CN219718625U - Special nail bed of thickening printed circuit board welding prevention - Google Patents
Special nail bed of thickening printed circuit board welding prevention Download PDFInfo
- Publication number
- CN219718625U CN219718625U CN202320641049.XU CN202320641049U CN219718625U CN 219718625 U CN219718625 U CN 219718625U CN 202320641049 U CN202320641049 U CN 202320641049U CN 219718625 U CN219718625 U CN 219718625U
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- Prior art keywords
- sliding groove
- seat
- circuit board
- printed circuit
- nail bed
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- 210000004904 fingernail bed Anatomy 0.000 title claims abstract description 34
- 238000003466 welding Methods 0.000 title claims abstract description 14
- 230000008719 thickening Effects 0.000 title claims abstract description 6
- 230000002265 prevention Effects 0.000 title claims description 9
- 210000000282 nail Anatomy 0.000 claims abstract description 45
- 229910000679 solder Inorganic materials 0.000 claims abstract description 14
- 239000000758 substrate Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 abstract description 13
- 238000004519 manufacturing process Methods 0.000 description 7
- 230000001105 regulatory effect Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model relates to the technical field of solder mask nail beds of circuit boards, and discloses a special nail bed for thickening solder mask of a printed circuit board, which comprises the following components: the positioning plate is arranged on the surface of the bottom plate, a longitudinal sliding groove is formed in the surface of the positioning plate, and scale strips are arranged on the side surface of the longitudinal sliding groove; the sliding seats are arranged in the longitudinal sliding grooves in a sliding manner; the adjusting plate is fixedly arranged on the surface of the sliding seat, the surface of the adjusting plate is provided with the transverse sliding groove, the special welding nail bed for the thickened printed circuit board is designed through the matching of the longitudinal sliding groove on the surface of the positioning plate and the transverse sliding groove on the surface of the adjusting plate and the design of the nail seat in the transverse sliding groove, the positions of the PIN nails can be adjusted randomly, so that the positions of the PIN nails can be adjusted and set in advance according to the material numbers or versions of the circuit boards, the independent design of the circuit boards with different material numbers or versions is not needed, the cost of the welding nail bed for the circuit board is reduced, and the management of the nail bed is facilitated.
Description
Technical Field
The utility model relates to the technical field of solder mask nail beds for circuit boards, in particular to a special nail bed for solder mask for thickened printed circuit boards.
Background
The circuit board production process is required to be subjected to multiple printing procedures such as solder resist, character printing and the like. When the circuit board is printed on the anti-welding double-sided printing, after the first side is printed, when the second side is printed, in order to avoid wet ink from being stained on a printing table surface, a nail bed jig is needed to jack up the plate surface on which the ink is printed on the first side so as to print the second side, and at present, two conventional nail bed manufacturing jig modes in the industry are mainly adopted.
Firstly, a nail bed jig is manufactured by sticking a single-sided PIN nail on an invalid area on a circuit board to be printed by double-sided adhesive. When the manufacturing mode is adopted to manufacture the nail bed jigs in batches, one to two circuit boards are required to be used as special PIN nail pasting boards for each material number/version, so that the nail bed jigs are manufactured, the cost is high, and when the material number/version is more, the management is difficult.
Secondly, the positions are designed in advance on the circuit board, drilling is carried out, and the double-sided PIN nails are inserted into the drilled holes to manufacture the nail bed jig. By adopting the manufacturing mode of the nail bed jig, the positions of the holes are required to be specially designed, each material number/version is required to be designed independently, the PCB is wasted, the operation is complex, the number/version of the material is more, and the management is difficult.
Disclosure of Invention
In order to solve the problems that each material number/version of the traditional circuit board solder mask nail bed needs to use one to two circuit boards as special PIN nail pasting boards to manufacture a nail bed jig or each material number/version needs to be designed independently, the cost is high, and when the material number/version is more, the management is difficult, the utility model is realized by the following technical scheme: a special nail bed for thickened printed circuit board solder resist, comprising:
the positioning plate is arranged on the surface of the bottom plate, a longitudinal sliding groove is formed in the surface of the positioning plate, and scale strips are arranged on the side surface of the longitudinal sliding groove;
the sliding seats are arranged in the longitudinal sliding grooves in a sliding manner;
the adjusting plate is fixedly arranged on the surface of the sliding seat, a transverse sliding groove is formed in the surface of the adjusting plate, the transverse sliding groove is perpendicular to the longitudinal sliding groove, and a scale bar is arranged on the surface of the adjusting plate;
the nail seat is slidably mounted in the transverse sliding groove, a plurality of nail seats are mounted in the same transverse sliding groove, and PIN nails are arranged on the upper surfaces of the nail seats.
Further, the cross sections of the longitudinal sliding groove and the transverse sliding groove are both inverted T-shaped.
Further, the lower surface of nail seat is equipped with the positioning module, the positioning module includes the positioning seat, the upper surface of positioning seat is equipped with the pillar, slidable mounting has the kicking block about the up end of pillar, the upper surface of kicking block with the inside roof of horizontal spout is corresponding, the kicking block with be equipped with the pressure spring between the positioning seat, nail seat fixed mounting is in the upper surface of kicking block.
Further, a positioning module is arranged on the lower surface of the sliding seat, and the upper surface of a top block in the positioning module on the lower surface of the sliding seat corresponds to the top wall inside the longitudinal sliding groove.
Further, fixing components for fixing the circuit board are arranged at two ends of the adjusting plate.
Further, the fixing assembly includes:
the support seats are slidably arranged in the transverse sliding grooves, two support seats are in a group, and the two support seats in the same group are distributed in the same transverse sliding groove;
the base plate is positioned on the upper surface of the supporting seat;
a fixing clip fixedly installed on a side surface of the base plate;
the movable clamping plate is rotatably arranged in the base plate through a switching shaft, a vertical chute is formed in the base plate, and the switching shaft is positioned in the vertical chute;
the lower end of the tension spring is arranged on the inner surface of the base plate, and the upper end of the tension spring is connected with the movable clamping plate.
Further, a positioning module is arranged on the lower surface of the supporting seat.
Further, the lower surface of the positioning seat is provided with a roller.
Compared with the prior art, the utility model has the following beneficial effects:
1. this special nail bed of thickening printed circuit board welding prevention through the cooperation design of locating plate surface vertical spout and regulating plate surface horizontal spout and the design of nail seat in the horizontal spout, can carry out arbitrary regulation to the position of PIN nail to can be according to the material number or the version of circuit board, adjust in advance the setting to the position of PIN nail, need not to carry out independent design to the circuit board of every different material numbers or version, be favorable to reducing the cost of circuit board welding prevention nail bed, the management of nail bed of being convenient for.
2. This special nail bed of thickening printed circuit board welding prevention through the design of the reverse T shape of vertical spout and horizontal spout and the design of locating seat, kicking block and pressure spring, is convenient for adjust the position of slide and nail seat, and the PIN nail after being convenient for can adjusting simultaneously is fixed, prevents that the position of PIN nail from taking place to change.
3. The special nail bed for the thickened printed circuit board welding prevention can adjust the position of the fixing component according to the material number or version of the circuit board through the design of the supporting seat in the transverse chute and the combined design of the supporting seat, the base, the fixing clamp plate and the movable clamp plate, thereby fixing the circuit boards with various material numbers or versions.
Drawings
FIG. 1 is a top view of the nail bed structure of the present utility model;
FIG. 2 is a front view of the internal structure of the regulator plate of the present utility model;
FIG. 3 is a front view of the structure of the nail seat and the positioning seat of the present utility model;
FIG. 4 is a front view of a support and positioning seat according to the present utility model;
fig. 5 is a front view of a support and positioning seat structure according to the present utility model.
In the figure: 1. a bottom plate; 2. a positioning plate; 3. a longitudinal chute; 4. a slide; 5. an adjusting plate; 51. a transverse chute; 6. a nail seat; 61. PIN nails; 7. a positioning seat; 71. a support post; 72. a top block; 73. a pressure spring; 8. a support base; 81. a substrate; 811. a fixed clamping plate; 812. a movable clamping plate; 9. and a tension spring.
Description of the embodiments
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
The embodiment of the special nail bed for the solder mask of the thickened printed circuit board is as follows:
referring to fig. 1-5, a special nail bed for solder mask of a thickened printed circuit board, comprising:
the bottom plate 1, the surface mounting of bottom plate 1 has locating plate 2, and longitudinal chute 3 has been seted up on the surface of locating plate 2, and longitudinal chute 3 cross section is the shape of falling T, and the side surface of longitudinal chute 3 is equipped with the scale strip.
The sliding seat 4 is arranged in the longitudinal sliding groove 3 in a sliding manner, and a positioning module is arranged on the lower surface of the sliding seat 4.
The adjusting plate 5 is fixedly arranged on the surface of the sliding seat 4, the surface of the adjusting plate 5 is provided with a transverse sliding groove 51, the cross section of the transverse sliding groove 51 is in an inverted T shape, the transverse sliding groove 51 is perpendicular to the longitudinal sliding groove 3, and the surface of the adjusting plate 5 is provided with scale bars.
The both ends of regulating plate 5 are equipped with the fixed subassembly that is used for fixed circuit board, and fixed subassembly includes: the support seats 8 are slidably arranged in the transverse sliding grooves 51, two support seats 8 are in a group, the two support seats 8 in the same group are distributed in the same transverse sliding groove 51, and a positioning module is arranged on the lower surface of each support seat 8; a substrate 81 positioned on the upper surface of the support base 8; a fixing clip 811 fixedly mounted on a side surface of the substrate 81; the movable clamping plate 812 is rotatably arranged in the base plate 81 through a switching shaft, a vertical chute is formed in the base plate 81, and the switching shaft is positioned in the vertical chute; the lower end of the tension spring 9 is installed on the inner surface of the base plate 81, and the upper end is connected with the movable clamp plate 812.
The nail seat 6, slidable mounting is in the inside of horizontal spout 51, and the internally mounted of same horizontal spout 51 has a plurality of nail seats 6, and the lower surface of nail seat 6 is equipped with the location module, and the upper surface of nail seat 6 is equipped with PIN nail 61.
The positioning module comprises a positioning seat 7, a roller is arranged on the lower surface of the positioning seat 7, a support column 71 is arranged on the upper surface of the positioning seat 7, a top block 72 is arranged on the upper end surface of the support column 71 in a vertically sliding mode, the upper surface of the top block 72 corresponds to the top wall inside the transverse sliding groove 51, a pressure spring 73 is arranged between the top block 72 and the positioning seat 7, a nail seat 6 is fixedly arranged on the upper surface of the top block 72, and the upper surface of the top block 72 in the positioning module on the lower surface of the sliding seat 4 corresponds to the top wall inside the longitudinal sliding groove 3.
The use principle of the circuit board solder mask nail bed is as follows:
when the circuit board is subjected to solder mask printing, the positions of the PIN nails 61 on the surface of the positioning plate 2 are adjusted according to the version of the circuit board, the sliding seat 4 is pressed downwards, the sliding seat 4 can push the top block 72 downwards, the top block 72 is separated from the top wall inside the longitudinal sliding groove 3, and at the moment, the sliding seat 4 can be pushed to move inside the longitudinal sliding groove 3, so that the longitudinal positions of the adjusting plate 5 and further the positions of the PIN nails 61 in the longitudinal direction can be adjusted.
The nail seat 6 is pressed downwards, the nail seat 6 can push the top block 72 downwards, the top block 72 is separated from the top wall inside the transverse sliding groove 51, the nail seat 6 can be pushed to move inside the transverse sliding groove 51 at the moment, the positions of the PIN nails 61 in the transverse direction can be adjusted, and the positions of the PIN nails 61 can be adjusted in a matched mode according to the version of any circuit board by adjusting the spacing between the PIN nails 61.
The supporting seat 8 is pressed downwards, the supporting seat 8 can push the jacking block 72 downwards, the jacking block 72 is separated from the top wall inside the transverse sliding groove 51, the supporting seat 8 can be pushed to move inside the transverse sliding groove 51 at the moment, so that the positions of the clamping plates 811 and the movable clamping plates 812 can be fixed, the supporting seat 8 is adjusted to a proper position, a circuit board is placed at the top end of the PIN nail 61, the side edge of the circuit board can be contacted with the upper surface of the fixed clamping plates 811, the movable clamping plates 812 are rotated towards the direction of the fixed clamping plates 811, the movable clamping plates 812 are rotated and adjusted to be in a horizontal state, and when the movable clamping plates 812 are adjusted to be in a horizontal state, the movable clamping plates 812 downwards compress the circuit board under the action of the tension springs 9, so that the circuit board of any version can be fixed.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. A special nail bed of thickening printed circuit board solder mask, its characterized in that includes:
the positioning device comprises a bottom plate (1), wherein a positioning plate (2) is arranged on the surface of the bottom plate (1), and a longitudinal sliding groove (3) is formed in the surface of the positioning plate (2);
the sliding seats (4) are arranged in the longitudinal sliding grooves (3) in a sliding manner;
the adjusting plate (5) is fixedly arranged on the surface of the sliding seat (4), a transverse sliding groove (51) is formed in the surface of the adjusting plate (5), and the transverse sliding groove (51) is perpendicular to the longitudinal sliding groove (3);
the nail seat (6) is slidably mounted in the transverse sliding groove (51), a plurality of nail seats (6) are mounted in the same transverse sliding groove (51), and PIN nails (61) are arranged on the upper surface of the nail seats (6).
2. The special nail bed for thickened printed circuit board welding prevention according to claim 1, wherein: the cross sections of the longitudinal sliding groove (3) and the transverse sliding groove (51) are of inverted T shapes.
3. The special nail bed for thickened printed circuit board welding prevention according to claim 2, wherein: the lower surface of nail seat (6) is equipped with positioning module, positioning module includes positioning seat (7), the upper surface of positioning seat (7) is equipped with pillar (71), slidable mounting has kicking block (72) about the up end of pillar (71), the upper surface of kicking block (72) with the inside roof of horizontal spout (51) is corresponding, kicking block (72) with be equipped with pressure spring (73) between positioning seat (7), nail seat (6) fixed mounting is in the upper surface of kicking block (72).
4. A special nail bed for preventing welding of thickened printed circuit boards according to claim 3, characterized in that: the lower surface of the sliding seat (4) is provided with a positioning module, and the upper surface of a top block (72) in the positioning module on the lower surface of the sliding seat (4) corresponds to the top wall inside the longitudinal sliding groove (3).
5. A special nail bed for preventing welding of thickened printed circuit boards according to claim 3, characterized in that: and fixing components for fixing the circuit board are arranged at two ends of the adjusting plate (5).
6. The special nail bed for thickened printed circuit board welding prevention as claimed in claim 5, wherein: the fixing assembly includes:
the support seats (8) are slidably arranged in the transverse sliding grooves (51), two support seats (8) are in a group, and the two support seats (8) in the same group are distributed in the same transverse sliding groove (51);
a base plate (81) positioned on the upper surface of the support base (8);
a fixing clip (811) fixedly attached to a side surface of the substrate (81);
the movable clamping plate (812) is rotatably arranged in the base plate (81) through a switching shaft, a vertical chute is formed in the base plate (81), and the switching shaft is positioned in the vertical chute;
the lower end of the tension spring (9) is arranged on the inner surface of the base plate (81), and the upper end of the tension spring is connected with the movable clamping plate (812).
7. The special nail bed for thickened printed circuit board solder resist of claim 6, wherein: the lower surface of the supporting seat (8) is provided with a positioning module.
8. The special nail bed for thickened printed circuit board solder mask according to claim 7, wherein: the lower surface of the positioning seat (7) is provided with a roller.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320641049.XU CN219718625U (en) | 2023-03-28 | 2023-03-28 | Special nail bed of thickening printed circuit board welding prevention |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320641049.XU CN219718625U (en) | 2023-03-28 | 2023-03-28 | Special nail bed of thickening printed circuit board welding prevention |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219718625U true CN219718625U (en) | 2023-09-19 |
Family
ID=87981194
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320641049.XU Active CN219718625U (en) | 2023-03-28 | 2023-03-28 | Special nail bed of thickening printed circuit board welding prevention |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219718625U (en) |
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2023
- 2023-03-28 CN CN202320641049.XU patent/CN219718625U/en active Active
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| GR01 | Patent grant |