CN219698002U - 5G mobile phone circuit board - Google Patents
5G mobile phone circuit board Download PDFInfo
- Publication number
- CN219698002U CN219698002U CN202321361999.3U CN202321361999U CN219698002U CN 219698002 U CN219698002 U CN 219698002U CN 202321361999 U CN202321361999 U CN 202321361999U CN 219698002 U CN219698002 U CN 219698002U
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- lifting
- circuit board
- positioning
- fixedly connected
- wall
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- 239000011148 porous material Substances 0.000 claims abstract description 14
- 230000017525 heat dissipation Effects 0.000 claims description 19
- 239000000758 substrate Substances 0.000 claims description 16
- 238000010438 heat treatment Methods 0.000 claims description 4
- 239000000306 component Substances 0.000 description 12
- 239000012528 membrane Substances 0.000 description 5
- 238000009434 installation Methods 0.000 description 4
- 230000005855 radiation Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Abstract
The utility model belongs to the technical field of circuit boards, and particularly relates to a 5G mobile phone circuit board which comprises a circuit main board and a dismounting mechanism arranged at the top end of the circuit main board, wherein the dismounting mechanism also comprises a lifting assembly, a sliding assembly and a clamping assembly; the lifting assembly comprises a positioning frame, a lifting rod, a pressing block, a lifting pore plate and a positioning spring, wherein the top end of the circuit main board is fixedly connected with the positioning frame, the lifting rod penetrates through the inner wall of the positioning frame, the pressing block is fixedly connected with the top end of the lifting rod, the 5G mobile phone circuit board vertically lifts through a lifting pore groove which is arranged on the outer wall of the lifting pore plate and is driven by the positioning spring through elasticity of the positioning spring, the lifting pore groove slides to drive a telescopic sliding block to horizontally slide through a connecting column, the telescopic sliding block slides to drive the triangular telescopic supporting column to be clamped with the trapezoidal lifting clamping block, the quick dismounting operation of the shielding cover is realized, and the surface of the circuit main board is damaged when the shielding cover is prevented from being dismounted.
Description
Technical Field
The utility model belongs to the technical field of circuit boards, and particularly relates to a 5G mobile phone circuit board.
Background
A 5G handset refers to a smart phone using a fifth generation communication system. Compared with a 4G mobile phone, a 5G mobile phone has faster transmission speed and low time delay, has more accurate positioning through a network slicing technology, and needs to carry various communication modules on a circuit board in order to realize various functions of the 5G mobile phone, the circuit board can provide a carrier for electronic elements, is a miniature visualized embodiment of a circuit and plays an extremely important role in optimizing circuit layout, and the mobile phone circuit board is a core component of the whole mobile phone system and manages the normal operation of the whole mobile phone system, so that the quality of the mobile phone circuit board is related to the normal use of the whole mobile phone.
For example, chinese patent with publication number CN215500165U discloses a 5G mobile phone circuit board, which comprises a body, dustproof membrane and installation mechanism, the upper surface of body is provided with dustproof membrane, the junction of dustproof membrane and body is provided with installation mechanism, the lower surface of body is provided with heat conduction mechanism, installation mechanism includes support and pivot, the one end symmetry fixed mounting of body has the support, rotate between two sets of supports and be connected with the pivot, the dustproof membrane twines the surface at the pivot, the shape of support is L shape, the one end fixed mounting that the support was kept away from to dustproof membrane has the plastic stick, the both ends symmetry fixed mounting of plastic stick has the button. According to the utility model, by arranging the dustproof film, after a worker installs the circuit board, the dustproof film can be paved on the outer surface of the circuit board, so that dust and the circuit board are effectively separated, the dust on the surface area of the circuit board is prevented, and the overall performance of the circuit board is not influenced.
When the existing 5G mobile phone circuit board is used, in order to shield signal interference, a shielding cover is required to be installed between electronic components, the electronic components are inconvenient to assemble and disassemble, and are easy to damage, so that the electronic components on the circuit board are damaged.
Disclosure of Invention
The utility model aims to solve the technical problems, and provides a 5G mobile phone circuit board which achieves the effect of quick disassembly and assembly of a shielding cover.
In view of the above, the utility model provides a 5G mobile phone circuit board, which comprises a circuit main board and a dismounting mechanism arranged at the top end of the circuit main board, wherein the dismounting mechanism also comprises a lifting component, a sliding component and a clamping component;
the lifting assembly comprises a positioning frame, lifting rods, pressing blocks, lifting pore plates and positioning springs, wherein the top end of the circuit main board is fixedly connected with the positioning frame, the lifting rods penetrate through the inner wall of the positioning frame, the pressing blocks are fixedly connected to the top ends of the lifting rods, the lifting pore plates are fixedly connected to the bottom ends of the lifting rods, and the positioning springs fixedly connected with the inner wall of the positioning frame are fixedly connected to the bottom ends of the lifting pore plates;
the sliding assembly comprises a lifting hole groove, a connecting column and a telescopic sliding block, wherein the lifting hole groove is formed in the outer wall of the lifting hole plate, the connecting column is movably connected to the outer wall of the lifting hole groove, and one end of the connecting column is fixedly connected with the telescopic sliding block which is in sliding connection with the inner wall of the positioning frame;
the clamping assembly comprises a telescopic supporting column, a lifting clamping block, a positioning clamping groove and a shielding cover, wherein the telescopic supporting column is fixedly connected with the outer wall of the telescopic sliding block, the lifting clamping block is clamped at the bottom end of the telescopic supporting column, the positioning clamping groove is formed in the connecting part of the lifting clamping block and the positioning frame, and the shielding cover is fixedly connected with the outer wall of the lifting clamping block.
Based on the structure, the positioning spring drives the lifting hole groove on the outer wall of the lifting hole plate to vertically lift through self elasticity, the lifting hole groove slides and drives the telescopic sliding block to horizontally slide through the connecting column, the telescopic sliding block slides and drives the triangular telescopic supporting column to be clamped with the trapezoidal lifting clamping block, the quick dismounting operation of the shielding cover is realized, and the surface of the circuit main board is damaged when the shielding cover is prevented from being dismounted.
Preferably, the outer wall of shielding lid runs through there is the heating panel, the locating hole has been seted up to circuit board's top edge, circuit board's bottom is provided with circuit board, circuit board and circuit board's junction point is provided with the heat conduction strip, the bottom of heat conduction strip is located circuit board's bottom fixedly connected with circuit board, the one end fixedly connected with of heat conduction strip is with the heat dissipation strip of laminating mutually of circuit board outer wall, realizes the even heat dissipation operation to circuit board.
Preferably, the positioning frames are provided with four groups, and the four groups of positioning frames are positioned at the edges of four corners of the shielding cover, so that the stable installation operation of the shielding cover is realized.
Preferably, the shape of the lifting hole groove is inclined, and the lifting hole groove forms a lifting structure through the lifting hole plate, the positioning spring and the positioning frame, so that the control operation of vertical lifting of the lifting hole groove is realized.
Preferably, the telescopic sliding block forms a telescopic structure between the connecting column and the positioning frame through the lifting hole groove, so as to realize the control operation of horizontal sliding of the telescopic sliding block.
Preferably, the shielding cover forms a clamping structure through the telescopic supporting column, the lifting clamping block and the positioning frame, the telescopic supporting column is triangular in shape, the lifting clamping block is trapezoidal in shape, and the rapid dismounting operation of the shielding cover is realized.
Preferably, the heat dissipation plates are distributed in an array along the outer wall of the shielding cover, the cross section of the heat dissipation plates is I-shaped, and heat passing through the inside of the shielding cover is conducted to the outside of the shielding cover through the heat dissipation plates.
Preferably, the shape of the heat conducting strip is in an H shape, and the circuit substrate forms a heat conducting structure between the heat conducting strip and the heat radiating strip, so that uniform heat radiation operation of the circuit main board is realized.
The beneficial effects of the utility model are as follows:
1. this 5G cell-phone circuit board is through setting up flexible post and the lift fixture block of supporting, and positioning spring passes through the vertical lift of the lift hole groove of self elasticity drive lift orifice outer wall, and the lift hole groove slides and drives flexible slider horizontal slip through the spliced pole, and flexible slider slides and drives triangle-shaped flexible post and trapezoidal lift fixture block looks block of supporting, realizes the quick assembly disassembly operation to the shield cover, when avoiding the shield cover dismouting, circuit mainboard surface is impaired.
2. This 5G cell-phone circuit board can produce a large amount of heats through setting up heating panel and conducting strip, and the electronic component during operation on the circuit motherboard, and wherein a part heat is inside the shield cover, and the heat through the shield cover is inside is outside through the heating panel conduction to the shield cover, through on the circuit motherboard another part heat through the conducting strip evenly conduction to circuit substrate and circuit substrate on, then the heat in the conducting strip is to outer heat dissipation through the radiating strip, realizes the even radiating operation to the circuit motherboard.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present utility model;
FIG. 2 is a schematic diagram of a cross-sectional structure of a circuit board according to the present utility model;
FIG. 3 is an enlarged view of FIG. 2 at A;
FIG. 4 is a schematic view of a heat conducting strip according to the present utility model;
fig. 5 is a schematic view of the telescopic support column and the lifting fixture block structure in the utility model.
The label in the figure is:
1. a circuit motherboard; 2. a positioning frame; 3. a lifting rod; 4. briquetting; 5. lifting pore plates; 6. a positioning spring; 7. lifting the hole groove; 8. a connecting column; 9. a telescopic slide block; 10. a telescopic prop; 11. lifting the clamping block; 12. positioning clamping grooves; 13. a shielding cover; 14. a heat dissipation plate; 15. positioning holes; 16. a circuit substrate; 17. a heat conducting strip; 18. a circuit backplane; 19. and a heat radiation strip.
Detailed Description
The present utility model is described in further detail below with reference to fig. 1-5.
In the present utility model, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", and the like indicate an azimuth or a positional relationship based on that shown in the drawings. These terms are only used to better describe the present utility model and its embodiments and are not intended to limit the scope of the indicated devices, elements or components to the particular orientations or to configure and operate in the particular orientations.
The embodiment of the utility model discloses a 5G mobile phone circuit board, which comprises a circuit main board 1, a dismounting mechanism arranged at the top end of the circuit main board 1, a lifting assembly, a sliding assembly and a clamping assembly, wherein the dismounting mechanism comprises a lifting assembly, a sliding assembly and a clamping assembly;
the lifting assembly comprises a positioning frame 2, a lifting rod 3, a pressing block 4, a lifting pore plate 5 and a positioning spring 6, wherein the top end of the circuit main board 1 is fixedly connected with the positioning frame 2, the lifting rod 3 penetrates through the inner wall of the positioning frame 2, the pressing block 4 is fixedly connected with the top end of the lifting rod 3, the lifting pore plate 5 is fixedly connected with the bottom end of the lifting rod 3, and the positioning spring 6 fixedly connected with the inner wall of the positioning frame 2 is fixedly connected with the bottom end of the lifting pore plate 5;
the sliding component comprises a lifting hole groove 7, a connecting column 8 and a telescopic sliding block 9, the lifting hole groove 7 is formed in the outer wall of the lifting hole plate 5, the connecting column 8 is movably connected to the outer wall of the lifting hole groove 7, and one end of the connecting column 8 is fixedly connected with the telescopic sliding block 9 which is in sliding connection with the inner wall of the positioning frame 2;
the clamping assembly comprises a telescopic supporting column 10, a lifting clamping block 11, a positioning clamping groove 12 and a shielding cover 13, wherein the telescopic supporting column 10 is fixedly connected with the outer wall of the telescopic sliding block 9, the lifting clamping block 11 is clamped at the bottom end of the telescopic supporting column 10, the positioning clamping groove 12 is formed in the connecting part of the lifting clamping block 11 and the positioning frame 2, and the shielding cover 13 is fixedly connected with the outer wall of the lifting clamping block 11.
Based on the structure, the positioning spring 6 drives the lifting hole groove 7 on the outer wall of the lifting hole plate 5 to vertically lift through self elasticity, the lifting hole groove 7 slides and drives the telescopic sliding block 9 to horizontally slide through the connecting column 8, the telescopic sliding block 9 slides and drives the triangular telescopic supporting column 10 to be clamped with the trapezoidal lifting clamping block 11, the rapid dismounting operation of the shielding cover 13 is realized, and the surface of the circuit main board 1 is prevented from being damaged when the shielding cover 13 is dismounted.
In one embodiment, the outer wall of the shielding cover 13 penetrates through the heat dissipation plate 14, the top edge of the circuit board 1 is provided with the positioning hole 15, the bottom end of the circuit board 1 is provided with the circuit substrate 16, the connection part of the circuit substrate 16 and the circuit board 1 is provided with the heat conducting strip 17, the bottom end of the heat conducting strip 17 is fixedly connected with the circuit substrate 18 at the bottom end of the circuit substrate 16, and one end of the heat conducting strip 17 is fixedly connected with the heat dissipation strip 19 attached to the outer wall of the circuit substrate 16.
In this embodiment, a large amount of heat is generated when the electronic components on the circuit board 1 work, wherein a part of the heat is inside the shielding cover 13, the heat inside the shielding cover 13 is conducted to the outside of the shielding cover 13 through the heat dissipation plate 14, the other part of the heat on the circuit board 1 is uniformly conducted to the circuit board 16 and the circuit board 18 through the heat conduction strips 17, and then the heat in the heat conduction strips 17 is dissipated to the outside through the heat dissipation strips 19, so that the uniform heat dissipation operation of the circuit board 1 is realized.
In one embodiment, the positioning frames 2 are provided with four groups, and the four groups of positioning frames 2 are positioned at the four corner edges of the shielding cover 13.
In the present embodiment, by providing four sets of the positioning frames 2, the stable mounting operation of the shield cover 13 is realized.
In one embodiment, the shape of the lifting hole groove 7 is inclined, and the lifting hole groove 7 forms a lifting structure with the positioning frame 2 through the lifting hole plate 5 and the positioning spring 6.
In this embodiment, the positioning spring 6 drives the lifting hole groove 7 on the outer wall of the lifting hole plate 5 to vertically lift through self elasticity, so as to realize the control operation of vertically lifting the lifting hole groove 7.
In one embodiment, the telescopic sliding block 9 forms a telescopic structure with the positioning frame 2 through the lifting hole groove 7 and the connecting column 8.
In the embodiment, the lifting hole groove 7 slides to drive the telescopic sliding block 9 to horizontally slide through the connecting column 8, so that the control operation of the horizontal sliding of the telescopic sliding block 9 is realized.
In one embodiment, the shielding cover 13 forms a clamping structure between the telescopic support column 10 and the lifting clamping block 11 and the positioning frame 2, the telescopic support column 10 is triangular in shape, and the lifting clamping block 11 is trapezoidal in shape.
In this embodiment, the telescopic slider 9 slides to drive the triangular telescopic support column 10 to be engaged with the trapezoidal lifting fixture block 11, so as to realize the rapid disassembly and assembly operation of the shielding cover 13.
In one embodiment, the heat dissipation plates 14 are distributed in an array along the outer wall of the shielding cover 13, and the cross section of the heat dissipation plate 14 is i-shaped.
In this embodiment, a large amount of heat is generated when the electronic components on the circuit board 1 are operated, wherein a part of the heat is inside the shielding cover 13, and the heat passing through the inside of the shielding cover 13 is conducted to the outside of the shielding cover 13 through the heat dissipation plate 14.
In one embodiment, the heat conducting strip 17 has an "H" shape, and the circuit substrate 16 forms a heat conducting structure between the heat conducting strip 17 and the heat dissipating strip 19.
In this embodiment, the heat on the circuit board 1 is uniformly transferred to the circuit substrate 16 and the circuit board 18 through the heat conducting strips 17, and then the heat in the heat conducting strips 17 is radiated to the outside through the heat radiating strips 19, so that the uniform heat radiation operation of the circuit board 1 is realized.
When the 5G mobile phone circuit board of this embodiment is used, firstly, the shielding cover 13 is disassembled and assembled, the staff places the lifting clamping block 11 on the outer wall of the shielding cover 13 in the positioning clamping groove 12, then, the positioning spring 6 drives the lifting hole groove 7 on the outer wall of the lifting hole plate 5 to vertically lift through self elasticity, the lifting hole groove 7 slides and drives the telescopic sliding block 9 to horizontally slide through the connecting column 8, the telescopic sliding block 9 slides and drives the triangular telescopic supporting column 10 to be clamped with the trapezoidal lifting clamping block 11, the rapid disassembly and assembly operation of the shielding cover 13 is realized, and the surface of the circuit main board 1 is prevented from being damaged when the shielding cover 13 is disassembled and assembled.
Finally, a large amount of heat is generated when the electronic components on the circuit board 1 work, wherein a part of the heat is in the shielding cover 13, the heat in the shielding cover 13 is conducted to the outside of the shielding cover 13 through the heat dissipation plate 14, the other part of the heat on the circuit board 1 is uniformly conducted to the circuit board 16 and the circuit board 18 through the heat conduction strips 17, and then the heat in the heat conduction strips 17 dissipates the heat to the outside through the heat dissipation strips 19, so that the uniform heat dissipation operation of the circuit board 1 is realized.
The foregoing has shown and described the basic principles, principal features and advantages of the utility model. It will be understood by those skilled in the art that the present utility model is not limited to the above-described embodiments, and that the above-described embodiments and descriptions are only preferred embodiments of the present utility model, and are not intended to limit the utility model, and that various changes and modifications may be made therein without departing from the spirit and scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (8)
1. The utility model provides a 5G cell-phone circuit board, includes circuit motherboard and sets up the dismouting mechanism on circuit motherboard top, its characterized in that: the dismounting mechanism further comprises a lifting assembly, a sliding assembly and a clamping assembly;
the lifting assembly comprises a positioning frame, lifting rods, pressing blocks, lifting pore plates and positioning springs, wherein the top end of the circuit main board is fixedly connected with the positioning frame, the lifting rods penetrate through the inner wall of the positioning frame, the pressing blocks are fixedly connected to the top ends of the lifting rods, the lifting pore plates are fixedly connected to the bottom ends of the lifting rods, and the positioning springs fixedly connected with the inner wall of the positioning frame are fixedly connected to the bottom ends of the lifting pore plates;
the sliding assembly comprises a lifting hole groove, a connecting column and a telescopic sliding block, wherein the lifting hole groove is formed in the outer wall of the lifting hole plate, the connecting column is movably connected to the outer wall of the lifting hole groove, and one end of the connecting column is fixedly connected with the telescopic sliding block which is in sliding connection with the inner wall of the positioning frame;
the clamping assembly comprises a telescopic supporting column, a lifting clamping block, a positioning clamping groove and a shielding cover, wherein the telescopic supporting column is fixedly connected with the outer wall of the telescopic sliding block, the lifting clamping block is clamped at the bottom end of the telescopic supporting column, the positioning clamping groove is formed in the connecting part of the lifting clamping block and the positioning frame, and the shielding cover is fixedly connected with the outer wall of the lifting clamping block.
2. The 5G cell phone circuit board of claim 1, wherein: the outer wall of shielding lid runs through there is the heating panel, the locating hole has been seted up to circuit motherboard's top edge, circuit motherboard's bottom is provided with circuit substrate, circuit substrate and circuit motherboard's junction point is provided with the heat conduction strip, the bottom of heat conduction strip is located circuit substrate's bottom fixedly connected with circuit motherboard, the one end fixedly connected with of heat conduction strip is laminated with circuit substrate outer wall mutually the heat dissipation strip.
3. The 5G cell phone circuit board of claim 1, wherein: the positioning frames are provided with four groups, and the four groups of positioning frames are positioned at the edges of four corners of the shielding cover.
4. The 5G cell phone circuit board of claim 1, wherein: the appearance of lifting hole groove is the slope form, lifting hole groove passes through and goes up and down to constitute elevation structure between orifice plate and the positioning spring and the positioning frame.
5. The 5G cell phone circuit board of claim 1, wherein: and the telescopic sliding block forms a telescopic structure with the positioning frame through the lifting hole groove and the connecting column.
6. The 5G cell phone circuit board of claim 1, wherein: the shielding cover forms a clamping structure through the telescopic supporting column, the lifting clamping block and the positioning frame, the telescopic supporting column is triangular in shape, and the lifting clamping block is trapezoidal in shape.
7. The 5G cell phone circuit board of claim 2, wherein: the radiating plates are distributed in an array along the outer wall of the shielding cover, and the cross sections of the radiating plates are I-shaped.
8. The 5G cell phone circuit board of claim 2, wherein: the appearance of heat conduction strip is "H" form, the circuit substrate passes through between heat conduction strip and the radiating strip and constitutes heat conduction structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321361999.3U CN219698002U (en) | 2023-05-31 | 2023-05-31 | 5G mobile phone circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321361999.3U CN219698002U (en) | 2023-05-31 | 2023-05-31 | 5G mobile phone circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219698002U true CN219698002U (en) | 2023-09-15 |
Family
ID=87970221
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321361999.3U Active CN219698002U (en) | 2023-05-31 | 2023-05-31 | 5G mobile phone circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219698002U (en) |
-
2023
- 2023-05-31 CN CN202321361999.3U patent/CN219698002U/en active Active
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| GR01 | Patent grant |