CN219725861U - Clamping device for processing semiconductor precision die - Google Patents
Clamping device for processing semiconductor precision die Download PDFInfo
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- CN219725861U CN219725861U CN202320175237.8U CN202320175237U CN219725861U CN 219725861 U CN219725861 U CN 219725861U CN 202320175237 U CN202320175237 U CN 202320175237U CN 219725861 U CN219725861 U CN 219725861U
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- precision die
- fixedly connected
- clamping device
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- connecting rod
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 41
- 238000012545 processing Methods 0.000 title claims abstract description 27
- 230000005540 biological transmission Effects 0.000 claims abstract description 13
- 238000007789 sealing Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 5
- 230000000087 stabilizing effect Effects 0.000 claims description 5
- 230000000694 effects Effects 0.000 claims 1
- 230000008901 benefit Effects 0.000 abstract description 3
- 239000011324 bead Substances 0.000 description 6
- 239000012634 fragment Substances 0.000 description 5
- 238000005457 optimization Methods 0.000 description 5
- 230000009471 action Effects 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The utility model discloses a clamping device for processing a semiconductor precision die, which comprises a placing block, wherein the top of the placing block is provided with a plurality of patterns of placing grooves, the surface of the placing block is fixedly connected with a fixing sleeve, the right side of the inner wall of the fixing sleeve is fixedly provided with a motor, the output end of the motor is fixedly connected with a transmission gear, and the inside of the fixing sleeve is provided with a toothed ring meshed with the transmission gear. According to the utility model, firstly, the semiconductor precision die arranged outside is placed and limited by the multiple-mode placing groove, then the motor drives the transmission gear to rotate and then drives the toothed ring to rotate in the fixed sleeve, and finally, the toothed ring drives the connecting rod and the clamping plate to rotate through meshing with the fixed gear to clamp and limit the semiconductor precision die, so that the clamping device has the advantage of stable clamping, replaces the mode that the two ends of the semiconductor precision die are clamped in the processing of the traditional clamping device, and improves the clamping stability of the semiconductor precision die in the processing.
Description
Technical Field
The utility model relates to the technical field of semiconductors, in particular to a clamping device for processing a semiconductor precision die.
Background
The semiconductor refers to a material with conductivity between a conductor and an insulator at normal temperature, the semiconductor refers to a material with controllable conductivity ranging from the insulator to the conductor, and the semiconductor affects daily work and life of people from the aspects of scientific technology and economic development.
When the semiconductor precision die is processed, the clamping device is used for clamping the semiconductor precision die, so that the semiconductor precision die can be processed such as drilling and cutting, but the conventional clamping device is used for clamping and limiting the two ends of the semiconductor precision die in the processing, and the clamping mode can only provide two-end clamping, so that the clamping stability is still to be improved.
Therefore, there is a need for design modification of a clamping device in semiconductor precision die processing, which effectively prevents the phenomenon that the clamping device cannot be stably clamped in the semiconductor precision die processing.
Disclosure of Invention
In order to solve the problems in the prior art, the utility model aims to provide a clamping device for processing a semiconductor precision die, which has the advantage of stable clamping and solves the problems that the clamping stability is still to be improved because the two ends of the existing semiconductor precision die are clamped in the processing.
In order to achieve the above purpose, the present utility model provides the following technical solutions: a clamping device for processing a semiconductor precision die comprises a placing block;
the top of the placing block is provided with a plurality of patterns of placing grooves, the surface of the placing block is fixedly connected with a fixing sleeve, the right side of the inner wall of the fixing sleeve is fixedly provided with a motor, the output end of the motor is fixedly connected with a transmission gear, the inside of the fixing sleeve is provided with a toothed ring meshed with the transmission gear, the inner wall of the fixing sleeve is provided with a limiting ring groove, the limiting ring groove is positioned at the outer side of the toothed ring, the inner wall of the fixing sleeve is fixedly connected with a stabilizing block, the bottom of the stabilizing block is movably connected with a connecting rod, the bottom fixedly connected with fixed gear of connecting rod, fixed gear's surface and the inner wall meshing of ring gear, the top of connecting rod runs through to the top of fixed cover and fixedly connected with clamping plate, spacing mouth has been seted up to the surface of connecting rod, the powerful shell fragment of stirring of inside fixedly connected with of spacing mouth, the surface cover of connecting rod is equipped with and supports tight board, the powerful shell fragment of stirring is kept away from one side of spacing mouth and is supported tight board's inner wall fixed connection.
As the preferable mode of the utility model, the bottom of the surface of the placing block is fixedly connected with mounting plates, the number of the mounting plates is three, and the three mounting plates are distributed in an annular equidistant manner.
As the preferable mode of the utility model, the top and the bottom of the inner wall of the limit ring groove are movably embedded with balls, and the surfaces of the balls are in sliding connection with the surfaces of the toothed rings.
As the preferable mode of the utility model, the number of the balls is a plurality of balls, and the balls are circularly distributed in the limiting ring groove.
As a preferable mode of the utility model, the inner wall of the fixing sleeve is fixedly connected with a sealing ring, and the inner wall of the sealing ring is contacted with the surface of the placing block.
Preferably, the surface of the connecting rod is connected with a fluent bead in a sliding way, and the surface of the fluent bead is movably inlaid in the fixing sleeve.
Compared with the prior art, the utility model has the following beneficial effects:
1. according to the utility model, firstly, the semiconductor precision die arranged outside is placed and limited by the multiple-mode placing groove, then the motor drives the transmission gear to rotate and then drives the toothed ring to rotate in the fixed sleeve, and finally, the toothed ring drives the connecting rod and the clamping plate to rotate through meshing with the fixed gear to clamp and limit the semiconductor precision die, so that the clamping device has the advantage of stable clamping, replaces the mode that the two ends of the semiconductor precision die are clamped in the processing of the traditional clamping device, and improves the clamping stability of the semiconductor precision die in the processing.
2. According to the utility model, the mounting plate is arranged, so that the placing block can be supported, and can be mounted on an external processing platform in use, and a user can conveniently fix the placing block.
Drawings
FIG. 1 is a schematic perspective view of the structure of the present utility model;
FIG. 2 is a schematic front view of the structure of the present utility model;
FIG. 3 is an enlarged schematic view of the structure of the present utility model at A in FIG. 2.
In the figure: 1. placing a block; 2. a multi-style placement slot; 3. a fixed sleeve; 4. a motor; 5. a transmission gear; 6. a toothed ring; 7. a limit ring groove; 8. a stabilizing block; 9. a connecting rod; 10. a fixed gear; 11. a clamping plate; 12. a limit opening; 13. the spring plate is strongly stirred; 14. a pressing plate; 15. a mounting plate; 16. a ball; 17. a seal ring; 18. fluent beads.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
As shown in fig. 1 to 3, the clamping device for processing a semiconductor precision die provided by the utility model comprises a placing block 1;
the top of placing the piece 1 has offered many styles standing groove 2, the fixed cover 3 of fixed fixedly connected with of surface of placing the piece 1, the right side fixed mounting of fixed cover 3 inner wall has motor 4, the output fixedly connected with drive gear 5 of motor 4, the inside of fixed cover 3 is provided with the ring gear 6 with drive gear 5 meshing, spacing annular 7 has been seted up to the inner wall of fixed cover 3, spacing annular 7 is located the outside of ring gear 6, the inner wall fixedly connected with steady block 8 of fixed cover 3, the bottom swing joint of steady block 8 has connecting rod 9, the bottom fixedly connected with fixed gear 10 of connecting rod 9, the surface of fixed gear 10 meshes with the inner wall of ring gear 6, the top of connecting rod 9 runs through to the top of fixed cover 3 and fixedly connected with clamping plate 11, spacing mouth 12 has been seted up on the surface of connecting rod 9, the inside fixedly connected with strong shell fragment 13 of spacing mouth 12, the surface cover of connecting rod 9 is equipped with supports tight board 14, the one side that spacing mouth 12 was kept away from to strong shell fragment 13 is fixedly connected with the inner wall of tight board 14.
Referring to fig. 1, the bottom of the surface of the placement block 1 is fixedly connected with mounting plates 15, the number of the mounting plates 15 is three, and the three mounting plates 15 are distributed in an annular equidistant manner.
As a technical optimization scheme of the utility model, the placement block 1 can be supported by arranging the mounting plate 15, so that the placement block 1 can be mounted on an external processing platform in use, and a user can conveniently fix the placement block 1.
Referring to fig. 3, balls 16 are movably embedded at the top and the bottom of the inner wall of the limit ring groove 7, and the surfaces of the balls 16 are slidably connected with the surface of the toothed ring 6.
As a technical optimization scheme of the utility model, through the arrangement of the balls 16, the toothed ring 6 can smoothly rotate in the limiting ring groove 7, so that the toothed ring 6 can stably and smoothly rotate in the limiting ring groove 7 under the drive of the transmission gear 5.
Referring to fig. 2, the number of balls 16 is a plurality, and the balls 16 are circularly distributed inside the limiting ring groove 7.
As a technical optimization scheme of the present utility model, the number of the balls 16 is set to be a plurality, so that the toothed ring 6 can be stably supported in the limiting ring groove 7, and the toothed ring 6 can be stably rotated in the limiting ring groove 7.
Referring to fig. 2, the inner wall of the fixed sleeve 3 is fixedly connected with a sealing ring 17, and the inner wall of the sealing ring 17 is in contact with the surface of the placement block 1.
As a technical optimization scheme of the utility model, the gap between the fixed sleeve 3 and the placing block 1 can be sealed by arranging the sealing ring 17, so that the phenomenon that the meshing between the toothed ring 6 and the transmission gear 5 is influenced by processing scraps and dust entering the inside of the fixed sleeve 3 from the gap between the fixed sleeve 3 and the placing block 1 is avoided.
Referring to fig. 3, the surface of the connecting rod 9 is slidably connected with a fluid bead 18, and the surface of the fluid bead 18 is movably embedded in the fixing sleeve 3.
As a technical optimization scheme of the utility model, the surface of the connecting rod 9 can be limited by arranging the fluent beads 18, so that the connecting rod 9 is stably limited in the rotation of the inside of the fixed sleeve 3, and the connecting rod 9 is fluently rotated in the inside of the fixed sleeve 3.
The working principle and the using flow of the utility model are as follows: during the use, the user at first places the semiconductor precision die that needs processing into the inside of the multiple formula standing groove 2 at standing block 1 top, and multiple formula standing groove 2 can adapt to the semiconductor precision die of multiple size, make the semiconductor precision die place into multiple formula standing groove 2 obtain the spacing of multiple formula standing groove 2, then start motor 4 drives transmission gear 5 and rotate, the transmission gear 5 rotates the back and drives toothed ring 6 and rotate in the inside of spacing annular groove 7 through the meshing with toothed ring 6, toothed ring 6 rotates the back fixed gear 10 and drives connecting rod 9 under the spacing support of stable piece 8 through the meshing with toothed ring 6 inner wall and rotate, connecting rod 9 rotates back and drives clamping plate 11 and support tight plate 14 and rotate, after the high height of semiconductor precision die is higher than multiple formula standing groove 2, can with the surface contact of clamping plate 11, make three clamping plate 11 press from multiple semiconductor precision die press from a plurality of places spacing, after the high of semiconductor precision die is less than multiple formula standing groove 2, can make support tight plate 14 and clamping plate 11 compress tightly in the inside of multiple formula standing groove 2, can make the high-precision die 13 rotate the high-speed die 13 and can be pressed from top to bottom the multiple precision die 13 to the high-speed die, thereby can reach the high-strength and can be pressed down to the high-strength to the semiconductor precision die 13, the high-precision die 13 can be stirred the high to the high-strength and the high-precision die 13 can be stirred down at multiple precision die 13 and the high-speed down die 13.
To sum up: this clamping device is used in accurate mould processing of semiconductor is through setting up to place piece 1, multiple pattern standing groove 2, fixed cover 3, motor 4, drive gear 5, ring gear 6, spacing annular 7, stable piece 8, connecting rod 9, fixed gear 10, clamping plate 11, spacing mouth 12, powerful stirring shell fragment 13 and support the cooperation of tight board 14 and use, has solved the accurate mould of current semiconductor and has adopted both ends to press from both sides tightly in the processing, and the clamping stability still remains the problem that improves.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. A clamping device for processing a semiconductor precision die comprises a placing block (1);
the method is characterized in that: the utility model discloses a high-strength elastic piece fixing device, which is characterized in that a plurality of types of standing grooves (2) are formed in the top of a standing block (1), a fixed sleeve (3) is fixedly connected with the surface of the standing block (1), a motor (4) is fixedly arranged on the right side of the inner wall of the fixed sleeve (3), a transmission gear (5) is fixedly connected with the output end of the motor (4), a toothed ring (6) meshed with the transmission gear (5) is arranged in the fixed sleeve (3), a limit ring groove (7) is formed in the inner wall of the fixed sleeve (3), the limit ring groove (7) is arranged on the outer side of the toothed ring (6), a stabilizing block (8) is fixedly connected with the inner wall of the fixed sleeve (3), a connecting rod (9) is movably connected with the bottom of the stabilizing block (8), a fixed gear (10) is fixedly connected with the bottom of the connecting rod (9), the surface of the fixed gear (10) is meshed with the inner wall of the toothed ring (6), the top of the connecting rod (9) penetrates through the top of the fixed sleeve (3) and is fixedly connected with a clamping plate (11), a surface of the connecting rod (9) is provided with a limit plate (12), a limit plate (13) is arranged in the surface of the connecting rod (13), one side of the strong toggle spring piece (13) far away from the limit opening (12) is fixedly connected with the inner wall of the abutting plate (14).
2. The clamping device for precision die processing of semiconductor according to claim 1, wherein: the bottom of placing piece (1) surface fixedly connected with mounting panel (15), the quantity of mounting panel (15) is three, and three mounting panel (15) are annular equidistance and distribute.
3. The clamping device for precision die processing of semiconductor according to claim 1, wherein: balls (16) are movably embedded at the top and the bottom of the inner wall of the limit ring groove (7), and the surfaces of the balls (16) are slidably connected with the surface of the toothed ring (6).
4. A clamping device for precision die processing of semiconductor as defined in claim 3, wherein: the number of the balls (16) is a plurality of the balls (16), and the balls (16) are circularly distributed in the limiting ring groove (7).
5. The clamping device for precision die processing of semiconductor according to claim 1, wherein: the inner wall of the fixed sleeve (3) is fixedly connected with a sealing ring (17), and the inner wall of the sealing ring (17) is in contact with the surface of the placing block (1).
6. The clamping device for precision die processing of semiconductor according to claim 1, wherein: the surface sliding connection of connecting rod (9) has smooth pearl (18), the surface activity of smooth pearl (18) is inlayed in the inside of fixed cover (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320175237.8U CN219725861U (en) | 2023-02-10 | 2023-02-10 | Clamping device for processing semiconductor precision die |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320175237.8U CN219725861U (en) | 2023-02-10 | 2023-02-10 | Clamping device for processing semiconductor precision die |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219725861U true CN219725861U (en) | 2023-09-22 |
Family
ID=88053453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320175237.8U Active CN219725861U (en) | 2023-02-10 | 2023-02-10 | Clamping device for processing semiconductor precision die |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219725861U (en) |
-
2023
- 2023-02-10 CN CN202320175237.8U patent/CN219725861U/en active Active
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