CN219730549U - Reduction furnace with high thermal stability - Google Patents
Reduction furnace with high thermal stability Download PDFInfo
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- CN219730549U CN219730549U CN202320401377.2U CN202320401377U CN219730549U CN 219730549 U CN219730549 U CN 219730549U CN 202320401377 U CN202320401377 U CN 202320401377U CN 219730549 U CN219730549 U CN 219730549U
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- Prior art keywords
- cavity
- pipe
- condensing
- evaporating
- reducing furnace
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- 238000001704 evaporation Methods 0.000 claims abstract description 61
- 230000008020 evaporation Effects 0.000 claims abstract description 27
- 238000009833 condensation Methods 0.000 claims abstract description 26
- 230000005494 condensation Effects 0.000 claims abstract description 24
- 239000011148 porous material Substances 0.000 claims abstract description 17
- 229910021420 polycrystalline silicon Inorganic materials 0.000 abstract description 8
- 229920005591 polysilicon Polymers 0.000 abstract description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 2
- 238000006722 reduction reaction Methods 0.000 description 20
- 239000002994 raw material Substances 0.000 description 2
- 238000004064 recycling Methods 0.000 description 2
- 239000000498 cooling water Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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Abstract
A reducing furnace with high thermal stability relates to the technical field of polysilicon production. The outside of the tail gas pipe is wrapped with an evaporation cavity, the outside of the reduction furnace is wrapped with a condensation cavity, a layer of capillary porous material is attached to the outside of the furnace body in the condensation cavity, a layer of capillary porous material is attached to the outside of the tail gas pipe in the evaporation cavity, and the evaporation cavity and the condensation cavity are connected through the evaporation pipe and the condensation pipe to form a closed space. The beneficial effects of the utility model are as follows: the evaporating cavity and the condensing cavity form a heat pipe system, the heat conduction oil in the evaporating cavity is heated and evaporated under the negative pressure condition, the evaporated heat conduction oil is condensed in the condensing cavity to release heat, the condensed heat conduction oil flows back to the evaporating cavity through the condensing pipe to circulate, under the action of the heat pipe, the heat of the tail gas pipe is brought back to the outer side of the reduction furnace body, the heat dissipation of the furnace body of the reduction furnace is prevented from influencing the temperature of a thermal field of the reduction furnace, and the stability of the thermal field of the reduction furnace is improved.
Description
Technical Field
The utility model relates to the technical field of polysilicon production, in particular to a reducing furnace with high thermal stability.
Background
In the production process of polysilicon, the reduction of raw materials is a very critical step, the reduction reaction is carried out on the raw materials through a reduction furnace, the tail gas in the reduction furnace contains a large amount of heat in the use process of the reduction furnace, in order to avoid energy waste, the heat is usually recycled, a common recycling device is a low-pressure steam flash tank (0.2/0.4 MPa), the reduction tail gas is cooled by using furnace cooling water after exiting the reduction furnace, the heat energy is brought to the low-pressure steam flash tank (0.2/0.4 MPa) to flash low-pressure steam, the recycling efficiency is low, matched equipment is needed, and the part of heat energy cannot be utilized in the occasion of not needing low-pressure steam.
Disclosure of Invention
The utility model provides a reduction furnace with high thermal stability, which aims to solve the problems of low tail gas recovery efficiency and high equipment cost of the existing polysilicon reduction furnace.
The technical scheme provided by the utility model is as follows: the utility model provides a high reducing furnace of thermal stability, includes reducing furnace and tail gas pipe, and the tail gas pipe outside parcel has the evaporating chamber, and the reducing furnace outside parcel has the condensing chamber, still the furnace body outside in the condensing chamber adheres to one deck capillary porous material, and the tail gas pipe outside in the evaporating chamber adheres to one deck capillary porous material, connects into a inclosed space through evaporating pipe and condenser pipe between evaporating chamber and the condensing chamber, the intussuseption of inclosed space is filled with the conduction oil, and this confined space is sucked into negative pressure state, and wherein the capillary porous material of condensing pipe is adhered to in the condensing pipe, and the capillary porous material of condensing pipe is connected with evaporating chamber, the capillary porous material of condensing intracavity.
The number of the evaporation chambers is three; the condensing chambers are divided into three, the three evaporating chambers are sequentially arranged on the tail gas pipe, the condensing chambers are arranged up and down on the outer side of the reducing furnace body, the evaporating chamber closest to the reducing furnace is connected with the condensing chamber on the uppermost side of the reducing furnace through the evaporating pipe and the condensing pipe, the intermediate evaporating chamber is connected with the condensing chamber in the middle of the reducing furnace through the evaporating pipe and the condensing pipe, and the evaporating chamber furthest from the reducing furnace is connected with the condensing chamber on the lowermost side of the reducing furnace through the evaporating pipe and the condensing pipe.
An electric valve is arranged on the evaporation cavity.
The beneficial effects of the utility model are as follows: the evaporation cavity and the condensation cavity form a heat pipe system, heat conduction oil in the evaporation cavity is heated and evaporated under the negative pressure condition, the evaporated heat conduction oil condenses in the condensation cavity to release heat, the condensed heat conduction oil flows back to the evaporation cavity through the condensation pipe to circulate, under the action of the heat pipe, the heat of the tail gas pipe is brought back to the outer side of the reduction furnace, the heat dissipation of the furnace body of the reduction furnace is prevented from influencing the thermal field temperature of the reduction furnace, the thermal field stability of the reduction furnace is improved, three groups of evaporation cavities and the condensation cavity are arranged at the stage of the tail gas pipe from high temperature to low temperature to form three heat pipe systems, the three groups of evaporation cavities and the condensation cavity are respectively matched with the growth temperature gradient of polysilicon at the stage of the furnace body of the reduction furnace from the lower part to the upper part, the thermal field stability of the reduction furnace is further improved, the growth quality of polysilicon is improved, and the evaporation pipe is provided with an electric valve to play a role of a heat pipe switch, so that the thermal field temperature and the gradient of the reduction furnace are accurately controlled.
Drawings
Fig. 1 is a schematic diagram of the structure of the present utility model.
In the figure: the device comprises a 1-reduction furnace, a 2-tail gas pipe, a 3-evaporation cavity, a 4-condensation cavity, a 5-evaporation pipe, a 6-condensation pipe and a 7-electric valve.
Detailed Description
As shown in fig. 1, the reducing furnace with high thermal stability comprises a reducing furnace 1 and a tail gas pipe 2, wherein an evaporation cavity 3 is wrapped outside the tail gas pipe 2, a condensation cavity 4 is wrapped outside the reducing furnace 1, a layer of capillary porous material is adhered to the outer side of a furnace body 1 in the condensation cavity 4, a layer of capillary porous material is adhered to the outer side of a tail gas pipe 2 in the evaporation cavity 3, the evaporation cavity 3 and the condensation cavity 4 are connected through an evaporation pipe 5 and a condensation pipe 6 to form a closed space, heat conducting oil is filled in the closed space, the closed space is pumped into a negative pressure state, the capillary porous material is adhered to the condensation pipe 6, the capillary porous material of the condensation pipe 6 is connected with the evaporation cavity 3 and the capillary porous material in the condensation cavity 4, the evaporation cavity 3 and the condensation cavity 4 form a heat pipe system, the evaporated heat conducting oil in the evaporation cavity 3 is heated under the negative pressure condition, the condensed heat releasing quantity in the condensation cavity 4, the condensed heat conducting oil flows back to the evaporation cavity 3 through the condensation pipe 6, the heat conducting oil of the tail gas pipe 2 is brought back to the reduction furnace 1 under the action of the heat of the condensation pipe 6, the heat of the reducing furnace is prevented from affecting the thermal stability of the reducing furnace 1, and the thermal stability of the reducing furnace 1 is prevented.
The number of the evaporation chambers 3 is three; the condensing chambers 4 are divided into three, three evaporating chambers 3 are sequentially arranged on the tail gas pipe 2, the condensing chambers 4 are arranged up and down on the outer side of the reducing furnace 1, the evaporating chamber 3 closest to the reducing furnace 1 is connected with the condensing chamber 4 on the uppermost side of the reducing furnace 1 through the evaporating pipe 5 and the condensing pipe 6, the evaporating chamber 3 in the middle is connected with the condensing chamber 4 in the middle of the reducing furnace 1 through the evaporating pipe 5 and the condensing pipe 6, the evaporating chamber 3 farthest from the reducing furnace 1 is connected with the condensing chamber 4 on the lowermost side of the reducing furnace 1 through the evaporating pipe 5 and the condensing pipe 6, three groups of evaporating chambers 3 and the condensing chamber 4 are arranged at the stage of the tail gas pipe 2 from high temperature to low temperature to form three heat pipe systems, the stage of the temperature rise of the lower part to the upper part of the furnace body of the reducing furnace 1 is matched with the growth temperature gradient of polysilicon, the thermal field stability of the reducing furnace 1 is further improved, and the growth quality of polysilicon is improved.
The evaporating cavity 3 is provided with an electric valve 7 which plays a role of a heat pipe switch, thereby precisely controlling the temperature and gradient of the thermal field of the reduction furnace 1.
Claims (3)
1. The utility model provides a high reducing furnace of thermal stability, includes reducing furnace (1) and tail gas pipe (2), its characterized in that: the evaporation cavity (3) is wrapped up in the tail gas pipe (2), the condensation cavity (4) is wrapped up in the reducing furnace (1) outside, one deck capillary porous material is attached to the reducing furnace (1) outside in the condensation cavity (4), one deck capillary porous material is attached to the tail gas pipe (2) outside in the evaporation cavity (3), connect into a inclosed space through evaporating pipe (5) and condenser pipe (6) between evaporation cavity (3) and the condensation cavity (4), this inclosed space intussuseption is filled with conduction oil, sealed space is sucked into negative pressure state, wherein capillary porous material is attached to in the condenser pipe (6), capillary porous material in condenser pipe (6) is connected with capillary porous material in evaporation cavity (3), the condensation cavity (4).
2. The reduction furnace with high thermal stability according to claim 1, wherein: the number of the evaporation chambers (3) is three; the condensing cavities (4) are divided into three, three evaporating cavities (3) are sequentially arranged on the tail gas pipe (2), the condensing cavities (4) are arranged up and down on the outer side of the reducing furnace (1), the evaporating cavities (3) closest to the reducing furnace (1) are connected with the condensing cavities (4) on the uppermost side of the reducing furnace (1) through evaporating pipes (5) and condensing pipes (6), the middle evaporating cavities (3) are connected with the condensing cavities (4) in the middle of the reducing furnace (1) through the evaporating pipes (5) and the condensing pipes (6), and the evaporating cavities (3) farthest from the reducing furnace (1) are connected with the condensing cavities (4) on the lowermost side of the reducing furnace (1) through the evaporating pipes (5) and the condensing pipes (6).
3. The reduction furnace with high thermal stability according to claim 1, wherein: an electric valve (7) is arranged on the evaporation cavity (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320401377.2U CN219730549U (en) | 2023-03-06 | 2023-03-06 | Reduction furnace with high thermal stability |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320401377.2U CN219730549U (en) | 2023-03-06 | 2023-03-06 | Reduction furnace with high thermal stability |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219730549U true CN219730549U (en) | 2023-09-22 |
Family
ID=88063019
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320401377.2U Active CN219730549U (en) | 2023-03-06 | 2023-03-06 | Reduction furnace with high thermal stability |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219730549U (en) |
-
2023
- 2023-03-06 CN CN202320401377.2U patent/CN219730549U/en active Active
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