten the distance between the filter 220 and the photosensitive chip 210 as much as possible in order to use it as efficiently as possible. In this embodiment, the filter 220 is attached to the first surface of the photosensitive chip 210, so that the distance between the filter 220 and the photosensitive chip 210 can be reduced as much as possible, and the anti-crosstalk effect of each channel is improved.

In some embodiments, the area of the filter 220 that is disposed on the first side of the photo-sensing chip 210 in a fitting manner is different from the area of the first side of the photo-sensing chip 210 (shown by the solid line circle in fig. 1) for connection with the conductive line. Generally, the photosensitive chip 210 needs to be additionally provided with a wire (e.g., gold wire) to lead out the first electrode signal of the first surface. The filter 220 is attached to a region different from the region for connection with the wire, and interference between the filter 220 and the first wire 230 can be prevented.

In some embodiments, the light filtering part 220 includes a light filter 221, and the light filter 221 is adhered to the first surface of the photosensitive chip 210 through the light path matching glue. The difference value between the refractive index of the light path matching glue and the refractive index of the optical filter is smaller than a preset threshold value.

In other embodiments, the filter 220 includes a filter film coated on the first surface of the photosensitive chip. In other embodiments, the filter 220 includes an optical isolator with a magnetic ring and coated with a filter film. In this case, the corresponding photo-sensing chip assembly 10 can better achieve the effect of eliminating optical crosstalk, i.e., antireflection, using the polarization principle.

Fig. 2 shows a schematic perspective view of a lidar receiver 1 according to an embodiment of the disclosure. As shown in fig. 2, the lidar receiver 1 includes a housing 100 and at least one light-sensitive chip assembly. An accommodating space is formed inside the housing 100, and a window 111 is formed in the housing 100 to allow the detection light to enter. At least one photosensitive chip assembly is disposed inside the accommodating space for detecting the detection light incident into the accommodating space.

Each of the photosensitive chip assemblies 200 includes: a photo-sensing chip 210 and a filter 220. Fig. 3 shows a schematic view of the internal structure of a lidar receiver according to an embodiment of the present disclosure, fig. 4 is a top view of fig. 3, with a part of the housing of the lidar receiver 1 removed for clarity of the internal structure. As shown in fig. 3 and 4, at least one photo-sensing chip assembly 200 includes 4 photo-sensing chip assemblies 200, and the 4 photo-sensing chip assemblies 200-1, 200-2, 200-3, and 200-4 are arranged along a first direction (X direction shown in fig. 4). In other embodiments, the lidar receiver 1 may include more or fewer photo-sensitive chip assemblies 200, and these photo-sensitive chip assemblies 200 may also be arranged in other ways, for example, in an M x N format detector array.

In each of the photo-sensing chip assemblies 200, the photo-sensing chip 210 thereof has a first face facing the window 111 and a second face facing away from the window 111 (the first face facing upward and the second face facing downward in fig. 3 and 4), the first face being for receiving the detection light entering the window 111. The first face and the second face also respectively constitute a first pole and a second pole of the photosensitive chip 210, and illustratively, the first face constitutes a positive pole of the photosensitive chip 210, and generates a positive pole electric signal, that is, a first pole electric signal hereinafter; the second face constitutes the negative electrode of the photosensitive chip 210, and generates a negative electrode electric signal, that is, a second electrode electric signal hereinafter. Conductive devices (e.g., wires, pins, etc.) may be used to respectively derive the positive and negative electrical signals to form the output signal of the photosensitive chip assembly 200.

The first surface is further formed with a photosensitive region (not shown in the drawings because the photosensitive region is blocked by the optical filter 221 in fig. 3 and 4) for receiving the detection light, the photosensitive region being located at an intermediate position of the first surface, and the photosensitive region may be made of a photosensitive material. In some embodiments, the photosensitive chip 210 may be rectangular, and the first surface and the second surface thereof are rectangular surfaces, and the photosensitive area is a circular area located in the middle of the rectangular first surface. The optical filter 221 is disposed on the first surface of the photosensitive chip 210 in a bonding manner, and is used for filtering out stray light incident on the photosensitive area, such as an optical signal of crosstalk caused by the outside or other channels. The filter 221 may entirely cover the photosensitive region to perform parasitic light filtering for the entire photosensitive region. The filter 221 may filter out light within a preset wavelength range, and the wavelength of the detection light of the lidar is outside the preset wavelength range, so that the filter 221 may allow the detection light to enter the photosensitive region.

In the related art, a bracket is generally disposed above the first surface of the photo-sensing chip 210, and the optical filter 221 is disposed on the bracket, so that there will be a certain interval between the optical filter 221 and the photo-sensing chip 210. However, the inventors of the present disclosure found that the farther the filter 221 is from the photo-sensing chip 210, the worse the anti-crosstalk effect, particularly, the crosstalk between channels, from the practical point of view. It is necessary to shorten the distance between the optical filter 221 and the photo-sensing chip 210 as much as possible in order to use it as efficiently as possible. In this embodiment, the optical filter 221 is attached to the first surface of the photosensitive chip 210, so that the interval distance between the optical filter 221 and the photosensitive chip 210 can be reduced as much as possible, and the anti-crosstalk effect of each channel is improved.

As shown in fig. 3 and 4, each of the photosensitive chip assemblies 200 further includes: the first conductive wire 230 has one end of the first conductive wire 230 connected to the first surface of the photo-sensing chip 210 in the photo-sensing chip assembly 200 for conducting the first polarity electrical signal generated by the photo-sensing chip 210. Generally, the photosensitive chip 210 is disposed at the bottom of the accommodating space of the housing 100, the first surface of the photosensitive chip 210 is disposed upward, and the upper portion of the first surface is free, and the first conductive wire 230 is required to be additionally disposed to guide out the first electrode signal of the first surface.

Fig. 5 shows a partial enlarged view of one photo chip assembly 200 in the lidar receiver 1 shown in fig. 4. As shown in fig. 5, the first surface of the photosensitive chip 210 and the filter 221 are rectangular, for example, square. The size of the filter 221 is adapted to the size of the first side of the photo chip 210 so that the filter 221 can completely block the photosensitive area on the first side (in fig. 5, the photosensitive area is shown by a circular dotted line). The connection point (shown by a circular solid line) of the first wire 230 to the first face of the photosensitive chip 210 is located at the rectangular corner of the first face, as shown in fig. 5, at the upper left corner position of the first face. The rectangular sides of the optical filter 221 and the corresponding rectangular sides of the first surface are arranged at an included angle of a preset angle, so that the optical filter 221 avoids the connection point. In fig. 5, the predetermined angle may be 45 °, that is, the first side a of the optical filter 221 forms an included angle of 45 ° with the corresponding first side b of the first surface, and accordingly, the second side, the third side, and the fourth side of the optical filter 221 form an included angle of 45 ° with the corresponding second side, the third side, and the fourth side of the first surface, respectively. Through the above arrangement, the optical filter 221 is obliquely attached to the corresponding photosensitive chip 210, so that the connection point at the corner of the first surface is exposed, so as to prevent the optical filter 221 from interfering with the first conductive wire 230. Although the preset angle is set to 45 ° in the present embodiment, in other embodiments, the preset angle may be set to other angles such as 30 °, 50 °, etc., as long as the optical filter 221 does not cover the connection point, and the present disclosure does not limit the preset angle.

Although in the embodiment shown in fig. 5, the shape of the first face of the photo-sensing chip 210 and the filter 221 is rectangular, in other embodiments, the first face of the photo-sensing chip 210 and the filter 221 may be circular, triangular, polygonal, or the like, and the first face and the filter 221 may have different shapes. For example, the first surface and the optical filter 221 may be two concentric circles, and the radius of the circle of the optical filter 221 is smaller than that of the first surface, and the connection point of the first wire 230 and the first surface of the photosensitive chip 210 is disposed at the circular edge of the first surface, so that the area where the optical filter 220 is disposed in a fitting manner can be avoided from the edge. For another example, the first surface may be rectangular, the optical filter 221 may be circular, and the connection point between the first conductive wire 230 and the first surface of the photosensitive chip 210 may be disposed at a rectangular corner of the first surface, so that the area where the optical filter 220 is disposed in a fitting manner may be prevented from being disposed at the rectangular corner of the first surface.

Returning to fig. 3 and 4, the lidar receiver 1 further comprises: at least one first lead 310, such as a metal lead. Each first lead 310 is at least partially disposed within the receiving space and extends from the interior of the housing 100. The first metal lead 310 portion located inside the housing 100 is for electrically connecting to the first face of the photo chip 210 of the corresponding photo chip assembly 200 so as to conduct an electrical signal generated by the photo chip 210 to other electrical devices (e.g., an electrical signal receiver for receiving a detection result of the lidar receiver 1) outside the housing. The other end of the first wire 230 of each of the above-mentioned photo-sensing chip assemblies 200 is directly or indirectly connected to the corresponding first lead pin 310 for conducting the first pole electric signal generated by the photo-sensing chip 210 of the photo-sensing chip assembly 200 to the first lead pin 310. In some embodiments, the first wire 230 of each photo-sensing chip assembly 200 may directly connect the photo-sensing chip 210 to the corresponding first lead 310, i.e., both ends of the first wire 230 are connected to the connection point on the photo-sensing chip 210 and the first lead 310, respectively. In some embodiments, for example, in the present embodiment, the first conductive lines 230 indirectly connect (by providing additional conductive areas) the photosensitive chips 210 to the corresponding first conductive pins 310, which will be described in detail below in connection with fig. 3 and 4.

As shown in fig. 3 and 4, the lidar receiver 1 further includes: the adapter plate 400. The adapter plate 400 is disposed at the bottom of the accommodating space, and is used for mounting and carrying at least one photosensitive chip assembly 200. The interposer 400 includes a body made of an insulating material, which may be made of a ceramic material, and a plurality of conductive regions on the body. In the present embodiment, the interposer 400 is a board extending along a first direction (X direction), at least one of the photosensitive chip assemblies 200 is arranged along the first direction (X direction), and each of the photosensitive chip assemblies 200 may be disposed at a central position in a width direction (i.e., a second direction Y) of the interposer 400. The first guide pins 310 are disposed at one side or both sides of the adapter plate 400 in the width direction.

At least one first conductive region 410 is disposed on the interposer 400, and each first conductive region 410 corresponds to one of the photosensitive chip assemblies 200. As shown in fig. 4, the first conductive region 410-1 corresponds to the photosensitive chip assembly 200-1; the first conductive region 410-2 corresponds to the photosensitive chip assembly 200-2; the first conductive region 410-3 corresponds to the photosensitive chip assembly 200-3; the first conductive region 410-4 corresponds to the photo-sensing chip assembly 200-4. At least one of the photo-sensing chip assemblies 200 is fixedly disposed on the interposer 400, and the second surface of the photo-sensing chip 210 in the photo-sensing chip assembly 200 faces the upper surface of the interposer 400, and the other end of the first wire 230 of each photo-sensing chip assembly 200 is indirectly connected to the first metal lead 310 via the first conductive region 410 corresponding to the photo-sensing chip assembly 200. The first conductive area 410 may extend from a central position near the width direction of the interposer 400 to an edge of the interposer 400 so as to be electrically connected to the first metal lead 310 outside the interposer 400, and then an additional wire may be used to electrically connect the edge of the first conductive area 410 to the first metal lead 310.

In this embodiment, the first conductive area 410 on the interposer 400 may be used to electrically connect the photosensitive chip 210 of the photosensitive chip assembly 200 and the first metal pins 310, so as to shorten the length of the wires to be set and improve the overall structural stability of the lidar receiver 1.

As shown in fig. 4, at least one second conductive area 420 is disposed on the interposer 400 in addition to the first conductive areas 410, and each second conductive area 420 corresponds to one photosensitive chip assembly 200. The second surface of the photosensitive chip 210 in each photosensitive chip assembly 200 is fixedly disposed on the corresponding second conductive region 420. The second conductive region 420-1 corresponds to the photosensitive chip assembly 200-1; the second conductive area 420-2 corresponds to the photosensitive chip assembly 200-2; the second conductive area 420-3 corresponds to the photosensitive chip assembly 200-3; the second conductive area 420-4 corresponds to the photo-sensing chip assembly 200-4. Each of the second conductive areas 420 is directly in contact with the second face of the photo chip 210 in the photo chip assembly 200, and one end of the second conductive area 420 extends to the edge of the interposer 400, thereby guiding the second electrical signal to the edge of the interposer 400.

The lidar receiver 1 further comprises: at least one second lead 320 and at least one second lead 330. Each second lead 320 is at least partially disposed within the receiving space and extends from the interior of the housing 100. The number of second pins 320 is the same as the number of first pins 310, and may be equal to the number of photosensitive chip assemblies 200, for example, in the embodiment shown in fig. 3 and fig. 4, the number of first pins 310 and the number of second pins 320 are 4. The second pins 320 are similar in material, size, shape and arrangement to the first pins 310, and in particular, at least one second pin 320 is also disposed at one side or both sides of the interposer 400 in the width direction. One end of each second wire 330 is connected to one second conductive region 420, and the other end is connected to a corresponding second metal lead 320, for conducting a second polarity electrical signal generated by the photo-sensing chip 210 in the corresponding photo-sensing chip assembly 200 to the second lead 320.

The specific distribution of the plurality of first conductive areas 410, the plurality of second conductive areas 420, the plurality of first pins 310, and the plurality of second pins 320 will be described in detail below in conjunction with fig. 4. As shown in fig. 4, two sets of pins are disposed on either side of the adapter plate 400 in the width direction, each set of pins corresponds to one photosensitive chip assembly 200, and includes 1 first metal pin 310 and 1 second metal pin 320 for respectively conducting positive and negative electrical signals of the photosensitive chip 210 corresponding to the photosensitive chip assembly 200. Each of the photo-sensing chip assemblies 200 corresponds to a first conductive area 410 and a second conductive area 420 on the interposer 400, which respectively extend from a position near the photo-sensing chip 210 or a position near the second side of the photo-sensing chip 210 to the vicinity of the first lead 310 or the second lead 320 corresponding to the photo-sensing chip assembly 200.

In other embodiments, the plurality of first conductive areas 410, the plurality of second conductive areas 420, the plurality of first pins 310, and the plurality of second pins 320 may also have a different distribution than shown in fig. 4. For example, in some embodiments, the plurality of first pins 310 are disposed on a first side of the interposer 400 in the width direction; the plurality of second pins 320 are disposed on a second side of the interposer 400 in the width direction. Accordingly, the plurality of first conductive areas 410 are each disposed between the plurality of photosensitive chip assemblies 200 and the plurality of first pins 310; the plurality of second conductive areas 420 are each disposed between the plurality of photosensitive chip assemblies 200 and the plurality of second pins 320. So configured, the plurality of first pins 310 and the plurality of second pins 320 may be disposed on both sides, respectively. It will be appreciated that the plurality of first conductive areas 410, the plurality of second conductive areas 420, the plurality of first pins 310 and the plurality of second pins 320 in the lidar receiver 1 may have respective different arrangements depending on the manner of connection to the electrical signal receiver 1, and the present disclosure is not limited to the distribution and arrangement of these pins or conductive areas.

Returning to fig. 2, the housing 100 includes: tube holder 120 and tube cap 110. Cap 110 is fastened to tube holder 120, and tube holder 120 and cap 110 can be connected together by means of snap-fit connection, riveting, or the like. The window 111 is provided on a side wall of the cap 110 remote from the stem 120, and the window 111 may be a rectangular window 111 or an oval window 111 or the like. A light transmissive member, such as a glass member, is provided on the window 111 to allow the detection light to enter.

As described above, the at least one photo chip assembly 200 includes a plurality of photo chip assemblies 200, for example, in the embodiment shown in fig. 3 and 4, the number of the plurality of photo chip assemblies 200 is 4. The plurality of photo-sensing chip assemblies 200 are arranged in a first direction (X direction), and the window 111 is also arranged to extend along the first direction. The window 111 completely covers the plurality of photo-sensing chip assemblies 200 in a horizontal plane to ensure that each photo-sensing chip assembly 200 can receive the detection light entered from the outside.

In some embodiments, the optical filter 221 is adhered to the first surface of the photosensitive chip 210 through an optical path matching adhesive. The light path matching glue is a special adhesive for cementing transparent optical elements (such as lenses and the like). The light path matching glue is required to be colorless and transparent, has light transmittance of more than 90%, good cementing strength, can be cured at room temperature or medium temperature, and has small curing shrinkage and the like. The light path matching glue comprises, but is not limited to, an adhesive such as organic silica gel, acrylic resin, unsaturated polyester, polyurethane, epoxy resin and the like. Some treatments may also be added during formulation to improve its optical properties or reduce cure shrinkage. The difference between the refractive index of the optical path matching glue and the refractive index of the optical filter 221 is smaller than a predetermined threshold, which may be, for example, 0.1, 0.05, or the like. That is, the light path matching glue has a refractive index similar to that of the optical filter and has the characteristic of ultra-high transmittance, so that the reflection of the light path can be reduced, and the crosstalk between the photosensitive chip assemblies 200 is reduced.

In some other embodiments, instead of filters, other parasitic filters for filtering out the incident light to the photosensitive area may be used. For example, a filter film is coated on the first surface of the photosensitive chip. For another example, an optical isolator is provided on the first surface of the photosensitive chip in a contact manner, and the optical isolator is provided with a magnetic ring and is coated with a filter film.

According to another aspect of the present disclosure, there is also provided a lidar. The laser radar includes: at least one lidar transmitter and at least one lidar receiver 1 as described above. The laser radar transmitter is used for transmitting detection light to the external environment, and the detection light returns after encountering an obstacle of the external environment. The lidar receiver 1 is configured to detect the detection light emitted and returned by at least one lidar transmitter, and by detecting the returned detection light, information such as the position of an obstacle, the distance from the vehicle, the size and type of the obstacle can be determined.

It should be noted that, although in the above embodiments, the filtering portion 210 is disposed in the light sensing chip assembly 200 of the lidar receiver 1, in other embodiments, the filtering portion 210 may be applied to a lidar transmitter of the lidar. The filter 210 may be disposed on a surface of a laser chip in the lidar transmitter, and the filter 210 is attached using an optical path matching adhesive to achieve the effects of eliminating optical crosstalk of different wavelengths and preventing light reflection.

According to another aspect of the present disclosure, there is also provided a vehicle system, which may be a vehicle, for example, comprising the above-described lidar. In the case where the vehicle system is a vehicle, the lidar may be provided outside the vehicle body, such as a roof, a front end of the vehicle body, or the like, for detecting a running environment around the vehicle and road conditions.

It will be appreciated that the use scenarios of lidar include, but are not limited to, various vehicle systems, road-end detection devices, dock monitoring, intersection monitoring, factories, etc. systems having multiple sensors. In some examples, lidar may be provided, for example, on both sides of a road or at an intersection of the road for acquiring an image of the condition of the road or a related image of a motor vehicle traveling on the road. In other examples, the lidar may be disposed on a carrier system, for example, with multiple lidars of the lidar disposed at different locations of the carrier system to acquire objects in front of, behind, or on both sides of the carrier system. Vehicle systems include, but are not limited to, vehicles, aircraft, drones, watercraft, and the like.

Some exemplary aspects of the present disclosure are described below.

Scheme 1, a sensitization chip subassembly for laser radar, its characterized in that, sensitization chip subassembly includes:

a photosensitive chip having a first face and a second face, and having a photosensitive region formed thereon for receiving light;

and the light filtering part is attached to the first surface of the photosensitive chip and is used for filtering stray light incident into the photosensitive area.

The photosensitive chip assembly according to claim 2, wherein the area of the optical filter portion attached to the first surface of the photosensitive chip is different from the area of the first surface of the photosensitive chip, which is used for connection with the conductive wire.

The photosensitive chip assembly according to claim 3, wherein the light filtering portion includes a light filter, and the light filter is adhered to the first surface of the photosensitive chip through light path matching glue.

The photosensitive chip assembly according to any of aspects 1 to 3, wherein,

the difference value between the refractive index of the light path matching glue and the refractive index of the optical filter is smaller than a preset threshold value.

The photosensitive chip assembly according to any of claims 1-4, wherein the light filtering portion comprises a light filtering film coated on the first surface of the photosensitive chip.

The photosensitive chip assembly according to any of claims 1-5, wherein the light filtering portion comprises an optical isolator with a magnetic ring and coated with a light filtering film.

Scheme 7, a lidar receiver, characterized in that the lidar receiver comprises:

a housing, wherein an accommodating space is formed inside the housing, and a window is formed on the housing to allow detection light to enter;

at least one photosensitive chip assembly according to any one of claims 1 to 6, which is provided inside the accommodation space, wherein each photosensitive chip assembly comprises:

the light sensing chip is provided with a first surface facing the window and a second surface facing away from the window, the first surface and the second surface respectively form a first pole and a second pole of the light sensing chip, and a light sensing area for receiving detection light is formed on the first surface; and

The lidar receiver according to claim 7, wherein each of the light-sensing chip assemblies further comprises:

and one end of the first lead is connected to the first surface of the photosensitive chip in the photosensitive chip assembly, so as to be used for sensing a first polar electric signal generated by the photosensitive chip, wherein the area of the optical filtering part which is attached to and arranged is different from the area of the connecting point of the first lead and the first surface of the photosensitive chip.

Solution 9 the lidar receiver according to claim 8, characterized in that,

the optical filtering part comprises an optical filter, the connecting point of the first lead and the first surface of the photosensitive chip is positioned at the edge of the first surface, and the area which is attached to the optical filtering part is avoided at the edge.

Solution 10, the lidar receiver according to any of the solutions 7 to 9, characterized in that,

the shape of the first surface of the photosensitive chip and the shape of the optical filter are rectangular, the connection point of the first lead and the first surface of the photosensitive chip is located at the rectangular corner of the first surface, and the rectangular edge of the optical filter and the corresponding rectangular edge of the first surface are arranged at an included angle with a preset angle, so that the optical filter avoids the connection point.

The lidar receiver according to any of claims 7 to 10, wherein the lidar receiver further comprises:

at least one first lead, each of the first leads being at least partially disposed within the receiving space and protruding from the interior of the housing, wherein,

the other end of the first wire of each photosensitive chip component is directly or indirectly connected to a corresponding first guide pin, so as to be used for conducting the first electrode electric signal generated by the photosensitive chip of the photosensitive chip component to the first guide pin.

The lidar receiver according to any of claims 7 to 11, wherein the lidar receiver further comprises:

the adapter plate is provided with at least one first conductive area, each first conductive area corresponds to one photosensitive chip component, wherein,

the at least one photosensitive chip assembly is fixedly arranged on the adapter plate, and the other end of the first wire of each photosensitive chip assembly is indirectly connected to the first guide pin through a first conductive area corresponding to the photosensitive chip assembly.

The lidar receiver according to any of claims 7 to 12, wherein at least one second conductive area is further provided on the interposer, each second conductive area corresponding to one of the photosensitive chip assemblies, wherein,

the second surface of the photosensitive chip in each photosensitive chip component is fixedly arranged on the corresponding second conductive area.

The lidar receiver according to any of claims 7 to 13, wherein the lidar receiver further comprises:

at least one second lead, each second lead is at least partially disposed within the receiving space and extends from the interior of the housing; and

and one end of each second lead is connected to one second conductive area, and the other end of each second lead is connected to the corresponding second lead pin, so as to be used for conducting second-pole electric signals generated by the photosensitive chips in the corresponding photosensitive chip assemblies to the second lead pins.

The lidar receiver according to any of claims 7 to 14, wherein the housing comprises:

a tube seat; and

the pipe cap is buckled on the pipe seat, the window is arranged on the side wall of the pipe cap, which is far away from the pipe seat, and the window is provided with a light-transmitting piece to allow detection light to enter.

The lidar receiver according to any of claims 7 to 15, wherein the at least one photo-sensing chip assembly comprises a plurality of photo-sensing chip assemblies, wherein,

the plurality of photosensitive chip assemblies are arranged along a first direction, and the window extends along the first direction.

Scheme 17, a lidar characterized in that the lidar comprises:

at least one lidar transmitter for transmitting detection light to an external environment; and

at least one lidar receiver according to any of claims 7 to 16, which is adapted to detect the detection light emitted and returned by the at least one lidar transmitter.

Solution 18, a carrier system, characterized in that the carrier system comprises a lidar according to solution 17.

It should be understood that in this specification, terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., refer to an orientation or positional relationship or dimension based on that shown in the drawings, which are used for convenience of description only, and do not indicate or imply that the device or element referred to must have a particular orientation, be configured and operated in a particular orientation, and thus should not be construed as limiting the scope of protection of the present disclosure.

Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", or a third "may explicitly or implicitly include one or more such feature. In the description of the present disclosure, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In the present disclosure, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; the device can be mechanically connected, electrically connected and communicated; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the terms in this disclosure will be understood by those of ordinary skill in the art as the case may be.

In this disclosure, unless expressly stated or limited otherwise, a first feature being "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other by way of additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

The specification provides many different embodiments or examples that can be used to implement the present disclosure. It should be understood that these various embodiments or examples are purely illustrative and are not intended to limit the scope of the disclosure in any way. Various changes and substitutions will occur to those skilled in the art based on the disclosure of the specification and these are intended to be included within the scope of the present disclosure. Accordingly, the scope of the present disclosure should be determined by the following claims.

Claims

1. A light sensitive chip assembly for a lidar, the light sensitive chip assembly comprising:

2. The photosensitive chip assembly of claim 1, wherein the area of the filter portion disposed on the first surface of the photosensitive chip is different from the area of the first surface of the photosensitive chip for connection to the conductive wire.

3. The light-sensing chip assembly according to claim 1 or 2, wherein the light filtering portion comprises a light filter, and the light filter is adhered to the first surface of the light-sensing chip through a light path matching adhesive.

4. The photosensitive chip assembly of claim 3, wherein,

5. The light-sensing chip assembly according to claim 1 or 2, wherein the light filtering portion comprises a light filtering film coated on the first face of the light-sensing chip.

6. The photosensitive chip assembly according to claim 1 or 2, wherein the light filter portion comprises an optical isolator with a magnetic ring and coated with a light filter film.

7. A lidar receiver, the lidar receiver comprising:

at least one light-sensing chip assembly according to any one of claims 1-6, which is arranged inside the accommodation space, wherein each light-sensing chip assembly comprises:

8. The lidar receiver of claim 7, wherein each light sensitive chip assembly further comprises:

9. The lidar receiver of claim 8, wherein the radar receiver is configured to receive the radar signal,

10. The lidar receiver of claim 9, wherein the radar receiver is configured to receive the radar signal,

11. The lidar receiver according to any of claims 8 to 10, wherein the lidar receiver further comprises:

12. The lidar receiver of claim 11, further comprising:

13. The lidar receiver of claim 12, wherein the interposer further has at least one second conductive region, each second conductive region corresponding to one of the light-sensitive chip assemblies, wherein,

14. The lidar receiver of claim 13, further comprising:

15. The lidar receiver according to any of claims 7 to 10, wherein the housing comprises:

a tube seat; and

16. The lidar receiver of any of claims 7 to 10, wherein the at least one photo-sensing chip assembly comprises a plurality of photo-sensing chip assemblies, wherein,

17. A lidar, the lidar comprising:

at least one lidar receiver according to any of claims 7 to 16, for detecting the detection light emitted and returned by the at least one lidar transmitter.

18. A vehicle system, characterized in that it comprises a lidar according to claim 17.