CN219718235U - LGA packaged wireless communication module and electronic equipment - Google Patents

Abstract

The utility model discloses a LGA (land grid array) packaged wireless communication module, which belongs to the field of communication modules and comprises a main circuit and an external interface, wherein the main circuit comprises a wireless transceiver main control unit, a voltage-controlled temperature compensation crystal oscillator, a power supply management circuit and a crystal oscillator which are packaged together, and the main circuit is connected with the outside through the external interface. Solves the problems that the traditional wireless communication module has larger volume and is usually 2cm in area ² The height is 2.4mm, and the device is not suitable for miniaturized equipment such as intelligent watches, and the device such as a capacitor, a resistor, a crystal oscillator and the like are required to be added on a PCB, so that the design work is inconvenient; the LGA encapsulated wireless communication module usesLGA package with area of 1cm ² The module with the height of 1.5mm has smaller volume, does not need to add various components, has simple layout and reduces the working difficulty and time cost of hardware development.

Description

LGA packaged wireless communication module and electronic equipment

Technical Field

The present utility model relates to a wireless communication module and an electronic device, and more particularly, to a wireless communication module packaged by an LGA.

Background

The concept of the internet of things is to connect devices, sensors and the like through a network. Intelligent and informationized identification and management are realized. The equipment and the wireless module are connected through the communication end to form the terminal equipment of the Internet of things, and then the wireless module forms a local area network to realize remote information interaction and equipment management. Common network topology relationships of the internet of things include star topology and compound topology. The prior art needs a baseband chip, a linear power supply circuit for supplying power to the baseband chip, a clock circuit for the baseband chip to work, a control circuit for realizing communication time sequence, a radio frequency link for realizing radio frequency receiving and transmitting, a matching network and the like.

In the prior art, the circuit is usually required to be installed on a hardware motherboard, and the circuit structure is complex, so that peripheral circuits are required to be added on a baseband chip. The device comprises a linear power supply circuit, a clock circuit, a control circuit and a radio frequency transceiving link. The radio frequency link comprises an impedance matching network of the antenna and the transmission line, and an impedance matching network of the chip and the transmission line.

The traditional wireless communication module has larger volume and is usually 2cm in area ² The height of the electronic device is 2.4mm, the electronic device is not suitable for miniaturized equipment such as intelligent watches, components such as capacitors and resistors are required to be added on a PCB, and the electronic device is inconvenient to design and work.

In order to reduce the occupied area, a multi-layer PCB is usually arranged, and the two layers of copper layers of the traditional PCB can be equivalently formed into a capacitor, so that the baseband chip and alternating current signals below the peripheral circuit of the baseband chip have influence on the wireless performance, the signal to noise ratio can be increased, the transmitting signal to noise ratio is increased, and the receiving sensitivity is reduced. To circumvent this problem, wiring is not typically done under the radio frequency circuit area, which is a troublesome problem in certain product applications. For example, the smart watch has small usable area of the main board, and the chip and peripheral circuits thereof are increased while wiring in a narrow space is ensured. The number of layers of the main board is increased, the cost is increased, and the work difficulty of engineers is increased.

Accordingly, there is a need for a new type of long-range wireless communication device that can solve the above-described problems.

Disclosure of Invention

In order to solve the deficiencies of the prior art, the present utility model provides an LGA packaged wireless communication module. The high-performance low-power ARM Cortex M0 kernel processor, the wireless receiving and transmitting main control unit, the voltage-controlled temperature compensation crystal oscillator, the power supply management circuit and the like are integrated in the LGA packaged chip, and a developer only needs to connect a power supply with an antenna without other circuits, so that the burden of engineers is reduced.

The technical effects to be achieved by the utility model are realized by the following scheme:

according to a first aspect of the present utility model, there is provided an LGA packaged wireless communication module, including a main circuit and an external interface, the main circuit including a wireless transceiver main control unit, a voltage controlled temperature compensation crystal oscillator, a power management circuit and a crystal oscillator packaged together, the main circuit being connected to the outside through the external interface, the main circuit being packaged by an LGA packaging method, wherein:

the wireless receiving and transmitting main control unit is used for receiving and transmitting wireless information and processing the information;

the crystal oscillator and the voltage-controlled temperature compensation crystal oscillator are used for providing a crystal oscillator clock for the wireless receiving and transmitting main control unit;

the power supply management circuit is used for managing the internal power supply of the module;

the external interface at least comprises a UART interface, an SPI interface, a WKM/WKH low-power consumption receiving and transmitting control interface, an RF_RX differential radio frequency receiving interface, an RF_TX radio frequency transmitting interface, a TXEN/RXEN radio frequency receiving and transmitting control interface and a GPIO interface.

Preferably, the wireless transceiver master control unit is a JTM2000 chip assembly.

Preferably, the JTM2000 chip assembly includes a RAM core, a wireless transceiver, and a bus interface, both of which are connected to the RAM core.

Preferably, the voltage-controlled temperature compensation crystal oscillator is a 32MHz voltage-controlled temperature compensation crystal oscillator.

Preferably, the crystal oscillator is a 32.768KHz crystal oscillator.

Preferably, the main circuit and the external interface are both mounted on a substrate, and the substrate is a PCB board with shielding function.

According to a second aspect of the present utility model, there is provided an electronic device, a wireless communication module employing the LGA package described above.

The technical effect of the wireless communication module adopting the LGA package is that all electronic devices are packaged inside the substrate. The space occupation is small, no complex peripheral circuit exists, the layout is simple, and a developer can use the antenna by connecting a power supply with the antenna. The working difficulty and time cost of hardware development are reduced.

Drawings

In order to more clearly illustrate the embodiments of the utility model or the prior art solutions, the drawings which are used in the description of the embodiments or the prior art will be briefly described below, it being obvious that the drawings in the description below are only some of the embodiments described in the present utility model, and that other drawings can be obtained according to these drawings without inventive faculty for a person skilled in the art.

Fig. 1 is a schematic diagram of an LGA packaged wireless communication module according to an embodiment of the present utility model.

Fig. 2 is a schematic diagram of a JTM2000 chip assembly according to an embodiment of the present utility model.

Detailed Description

In order to make the objects, technical solutions and advantages of the present utility model more apparent, the technical solutions of the present utility model will be clearly and completely described below with reference to specific embodiments and corresponding drawings. It will be apparent that the described embodiments are only some, but not all, embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

As shown in fig. 1, the LGA packaged wireless communication module in an embodiment of the present utility model includes a main circuit and an external interface, the main circuit is packaged on a substrate 300 in an LGA packaging manner, the main circuit includes a wireless transceiver main control unit 110, a voltage controlled temperature compensation crystal oscillator 120, a power management circuit 130 and a crystal oscillator 140, and the main circuit is connected with the external world through the external interface. The size of the module after encapsulation is 10mm multiplied by 1.5mm.

Wherein: the wireless receiving and transmitting main control unit is used for controlling receiving and transmitting wireless information and processing the information;

the crystal oscillator and the voltage-controlled temperature compensation crystal oscillator are used for providing a crystal oscillator clock for the wireless receiving and transmitting main control unit;

the power management circuit is used for managing the internal power supply of the module.

In an embodiment of the present utility model, the external interfaces at least include UART interface 210, SPI interface 220, WKM/WKH low power consumption transceiver control interface 230, rf_rx differential radio frequency receiving interface 240, rf_tx radio frequency transmitting interface 250, TXEN/RXEN radio frequency transceiver control interface 260, and GPIO interface 270, wherein:

UART interface: the bus interface is communicated with the external equipment and can receive the AT command and send the received wireless data to the external equipment; the device can also be used as a firmware upgrading interface of the wireless communication module;

SPI interface: the bus interface is communicated with the external equipment and can receive the AT command and send the received wireless data to the external equipment;

GPIO interface: a general purpose input/output interface;

WKM/WKH low-power consumption receiving and transmitting control interface: in the low power consumption mode, a communication port between the module and the external equipment is used for controlling the receiving and transmitting states of the host and the slave in the low power consumption mode;

the RF-TX differential radio frequency receiving interface is a transmitting antenna interface of the module;

the RF_RX radio frequency transmitting interface is a module receiving antenna interface;

TXEN/RXEX radio frequency transceiver control interface: the module is used for wireless receiving and transmitting to enable the output interface.

In an embodiment of the present utility model, as shown in fig. 2, the wireless transceiver main control unit 110 is a JTM2000 chip assembly, and includes an ARM core processor 111, a wireless transceiver 112, and a bus interface 113. The bus interface 113 communicates with the external device, i.e. is connected with the external interface, and the external interface performs information interaction through the bus interface, so that the information is sent to the ARM core processor for processing, and the processed information is sent to the corresponding external interface through the bus interface. The wireless transceiver 112 receives and transmits wireless information, and is a radio frequency switch controller, and is packaged inside the JTM2000 assembly; ARM core processor 111 processes information and communicates with external devices.

The power management circuit can be integrated in the JTM2000 assembly and realized through software configuration, so that the integration degree is further improved, and the size of the device is reduced.

The voltage-controlled temperature compensation crystal oscillator 120 is a 32MHz voltage-controlled temperature compensation crystal oscillator, provides a 32MHz clock for the JTM2000, for example, is a VCTXO crystal oscillator, and has the advantages of high precision, small carrier frequency offset of wireless signals and small noise coefficient. Crystal oscillator 140 is a 32.768KHz crystal oscillator that provides a 32.768KHz clock signal for JTM 2000. The module encapsulates the baseband chip and its peripheral circuitry within a 1cm square substrate having a thickness of 1.5mm. The substrate is a PCB board with a multi-layer shielding effect. The developer only needs to connect the power supply and the antenna without other circuits, thus reducing the burden of engineers.

In an embodiment of the utility model, the substrate is a PCB with shielding function, so that the signal-to-noise ratio can be reduced and the receiving sensitivity can be improved.

In an embodiment of the present utility model, there is also provided an electronic device, and a wireless communication module employing the LGA package described above.

The LGA packaged wireless communication module supports various working modes, including a wireless normal receiving and transmitting mode: the AT command and the wireless data can be normally transmitted and received. Wireless silence mode: entering sleep does not respond to command operations and may wake up by an interrupt. Wireless listening mode: the module forwards the received wireless information and the information with the same content, and the information is not repeatedly forwarded. Wireless listening mode: the system receives the wireless signal once at regular intervals, and the time interval can be freely set.

The working temperature is-40-70 ℃. The carrier frequency of the module can be freely set within 400 MHz-510 MHz. The supported bandwidths include 62.5KHz, 125KHz, 250KHz, 500KHz. The method supports the spreading factors of 7-12 and the code rates of 4/5, 4/6, 4/7 and 4/8. Flexible configuration and wide application range.

It should be noted that the foregoing detailed description is exemplary and is intended to provide further explanation of the utility model. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of exemplary embodiments according to the present utility model. As used herein, the singular is intended to include the plural unless the context clearly indicates otherwise. Furthermore, it will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, steps, operations, devices, components, and/or groups thereof.

It should be noted that the terms "first," "second," and the like in the description and the claims of the present utility model and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the terms so used are interchangeable under appropriate circumstances such that the embodiments of the utility model described herein are capable of operation in sequences other than those illustrated or otherwise described herein.

Furthermore, the terms "comprise" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those elements but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

Spatially relative terms, such as "above … …," "above … …," "upper surface at … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial location relative to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "above" or "over" other devices or structures would then be oriented "below" or "beneath" the other devices or structures. Thus, the exemplary term "above … …" may include both orientations of "above … …" and "below … …". The device may also be positioned in other different ways, such as rotated 90 degrees or at other orientations, and the spatially relative descriptors used herein interpreted accordingly.

In the above detailed description, reference is made to the accompanying drawings, which form a part hereof. In the drawings, like numerals typically identify like components unless context indicates otherwise. The illustrated embodiments described in the detailed description, drawings, and claims are not meant to be limiting. Other embodiments may be utilized, and other changes may be made, without departing from the spirit or scope of the subject matter presented herein.

The above is only a preferred embodiment of the present utility model, and is not intended to limit the present utility model, but various modifications and variations can be made to the present utility model by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.

Claims (7)

1. The LGA packaged wireless communication module is characterized by comprising a main circuit and an external interface, wherein the main circuit comprises a wireless receiving and transmitting main control unit, a voltage-controlled temperature compensation crystal oscillator, a power management circuit and a crystal oscillator which are packaged together, the main circuit is connected with the outside through the external interface, and the main circuit is packaged in an LGA packaging mode; wherein:

the wireless receiving and transmitting main control unit is used for controlling receiving and transmitting wireless information and processing the information;

the crystal oscillator and the voltage-controlled temperature compensation crystal oscillator are used for providing a crystal oscillator clock for the wireless receiving and transmitting main control unit;

the power supply management circuit is used for managing the internal power supply of the module;

the external interface at least comprises a UART interface, an SPI interface, a WKM/WKH low-power consumption receiving and transmitting control interface, an RF_RX differential radio frequency receiving interface, an RF_TX radio frequency transmitting interface, a TXEN/RXEN radio frequency receiving and transmitting control interface and a GPIO interface.

2. The LGA packaged wireless communications module of claim 1 wherein the wireless transceiver master is a JTM2000 chip assembly.

3. The LGA packaged wireless communications module of claim 2, wherein the JTM2000 chip assembly includes a RAM core, a wireless transceiver, and a bus interface, the wireless transceiver and the bus interface each being connected to the RAM core.

4. The LGA packaged wireless communication module of claim 1, wherein the voltage controlled temperature compensated crystal oscillator is a 32MHz voltage controlled temperature compensated crystal oscillator.

5. The LGA packaged wireless communications module of claim 1, wherein the crystal oscillator is a 32.768KHz crystal oscillator.

6. The LGA packaged wireless communication module of claim 1, wherein the main circuit and the external interface are both mounted to a substrate, the substrate being a PCB board with shielding functionality.

7. An electronic device characterized by a wireless communication module employing the LGA package of any one of claims 1 to 6.