CN219752464U - Device for adjusting liquid level and eliminating foam in electroplating process - Google Patents
Device for adjusting liquid level and eliminating foam in electroplating process Download PDFInfo
- Publication number
- CN219752464U CN219752464U CN202320317501.7U CN202320317501U CN219752464U CN 219752464 U CN219752464 U CN 219752464U CN 202320317501 U CN202320317501 U CN 202320317501U CN 219752464 U CN219752464 U CN 219752464U
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- tank
- pipeline
- groove
- liquid level
- valve
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- 239000007788 liquid Substances 0.000 title claims abstract description 32
- 239000006260 foam Substances 0.000 title claims abstract description 19
- 238000009713 electroplating Methods 0.000 title claims abstract description 18
- 238000000034 method Methods 0.000 title claims abstract description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 17
- 230000001105 regulatory effect Effects 0.000 claims 1
- 238000010992 reflux Methods 0.000 description 7
- 229910003460 diamond Inorganic materials 0.000 description 6
- 239000010432 diamond Substances 0.000 description 6
- 238000005253 cladding Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000001502 supplementing effect Effects 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The utility model discloses a device for adjusting liquid level and eliminating foam in an electroplating process, which consists of a main tank, an auxiliary tank (12) and a pump (8), wherein the main tank consists of an upper tank (10) and a lower tank (11), the pump (8) is respectively communicated with the upper tank (10), the lower tank (11) and the auxiliary tank (12) through a first pipeline, a second pipeline and a third pipeline, the first pipeline, the second pipeline and the third pipeline are respectively provided with a first valve (5), a second valve (6) and a third valve (7), the upper tank (10) is communicated with the lower tank (11) through a first backflow pipeline (9), the upper tank (10) is communicated with the auxiliary tank (12) through a second backflow pipeline (3), and the lower tank (11) is communicated with the auxiliary tank (12) through a third backflow pipeline (4).
Description
Technical Field
The utility model belongs to equipment for electroplating technology, and particularly relates to a device for adjusting liquid level and eliminating foam in an electroplating process.
Background
Because the diamond wire is in electroplating production process, the depth of liquid level submergence diamond wire has certain influence to the quality of diamond wire, and in the production process simultaneously, auxiliary tank liquid passes through the pump and carries to the main tank, and main working tank liquid rethread return port returns to the auxiliary tank, and the whole in-process backward flow liquid can form the foam at the auxiliary tank, and then is carried to main working tank by the pump, when there is the foam in the main working tank, can exert an influence to the cladding quality of diamond wire, causes cladding firmness to worsen.
There is a need for an apparatus or device that can control the level of liquid during electroplating and eliminate foam generated during electroplating.
Disclosure of Invention
In order to overcome the defects in the prior art, the utility model provides a device for adjusting the liquid level and eliminating foam in the electroplating process, which comprises the following specific technical scheme: the utility model provides a device for adjusting liquid level and eliminate foam in electroplating process, it comprises main tank, auxiliary tank and pump, the main tank comprises last groove and lower tank, the pump is linked together with last groove, lower tank and auxiliary tank respectively through first pipeline, second pipeline and third pipeline, is equipped with first valve, second valve and third valve on first pipeline, second pipeline and the third pipeline respectively, goes up between groove and the lower tank and communicates through first return line, goes up the groove and is linked together through second return line with the auxiliary tank, and lower tank is linked together through third return line with the auxiliary tank.
The inner bottoms of the upper groove and the lower groove are fixedly provided with water baffles, and overflow ports are arranged at positions 1/5-1/4 of the positions, which are away from the upper top points of the water baffles.
Preferably, the first return pipe, the second return pipe and the third return pipe are all 2 and symmetrically arranged.
The width of the water baffle is 4.5mm.
The upper groove and the lower groove are internally provided with 2 water baffles which are symmetrically arranged.
The utility model connects the auxiliary tank and the tank through the pump, and is used for conveying the electroplating liquid; the first, second and third valves are used for adjusting the liquid inlet amount distribution proportion of the auxiliary tank and the main tank and the liquid inlet amount distribution proportion of the upper tank and the lower tank of the main working tank; the first backflow pipeline is mainly used for removing foam in the main tank and enabling the foam to flow back to the auxiliary tank; the second reflux pipeline and the third reflux pipeline are mainly used for enabling the liquid in the upper tank to reflux to the lower working main tank and the liquid in the lower working main tank to reflux to the auxiliary tank; the overflow port on the baffle is an outlet of the diamond wire and the liquid, and the liquid is reserved at the reflux port through the overflow port; through the design, the effects of improving the liquid level and eliminating the foam are achieved, and the quality of the diamond wire coating is improved.
Can follow current 3.5mm width adjustment to 4.5mm through this device breakwater width, under the prerequisite that does not increase the power of pump simultaneously, promote liquid level height and with the quick discharge working tank of bubble to promote cladding material quality. Compared with the prior art that one pump supplies an upper working tank and a lower working tank, the main flow is supplied to the upper working tank, and the lower working tank has a great improvement in a way of using the upper tank for backflow and replenishment.
Drawings
Fig. 1 is a schematic view of the device of the present utility model.
Wherein 1-overflow port; 2-a water baffle; 3-a second return line; 4-a third return line; 5-a first valve; 6-a second valve; 7-a third valve; 8-a pump; 9-a first return line; 10-upper groove; 11-a lower groove; 12-secondary groove.
Fig. 2 is a schematic view of the working state of the device of the present utility model.
Detailed Description
Example 1
As shown in figure 1, the device for adjusting liquid level and eliminating foam in the electroplating process consists of a main tank, an auxiliary tank 12 and a pump 8, wherein the main tank consists of an upper tank 10 and a lower tank 11, the pump 8 is respectively communicated with the upper tank 10, the lower tank 11 and the auxiliary tank 12 through a first pipeline, a second pipeline and a third pipeline, the first pipeline, the second pipeline and the third pipeline are respectively provided with a first valve 5, a second valve 6 and a third valve 7, the upper tank 10 is communicated with the lower tank 11 through a first backflow pipeline 9, the upper tank 10 is communicated with the auxiliary tank 12 through a second backflow pipeline 3, and the lower tank 11 is communicated with the auxiliary tank 12 through a third backflow pipeline 4. The inner bottoms of the upper groove 10 and the lower groove 11 are fixedly provided with a water baffle 2, the position 1/5-1/4 away from the upper top point of the water baffle 2 is provided with an overflow port 1, and the width of the water baffle 2 is 4.5mm.
As shown in fig. 2, in operation, the pump 8 (the mayor pump) pumps liquid from the auxiliary tank through the third pipeline and the third valve 7, and connects the upper tank and the lower tank of the main tank through the first and second pipelines and the first and second valves 5 and 5; closing the opening of the second valve 6 to gradually increase the liquid level of the upper tank, and allowing the liquid to flow back to the backflow port 4 from the overflow port 1 on the water baffle 2; the rear reflux port 4 is refluxed to the lower tank for supplementing liquid level through a pipeline; the air outlet 3 discharges air bubbles on the surface of the liquid into the auxiliary groove through a pipeline; the liquid in the lower tank flows back to the reflux port 4 through the overflow port 1 of the water baffle, and thus flows back to the auxiliary tank.
Example 2
A device for adjusting liquid level and eliminating foam in electroplating process comprises a main tank, an auxiliary tank 12 and a pump 8, wherein the main tank comprises an upper tank 10 and a lower tank 11, the pump 8 is respectively communicated with the upper tank 10, the lower tank 11 and the auxiliary tank 12 through a first pipeline, a second pipeline and a third pipeline, a first valve 5, a second valve 6 and a third valve 7 are respectively arranged on the first pipeline, the second pipeline and the third pipeline, the upper tank 10 is communicated with the lower tank 11 through a first backflow pipeline 9, the upper tank 10 is communicated with the auxiliary tank 12 through a second backflow pipeline 3, and the lower tank 11 is communicated with the auxiliary tank 12 through a third backflow pipeline 4. The inner bottoms of the upper groove 10 and the lower groove 11 are fixedly provided with a water baffle 2, an overflow port 1 is arranged at a position 1/4 of the position, which is away from the upper top point of the water baffle 2, and the width of the water baffle 2 is 4.5mm.
Claims (5)
1. A device for adjusting liquid level and eliminating foam in an electroplating process is characterized by comprising a main groove, an auxiliary groove (12) and a pump (8), wherein the main groove is formed by an upper groove (10) and a lower groove (11), the pump (8) is respectively communicated with the upper groove (10), the lower groove (11) and the auxiliary groove (12) through a first pipeline, a second pipeline and a third pipeline, a first valve (5), a second valve (6) and a third valve (7) are respectively arranged on the first pipeline, the second pipeline and the third pipeline, the upper groove (10) is communicated with the lower groove (11) through a first backflow pipeline (9), the upper groove (10) is communicated with the auxiliary groove (12) through a second backflow pipeline (3), and the lower groove (11) is communicated with the auxiliary groove (12) through a third backflow pipeline (4).
2. The device for adjusting liquid level and eliminating foam in electroplating process according to claim 1, wherein the upper tank (10) and the lower tank (11) are fixedly provided with a water baffle (2) on the inner bottom, and overflow ports (1) are arranged at positions 1/5-1/4 of the upper top points of the water baffle (2).
3. The apparatus for adjusting liquid level and eliminating foam during electroplating according to claim 1 or 2, wherein the first return pipe, the second return pipe and the third return pipe are all 2 and symmetrically arranged.
4. Device for regulating the level and eliminating foam during electroplating according to claim 2, characterized in that the water baffle (2) has a width of 4.5mm.
5. The device for adjusting liquid level and eliminating foam in electroplating process according to claim 4, wherein 2 water baffles are symmetrically arranged in the upper tank (10) and the lower tank (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320317501.7U CN219752464U (en) | 2023-02-27 | 2023-02-27 | Device for adjusting liquid level and eliminating foam in electroplating process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320317501.7U CN219752464U (en) | 2023-02-27 | 2023-02-27 | Device for adjusting liquid level and eliminating foam in electroplating process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219752464U true CN219752464U (en) | 2023-09-26 |
Family
ID=88073557
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320317501.7U Active CN219752464U (en) | 2023-02-27 | 2023-02-27 | Device for adjusting liquid level and eliminating foam in electroplating process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219752464U (en) |
-
2023
- 2023-02-27 CN CN202320317501.7U patent/CN219752464U/en active Active
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