CN219702432U - Surface coating mechanism for semiconductor part processing - Google Patents
Surface coating mechanism for semiconductor part processing Download PDFInfo
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- CN219702432U CN219702432U CN202320478947.8U CN202320478947U CN219702432U CN 219702432 U CN219702432 U CN 219702432U CN 202320478947 U CN202320478947 U CN 202320478947U CN 219702432 U CN219702432 U CN 219702432U
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- fixed
- pipe
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- semiconductor
- paint
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 59
- 230000007246 mechanism Effects 0.000 title claims abstract description 46
- 239000011248 coating agent Substances 0.000 title claims abstract description 25
- 238000000576 coating method Methods 0.000 title claims abstract description 25
- 239000003973 paint Substances 0.000 claims abstract description 57
- 238000005507 spraying Methods 0.000 claims abstract description 26
- 238000007605 air drying Methods 0.000 claims abstract description 23
- 239000007921 spray Substances 0.000 claims abstract description 20
- 238000001035 drying Methods 0.000 claims abstract description 5
- 238000010438 heat treatment Methods 0.000 claims description 22
- 239000007788 liquid Substances 0.000 claims description 18
- 230000000694 effects Effects 0.000 abstract description 2
- 238000003754 machining Methods 0.000 abstract description 2
- 230000009471 action Effects 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 5
- 238000000861 blow drying Methods 0.000 description 3
- 239000011253 protective coating Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Drying Of Solid Materials (AREA)
Abstract
The utility model relates to a semiconductor part processing surface coating mechanism, which comprises a supporting plate, wherein the upper surface of the supporting plate is fixedly provided with a supporting frame, the top wall of an inner cavity of the supporting frame is provided with a drying mechanism for rapidly air-drying the surface of a semiconductor part after spraying, the upper surface of the supporting plate and the inside of the supporting frame are provided with a collecting mechanism for collecting and reutilizing redundant paint on the surface of the semiconductor part during spraying, the drying mechanism comprises a movable module fixed on the top wall of the inner cavity of the supporting frame, and the lower surface of the movable module is fixedly provided with an electric push rod. This semiconductor spare part processing surface coating mechanism weathers the mechanism and can air-dry the semiconductor spare part surface after the spraying fast, promotes machining efficiency, saves the labour, and the spray tube is taken to move even spraying around carrying out the surface of semiconductor spare part around moving the effect of side-by-side of module at the same time, promotes the spraying quality.
Description
Technical Field
The utility model relates to the technical field of coating mechanisms, in particular to a surface coating mechanism for processing semiconductor parts.
Background
When the semiconductor parts are processed, the outer sides of the semiconductor parts are required to be sprayed with paint to form a protective coating, the protective coating can protect the outer sides of the semiconductor parts, and the semiconductor parts can be applied to medical equipment, industrial equipment and the like.
The coating mechanism is needed when the semiconductor part is processed, the coating mechanism can spray paint on the outer side of the semiconductor part to form a protective layer, the surface of the semiconductor part in the prior art is generally required to be carried and dried after being sprayed with the coating, the process is complicated, the labor force is increased, and therefore the surface coating mechanism for processing the semiconductor part is provided, the surface of the semiconductor part can be directly and rapidly dried after being sprayed with the coating, the labor force is reduced, and the processing efficiency is improved.
Disclosure of Invention
Aiming at the defects of the prior art, the utility model provides a surface coating mechanism for processing semiconductor parts, which has the advantages of being capable of directly and rapidly air-drying the surface of the semiconductor part after being coated by spraying, and the like, and solves the problems that the surface of the semiconductor part is generally required to be carried and air-dried after being coated by spraying, the process is complicated, and the labor force is increased.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a semiconductor spare part processing surface coating mechanism, includes the backup pad, the upper surface of backup pad is fixed with the support frame, the roof of support frame inner chamber is equipped with and is used for carrying out quick air-drying's the mechanism that weathers to the surface of semiconductor spare part after the spraying, backup pad upper surface just is located the inside of support frame and is equipped with the collection mechanism that is used for collecting the unnecessary paint of semiconductor spare part surface when spraying and recycles;
the utility model discloses a mechanism is weathered including fixing the removal module at support frame inner chamber roof, the lower fixed surface of removal module has electric putter, the left and right sides that removes the module lower surface and be located electric putter all is fixed with the bracing piece, the bottom mounting of electric putter output shaft outside and left and right sides bracing piece has the mounting panel, the right side of support frame is fixed with the paint box, the upper surface intercommunication of paint box has the input tube, the right side of support frame upper surface is fixed with the paint pump, the right side of input tube and the input intercommunication of paint pump, the output of paint pump is fixed with the output tube, the lower fixed surface of mounting panel has the spray tube, the left side of output tube and the right side intercommunication of spray tube, the left side of support frame upper surface is equipped with air-dries the subassembly.
Further, the air-drying assembly comprises a fan fixed on the left side of the upper surface of the support frame, a connecting pipe is fixed at the air outlet end of the fan, a heating box is communicated with the right side of the connecting pipe, an air outlet pipe is communicated with the right side of the heating box, an air drying pipe is fixed on the lower surface of the mounting plate and positioned on the left side of the spray pipe, and the right side of the air outlet pipe is communicated with the left side of the air drying pipe.
Further, the support rod comprises a first movable rod, and a second movable rod is connected inside the first movable rod in a sliding mode.
Further, the heating wires with the number not less than two are fixed in the heating box, and the heating wires with the number not less than two are uniformly distributed in the heating box.
Further, the right side intercommunication of paint box upper surface has the inlet pipe, and the inside of inlet pipe is fixed with the filter screen.
Further, collection mechanism is including fixing at backup pad upper surface and being located the inside collection frame of support frame, the inside of collecting the frame is fixed with places the board, place the lower surface of board and seted up the circulation mouth that quantity is not less than two, the upper surface of placing the board is fixed with the non-slip joint of quantity not less than two, the lower surface intercommunication of collecting the frame has communicating pipe, the lower surface of backup pad is fixed with the collecting box, the right side of communicating pipe communicates with the left side of collecting box, the lower surface intercommunication of collecting box has liquid outlet structure.
Further, the liquid outlet structure comprises a first liquid outlet pipe, a valve is communicated with the outer side of the first liquid outlet pipe, and a second liquid outlet pipe is communicated with the inner side of the valve.
Compared with the prior art, the technical scheme of the utility model has the following beneficial effects:
1. this semiconductor spare part processing surface coating mechanism weathers the mechanism and can air-dry the semiconductor spare part surface after the spraying fast, promotes machining efficiency, saves the labour, and the spray tube is taken to move even spraying around carrying out the surface of semiconductor spare part around moving the effect of side-by-side of module at the same time, promotes the spraying quality.
2. This semiconductor spare part processing surface coating mechanism, the unnecessary paint of semiconductor spare part surface spraying can flow to the inside of collecting the frame through the circulation mouth that is not less than two in quantity, flows the inside of collecting the collection box through the intercommunication pipe again and collects, and the paint after the collection can carry out cyclic utilization to can save the paint of spraying usefulness.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a schematic view of a blow-drying mechanism according to the present utility model;
FIG. 3 is a schematic view of the collection mechanism of the present utility model.
In the figure: 1 supporting plate, 2 supporting frames, 3 blow-drying mechanism, 301 moving module, 302 electric push rod, 303 supporting rod, 304 mounting plate, 305 paint box, 306 input pipe, 307 paint pump, 308 output pipe, 309 spray pipe, 310 fan, 311 connecting pipe, 312 heating box, 313 air outlet pipe, 314 air drying pipe, 4 collecting mechanism, 401 collecting frame, 402 placing plate, 403 circulation port, 404 anti-slip block, 405 communicating pipe, 406 collecting box, 407 liquid outlet structure.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1, a semiconductor part processing surface coating mechanism in this embodiment includes a supporting plate 1, the upper surface of the supporting plate 1 is fixed with a supporting frame 2, the top wall of an inner cavity of the supporting frame 2 is provided with a drying mechanism 3 for carrying out quick air drying on the surface of a semiconductor part after spraying, the drying mechanism 3 is used for carrying out quick air drying on the surface of the semiconductor part after spraying, the upper surface of the supporting plate 1 and the inside of the supporting frame 2 are provided with a collecting mechanism 4 for collecting and reutilizing redundant paint on the surface of the semiconductor part during spraying, and the collecting mechanism 4 is used for saving paint for spraying.
Referring to fig. 2, in order to perform quick air-drying on the surface of the sprayed semiconductor component, in this embodiment, the blow-drying mechanism 3 includes a moving module 301 fixed on the top wall of the inner cavity of the supporting frame 2, an electric push rod 302 is fixed on the lower surface of the moving module 301, supporting rods 303 are fixed on the left and right sides of the upper surface of the moving module 301, mounting plates 304 are fixed on the outer sides of the output shafts of the electric push rod 302 and the bottom ends of the left and right supporting rods 303, a paint tank 305 is fixed on the right side of the supporting frame 2, an input pipe 306 is communicated with the upper surface of the paint tank 305, a paint pump 307 is fixed on the right side of the upper surface of the supporting frame 2, the right side of the input pipe 306 is communicated with the input end of the paint pump 307, an output pipe 308 is fixed on the output end of the paint pump 307, a spray pipe 309 is fixed on the lower surface of the mounting plates 304, the left side of the output pipe 308 is communicated with the right side of the spray pipe 309, air-drying components are arranged on the left side of the upper surface of the supporting frame 2, the semiconductor component is placed on the upper surfaces of the non-less than two anti-skid blocks 404, then paint tank is poured into a certain amount of paint, the paint is poured into the interior of the electric push rod 302 and the upper surface of the electric push rod 302 is moved to the inner side of the upper surface of the electronic push rod 309, and the inner side of the semiconductor component 309 is then pumped into the inner side of the paint pump 309, and the inner part 309 is then pumped into the interior of the paint tank 309.
In this embodiment, the air drying assembly includes a fan 310 fixed on the left side of the upper surface of the support frame 2, a connecting pipe 311 is fixed at the air outlet end of the fan 310, a heating box 312 is communicated on the right side of the connecting pipe 311, an air outlet pipe 313 is communicated on the right side of the heating box 312, an air drying pipe 314 is fixed on the lower surface of the mounting plate 304 and on the left side of the spray pipe 309, the right side of the air outlet pipe 313 is communicated with the left side of the air drying pipe 314, the support rod 303 includes a first movable rod, a second movable rod is slidably connected inside the first movable rod, heating wires with the number not less than two are fixed inside the heating box 312, heating wires with the number not less than two are uniformly distributed inside the heating box 312, a feeding pipe is communicated on the right side of the upper surface of the paint box 305, a filter screen is fixed inside the feeding pipe, the filter screen can filter paint, the spray quality is improved, and the spray pipe 309 is driven to perform comprehensive spraying on the surface of the semiconductor components under the action of the back-and-forth movement of the moving module 301.
It should be noted that, the fan 310 is started, the air blown out by the fan 310 is heated by the heating box 312, the heated air flows into the air outlet pipe 313, then flows into the air drying pipe 314, and then moves and dries the surface of the semiconductor component with the air drying pipe 314 under the action of the front-back and left-right movement of the moving module 301, so that the sprayed semiconductor component can be quickly dried, the processing efficiency is improved, and the labor force is saved.
Referring to fig. 3, in order to save paint for spraying, in this embodiment, the collecting mechanism 4 includes a collecting frame 401 fixed on an upper surface of the supporting plate 1 and located inside the supporting frame 2, a placing plate 402 is fixed inside the collecting frame 401, a number of flow openings 403 not less than two are provided on a lower surface of the placing plate 402, a number of non-slip blocks 404 are fixed on an upper surface of the placing plate 402, a communicating pipe 405 is communicated with a lower surface of the collecting frame 401, a collecting tank 406 is fixed on a lower surface of the supporting plate 1, a right side of the communicating pipe 405 is communicated with a left side of the collecting tank 406, when the semiconductor component is placed on an upper surface of the placing plate 402 for spraying paint, the paint superfluous on the surface of the semiconductor component can flow into the collecting frame 401 through the number of the flow openings 403 not less than two, and then the paint inside the collecting frame 401 flows into the collecting tank 406 through the communicating pipe 405 for collecting, and the lower surface of the collecting tank 406 is communicated with the liquid outlet structure 407.
In this embodiment, the liquid outlet structure 407 includes a first liquid outlet pipe, a valve is communicated with the outer side of the first liquid outlet pipe, and a second liquid outlet pipe is communicated with the inner side of the valve.
It should be noted that, the paint inside the collection box 406 can be discharged through the liquid outlet structure 407, and the discharged paint can be recycled, so that paint for spraying can be saved, and the practicability of the coating mechanism is improved.
The working principle of the embodiment is as follows:
(1) Placing the semiconductor parts on the upper surfaces of the non-less than two anti-skid blocks 404, pouring a certain amount of paint into the paint box 305, starting the electric push rod 302 and the moving module 301, moving the bottom end of the spray pipe 309 to the upper side of the semiconductor parts by the electric push rod 302 and the moving module 301, starting the paint pump 307, pumping the paint in the paint box 305 into the input pipe 306, flowing into the output pipe 308 and the spray pipe 309 by the paint pump 307, spraying the paint on the surface of the semiconductor parts by the spray pipe 309 under the action of the moving module 301, driving the spray pipe 309 to comprehensively spray the paint on the surface of the semiconductor parts under the action of the moving module 301, starting the fan 310 after the surface of the semiconductor parts is sprayed, heating the air blown by the fan 310 through the heating box 312, flowing into the air outlet pipe 313, then flowing into the air drying pipe 314, moving the air drying pipe 314 around under the action of the moving module 301, and then moving the air drying pipe 314 on the surface of the semiconductor parts, so that the labor efficiency is improved, and the semiconductor parts can be rapidly processed.
(2) When semiconductor spare part is placed and is sprayed paint on the upper surface of the placing plate 402, redundant paint sprayed on the surface of the semiconductor spare part can flow into the collecting frame 401 through the circulation ports 403 with the quantity not less than two, then the paint in the collecting frame 401 flows into the collecting box 406 through the communicating pipe 405 to be collected, the paint in the collecting box 406 can be discharged through the liquid outlet structure 407, the discharged paint can be recycled, and therefore paint for spraying can be saved, and the practicability of a coating mechanism is improved.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides a semiconductor spare part processing surface coating mechanism, includes backup pad (1), its characterized in that: the upper surface of the supporting plate (1) is fixedly provided with a supporting frame (2), the top wall of the inner cavity of the supporting frame (2) is provided with a drying mechanism (3) for carrying out quick air drying on the surface of the semiconductor part after spraying, and a collecting mechanism (4) for collecting and reutilizing redundant paint on the surface of the semiconductor part during spraying is arranged on the upper surface of the supporting plate (1) and positioned in the supporting frame (2);
the utility model provides a weather mechanism (3) is including fixing at removal module (301) of support frame (2) inner chamber roof, the lower surface of removing module (301) is fixed with electric putter (302), remove module (301) lower surface and be located the left and right sides of electric putter (302) and all be fixed with bracing piece (303), the bottom mounting of electric putter (302) output shaft outside and left and right sides bracing piece (303) has mounting panel (304), the right side of support frame (2) is fixed with paint box (305), the upper surface intercommunication of paint box (305) has input tube (306), the right side of support frame (2) upper surface is fixed with paint pump (307), the right side of input tube (306) is connected with the input of paint pump (307), the output of paint pump (307) is fixed with output tube (308), the lower surface mounting panel (304) is fixed with spray tube (309), the left side of output tube (308) communicates with the right side of spray tube (309), the left side of support frame (2) upper surface is air-dries and is equipped with the subassembly.
2. A semiconductor component processing surface coating mechanism according to claim 1, wherein: the air drying assembly comprises a fan (310) fixed on the left side of the upper surface of a supporting frame (2), a connecting pipe (311) is fixed at the air outlet end of the fan (310), a heating box (312) is communicated with the right side of the connecting pipe (311), an air outlet pipe (313) is communicated with the right side of the heating box (312), an air drying pipe (314) is fixed on the lower surface of a mounting plate (304) and positioned on the left side of a spray pipe (309), and the right side of the air outlet pipe (313) is communicated with the left side of the air drying pipe (314).
3. A semiconductor component processing surface coating mechanism according to claim 1, wherein: the support rod (303) comprises a first movable rod, and a second movable rod is connected inside the first movable rod in a sliding mode.
4. A semiconductor component processing surface coating mechanism as recited in claim 2, wherein: the heating box (312) is internally fixed with heating wires with the number not less than two, and the heating wires with the number not less than two are uniformly distributed in the heating box (312).
5. A semiconductor component processing surface coating mechanism according to claim 1, wherein: the right side of paint case (305) upper surface intercommunication has the inlet pipe, and the inside of inlet pipe is fixed with the filter screen.
6. A semiconductor component processing surface coating mechanism according to claim 1, wherein: the collecting mechanism (4) comprises a collecting frame (401) fixed on the upper surface of the supporting plate (1) and located inside the supporting frame (2), a placing plate (402) is fixed inside the collecting frame (401), the lower surface of the placing plate (402) is provided with a number of circulation ports (403) which are not less than two, the upper surface of the placing plate (402) is fixedly provided with a number of non-slip blocks (404) which are not less than two, the lower surface of the collecting frame (401) is communicated with a communicating pipe (405), the lower surface of the supporting plate (1) is fixedly provided with a collecting box (406), the right side of the communicating pipe (405) is communicated with the left side of the collecting box (406), and the lower surface of the collecting box (406) is communicated with a liquid outlet structure (407).
7. A semiconductor component processing surface coating mechanism as recited in claim 6, wherein: the liquid outlet structure (407) comprises a first liquid outlet pipe, a valve is communicated with the outer side of the first liquid outlet pipe, and a second liquid outlet pipe is communicated with the inner side of the valve.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320478947.8U CN219702432U (en) | 2023-03-14 | 2023-03-14 | Surface coating mechanism for semiconductor part processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320478947.8U CN219702432U (en) | 2023-03-14 | 2023-03-14 | Surface coating mechanism for semiconductor part processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219702432U true CN219702432U (en) | 2023-09-19 |
Family
ID=87984495
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320478947.8U Active CN219702432U (en) | 2023-03-14 | 2023-03-14 | Surface coating mechanism for semiconductor part processing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219702432U (en) |
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2023
- 2023-03-14 CN CN202320478947.8U patent/CN219702432U/en active Active
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