CN219696449U - Metal wire for semiconductor bonding wire - Google Patents
Metal wire for semiconductor bonding wire Download PDFInfo
- Publication number
- CN219696449U CN219696449U CN202223385994.2U CN202223385994U CN219696449U CN 219696449 U CN219696449 U CN 219696449U CN 202223385994 U CN202223385994 U CN 202223385994U CN 219696449 U CN219696449 U CN 219696449U
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- China
- Prior art keywords
- metal wire
- circuit board
- supporting
- welding
- semiconductor
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- 239000002184 metal Substances 0.000 title claims abstract description 60
- 239000004065 semiconductor Substances 0.000 title claims abstract description 35
- 238000003466 welding Methods 0.000 claims abstract description 56
- 230000003014 reinforcing effect Effects 0.000 claims description 12
- 210000000078 claw Anatomy 0.000 claims description 8
- 238000009434 installation Methods 0.000 abstract description 3
- 239000000126 substance Substances 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
The utility model belongs to the technical field of metal wires, in particular to a metal wire for semiconductor bonding wires, which comprises a metal wire body, wherein the upper end of the metal wire body is fixedly connected with a semiconductor body, a circuit board is arranged below the semiconductor body, the lower end of the metal wire body penetrates through the circuit board and is positioned below the circuit board, a supporting main body is sleeved on the upper part of the circuit board, the supporting main body is positioned on the upper end of the circuit board, a welding main body is sleeved on the lower part of the circuit board, and the welding main body is fixedly welded at the lower end of the circuit board. The utility model has the advantages that the structure is simple, the disassembly and the installation are convenient, the semiconductor body can be supported, the semiconductor body is orderly arranged and is convenient to distinguish, the length of the upper part of the metal wire body passing through the welding main body can be limited, the damage to the metal wire body is prevented, the shaking of the metal wire body during welding can be avoided, and the welding quality is improved through the arrangement of the welding main body.
Description
Technical Field
The utility model relates to the technical field of metal wires, in particular to a metal wire used for semiconductor bonding wires.
Background
The semiconductor is a substance with electric conductivity between an insulator and a conductor, the electric conductivity of the substance is easy to control, the substance can be used as an element material for information processing, the semiconductor is the diode most commonly, when the diode is subjected to wire welding, a pin metal wire passes through a circuit board and then is welded through soldering tin, but when the diode is subjected to wire welding, the metal wire passing through the circuit board is not easy to control, and when the wire passing through the circuit board is longer, the lead-out position of the bottom metal wire of the diode is easy to damage, therefore, a metal wire is used for the semiconductor wire welding.
Disclosure of Invention
The utility model mainly aims to provide a metal wire for semiconductor bonding wires, which can effectively solve the problems in the background technology.
In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows:
the utility model provides a metal wire for semiconductor bonding wire time, includes the metal wire body, the upper end fixedly connected with semiconductor body of metal wire body, the below of semiconductor body is provided with the circuit board, the lower extreme of metal wire body runs through the circuit board and is located the below of circuit board, the upper portion cover of circuit board is equipped with the support main part, the support main part is located the upper end of circuit board, the lower part cover of circuit board is equipped with the welding main part, and the fixed welding of welding main part is at the lower extreme of circuit board.
Preferably, the support main body comprises a support semicircle ring, two support semicircle rings are arranged, two support semicircle rings jointly form a cavity cylinder, two opposite ends of the support semicircle rings are respectively provided with a lug and a groove, and the size of the groove is matched with the size of the lug.
Preferably, the bump joint is in the recess that corresponds with two support semicircle ring joint each other together, the metal wire body cup joints in two support semicircle rings and with the laminating of the internal surface of support semicircle ring.
Preferably, the supporting semicircular ring comprises a reinforcing sleeve, the lower end of the reinforcing sleeve is integrally formed with a supporting sleeve, the outer diameter of the reinforcing sleeve is larger than that of the supporting sleeve, three extending claws are integrally formed at the lower part of the outer surface of the supporting sleeve, and the three extending claws are arranged at equal intervals in an annular shape.
Preferably, the welding body comprises a welding ring, extension blocks are uniformly formed on the front side and the rear side of the surface of the welding ring, and L-shaped supporting plates are uniformly formed on one side, away from the opposite ends, of the extension blocks.
Preferably, the inner diameter of the welding ring is matched with the outer diameter of the metal wire body, the lower part of the metal wire body is sleeved in the welding ring, and the upper end of the welding ring is fixedly welded with the lower end of the circuit board.
Compared with the prior art, the utility model has the following beneficial effects:
1. according to the utility model, the two supporting semicircular rings are clamped together in the corresponding grooves through the convex blocks, so that the supporting main body is sleeved on the upper part of the outer surface of the metal wire body to wrap and protect the metal wire body, the structure is simple, the disassembly and the installation are convenient, the semiconductor body can be supported through the supporting main body, the semiconductor body is orderly arranged and is convenient to distinguish, the length of the upper part of the metal wire body penetrating through the welding main body can be limited, and the damage to the metal wire body is prevented.
2. According to the utility model, through the arrangement of the welding main body, the welding ring and the lower end of the circuit board can be welded together, so that the shaking of the metal wire body during welding can be avoided, the welding quality is improved, and through the arrangement of the L-shaped supporting plate, the welding ring is conveniently supported, the upper end of the welding ring is tightly attached to the lower end of the circuit board, and the operation is convenient.
Drawings
FIG. 1 is a schematic view showing the overall structure of a metal wire used in bonding a semiconductor wire according to the present utility model;
fig. 2 is a schematic diagram of the bottom structure of a circuit board with metal wires for bonding wires of a semiconductor device according to the present utility model;
fig. 3 is a schematic view showing the composition of a supporting body of a metal wire for bonding a semiconductor device according to the present utility model;
fig. 4 is a schematic structural view of a bonding body of a metal wire used for bonding a semiconductor wire according to the present utility model.
In the figure: 1. a circuit board; 2. a semiconductor body; 3. a metal wire body; 4. a support body; 5. welding the main body; 41. supporting the semicircular ring; 42. a bump; 43. a groove; 44. a reinforcing sleeve; 45. a support sleeve; 46. an extension claw; 51. a weld ring; 52. an extension block; 53. l-shaped supporting plate.
Detailed Description
The utility model is further described in connection with the following detailed description, in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the utility model easy to understand.
In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific direction, be configured and operated in the specific direction, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "provided," "connected," and the like are to be construed broadly, and may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
Examples
Referring to fig. 1-4, the present utility model provides a technical solution:
the utility model provides a metal wire for semiconductor bonding wire time, includes metal wire body 3, the upper end fixedly connected with semiconductor body 2 of metal wire body 3, and semiconductor body 2 is the diode specifically, and the below of semiconductor body 2 is provided with circuit board 1, and the lower extreme of metal wire body 3 runs through circuit board 1 and is located the below of circuit board 1, and the upper portion cover of circuit board 1 is equipped with support main part 4, and support main part 4 is located the upper end of circuit board 1, and the lower part cover of circuit board 1 is equipped with welding main part 5, and welding main part 5 fixed weld is in the lower extreme of circuit board 1.
In this embodiment, the supporting body 4 includes two supporting semicircular rings 41, the two supporting semicircular rings 41 together form a hollow cylinder, opposite ends of the two supporting semicircular rings 41 are respectively provided with a bump 42 and a groove 43, and the size of the groove 43 is adapted to the size of the bump 42; the convex blocks 42 are clamped in the corresponding grooves 43 to clamp the two supporting semicircular rings 41 together, and the metal wire body 3 is sleeved in the two supporting semicircular rings 41 and is attached to the inner surface of the supporting semicircular rings 41; the supporting semicircular ring 41 comprises a reinforcing sleeve 44, a supporting sleeve 45 is integrally formed at the lower end of the reinforcing sleeve 44, the outer diameter of the reinforcing sleeve 44 is larger than that of the supporting sleeve 45, three extending claws 46 are integrally formed at the lower part of the outer surface of the supporting sleeve 45, and the three extending claws 46 are arranged at equal intervals in an annular shape; the two supporting semicircular rings 41 are clamped together in the corresponding grooves 43 through the convex blocks 42, the supporting main body 4 is sleeved on the upper portion of the outer surface of the metal wire body 3 to wrap and protect the metal wire body 3, the structure is simple, the disassembly and the installation are convenient, the semiconductor body 2 can be supported through the supporting main body 4, the semiconductor body 2 is orderly arranged, the resolution is convenient, the length of the upper portion of the metal wire body 3 passing through the welding main body 5 can be limited, and the damage to the metal wire body 3 is prevented.
In this embodiment, the welding body 5 includes a welding ring 51, and extension blocks 52 are integrally formed on both front and rear sides of the outer surface of the welding ring 51, and an L-shaped supporting plate 53 is integrally formed on one side of the two extension blocks 52 away from the opposite end; the inner diameter size of the welding ring 51 is matched with the outer surface diameter size of the metal wire body 3, the lower part of the metal wire body 3 is sleeved in the welding ring 51, and the upper end of the welding ring 51 is fixedly welded with the lower end of the circuit board 1; through the setting of welding main part 5, can be in the same place through welding ring 51 and circuit board 1 lower extreme welding, can avoid metal wire body 3 to take place the shake when the welding, improve welding quality, and through the setting of L type layer board 53, conveniently support welding ring 51, make the upper end of welding ring 51 hug closely the lower extreme at circuit board 1, convenient operation.
In the specific use process, the lower end of the metal wire body 3 is penetrated through the circuit board 1, then the two supporting semicircular rings 41 are clamped together in the corresponding grooves 43 through the convex blocks 42, the supporting main body 4 is sleeved on the upper part of the outer surface of the metal wire body 3 to wrap and protect the metal wire body 3, at the moment, the lower end of the semiconductor body 2 is positioned at the upper end of the reinforcing sleeve 44, the semiconductor body 2 is supported through the reinforcing sleeve 44, the lower ends of the extending claw 46 and the supporting sleeve 45 are positioned at the upper end of the circuit board 1, the length of the upper part of the metal wire body 3 penetrating through the welding main body 5 is limited by the supporting main body 4, an operator supports the welding ring 51 through the L-shaped supporting plate 53, the upper end of the welding ring 51 is tightly attached to the lower end of the circuit board 1, and then the welding ring 51 and the lower end of the circuit board 1 are welded together through melted soldering tin, so that the shaking of the metal wire body 3 during welding can be avoided, and the welding quality is improved.
The foregoing has shown and described the basic principles and main features of the present utility model and the advantages of the present utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (3)
1. The utility model provides a metal wire for semiconductor bonding wire, includes metal wire body (3), its characterized in that: the upper end of the metal wire body (3) is fixedly connected with the semiconductor body (2), a circuit board (1) is arranged below the semiconductor body (2), the lower end of the metal wire body (3) penetrates through the circuit board (1) and is positioned below the circuit board (1), a supporting main body (4) is sleeved on the upper portion of the circuit board (1), a welding main body (5) is sleeved on the lower portion of the circuit board (1), and the welding main body (5) is fixedly welded at the lower end of the circuit board (1);
the supporting body (4) comprises two supporting semicircular rings (41), the two supporting semicircular rings (41) form a cavity cylinder together, the opposite ends of the two supporting semicircular rings (41) are respectively provided with a convex block (42) and a concave groove (43), and the size of the concave groove (43) is matched with the size of the convex block (42);
the two supporting semicircular rings (41) are clamped together in the corresponding grooves (43) by the convex blocks (42), and the metal wire body (3) is sleeved in the two supporting semicircular rings (41) and is attached to the inner surface of the supporting semicircular rings (41);
the support semicircle ring (41) comprises a reinforcing sleeve (44), the lower end integrated into one piece of the reinforcing sleeve (44) is provided with a supporting sleeve (45), the outer diameter of the reinforcing sleeve (44) is larger than that of the supporting sleeve (45), the lower part of the outer surface of the supporting sleeve (45) is integrated into one piece with three extending claws (46), and the three extending claws (46) are arranged in an annular equidistant manner.
2. A metal wire for semiconductor bonding according to claim 1, wherein: the welding main body (5) comprises a welding ring (51), extension blocks (52) are uniformly formed on the front side and the rear side of the outer surface of the welding ring (51), and L-shaped supporting plates (53) are uniformly formed on one side, far away from the opposite ends, of each extension block (52).
3. A metal wire for semiconductor bonding according to claim 2, wherein: the inner diameter of the welding ring (51) is matched with the outer diameter of the metal wire body (3), the lower part of the metal wire body (3) is sleeved in the welding ring (51), and the upper end of the welding ring (51) is fixedly welded with the lower end of the circuit board (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223385994.2U CN219696449U (en) | 2022-12-16 | 2022-12-16 | Metal wire for semiconductor bonding wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223385994.2U CN219696449U (en) | 2022-12-16 | 2022-12-16 | Metal wire for semiconductor bonding wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219696449U true CN219696449U (en) | 2023-09-15 |
Family
ID=87965801
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223385994.2U Active CN219696449U (en) | 2022-12-16 | 2022-12-16 | Metal wire for semiconductor bonding wire |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219696449U (en) |
-
2022
- 2022-12-16 CN CN202223385994.2U patent/CN219696449U/en active Active
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