CN219718660U

CN219718660U - Film chip resistor paster equipment

Info

Publication number: CN219718660U
Application number: CN202321014642.8U
Authority: CN
Inventors: 韩大林; 张红雷; 王英党; 彭旭
Original assignee: Dongguan Aillen Electronic Technology Co ltd
Current assignee: Dongguan Aillen Electronic Technology Co ltd
Priority date: 2023-04-28
Filing date: 2023-04-28
Publication date: 2023-09-19
Anticipated expiration: 2033-04-28

Abstract

The utility model discloses film chip resistor chip device which comprises a base, wherein the bottom of the inner side surface of the base is fixedly connected with a first baffle, the inner bottom wall of the base is fixedly connected with a semiconductor refrigerator, and the top of the inner side surface of the base is fixedly connected with a second baffle. This film chip resistor paster equipment, through semiconductor refrigerator, the water pump, the drinking-water pipe, the condenser pipe, the setting of back flow and fan, semiconductor refrigerator operation makes the coolant liquid cooling, the drinking-water pipe passes through the inside that the cooling liquid was carried the condenser pipe, the air conditioning that the fan produced the condenser pipe blows the circuit board, the low temperature that utilizes the coolant liquid carries out cooling treatment to the high temperature that produces when the welding of condenser paster, increase cooling efficiency, the inside coolant liquid rethread back flow of condenser pipe returns inside the base again, form a backward flow, carry out continuous cooling treatment, the phenomenon that the high temperature that produces when avoiding the welding leads to circuit board and condenser damage takes place.

Description

Film chip resistor paster equipment

Technical Field

The utility model relates to the technical field of chip equipment, in particular to chip equipment for a film chip resistor.

Background

The chip resistor is also called a chip fixed resistor, which is one of metal glass glaze resistors, when the circuit resistor element is connected on the circuit board in order to save space, the chip resistor is often required to be used for designing a circuit, and the capacitor chip mounter is arranged in a production line and is a device for accurately placing the surface mounted component on the PCB bonding pad by moving the mounting head after the glue dispenser or the screen printer.

Through retrieving, chinese patent publication (bulletin) No. CN216212612U discloses a precision film chip resistor, when needs chip resistor presss from both sides and gets, can take off chip resistor from the deposit plastic strip of depositing, then inwards pinch through stable tweezers to drive and press from both sides and get the piece and remove to the inboard, then slide at the inner wall of stable draw-in groove through pressing from both sides getting the pad, can stably clamp up chip resistor, can drive through rotating stable horizontal pole and press from both sides and get the dead lever joint in pressing from both sides the inside of getting the dead slot, fix the angle of opening and shutting of tweezers, thereby can be with chip resistor steady clamp place the installation circuit board on, and then reach the effect of conveniently pressing from both sides and getting chip resistor.

The resistor is conveniently clamped, but the resistor can generate high temperature when welded on the circuit board, the circuit board of the patch needs to be cooled after the patch is finished, and the traditional chip mounter does not have a cooling device, so that the production efficiency is reduced, and therefore, the film patch resistor patch equipment is required to be designed to solve the problem.

Disclosure of Invention

The utility model mainly aims to provide a film chip resistor chip device which can effectively solve the problems in the background technology.

In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows:

the film chip resistor chip device comprises a base, wherein the bottom of the inner side surface of the base is fixedly connected with a first baffle, the inner bottom wall of the base is fixedly connected with a semiconductor refrigerator, and the top of the inner side surface of the base is fixedly connected with a second baffle; one side fixedly connected with water pump of first baffle upper surface, the output fixedly connected with drinking-water pipe of water pump, the one end fixedly connected with condenser pipe of drinking-water pipe, the one end fixedly connected with back flow of condenser pipe, the middle part fixedly connected with fan of second baffle upper surface, the surface fixedly connected with pipe clamp of condenser pipe, the pipe clamp is fixed connection with the base.

In order to achieve the effect of facilitating cold air circulation, as the film chip resistor chip device provided by the utility model, the middle part of the upper surface of the base is fixedly connected with the placing table, and through holes are formed in the placing table and the middle part of the upper surface of the base.

In order to achieve the effect of being convenient for water inflow, the film chip resistor chip device is characterized in that a water inlet hole is formed in the top of the outer surface of the base, and a plug is movably connected in the water inlet hole.

In order to achieve the effect of being convenient for mounting, the four corners of the upper surface of the base are fixedly connected with the supporting columns, the top of each supporting column is fixedly connected with the top plate, the middle of the lower surface of the top plate is fixedly connected with the hydraulic rod, and one end of the hydraulic rod is fixedly connected with the mounting head.

In order to achieve the effect of being convenient for air suction, as the film chip resistor chip device provided by the utility model, the edge of the upper surface of the top plate is fixedly connected with the purifying box, the upper surface of the purifying box is fixedly connected with the air suction pipe, and the outer surface of the air suction pipe is fixedly connected with the air pump.

In order to achieve the effect of being convenient for dust collection, as the film chip resistor chip device provided by the utility model, a connecting pipe is fixedly connected to the lower surface of the purifying box, and a dust collection hopper is fixedly connected to one end of the connecting pipe.

In order to achieve the effect of being convenient for adsorbing dust, as the film chip resistor chip device provided by the utility model, the outer surface of the purifying box is provided with the clamping groove, and the inside of the clamping groove is connected with the adsorption plate in a sliding manner.

In order to achieve the effect of being convenient for checking the liquid level, the film chip resistor chip device is characterized in that a liquid level window is fixedly connected to the middle of the front face of the base.

Compared with the prior art, the utility model has the following beneficial effects:

1. according to the utility model, through the arrangement of the semiconductor refrigerator, the water pump, the water suction pipe, the condensing pipe, the return pipe and the fan, the semiconductor refrigerator is operated to cool the cooling liquid, the cooling liquid is conveyed into the condensing pipe through the water pump by the water suction pipe, the cooling air generated by the condensing pipe is blown to the circuit board by the fan, the cooling efficiency is improved by utilizing the low temperature of the cooling liquid to cool the high temperature generated during welding of the capacitor patch, the cooling liquid in the condensing pipe is returned into the base again through the return pipe to form a return flow, and continuous cooling treatment is performed, so that the circuit board and the capacitor are prevented from being damaged due to the high temperature generated during welding.

2. According to the utility model, through the arrangement of the purifying box, the air pump, the exhaust pipe, the dust suction hopper, the clamping groove and the adsorption plate, the air pump reduces the pressure intensity in the purifying box through the exhaust pipe, the dust suction hopper generates suction force through the connecting pipe to absorb dust on the circuit board and smoke generated by welding, the three adsorption plates are clamped in the three clamping grooves, so that the cleaning and replacement are conveniently carried out after the three adsorption plates are used for a long time, the adsorption and purification effects of the smoke generated in the welding process are improved by the three adsorption plates, the staff is prevented from sucking harmful gas, the health of the staff is guaranteed, and the pollution of the harmful gas to the surrounding air environment is reduced.

Drawings

Fig. 1 is a schematic front view of embodiment 1 of the present utility model;

FIG. 2 is a schematic cross-sectional plan view of embodiment 1 of the present utility model;

FIG. 3 is a schematic view showing the internal structure of a base according to embodiment 1 of the present utility model;

FIG. 4 is a schematic view showing the internal structure of the purifying box according to embodiment 1 of the present utility model;

fig. 5 is a schematic view of the liquid level window according to embodiment 2 of the present utility model.

In the figure: 1. a base; 2. a first separator; 3. a semiconductor refrigerator; 4. a second separator; 5. a water pump; 6. a water pumping pipe; 7. a condensing tube; 8. a return pipe; 9. a fan; 10. a pipe clamp; 11. a placement table; 12. a through hole; 13. a water inlet hole; 14. a plug; 15. a support post; 16. a top plate; 17. a hydraulic rod; 18. a mounting head; 19. a purifying box; 20. an exhaust pipe; 21. an air pump; 22. a connecting pipe; 23. a dust collection hopper; 24. a clamping groove; 25. an adsorption plate; 26. a liquid level window.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Example 1

As shown in fig. 1-4, a film chip resistor chip device comprises a base 1, wherein a first baffle plate 2 is fixedly connected to the bottom of the inner side surface of the base 1, a semiconductor refrigerator 3 is fixedly connected to the inner bottom wall of the base 1, and a second baffle plate 4 is fixedly connected to the top of the inner side surface of the base 1;

in this embodiment, one side fixedly connected with water pump 5 of first baffle 2 upper surface, the output fixedly connected with drinking-water pipe 6 of water pump 5, the one end fixedly connected with condenser pipe 7 of drinking-water pipe 6, the one end fixedly connected with back flow 8 of condenser pipe 7, the middle part fixedly connected with fan 9 of second baffle 4 upper surface, the surface fixedly connected with pipe clamp 10 of condenser pipe 7, pipe clamp 10 is fixed connection with base 1.

When the cooling device is specifically used, through the arrangement of the first partition plate 2, the semiconductor refrigerator 3, the second partition plate 4, the water pump 5, the water suction pipe 6, the condenser pipe 7, the return pipe 8 and the fan 9, the first partition plate 2 and the second partition plate 4 divide the interior of the base 1 into three using spaces, the middle part of the space is used for placing cooling liquid, the semiconductor refrigerator 3 operates to cool the cooling liquid, the water suction pipe 6 conveys the cooling liquid to the interior of the condenser pipe 7 through the water pump 5, the fan 9 blows cold air generated by the condenser pipe 7 to the circuit board, the low temperature of the cooling liquid is utilized to cool the high temperature generated during welding of the capacitor patches, the cooling efficiency is increased, the condenser pipe 7 is a serpentine bent pipeline, the cold air loss is slow, the radiating efficiency can be increased, the cooling liquid in the interior of the condenser pipe 7 returns to the interior of the base 1 again through the return pipe 8, a backflow is formed, the pipeline can keep cool all the time, continuous cooling treatment is performed, the phenomenon that the circuit board and the capacitor is damaged due to the high temperature generated during welding is avoided, and the pipe clamp 10 is used for supporting and fixing the condenser pipe 7, and the stability of use is ensured.

In this embodiment, the middle part of the upper surface of the base 1 is fixedly connected with a placing table 11, and through holes 12 are formed in the placing table 11 and the middle part of the upper surface of the base 1.

When the patch is specifically used, through the arrangement of the placement table 11, the placement table 11 is used for placing a circuit board used by the patch, and the through holes 12 are convenient for circulation of cold air.

In this embodiment, a water inlet hole 13 is formed at the top of the outer surface of the base 1, and a plug 14 is movably connected inside the water inlet hole 13.

When the cooling device is specifically used, through the arrangement of the water inlet hole 13, when the cooling liquid is lack, the plug 14 is pulled out, and the cooling liquid is added into the base 1 through the water inlet hole 13.

In this embodiment, the four corners of the upper surface of the base 1 are fixedly connected with posts 15, the top of each post 15 is fixedly connected with a top plate 16, the middle of the lower surface of each top plate 16 is fixedly connected with a hydraulic rod 17, and one end of each hydraulic rod 17 is fixedly connected with a mounting head 18.

When the capacitor mounting device is specifically used, through the arrangement of the mounting head 18, the support 15 is used for supporting and fixing the top plate 16, the top plate 16 is used for supporting and fixing the hydraulic rod 17, and the mounting head 18 is controlled to move through the extension and contraction of the output end of the hydraulic rod 17, so that the capacitor mounting is completed.

In this embodiment, a purifying tank 19 is fixedly connected to the edge of the upper surface of the top plate 16, an exhaust pipe 20 is fixedly connected to the upper surface of the purifying tank 19, and an air pump 21 is fixedly connected to the outer surface of the exhaust pipe 20.

When the dust-removing device is particularly used, through the arrangement of the purifying box 19, the air pump 21 reduces the pressure inside the purifying box 19 through the air extraction pipe 20, so that suction is generated inside the purifying box 19, and dust and harmful gas are conveniently treated.

In this embodiment, a connection pipe 22 is fixedly connected to the lower surface of the purifying tank 19, and a dust suction hopper 23 is fixedly connected to one end of the connection pipe 22.

When the dust collector is specifically used, through the arrangement of the connecting pipe 22, the dust suction hopper 23 generates suction force through the connecting pipe 22, so that dust on a circuit board and smoke generated by welding are absorbed, environmental pollution is reduced, and welding quality is guaranteed.

In this embodiment, a clamping groove 24 is formed on the outer surface of the purifying tank 19, and an adsorption plate 25 is slidably connected to the inside of the clamping groove 24.

When the device is specifically used, through the arrangement of the adsorption plates 25, the three adsorption plates 25 are clamped in the three clamping grooves 24, the device is convenient to install and detach, cleaning and replacement are convenient to carry out after long-time use, the adsorption purification effect of smoke generated in the welding process is improved by the three adsorption plates 25, the staff is prevented from sucking harmful gas, the physical health of the staff is guaranteed, and the pollution of the harmful gas to the surrounding air environment is reduced.

Working principle: in use, a circuit board used for the patch is placed on the placing table 11, the expansion and contraction of the output end of the hydraulic rod 17 controls the mounting head 18 to move, the patch of the capacitor is completed, the air pump 21 reduces the internal pressure of the purifying box 19 through the air extraction pipe 20, the dust suction hopper 23 generates suction force through the connecting pipe 22, dust on the circuit board and smoke generated in welding are absorbed, the adsorption plate 25 enlarges the adsorption purification effect of the smoke generated in the welding process, the semiconductor refrigerator 3 operates to cool the cooling liquid, the water extraction pipe 6 conveys the cooling liquid to the inside of the condensing pipe 7 through the water pump 5, the fan 9 blows cool air generated by the condensing pipe 7 to the circuit board, the cooling treatment is carried out on the high temperature generated during welding of the capacitor patch by utilizing the low temperature of the cooling liquid, the phenomenon that the circuit board and the capacitor are damaged due to the high temperature generated during welding is avoided, and the cooling liquid in the condensing pipe 7 returns to the inside of the base 1 again through the return pipe 8, so that the cooling liquid is convenient to be recycled.

Example 2

As shown in fig. 1 to 5, the distinguishing features of this embodiment that distinguish embodiment 1 are: the middle part of the front surface of the base 1 is fixedly connected with a liquid level window 26.

When the cooling device is specifically used, through the arrangement of the liquid level window 26, the change state of the cooling liquid in the base 1 can be checked conveniently through the liquid level window 26, the cooling liquid amount can be added conveniently when the cooling liquid amount is small, and the adjustment is convenient.

The foregoing has shown and described the basic principles and main features of the present utility model and the advantages of the present utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. Film chip resistor paster equipment, including base (1), its characterized in that: the bottom of the inner side surface of the base (1) is fixedly connected with a first partition plate (2), the inner bottom wall of the base (1) is fixedly connected with a semiconductor refrigerator (3), and the top of the inner side surface of the base (1) is fixedly connected with a second partition plate (4);

one side fixedly connected with water pump (5) of first baffle (2) upper surface, the output fixedly connected with drinking-water pipe (6) of water pump (5), the one end fixedly connected with condenser pipe (7) of drinking-water pipe (6), the one end fixedly connected with back flow (8) of condenser pipe (7), the middle part fixedly connected with fan (9) of second baffle (4) upper surface, the surface fixedly connected with pipe clamp (10) of condenser pipe (7), pipe clamp (10) are fixed connection with base (1).

2. A film chip resistor chip device as claimed in claim 1, wherein: the middle part fixedly connected with of base (1) upper surface places platform (11), place the middle part of platform (11) and base (1) upper surface and all offered through-hole (12).

3. A film chip resistor chip device as claimed in claim 1, wherein: the top of base (1) surface has seted up inlet opening (13), the inside swing joint of inlet opening (13) has end cap (14).

4. A film chip resistor chip device as claimed in claim 1, wherein: the four corners of the upper surface of the base (1) are fixedly connected with struts (15), the top of each strut (15) is fixedly connected with a top plate (16), the middle of the lower surface of each top plate (16) is fixedly connected with a hydraulic rod (17), and one end of each hydraulic rod (17) is fixedly connected with a mounting head (18).

5. The film chip resistor chip device of claim 4, wherein: the edge of roof (16) upper surface fixedly connected with purifying box (19), the upper surface fixedly connected with exhaust tube (20) of purifying box (19), the surface fixedly connected with air pump (21) of exhaust tube (20).

6. The film chip resistor chip device of claim 5, wherein: the purifying box is characterized in that a connecting pipe (22) is fixedly connected to the lower surface of the purifying box (19), and a dust suction hopper (23) is fixedly connected to one end of the connecting pipe (22).

7. The film chip resistor chip device of claim 5, wherein: the purifying box is characterized in that a clamping groove (24) is formed in the outer surface of the purifying box (19), and an adsorption plate (25) is connected inside the clamping groove (24) in a sliding mode.

8. A film chip resistor chip device as claimed in claim 1, wherein: the middle part on the front of the base (1) is fixedly connected with a liquid level window (26).