CN219718620U

CN219718620U - Backing plate for routing and dust exhausting

Info

Publication number: CN219718620U
Application number: CN202320236456.2U
Authority: CN
Inventors: 何建芬; 张兵
Original assignee: Yangxuan Electronics Dongguan Co ltd
Current assignee: Yangxuan Electronics Dongguan Co ltd
Priority date: 2023-02-16
Filing date: 2023-02-16
Publication date: 2023-09-19
Anticipated expiration: 2033-02-16

Abstract

The utility model relates to the technical field of PCB processing equipment, in particular to a base plate for routing and dust exhausting. The base plate for routing and dust exhausting comprises a base plate main body, wherein a processing plate area and a positioning plate area are arranged on the base plate main body; a plurality of air return grooves are formed in the machining plate area, and the air return grooves correspond to areas of the PCB, which need to be subjected to groove milling machining; a plurality of positioning holes are formed in the positioning plate area; the base plate is characterized in that a plurality of plate taking grooves are formed in the base plate main body, and the plate taking grooves are uniformly distributed at the junction of the machining plate area and the positioning plate area. The utility model solves the problems that after the traditional PCB finishes the milling of the groove, the steel sheet is required to be adopted to pry the PCB up, so that the PCB is separated from the backing plate, and the process is easy to cause the damage of the PCB.

Description

Backing plate for routing and dust exhausting

Technical Field

The utility model relates to the technical field of PCB processing equipment, in particular to a base plate for routing and dust exhausting.

Background

At present, in the PCB processing industry, general methods for appearance processing of the PCB comprise beer boards, gong boards and V-CUT, wherein the gong boards are smooth in edges and accurate in size, time and cost can be greatly saved in small batches and sample plate output, and obviously, the gong boards become the preferred modes of the appearance processing technology of the PCB. In the prior art, dust collection capability of the gong machine is limited in the gong process, dust is easily blocked in a gong groove of a PCB, manual cleaning is needed, labor force is wasted, cleaning is not clear, and quality of the PCB is easily deteriorated.

Referring to the utility model patent with publication number CN204277862U, it discloses a gong board dust exhausting bottom plate processing jig, and this kind of gong board dust exhausting bottom plate processing jig makes the dust that produces in the gong board process fall into the return air duct through the design of seting up the return air duct on the backing plate, and the follow-up dust suction device that is disposed on gong machine chuck produces the negative pressure by the dust extraction that disposes again induced drafts, makes the dust discharge outside the PCB board along the return air duct under the effect of negative pressure induced draft. This kind of gong board dust exhaust bottom plate processing tool has solved the problem in dust easily blockked up PCB board gong groove, but adopts this gong board dust exhaust bottom plate processing tool cooperation to carry out the PCB board gong board after, because of the whole thinner of PCB board, too laminating with the backing plate, need adopt the steel sheet to pick up the PCB board, makes PCB board and backing plate separation, and this process easily causes the damage of PCB board.

Therefore, there is a need to provide a solution to the above-mentioned problems.

Disclosure of Invention

The utility model provides a base plate for routing and dust exhausting, and aims to solve the problems that after the traditional PCB finishes routing, the PCB is required to be pried up by adopting a steel sheet, the PCB is separated from the base plate, and the process is easy to cause damage to the PCB.

In order to achieve the above object, the present utility model provides a mat for routing and dust exhausting, comprising a mat body, wherein a processing board area and a positioning board area are arranged on the mat body, wherein:

a plurality of return air grooves are formed in the processing plate area;

a plurality of positioning holes are formed in the positioning plate area;

the base plate is characterized in that a plurality of plate taking grooves are formed in the base plate main body, and the plate taking grooves are uniformly distributed at the junction of the machining plate area and the positioning plate area.

More specifically, the thickness of the pad body is 8mm-10mm.

More specifically, the thickness of the pad body is 10mm.

More specifically, the length of the plate taking groove is 40mm-50mm, the width of the plate taking groove is 20mm-25mm, and the height of the plate taking groove is one third to one half of the thickness of the base plate main body.

More specifically, the length of the plate taking groove is 50mm, the width is 20mm, and the thickness is 5mm.

More specifically, the mat body is made of a high density wood fiberboard material.

More specifically, the surface of the pad body is covered with a heat-dissipating resin layer.

More specifically, the thickness of the heat dissipation resin layer is 20 μm to 60 μm.

The technical effects of the backing plate for routing and dust exhausting are as follows:

according to the utility model, the plurality of board taking grooves are arranged between the processing board area and the positioning board area, so that the processing of the PCB board milling groove is not affected, and after the PCB board milling groove is finished, a worker can easily take out the PCB board by putting fingers into the board taking grooves, so that the damage of the PCB board can be avoided, and the yield of the produced PCB board is improved.

Drawings

Fig. 1 is a schematic structural view of a mat for routing dust exhaust according to the present utility model.

The marks in the figure:

1-a pad body; 2-machining a plate area; 3-a locating plate area; 4-a return air groove; 5-positioning holes; 6, a plate taking groove;

Detailed Description

The present utility model will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present utility model more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.

It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present; when an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In the description of the embodiments of the present utility model, it should be understood that the directions or positional relationships indicated by "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience in describing the embodiments of the present utility model and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

In order to more clearly illustrate the technical solution of the present utility model, a preferred embodiment is provided below. Referring specifically to fig. 1. The utility model provides a backing plate for gong board dust exhaust, includes backing plate main part 1, be equipped with processing board district 2 and locating plate district 3 on the backing plate main part 1, wherein:

a plurality of return air grooves 4 are formed in the machining plate area 2;

a plurality of positioning holes 5 are formed in the positioning plate area 3;

the base plate is characterized in that a plurality of plate taking grooves 6 are formed in the base plate main body 1, and the plate taking grooves 6 are uniformly distributed at the junction of the machining plate area 2 and the positioning plate area 3.

In this embodiment, the plurality of air return grooves 4 are in one-to-one correspondence with the parts of the PCB board requiring the grooves. During the use, the bolt is installed on the locating hole 5, and treat the PCB board in gong groove place in when backing plate main part 1 is last, through the bolt is realized the location of PCB board with the cooperation of the conventional hole of PCB board periphery, and at this moment, the part that the PCB board needs gong groove then aligns return air duct 4 on backing plate main part 1, in the in-process that starts the gong sword to carry out gong groove to the PCB board, the piece dust that produces drops directly to return air duct 4 in, can not remain in the gong inslot of PCB board to this dust that avoids the gong inslot of the PCB board of processing exists in the gong inslot of the PCB board that has been processed, and when gong the gong knife gong inslot, the dust extraction who disposes on the gong machine chuck produces the negative pressure induced draft, and the dust is discharged outside the PCB board along return air duct 4 under the effect that the negative pressure induced draft. Through the design of return air groove 4, can effectively avoid the dust to adhere to on the gong groove of PCB board.

Further, in this embodiment, accomplish behind the gong groove work of PCB board, the staff can be relaxed with PCB board and backing plate main part 1 separation through putting into getting board recess 6 with the finger, need not the steel sheet cooperation, can avoid the damage of PCB board, improves the yields of the PCB board of output.

As a preferred version of this embodiment, the mat body 1 is made of a high density wood fiberboard material. The base plate main body 1 made of the material has the characteristics of high strength and high stability, so that the base plate main body 1 is not easy to damage in the routing process, and the base plate main body has a longer service life.

As a preferable mode of this embodiment, the surface of the pad body 1 is covered with a heat dissipation resin layer. Specifically, the heat dissipation resin layer has excellent heat dispersion, can produce a large amount of heat around the gong groove of PCB board at gong sword gong groove in-process, through the heat dissipation resin layer can dispel this heat fast, avoids PCB board high temperature to turn black, secondly, the design on heat dissipation resin layer makes the surface of backing plate main part 1 smoother, avoids the in-process of PCB board and backing plate main part 1 contact, and there is uneven position then to lead to the PCB board impaired because of backing plate main part 1 surface.

Preferably, the heat dissipation resin layer is formed by drying slurry coated on the surface of the pad body 1, and the slurry is formed by mixing polyethylene oxide, polyethylene glycol, glycerol, vinyl acetate and an organosilicon surfactant.

As a preferable mode of the present embodiment, the thickness of the heat dissipation resin layer is 20 μm to 60 μm. The thickness of the heat dissipation resin layer is in the above range, so that the surface of the pad body 1 can be ensured to be paved and flattened, and the coating processing is facilitated.

As another preferable aspect, the surface of the pad body 1 may be coated with an aluminum foil layer. The aluminum foil layer also has excellent heat dissipation function and can play the same role as the heat dissipation resin layer.

As a preferable scheme of the embodiment, the thickness of the pad body 1 is 8mm-10mm. It should be noted that, the thickness of the heat dissipation resin layer is within the above range, so that the structural stability of the pad body 1 can be ensured, and meanwhile, a sufficient space is reserved for the opening of the board taking groove 6.

Specifically, in the present embodiment, the thickness of the pad body 1 is 10mm.

As a preferable scheme of the embodiment, the length of the plate taking groove 6 is 40mm-50mm, the width thereof is 20mm-25mm, and the height thereof is one third to one half of the thickness of the backing plate main body 1. It should be noted that, when the length, width and height of the board taking groove 6 are set in the above-mentioned ranges, the board taking groove 6 can be matched with the finger part of the staff in size, so that the PCB board can be conveniently taken out, meanwhile, the board taking groove 6 is prevented from being too large, the strength and stability of the pad body 1 are affected, and the board taking groove 6 is also convenient to process.

Specifically, in this embodiment, the length of the plate taking groove 6 is 50mm, the width is 20mm, and the thickness is 5mm.

As a preferable solution of this embodiment, the pad body 1 is provided with a plurality of air holes (not shown in the figure), and the air holes are located in the machining plate area 2. Specifically, be connected with getter device on backing plate main part 1, after PCB board and bolt cooperation are fixed a position, can start this getter device, make gas pocket department produce suction to further adsorb fixedly the PCB board, avoid gong the groove in-process PCB board to produce the skew, improve processingquality.

The base plate for routing and dust exhausting solves the problems that after the traditional PCB finishes routing, the PCB is required to be pried up by adopting a steel sheet, the PCB is separated from the base plate, and the process is easy to cause damage to the PCB through reasonable structural arrangement.

The above-mentioned embodiments of the present utility model are not limited to the above-mentioned embodiments, but can be modified, equivalent, and improved within the spirit and principle of the present utility model, and the present utility model is also included in the scope of the present utility model.

Claims

1. A backing plate for gong board dust removal, its characterized in that: including the backing plate main part, be equipped with processing board district and locating plate district in the backing plate main part, wherein:

a plurality of return air grooves are formed in the processing plate area;

a plurality of positioning holes are formed in the positioning plate area;

2. A mat for routing dust exhaust according to claim 1, characterized in that: the thickness of the backing plate main body is 8mm-10mm.

3. A mat for routing dust exhaust according to claim 2, characterized in that: the thickness of the backing plate main body is 10mm.

4. A mat for routing dust exhaust according to claim 2, characterized in that: the length of the plate taking groove is 40mm-50mm, the width of the plate taking groove is 20mm-25mm, and the height of the plate taking groove is one third to one half of the thickness of the base plate main body.

5. A mat for routing dust exhaust according to claim 4, wherein: the length of the plate taking groove is 50mm, the width of the plate taking groove is 20mm, and the thickness of the plate taking groove is 5mm.

6. A mat for routing dust exhaust according to claim 1, characterized in that: the pad body is made of a high density wood fiberboard material.

7. A mat for routing dust exhaust according to claim 6, wherein: the surface of the backing plate main body is covered with a heat dissipation resin layer.

8. A mat for routing dust exhaust according to claim 7, wherein: the thickness of the heat dissipation resin layer is 20-60 mu m.