CN219740760U - Copper deposition device for printed circuit board - Google Patents
Copper deposition device for printed circuit board Download PDFInfo
- Publication number
- CN219740760U CN219740760U CN202321020436.8U CN202321020436U CN219740760U CN 219740760 U CN219740760 U CN 219740760U CN 202321020436 U CN202321020436 U CN 202321020436U CN 219740760 U CN219740760 U CN 219740760U
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- CN
- China
- Prior art keywords
- clamp splice
- circuit board
- copper deposition
- printed circuit
- deposition device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 47
- 239000010949 copper Substances 0.000 title claims abstract description 47
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 46
- 230000008021 deposition Effects 0.000 title claims abstract description 38
- 240000005002 Erythronium dens canis Species 0.000 claims description 6
- 238000006243 chemical reaction Methods 0.000 abstract description 5
- 239000007788 liquid Substances 0.000 description 9
- 238000001556 precipitation Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008602 contraction Effects 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006479 redox reaction Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
The utility model relates to the technical field of circuit board processing and discloses a copper deposition device for a printed circuit board, which comprises a processing pool, wherein a clamping mechanism is assumed in the processing pool and comprises four groups of support columns, the bottoms of the support columns are sleeved with first clamping blocks, the upper ends of the support columns are sleeved with telescopic fixing frames, a third clamping block is arranged below the fixing frames, and a plurality of second clamping blocks sleeved with the first clamping blocks are arranged between the first clamping blocks and the third clamping blocks. The first clamp splice, mount and third clamp splice are connected through setting up the support column, and connect a plurality of second clamp splice at the middle part of third clamp splice, carry out telescopic connection through the spring between messenger's second clamp splice and the first clamp splice, when the cylinder pushes down the scissors frame that the third clamp splice is taken together, the third clamp splice promotes the second clamp splice downwards, make a plurality of second clamp splice and first clamp splice carry out the centre gripping of a plurality of circuit boards fixedly, make the inside in the processing pond of impressing of circuit board stability, carry out copper deposition reaction, be convenient for the processing to the circuit board.
Description
Technical Field
The utility model relates to the technical field of circuit board processing, in particular to a copper deposition device for a printed circuit board.
Background
The chemical copper deposition is a self catalytic oxidation-reduction reaction, a circuit board to be deposited is soaked in copper deposition liquid, copper ions in the copper deposition liquid are reduced into metal copper and deposited on the circuit board, before copper deposition is carried out, the circuit board is required to be inserted onto a copper deposition frame, the copper deposition frame is carried to the corresponding position of a copper deposition wire, the circuit board is easy to collide in the process of inserting plates and carrying, the copper deposition thickness of the plate surface is enabled to be consistent, copper deposition liquid is unevenly distributed, the PCB is positioned at different depths of the copper deposition liquid in the copper deposition process, and small holes in the PCB in a copper deposition cylinder can not be covered by copper due to the existence of small bubbles, so that the produced PCB is unusable and poor in quality.
Disclosure of Invention
The utility model aims to provide a copper deposition device for a printed circuit board, which aims to solve the problems in the background technology.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a printed circuit board copper deposition apparatus, includes the processing pond, the inside assumption of processing pond has fixture, fixture includes four groups support columns, first clamp splice has been cup jointed to the bottom of support column, the upper end cover of support column has connect flexible mount, the below of mount is equipped with the third clamp splice, the centre of first clamp splice and third clamp splice sets up a plurality of and first clamp splice sheathed second clamp splice, the scissors frame has all been cup jointed at the middle part of first clamp splice, mount and third clamp splice, fixture's upper end is connected with the cylinder, the top of cylinder pierces through and cup joints on the roof of processing pond, the upper end of cylinder is connected with the dogtooth, the one side meshing of dogtooth has swing mechanism, swing mechanism's upper end is connected with the motor.
Optionally, the fixing frame is four L-shaped connecting plates, and four fixing frames are connected in pairs through four electric push rods.
Optionally, both ends of the second clamping block and the first clamping block are connected with circular rings sleeved with the support columns.
Optionally, the scissors frame includes X shape crisscross first link and first link, just the both ends of first link and second link all are connected with T shape stopper.
Optionally, the upper and lower both ends face of second clamp splice and third clamp splice all are equipped with the vertical cone, and a plurality of second clamp splice bottoms all are connected with the spring.
Optionally, swing mechanism is including fixing the slide rail at the processing pond upper surface, the top sliding connection of slide rail has the pinion rack of U word form, pinion rack one side is equipped with the tooth with protruding tooth meshing, eccentric block has been cup jointed to the inboard of pinion rack, the middle part of eccentric block rotates the output of connection at the motor.
Compared with the prior art, the utility model has the beneficial effects that:
1. this printed circuit board copper deposition device connects first clamp splice, mount and third clamp splice through setting up the support column, and connects a plurality of second clamp splice at the middle part of third clamp splice, carries out telescopic connection through the spring between messenger's second clamp splice and the first clamp splice, when the cylinder carries out the roll-down to the scissors frame that the third clamp splice was taken together, the third clamp splice promotes the second clamp splice downwards, makes a plurality of second clamp splice and first clamp splice carry out the centre gripping of a plurality of circuit boards and fix, makes the inside in the processing pond of impressing of circuit board stability, carries out copper deposition reaction, is convenient for the processing to the circuit board.
2. This printed circuit board copper precipitation device establishes ties and connects crisscross scissors frame at the middle part through the support column with first clamp splice, third clamp splice and mount, and is connected with electric putter on the mount, makes first clamp splice and second clamp splice carry out the centre gripping to four closed angle positions of circuit board fixed, erects circuit board horizontally at first clamp splice and second clamp splice middle part, is convenient for adjust the length and the width of adaptation circuit board through the flexible between first clamp splice, mount and the third clamp splice.
3. This printed circuit board copper precipitation device cup joints the cylinder in the middle part of processing pond to be connected with the dogtooth in the upper end of cylinder, make dogtooth and swing mechanism meshing be connected, drive eccentric block through the motor and rotate the reciprocal swing of messenger's pinion rack, drive cylinder and fixture at the inside vibration of processing pond, the bubble on circuit board surface is eliminated to the vibration that is convenient for utilize fixture, also stirs the copper precipitation liquid of processing pond inside, the copper precipitation liquid of processing pond inside of being convenient for evenly scribbles on the surface of circuit board.
Drawings
FIG. 1 is a schematic diagram of the overall structure of a copper deposition device for a printed circuit board according to the present utility model;
FIG. 2 is a schematic view of a clamping mechanism of a copper deposition device for a printed circuit board according to the present utility model;
FIG. 3 is a schematic diagram showing the connection of a clamping mechanism and a cylinder of a copper deposition device for a printed circuit board;
FIG. 4 is a schematic view of a scissors frame of a copper deposition device for a printed circuit board according to the present utility model;
FIG. 5 is a schematic view of a second clamp block of a copper deposition apparatus for a printed circuit board according to the present utility model;
fig. 6 is a schematic diagram of a swing mechanism of a copper deposition apparatus for a printed circuit board according to the present utility model.
In the figure: 1. a processing pool; 2. a clamping mechanism; 21. a support column; 22. a first clamping block; 23. a fixing frame; 24. a second clamping block; 25. a third clamping block; 26. a spring; 27. a scissors frame; 2701. a first connection frame; 2702. a second connecting frame; 28. an electric push rod; 29. a vertical cone; 3. a cylinder; 4. a swinging mechanism; 41. a toothed plate; 42. a slide rail; 43. an eccentric block; 5. a motor; 6. convex teeth.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1 to 6, the utility model provides a copper deposition device for a printed circuit board, which comprises a processing pool 1, wherein a clamping mechanism 2 is assumed in the processing pool 1, the clamping mechanism 2 comprises four groups of support columns 21, a first clamping block 22 is sleeved at the bottom of each support column 21, a telescopic fixing frame 23 is sleeved at the upper end of each support column 21, a third clamping block 25 is arranged below each fixing frame 23, a plurality of second clamping blocks 24 sleeved with each first clamping block 22 are arranged between each first clamping block 22 and each third clamping block 25, a scissors-shaped frame 27 is sleeved at the middle parts of each first clamping block 22, each fixing frame 23 and each third clamping block 25, an air cylinder 3 is connected at the upper end of each clamping mechanism 2, the top ends of the air cylinders 3 are penetratingly sleeved on a top plate of the processing pool 1, convex teeth 6 are connected at the upper ends of the air cylinders 3, a swinging mechanism 4 is meshed at one side of each convex tooth 6, and a motor 5 is connected at the upper ends of each swinging mechanism 4.
The fixing frames 23 are four L-shaped connecting plates, the four fixing frames 23 are connected in pairs through four electric push rods 28, and the length and the width of the electric push rods 28 after the four fixing frames 23 are connected are adjusted in a telescopic mode, so that the electric push rods are suitable for gears of the circuit board, the circuit board can be clamped and fixed stably, and copper deposition reaction of the circuit board is facilitated.
The two ends of the second clamping block 24 and the first clamping block 22 are connected with circular rings sleeved with the supporting columns 21, and the circular rings at the two sides of the first clamping block 22 and the third clamping block 25 are sleeved with the supporting columns 21, so that the first clamping block 22, the fixing frame 23, the second clamping block 24 and the third clamping block 25 are connected and slide up and down on the supporting columns 21, and the consistency of the device is ensured.
The scissors frame 27 comprises a first connecting frame 2701 and a first connecting frame 2701 which are crossed in an X shape, both ends of the first connecting frame 2701 and the second connecting frame 2702 are respectively connected with T-shaped limiting blocks, the first connecting frame 2701 and the second connecting frame 2702 are arranged to support the first clamping block 22, the fixing frame 23 and the third clamping block 25 conveniently, and the first clamping block 22, the fixing frame 23 and the third clamping block 25 are driven to slide and adjust conveniently, so that the size of the clamping mechanism 2 can be flexibly adjusted.
The upper and lower both ends face of second clamp splice 24 and third clamp splice 25 all is equipped with upright awl 29, a plurality of second clamp splice 24 bottoms all are connected with spring 26, upright awl 29's setting is convenient for carry out the centre gripping contact area to the circuit board at first clamp splice 22 and second clamp splice 24, increase circuit board and copper precipitation solution reaction's area, be convenient for carry out copper precipitation to the circuit board and handle, and spring 26's setting carries out elastic buffer connection between second clamp splice 24 and the first clamp splice 22, be convenient for synchronous adjustment height between second clamp splice 24 and the first clamp splice 22, be convenient for synchronous carry out centre gripping and loosen the circuit board, be convenient for the last unloading of circuit board.
The swing mechanism 4 comprises a sliding rail 42 fixed on the upper surface of the processing pool 1, a U-shaped toothed plate 41 is slidably connected above the sliding rail 42, teeth meshed with the convex teeth 6 are arranged on one side of the toothed plate 41, an eccentric block 43 is sleeved on the inner side of the toothed plate 41, the middle part of the eccentric block 43 is rotationally connected to the output end of the motor 5, tooth grooves on the toothed plate 41 are meshed with the convex teeth 6, the toothed plate 41 is driven to swing left and right on the sliding rail 42 in the rotation process of the eccentric block 43, the cylinder 3 is driven to swing back and forth in the tooth number of the convex teeth 6 in a small amplitude in the swing process, vibration is generated on the clamping mechanism 2 at the bottom end of the cylinder 3, and copper deposition reaction of a circuit board is facilitated.
Working principle: when the device is used, the upper end of the processing pool 1 is connected with the air cylinder 3, the bottom end of the air cylinder 3 is connected with the fixing frame 23 through the scissors frame 27, the fixing frame 23 is connected with the electric push rod 28, the expansion and contraction of the electric push rod 28 adjusts the interval between the four fixing frames 23, the first clamping block 22 and the third clamping block 25 which are connected with the bottom of the fixing frame 23 slide and swing on the scissors frame 27, the second clamping block 24 and the first clamping block 22 can adapt to the length and the width of a circuit board, the four sharp angle positions of the circuit board are clamped and fixed, the circuit board is horizontally erected in the middle of the first clamping block 22 and the second clamping block 24, the bottom of the fixing frame 23 is connected with the first clamping block 22 and the third clamping block 25 through the supporting columns 21, the middle of the third clamping block 25 is connected with a plurality of second clamping blocks 24, the second clamping blocks 24 and the first clamping blocks 22 are in expansion and contraction connection through springs 26, when the cylinder 3 presses down the scissors frame 27 connected with the third clamping block 25, the third clamping block 25 pushes down the second clamping block 24 to enable the second clamping blocks 24 and the first clamping block 22 to clamp and fix the circuit boards, the circuit boards are stably pressed into the processing pool 1, the clamping mechanism 2 and the circuit boards are immersed into copper deposition liquid in the processing pool 1 through the cylinder 3, the upper end of the cylinder 3 is connected with the convex teeth 6, the convex teeth 6 are meshed with the swinging mechanism 4, the motor 5 drives the eccentric block 43 to rotate, the eccentric block 43 impacts the toothed plate 41 to enable the toothed plate 41 to swing on the sliding rail 42 in a reciprocating way, the cylinder 3 is driven to swing at a small amplitude at a high frequency, the clamping mechanism 2 is enabled to vibrate in the processing pool 1, bubbles on the surface of the circuit boards are conveniently eliminated by utilizing vibration of the clamping mechanism 2, the copper deposition liquid in the processing pool 1 is also stirred, the copper deposition liquid inside the processing pool 1 is convenient to uniformly coat on the surface of the circuit board.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a printed circuit board copper deposition device, includes processing pond (1), its characterized in that, the inside of processing pond (1) is assumed to have fixture (2), fixture (2) are including four group's support columns (21), first clamp splice (22) have been cup jointed to the bottom of support column (21), telescopic mount (23) have been cup jointed to the upper end of support column (21), the below of mount (23) is equipped with third clamp splice (25), the centre of first clamp splice (22) and third clamp splice (25) sets up a plurality of second clamp splice (24) that cup joint with first clamp splice (22), the middle part of first clamp splice (22), mount (23) and third clamp splice (25) has all cup jointed a scissors frame (27), the upper end of fixture (2) is connected with cylinder (3), the top of cylinder (3) pierces through and cup joints on the roof of processing pond (1), the upper end of cylinder (3) is connected with dogtooth (6), one side of dogtooth (6) has motor (4) to cup joint on the swing mechanism (4), swing mechanism (4) have meshing.
2. The copper deposition device for the printed circuit board according to claim 1, wherein the fixing frames (23) are four L-shaped connecting plates, and the four fixing frames (23) are connected in pairs through four electric push rods (28).
3. A copper deposition device for printed circuit boards according to claim 1, wherein the second clamping block (24) and the first clamping block (22) are connected with a circular ring sleeved with the supporting column (21) at both ends.
4. A copper deposition device for printed circuit boards according to claim 1, wherein the scissors frame (27) comprises a first connecting frame (2701) and a first connecting frame (2701) which are crossed in an X shape, and both ends of the first connecting frame (2701) and the second connecting frame (2702) are connected with T-shaped limiting blocks.
5. The copper deposition device for the printed circuit board according to claim 1, wherein vertical cones (29) are respectively arranged on the upper end face and the lower end face of the second clamping blocks (24) and the third clamping blocks (25), and springs (26) are respectively connected to the bottoms of the second clamping blocks (24).
6. The copper deposition device for the printed circuit board according to claim 1, wherein the swinging mechanism (4) comprises a sliding rail (42) fixed on the upper surface of the processing pool (1), a U-shaped toothed plate (41) is slidably connected above the sliding rail (42), teeth meshed with the convex teeth (6) are arranged on one side of the toothed plate (41), an eccentric block (43) is sleeved on the inner side of the toothed plate (41), and the middle part of the eccentric block (43) is rotatably connected to the output end of the motor (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321020436.8U CN219740760U (en) | 2023-05-04 | 2023-05-04 | Copper deposition device for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321020436.8U CN219740760U (en) | 2023-05-04 | 2023-05-04 | Copper deposition device for printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219740760U true CN219740760U (en) | 2023-09-22 |
Family
ID=88054621
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321020436.8U Active CN219740760U (en) | 2023-05-04 | 2023-05-04 | Copper deposition device for printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219740760U (en) |
-
2023
- 2023-05-04 CN CN202321020436.8U patent/CN219740760U/en active Active
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