CN219746589U - High-recovery-rate soldering flux spraying device and corresponding wave soldering equipment thereof - Google Patents
High-recovery-rate soldering flux spraying device and corresponding wave soldering equipment thereof Download PDFInfo
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- CN219746589U CN219746589U CN202321152522.4U CN202321152522U CN219746589U CN 219746589 U CN219746589 U CN 219746589U CN 202321152522 U CN202321152522 U CN 202321152522U CN 219746589 U CN219746589 U CN 219746589U
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- 230000004907 flux Effects 0.000 title claims abstract description 88
- 238000005476 soldering Methods 0.000 title claims abstract description 85
- 238000005507 spraying Methods 0.000 title claims abstract description 57
- 238000001816 cooling Methods 0.000 claims abstract description 240
- 239000007788 liquid Substances 0.000 claims abstract description 129
- 238000011084 recovery Methods 0.000 claims abstract description 35
- 230000001681 protective effect Effects 0.000 claims description 18
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 8
- 238000003466 welding Methods 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 6
- 239000007921 spray Substances 0.000 claims description 3
- 238000009736 wetting Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract 1
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
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Abstract
The utility model relates to a soldering flux spraying device with high recovery rate and corresponding wave soldering equipment. The first cooling plate and the second cooling plate are vertically and obliquely arranged, and the distance between the lower end of the first cooling plate and the lower end of the second cooling plate is greater than that between the upper end of the first cooling plate and the upper end of the second cooling plate. The lower ends of the first cooling plate and the second cooling plate are arranged in the liquid collecting groove; one side of the top cover is connected with the upper end of the first cooling plate, and the other side of the top cover is connected with the upper end of the second cooling plate. And redundant soldering flux in the air is liquefied on the first cooling plate, the second cooling plate and the top cover, and the liquefied soldering flux is guided into the liquid collecting tank for recovery, so that loss of consumable materials is reduced, and the cost is obviously reduced. The wave soldering apparatus equipped with the flux spraying device having high recovery rate can achieve such an effect.
Description
Technical Field
The utility model relates to the field of wave soldering equipment, in particular to a high-recovery-rate soldering flux spraying device and corresponding wave soldering equipment.
Background
In the field of welding and processing components of a circuit board, two modes of reflow soldering and wave soldering are generally adopted, the wave soldering is a process technology for forming welding spots in a pin welding area by pumping pressure to enable the surface of molten liquid solder to form a solder wave with a specific shape when a mounting assembly inserted with the components passes through the solder wave at a certain angle. In the process of spraying the soldering flux, part of the sprayed soldering flux is sprayed out of the circuit board and is diffused into the air, so that the environment is polluted, the consumption of materials is high, and the cost is high.
It is therefore desirable to provide a flux spraying device with high recovery rate to solve the above-mentioned problems.
Disclosure of Invention
The utility model relates to a high-recovery-rate soldering flux spraying device and corresponding wave soldering equipment thereof, wherein a group of collecting units are arranged above a circuit board, a first cooling plate, a second cooling plate and a top cover are overlapped to form a conical structure, redundant soldering flux in air is liquefied on the first cooling plate, the second cooling plate and the top cover and the liquefied soldering flux is guided into a liquid collecting tank to be recovered, so that the loss of consumable materials is reduced, the cost is obviously reduced, the environment is protected, the cleaning cost is saved, and the problem that the cost is high because the sprayed soldering flux is partially sprayed out of the circuit board in the prior art and is diffused into the air is solved.
In order to solve the problems, the utility model comprises the following steps: a high recovery rate solder mask spraying device for spraying solder mask to a circuit board on a conveyor, comprising:
the liquid storage tank is arranged below the conveying device and is used for storing soldering flux;
the nozzle unit is movably arranged in the liquid storage tank, and the nozzle device is used for spraying soldering flux on the circuit board; the method comprises the steps of,
the collecting unit comprises a liquid collecting bin, a first cooling plate, a second cooling plate and a top cover, wherein the liquid collecting bin is arranged above the conveying device, and a liquid collecting groove is arranged in the liquid collecting bin; the first cooling plate and the second cooling plate are vertically and obliquely arranged, and the distance between the lower end of the first cooling plate and the lower end of the second cooling plate is larger than that between the upper end of the first cooling plate and the upper end of the second cooling plate; the lower ends of the first cooling plate and the second cooling plate are arranged in the liquid collecting groove; one side of the top cover is connected with the upper end of the first cooling plate, and the other side of the top cover is connected with the upper end of the second cooling plate; the circuit board to be sprayed is positioned in the area surrounded by the first cooling plate and the second cooling plate, and the first cooling plate, the second cooling plate and the top cover are used for liquefying and guiding redundant soldering flux into the liquid collecting tank.
Further, the top cover comprises a third cooling plate and two fourth cooling plates, the third cooling plates are arranged to be of an inverted V-shaped structure, one side of each third cooling plate is connected with the upper end of each first cooling plate, the other side of each third cooling plate is connected with the upper end of each second cooling plate, and collection efficiency is improved. The other two sides of the third cooling plate are respectively provided with a fourth cooling plate, and the fourth cooling plates are arranged in a triangular structure, so that the structural stability is improved.
Further, the upper end of the first cooling plate is provided with a plurality of first connecting columns, a plurality of first connecting columns are arranged outside the upper end of the first cooling plate at intervals, and one side of the third cooling plate is connected with the first cooling plate through the first connecting columns and screws. The upper end of second cooling plate is provided with a plurality of second spliced poles, and is a plurality of the second spliced pole interval sets up the upper end outside of second cooling plate, the opposite side of third cooling plate is passed through second spliced pole, screw connection in the second cooling plate. Gaps are formed between the inner side surface of the third cooling plate and the outer side surfaces of the first cooling plate and the second cooling plate, so that the collected soldering flux can flow into the liquid collecting groove conveniently.
Further, the top cover further comprises a plurality of fifth cooling plates and a plurality of sixth cooling plates. The fifth cooling plate is disposed between the first cooling plate and the third cooling plate, and the sixth cooling plate is disposed between the second cooling plate and the third cooling plate. The inner side surface of the lower end of the fifth cooling plate is connected with the outer side surface of the upper end of the first cooling plate, and the outer side surface of the upper end of the fifth cooling plate is connected with the inner side surface of one side of the third cooling plate. The lower end inner side of the sixth cooling plate is connected with the upper end outer side of the second cooling plate, the upper end outer side of the sixth cooling plate is connected with the inner side of the other side of the third cooling plate, the collecting space is improved, the soldering flux is completely collected as much as possible, and the cost is saved.
Further, the liquid collecting bin comprises a protective shell, a first liquid collecting plate, a second liquid collecting plate and two guide plates. The first liquid collecting plate is arranged below the first cover body, the second liquid collecting plate is arranged below the second cover body, and the first liquid collecting plate and the second liquid collecting plate are both provided with through liquid collecting grooves. One guide plate is connected to one end of the first liquid collecting plate and one end of the second liquid collecting plate, the other guide plate is connected to the other ends of the first liquid collecting plate and the second liquid collecting plate, and a guide groove is formed in the guide plate. The liquid collecting grooves of the first liquid collecting plate and the liquid collecting grooves of the second liquid collecting plate are communicated with the diversion grooves of the diversion plates, so that the structure is simple, and the cost is saved. The protective shell covers the peripheries of the first liquid collecting plate, the second liquid collecting plate and the guide plate.
Further, the first liquid collecting plate and the second liquid collecting plate are arranged in the same structure. The first liquid collecting plate comprises a first side plate, a second side plate and a liquid collecting bottom plate, wherein the first side plate is vertically arranged on one side of the liquid collecting bottom plate, the second side plate is vertically arranged on the other side of the liquid collecting bottom plate, and the first side plate and the second side plate are arranged in parallel. The length of the first side plate is greater than that of the second side plate, the area formed by surrounding the first side plate, the second side plate and the liquid collecting bottom plate is the liquid collecting groove, and the liquid collecting device is simple in structure and convenient to install and detach.
Further, the vertical height of the first side plate is greater than that of the second side plate, the first side plate is connected with the inner side wall of the protective shell through screws, and the mounting and dismounting efficiency is improved.
Further, the guide plate is arranged to be of an L-shaped plate structure, the guide plate and the other inner side wall of the protective shell are enclosed to form the guide groove for guiding and collecting soldering flux, and cost is saved.
Further, a diversion pipe is arranged on one inner side wall of the protection shell, which is opposite to the diversion plate, one end of the diversion pipe penetrates through the inner side wall of the protection shell and is positioned in the diversion groove, and the other end of the diversion pipe is connected with recovery equipment outside the protection shell, so that the liquid collection efficiency is improved.
A wave soldering apparatus, comprising:
the conveying device is used for conveying the circuit boards to be welded;
the high-recovery-rate soldering flux spraying device comprises any one of the high-recovery-rate soldering flux spraying devices and is used for spraying soldering flux;
the heating device is arranged on the conveying device and is used for heating the welding part of the circuit board sprayed with the soldering flux to the wetting temperature;
the tin spraying device is used for conducting tin spraying operation on the circuit board and forming welding spots; the method comprises the steps of,
and the cooling device is arranged at the discharge end of the conveying device and is used for cooling the circuit board.
Compared with the prior art, the utility model has the beneficial effects that as the soldering flux spraying device with high recovery rate and the corresponding wave soldering equipment are adopted, the utility model has the following beneficial effects: the utility model relates to a high-recovery-rate soldering flux spraying device and corresponding wave soldering equipment. The reservoir is arranged below the conveying device and is used for storing soldering flux. The nozzle unit is movably arranged in the liquid storage tank, and the nozzle device is used for spraying soldering flux on the circuit board. The collection unit comprises a liquid collection bin, a first cooling plate, a second cooling plate and a top cover, wherein the liquid collection bin is arranged above the conveying device, and a liquid collection groove is formed in the liquid collection bin. The first cooling plate and the second cooling plate are vertically and obliquely arranged, and the distance between the lower end of the first cooling plate and the lower end of the second cooling plate is greater than that between the upper end of the first cooling plate and the upper end of the second cooling plate. The lower ends of the first cooling plate and the second cooling plate are arranged in the liquid collecting groove; one side of the top cover is connected with the upper end of the first cooling plate, and the other side of the top cover is connected with the upper end of the second cooling plate. The circuit board to be sprayed is positioned in the area surrounded by the first cooling plate and the second cooling plate, and the first cooling plate, the second cooling plate and the top cover are used for liquefying redundant soldering flux and guiding the soldering flux into the liquid collecting tank. This high soldering flux spraying device of rate of recovery is through being provided with a set of collection unit in the top of circuit board, first cooling plate, second cooling plate and top cap overlap joint set up to the toper structure, liquefy unnecessary soldering flux in the air on first cooling plate, second cooling plate and top cap and retrieve in the liquid catch bowl with the flow guide of liquefied soldering flux, reduced the loss of consumptive material, showing the cost is reduced, be favorable to the environmental protection, also can practice thrift the clearance cost, solved among the prior art because of the spun soldering flux has part to spout outside the circuit board makes the diffusion lead to the great problem of cost in the air.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are needed in the embodiments are briefly described below, and the drawings in the following description are only drawings corresponding to some embodiments of the present utility model.
Fig. 1 is a schematic diagram showing the structure of an embodiment of a flux spraying apparatus with high recovery rate according to the present utility model.
Fig. 2 is a schematic structural view of an embodiment of a nozzle unit of the high recovery rate soldering flux spraying apparatus of the present utility model.
Fig. 3 is a schematic structural view of an embodiment of a collecting unit of the flux spraying device with high recovery rate according to the present utility model.
Fig. 4 is a schematic cross-sectional view showing an embodiment of a collecting unit of the flux spraying device of the present utility model with high recovery rate.
Fig. 5 is a schematic structural view of an embodiment of a first header plate of the high recovery rate soldering flux spraying apparatus of the present utility model.
Fig. 6 is a schematic structural view showing an example of the internal structure of the collecting unit of the flux spraying device of the present utility model with high recovery rate.
Fig. 7 is a schematic view showing another view of an embodiment of the internal structure of the collecting unit of the flux spraying apparatus of the present utility model with high recovery rate.
Fig. 8 is a schematic structural view of an embodiment of a wave soldering apparatus of the present utility model.
In the figure: 10. high recovery of the spray flux device 11, reservoir 111, reservoir 12, nozzle unit 121, drive motor 122, drive wheel 123, driven wheel 124, belt 125, connector 126, support bar 127, clamp 128, nozzle 13, collection unit 131, sump 1311, protective housing 1312, first header, a1. first side plate, a2, second side plate, a3. header base plate, 1313, second header, 1314, deflector, 1315, sump 1316, deflector slot 1317, deflector tube 132, first cooling plate 133, second cooling plate 134, fifth cooling plate 135, sixth cooling plate 136, top cover 1361, third cooling plate 1362, fourth cooling plate 137, first connecting post 138, second connecting post.
20. Wave soldering equipment, 21, a conveying device, 10, a soldering flux spraying device with high recovery rate, 22, a heating device, 23, a tin spraying device and 24, a cooling device.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
The terms of directions used in the present utility model, such as "up", "down", "front", "back", "left", "right", "inside", "outside", "side", "top" and "bottom", are used for explaining and understanding the present utility model only with reference to the orientation of the drawings, and are not intended to limit the present utility model.
In the drawings, like structural elements are denoted by like reference numerals.
Referring to fig. 1, in the first embodiment, the soldering flux spraying apparatus 10 with high recovery rate is used for spraying soldering flux on a circuit board on a conveying device 21, and includes a liquid storage tank 111, a nozzle unit 12 and a collecting unit 13. The liquid storage tank 11 is arranged below the circuit board, a liquid storage tank 111 is arranged in the liquid storage tank 11, and the liquid storage tank 111 is used for storing soldering flux. The nozzle unit 12 is movably disposed in the reservoir 111, and the nozzle 128 is provided for spraying flux onto the circuit board.
Referring to fig. 2, the nozzle unit 12 includes a driving motor 121, a driving wheel 122, a driven wheel 123, a belt 124, a connecting member 125, a supporting rod 126, a chuck 127, and a nozzle 128. One side of the liquid storage tank 11 is provided with a chute, a driving motor 121 is arranged at one end of the chute, an output shaft of the driving motor 121 is connected with a driving wheel 122, a driven wheel 123 is arranged at the other end of the chute, and the driving wheel 122 is connected with the driven wheel 123 through a belt 124. One end of the connecting piece 125 is fixedly connected with the belt 124, and the other end of the connecting piece 125 penetrates through the chute and is positioned above the liquid storage tank 111. The support bar 126 is vertically arranged at the other end of the connecting piece 125, and a clamping head 127 is fixedly arranged at the upper end of the support bar 126, and the clamping head 127 is used for fixing the nozzle 128. The driving motor 121 can drive the nozzle 128 to reciprocate in the liquid storage tank 11, so that the bottom reciprocating spraying operation of the circuit board is realized.
In the present embodiment, referring to fig. 3 and 4, the collecting unit 13 includes a liquid collecting bin 131, a first cooling plate 132, a second cooling plate 133, a plurality of fifth cooling plates 134, a plurality of sixth cooling plates 135 and a top cover 136. The sump 131 is provided above the conveyor 21, and a sump 1315 is provided in the sump 131. The sump 131 includes a protective housing 1311, a first sump 1312, a second sump 1313, and two baffles 1314. The first liquid collecting plate 1312 is disposed below the first cover body, the second liquid collecting plate 1313 is disposed below the second cover body, and the first liquid collecting plate 1312 and the second liquid collecting plate 1313 are respectively provided with a through liquid collecting groove 1315. One baffle 1314 is connected to one end of the first liquid collecting plate 1312 and one end of the second liquid collecting plate 1313, the other baffle 1314 is connected to the other end of the first liquid collecting plate 1312 and the other end of the second liquid collecting plate 1313, and a diversion trench 1316 is arranged on the baffle 1314. The liquid collecting grooves 1315 of the first liquid collecting plate 1312 and the liquid collecting grooves 1315 of the second liquid collecting plate 1313 are communicated with the diversion grooves 1316 of the diversion plate 1314, so that the structure is simple, and the cost is saved. The shield shell 1311 covers the outer circumferences of the first liquid collecting plate 1312, the second liquid collecting plate 1313, and the deflector 1314.
Specifically, referring to fig. 5, the first liquid collecting plate 1312 and the second liquid collecting plate 1313 are configured identically. The first liquid collecting plate 1312 includes a first side plate a1, a second side plate a2 and a liquid collecting bottom plate a3, the first side plate a1 is vertically disposed on one side of the liquid collecting bottom plate a3, the second side plate a2 is vertically disposed on the other side of the liquid collecting bottom plate a3, and the first side plate a1 and the second side plate a2 are disposed in parallel. The length of the first side plate a1 is greater than that of the second side plate a2, and the area formed by the first side plate a1, the second side plate a2 and the liquid collecting bottom plate a3 is the liquid collecting groove 1315, so that the structure is simple, and the assembly and the disassembly are convenient. The vertical height of first curb plate a1 is greater than the vertical height of second curb plate a2, and first curb plate a1 and the inside wall screwed connection of protecting crust 1311 improve the efficiency of installation dismantlement. The upper end of the protective housing 1311 is provided with a vent to improve the efficiency of collection.
The deflector 1314 is configured as an L-shaped plate, and the deflector 1314 and the other inner sidewall of the protective housing 1311 enclose a diversion trench 1316 for guiding and collecting flux, thereby saving cost. A guide pipe 1317 is arranged on an inner side wall of the protective shell 1311 opposite to the guide plate 1314, one end of the guide pipe 1317 penetrates through the inner side wall of the protective shell 1311 and is positioned in the guide groove 1316, and the other end of the guide pipe 1317 is connected with recovery equipment outside the protective shell 1311, so that the liquid collection efficiency is improved.
Referring to fig. 6 and 7, the first cooling plate 132 and the second cooling plate 133 are disposed vertically and obliquely, and a distance between a lower end of the first cooling plate 132 and a lower end of the second cooling plate 133 is greater than a distance between an upper end of the first cooling plate 132 and an upper end of the second cooling plate 133. The lower ends of the first cooling plate 132 and the second cooling plate 133 are disposed in the liquid collecting groove 1315. One side of the top cover 136 is connected to the upper end of the first cooling plate 132, and the other side of the top cover 136 is connected to the upper end of the second cooling plate 133. The circuit board to be sprayed is located in a region surrounded by the first cooling plate 132 and the second cooling plate 133, and the first cooling plate 132, the second cooling plate 133 and the top cover 136 serve to liquefy and guide the surplus flux into the liquid collecting tank 1315.
The top cover 136 comprises a third cooling plate 1361 and two fourth cooling plates 1362, the third cooling plate 1361 is arranged in an inverted V-shaped structure, one side of the third cooling plate 1361 is connected with the upper end of the first cooling plate 132, and the other side of the third cooling plate 1361 is connected with the upper end of the second cooling plate 133, so that the collection efficiency is improved. The other two sides of the third cooling plate 1361 are provided with a fourth cooling plate 1362, and the fourth cooling plate 1362 is provided with a triangle structure, thereby improving structural stability.
The upper end of the first cooling plate 132 is provided with a plurality of first connection columns 137, and a plurality of first connection columns 137 are arranged outside the upper end of the first cooling plate 132 at intervals, and one side of the third cooling plate 1361 is connected to the first cooling plate 132 through the first connection columns 137 and screws. The upper end of the second cooling plate 133 is provided with a plurality of second connecting columns 138, and a plurality of second connecting columns 138 are arranged outside the upper end of the second cooling plate 133 at intervals, and the other side of the third cooling plate 1361 is connected to the second cooling plate 133 through the second connecting columns 138 and screws. Gaps are formed between the inner side surface of the third cooling plate 1361 and the outer side surfaces of the first cooling plate 132 and the second cooling plate 133, so that the collected soldering flux can flow into the liquid collecting groove 1315.
The fifth cooling plate 134 is disposed between the first cooling plate 132 and the third cooling plate 1361, and the sixth cooling plate 135 is disposed between the second cooling plate 133 and the third cooling plate 1361. The lower inner side surface of the fifth cooling plate 134 is connected to the upper outer side surface of the first cooling plate 132, and the upper outer side surface of the fifth cooling plate 134 is connected to the inner side surface of one side of the third cooling plate 1361. The inner side of the lower end of the sixth cooling plate 135 is connected with the outer side of the upper end of the second cooling plate 133, and the outer side of the upper end of the sixth cooling plate 135 is connected with the inner side of the other side of the third cooling plate 1361, so that the collection space is increased, the soldering flux is completely collected as much as possible, and the cost is saved. The overlapping manner between two adjacent fifth cooling plates 134 is the same as the overlapping manner between the fifth cooling plates 134 and the first cooling plates 132, and reference is specifically made to the above-mentioned related matters.
When the nozzles 128 spray flux onto the circuit board, a part of the flux is not sprayed onto the circuit board, enters into the collecting unit 13, is liquefied on the first cooling plate 132, the second cooling plate 133, the fifth cooling plate 134, the sixth cooling plate 135 and the top cover 136, and then the liquefied flux is guided to flow into the liquid collecting tank 1315 through the first cooling plate 132, the second cooling plate 133, the fifth cooling plate 134, the sixth cooling plate 135, and the collected flux is guided to an external recovery apparatus through the guide grooves 1316 and the guide pipes 1317.
In this embodiment, referring to fig. 8, the wave soldering apparatus 20 includes a conveying device 21, a flux spraying device 10 with high recovery rate, a heating device 22, a tin spraying device 23, and a cooling device 24. The conveying device 21 is used for conveying the circuit boards to be soldered. The high recovery rate soldering flux spraying device 10 includes any one of the high recovery rate soldering flux spraying devices 10 described above for spraying soldering flux. The heating device 22 is provided on the conveying device 21 for heating the soldering portion of the circuit board on which the flux is sprayed to a wetting temperature. The tin spraying device 23 is used for carrying out tin spraying operation on the circuit board and forming welding spots. The cooling device 24 is disposed at the discharge end of the conveying device 21 for cooling the circuit board.
In this embodiment, the utility model relates to a high-recovery-rate soldering flux spraying device and a corresponding wave soldering apparatus thereof, wherein the high-recovery-rate soldering flux spraying device comprises a liquid storage tank, a nozzle unit and a collecting unit. The reservoir is arranged below the conveying device and is used for storing soldering flux. The nozzle unit is movably arranged in the liquid storage tank, and the nozzle device is used for spraying soldering flux on the circuit board. The collection unit comprises a liquid collection bin, a first cooling plate, a second cooling plate and a top cover, wherein the liquid collection bin is arranged above the conveying device, and a liquid collection groove is formed in the liquid collection bin. The first cooling plate and the second cooling plate are vertically and obliquely arranged, and the distance between the lower end of the first cooling plate and the lower end of the second cooling plate is greater than that between the upper end of the first cooling plate and the upper end of the second cooling plate. The lower ends of the first cooling plate and the second cooling plate are arranged in the liquid collecting groove; one side of the top cover is connected with the upper end of the first cooling plate, and the other side of the top cover is connected with the upper end of the second cooling plate. The circuit board to be sprayed is positioned in the area surrounded by the first cooling plate and the second cooling plate, and the first cooling plate, the second cooling plate and the top cover are used for liquefying redundant soldering flux and guiding the soldering flux into the liquid collecting tank. This high soldering flux spraying device of rate of recovery is through being provided with a set of collection unit in the top of circuit board, first cooling plate, second cooling plate and top cap overlap joint set up to the toper structure, liquefy unnecessary soldering flux in the air on first cooling plate, second cooling plate and top cap and retrieve in the liquid catch bowl with the flow guide of liquefied soldering flux, reduced the loss of consumptive material, showing the cost is reduced, be favorable to the environmental protection, also can practice thrift the clearance cost, solved among the prior art because of the spun soldering flux has part to spout outside the circuit board makes the diffusion lead to the great problem of cost in the air.
In summary, although the present utility model has been described in terms of the preferred embodiments, the above-mentioned embodiments are not intended to limit the utility model, and those skilled in the art can make various modifications and alterations without departing from the spirit and scope of the utility model, so that the scope of the utility model is defined by the appended claims.
Claims (10)
1. A high recovery rate spray flux device for spraying flux to a circuit board on a conveyor, comprising:
the liquid storage tank is arranged below the conveying device and is used for storing soldering flux;
the nozzle unit is movably arranged in the liquid storage tank, and the nozzle device is used for spraying soldering flux on the circuit board; the method comprises the steps of,
the collecting unit comprises a liquid collecting bin, a first cooling plate, a second cooling plate and a top cover, wherein the liquid collecting bin is arranged above the conveying device, and a liquid collecting groove is arranged in the liquid collecting bin; the first cooling plate and the second cooling plate are vertically and obliquely arranged, and the distance between the lower end of the first cooling plate and the lower end of the second cooling plate is larger than that between the upper end of the first cooling plate and the upper end of the second cooling plate; the lower ends of the first cooling plate and the second cooling plate are arranged in the liquid collecting groove; one side of the top cover is connected with the upper end of the first cooling plate, and the other side of the top cover is connected with the upper end of the second cooling plate; the circuit board to be sprayed is positioned in the area surrounded by the first cooling plate and the second cooling plate, and the first cooling plate, the second cooling plate and the top cover are used for liquefying and guiding redundant soldering flux into the liquid collecting tank.
2. The high recovery rate soldering flux spraying device according to claim 1, wherein the top cover comprises a third cooling plate and two fourth cooling plates, the third cooling plate is arranged in an inverted V-shaped structure, one side of the third cooling plate is connected with the upper end of the first cooling plate, and the other side of the third cooling plate is connected with the upper end of the second cooling plate; the other two sides of the third cooling plate are respectively provided with a fourth cooling plate, and the fourth cooling plates are arranged in a triangular structure.
3. The device for spraying soldering flux with high recovery rate according to claim 2, wherein a plurality of first connecting columns are arranged at the upper end of the first cooling plate, the plurality of first connecting columns are arranged at the outer side of the upper end of the first cooling plate at intervals, and one side of the third cooling plate is connected to the first cooling plate through the first connecting columns and screws; the upper end of the second cooling plate is provided with a plurality of second connecting columns, the second connecting columns are arranged outside the upper end of the second cooling plate at intervals, and the other side of the third cooling plate is connected with the second cooling plate through the second connecting columns and screws; and gaps are formed between the inner side surface of the third cooling plate and the outer side surfaces of the first cooling plate and the second cooling plate.
4. The high recovery rate solder flux device of claim 3, wherein the top cover further comprises a plurality of fifth cooling plates and a plurality of sixth cooling plates, the fifth cooling plates being disposed between the first cooling plates and the third cooling plates, the sixth cooling plates being disposed between the second cooling plates and the third cooling plates; the inner side surface of the lower end of the fifth cooling plate is connected with the outer side surface of the upper end of the first cooling plate, and the outer side surface of the upper end of the fifth cooling plate is connected with the inner side surface of one side of the third cooling plate; the inner side surface of the lower end of the sixth cooling plate is connected with the outer side surface of the upper end of the second cooling plate, and the outer side surface of the upper end of the sixth cooling plate is connected with the inner side surface of the other side of the third cooling plate.
5. The high-recovery-rate soldering flux spraying device according to claim 1, wherein the liquid collecting bin comprises a protective shell, a first liquid collecting plate, a second liquid collecting plate and two guide plates, the first liquid collecting plate is arranged below the first cover body, the second liquid collecting plate is arranged below the second cover body, and the first liquid collecting plate and the second liquid collecting plate are both provided with through liquid collecting grooves; one guide plate is connected to one end of the first liquid collecting plate and one end of the second liquid collecting plate, the other guide plate is connected to the other ends of the first liquid collecting plate and the second liquid collecting plate, and a guide groove is formed in the guide plate; the liquid collecting grooves of the first liquid collecting plate and the liquid collecting grooves of the second liquid collecting plate are communicated with the diversion grooves of the diversion plate; the protective shell covers the peripheries of the first liquid collecting plate, the second liquid collecting plate and the guide plate.
6. The high recovery rate flux spraying device according to claim 5, wherein the first liquid collecting plate and the second liquid collecting plate are provided in the same structure; the first liquid collecting plate comprises a first side plate, a second side plate and a liquid collecting bottom plate, the first side plate is vertically arranged on one side of the liquid collecting bottom plate, the second side plate is vertically arranged on the other side of the liquid collecting bottom plate, and the first side plate and the second side plate are arranged in parallel; the length of the first side plate is greater than that of the second side plate, and the area surrounded by the first side plate, the second side plate and the liquid collecting bottom plate is the liquid collecting groove.
7. The high recovery rate solder flux device of claim 6, wherein the first side plate has a vertical height greater than a vertical height of the second side plate, and wherein the first side plate is screwed to the inner side wall of the protective housing.
8. The high recovery rate soldering flux spraying device according to claim 5, wherein the guide plate is in an L-shaped plate structure, and the guide plate and the other inner side wall of the protective shell are enclosed to form the guide groove for guiding the collected soldering flux.
9. The device for spraying soldering flux with high recovery rate according to claim 8, wherein a diversion pipe is arranged on an inner side wall of the protective shell opposite to the diversion plate, one end of the diversion pipe penetrates through the inner side wall of the protective shell to be positioned in the diversion trench, and the other end of the diversion pipe is connected with recovery equipment outside the protective shell.
10. A wave soldering apparatus, comprising:
the conveying device is used for conveying the circuit boards to be welded;
a high recovery rate soldering flux spraying device comprising the high recovery rate soldering flux spraying device according to any one of claims 1 to 9 for spraying soldering flux;
the heating device is arranged on the conveying device and is used for heating the welding part of the circuit board sprayed with the soldering flux to the wetting temperature;
the tin spraying device is used for conducting tin spraying operation on the circuit board and forming welding spots; the method comprises the steps of,
and the cooling device is arranged at the discharge end of the conveying device and is used for cooling the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321152522.4U CN219746589U (en) | 2023-05-12 | 2023-05-12 | High-recovery-rate soldering flux spraying device and corresponding wave soldering equipment thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321152522.4U CN219746589U (en) | 2023-05-12 | 2023-05-12 | High-recovery-rate soldering flux spraying device and corresponding wave soldering equipment thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219746589U true CN219746589U (en) | 2023-09-26 |
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ID=88076932
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321152522.4U Active CN219746589U (en) | 2023-05-12 | 2023-05-12 | High-recovery-rate soldering flux spraying device and corresponding wave soldering equipment thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219746589U (en) |
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2023
- 2023-05-12 CN CN202321152522.4U patent/CN219746589U/en active Active
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