CN219695686U - High-density modularized server case - Google Patents

Abstract

The utility model discloses a high-density modularized server case, which comprises: the box body is internally provided with a power supply module and at least one PCIE module, wherein the PCIE module comprises a half-height half-length PCIE module and a full-height full-length PCIE module; and at least one PCIE module is arranged above the power module. The utility model can install a plurality of hard disks and a plurality of PCIE modules, realizes modularized design, facilitates hot plug maintenance or replacement of the hard disks and PCIE module replacement, interchange of OCP3.0 modules and BMC modules, can meet the combination of different types of requirements, greatly reduces the maintenance difficulty of a server, reduces the maintenance cost, meets different requirements of more clients, improves the competitiveness of products, and is beneficial to reducing the development and manufacturing cost.

Description

High-density modularized server case

Technical Field

The utility model relates to the technical field of server cabinets, in particular to a high-density modularized server cabinet based on a 2U cabinet.

Background

In the 2U server on the market at present, the back panel of the 2U server can only support 6 to 8 PCIE cards due to the limitation of the height dimension and the width dimension of the chassis 2U. However, with the development of new technologies and new requirements such as cloud computing, big data, mining machines and the like, the types of PCIE cards to be connected are more and more, the number of PCIE cards is more and more, and the more PCIE cards that each U server can support are required to be better.

The main board in the existing server case is fixed inside the case by using screws, various PCIE cards are inserted into PCIE slots on the main board, when the main board needs to be maintained, if PCIE card insertion is needed to be added or replaced, the server needs to be detached from the cabinet, the upper cover of the case is opened, then the server is maintained or replaced, the upper cover of the case is assembled after the maintenance or replacement of the server is completed, and finally the case is installed in the cabinet. This approach is time consuming and labor intensive, not conducive to rapid maintenance and is cost prohibitive.

Disclosure of Invention

The utility model mainly aims to provide a high-density modularized server case based on a 2U case, which greatly reduces the maintenance difficulty of a server, reduces the maintenance cost and meets different requirements of more clients.

To achieve the above object, the present utility model provides a high-density modular server enclosure, including: the power supply module and the PCIE module are arranged in the box body, and the PCIE module comprises a half-height half-length PCIE module and a full-height full-length PCIE module; and at least one PCIE module is arranged above the power module.

The power supply module is provided with a half-height half-length PCIE module and a 2.5 hard disk module, or 2 half-height half-length PCIE modules or 2 2.5 hard disk modules above.

The PCIE module is connected with the PCIE slot on the expansion board, and is exposed from the rear panel of the chassis.

The box body is internally provided with a core plate, a fan module, a hard disk module and a fan power supply adapter plate, wherein the core plate is positioned at the rear part of the box body and is provided with a double processor and a memory; the fan module is arranged between the hard disk module and the fan power supply adapter plate and comprises a plurality of fans which are connected with the fan power supply adapter plate; the power supply module is positioned at the rear part of the chassis and is connected with the expansion board for supplying power; the hard disk modules are respectively connected with the core plate, the expansion plate and the power supply module through the hard disk backboard.

Each full-length PCIE module supports three single-width full-length PCIE cards, or each full-length PCIE module supports one double-width full-length PCIE card and one single-width full-length PCIE card; each half-height half-length PCIE module supports two half-height half-length PCIE cards.

The half-height and half-length PCIE module comprises a first half-height and half-length PCIE module and a second half-height and half-length PCIE module, the first half-height and half-length PCIE module is connected with the PCIE slot of the expansion board through the first Riser adapter board, and the second half-height and half-length PCIE module is connected with the PCIE slot of the core board through the second Riser adapter board through a wire.

The first half-height and half-length PCIE module is connected with a cable through a connector interface arranged on the first Riser adapter plate, and the cable is connected with a PCIE slot of the expansion board.

The PCIE modules comprise two groups of full-length PCIE modules and two groups of half-length PCIE modules; and one side of the PCIE slot of the expansion board is provided with a Riser adapter board used for being connected with the full-length PCIE card, and the Riser adapter board is connected with the PCIE slot of the expansion board.

The hard disk module comprises a front hard disk module arranged at the front part of the case and a rear hard disk module arranged at the rear part of the case, and the rear hard disk module is positioned above the power supply module; the fan module is positioned between the front hard disk module and the core board; the fan module is in opposite plug connection with a connector arranged on the fan power supply adapter plate; a wind scooper module is arranged above the fan module; and an expansion board power interface used for being connected with the power supply module is arranged on the rear side of the expansion board.

The box body is internally provided with an OCP module and a BMC module, and the memories are evenly distributed on two sides of the dual processor; the core board is provided with a U-shaped notch which is convenient for the direct insertion of 2 OCP cards and the placement of 1 BMC module on the expansion board; two PCI slots are arranged at the U-shaped notch and are used for inserting two half-height half-length PCI cards; PCI slots are respectively distributed on at least two sides of the expansion board.

According to the high-density modularized server case based on the 2U case, provided by the technical scheme of the utility model, a plurality of hard disks and a plurality of PCIE modules can be installed, the modularized design is realized, hot plug maintenance or replacement of the hard disks and PCIE module replacement are facilitated, OCP3.0 modules are exchanged, BMC modules are exchanged, the combination of different types of requirements can be met, the maintenance difficulty of the server is greatly reduced, the maintenance cost is reduced, the different requirements of more clients are met, the competitiveness of products is improved, and development and manufacturing costs are reduced.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.

FIG. 1 is an exploded view of a high-density modular server chassis of the present utility model;

FIG. 2 is an assembled schematic diagram of a high-density modular server chassis according to the present utility model;

FIG. 3 is a motherboard layout of a high-density modular server chassis of the present utility model;

fig. 4 is a schematic view of a core board of the present utility model.

Reference numerals illustrate:

the device comprises a 1-hard disk module, a 2-fan power supply adapter plate, a 3-core plate, a 4-wind scooper, a 5-upper cover, a 6-expansion plate, a 7-BMC module, an 8-OCP3.0 module and a 9-OCP3.0 module; 10-2.5 rear hard disk modules, 11-half-height PCIE modules, 12-power supply modules and 13-full-height PCIE modules; 14-full-height PCIE module; 15-PCB guide brackets, 16-boxes and 17-fan modules; 18-CPU, 19-memory bank, 20-power interface, 21-connector interface.

The achievement of the objects, functional features and advantages of the present utility model will be further described with reference to the accompanying drawings, in conjunction with the embodiments.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

As shown in fig. 1-4, the present utility model proposes a high-density modular server chassis, which includes: the box 16, box 16 is equipped with upper cover 5, be provided with power module 12 and at least one PCIE module in the box 16, PCIE module includes half high half long PCIE module and full high full length PCIE module; at least one PCIE module is disposed above the power module 12.

The power module 12 is provided with a half-height half-length PCIE module and a 2.5 rear hard disk module 10, or 2 half-height half-length PCIE modules or 2 2.5 hard disk modules above.

The box 16 is further provided with an expansion board 6, a PCIE slot position is disposed at the rear side of the expansion board 6, the PCIE module is connected with the PCIE slot on the expansion board 6, and the PCIE module is exposed from the chassis rear panel.

The box body 16 is internally provided with a core plate 3, a fan module 17, a hard disk module 1 and a fan power supply adapter plate 2, wherein the core plate 3 is positioned at the rear part of the machine box, and the core plate 3 is provided with a double processor and a memory strip 19; the fan module 17 is arranged between the hard disk module 1 and the fan power supply adapter plate 2, and the fan module 17 comprises a plurality of fans which are connected with the fan power supply adapter plate 2; the power supply module 12 is positioned at the rear part of the chassis, and the power supply module 12 is connected with the expansion board 6 for supplying power; the hard disk modules 1 are respectively connected with the core plate 3, the expansion plate 6 and the power supply module 12 through hard disk back plates.

Each full-length PCIE module supports three single-width full-length PCIE cards, or each full-length PCIE module supports one double-width full-length PCIE card and one single-width full-length PCIE card; each half-height half-length PCIE module supports two half-height half-length PCIE cards.

The half-height and half-length PCIE module includes a first half-height and half-length PCIE module and a second half-height and half-length PCIE module, the first half-height and half-length PCIE module is connected with the PCIE slot of the expansion board 6 through the first Riser adapter board, and the second half-height and half-length PCIE module is connected with the PCIE slot of the core board 3 through the second Riser adapter board through a wire.

The first half-high and half-long PCIE module is connected to a cable through a connector interface 21 provided on the first Riser adapter board, and the cable is connected to a PCIE slot of the expansion board 6.

The PCIE modules comprise two groups of full-length PCIE modules and two groups of half-length PCIE modules; and a Riser adapter board used for being connected with the full-length PCIE card is arranged on one side of the PCIE slot of the expansion board 6, and the Riser adapter board is connected with the PCIE slot of the expansion board 6.

The hard disk module 1 comprises a front hard disk module 1 arranged at the front part of the chassis and a rear hard disk module 1 arranged at the rear part of the chassis, wherein the rear hard disk module 1 is positioned above the power supply module 12; the fan module 17 is positioned between the front hard disk module and the core plate 3; the fan module 17 is in opposite connection with a connector arranged on the fan power supply adapter plate 2; a wind scooper 4 is arranged above the fan module 17; the rear side of the expansion board 6 is provided with an expansion board 6 power interface 20 for connection with the power module 12.

Wherein, the box 16 is also provided with an OCP3.0 module 8 and a BMC module 7, and the memories are evenly distributed on two sides of the dual processor; the core board 3 is provided with a U-shaped notch which is convenient for the direct insertion of 2 OCP cards and the placement of 1 BMC module 7 on the expansion board 6; two PCI slots are arranged at the U-shaped notch and are used for inserting two half-height half-length PCI cards; PCI slots are respectively distributed on at least two sides of the expansion board 6.

Wherein, PCB guide bracket 15, CPU18 are also provided in the box 16.

According to the high-density modularized server case based on the 2U case, provided by the technical scheme of the utility model, a plurality of hard disks and a plurality of PCIE modules can be installed, the modularized design is realized, hot plug maintenance or replacement of the hard disks and PCIE module replacement are facilitated, OCP3.0 modules 8 are exchanged, BMC modules 7 are exchanged, the combination of different types of requirements can be met, the maintenance difficulty of the server is greatly reduced, the maintenance cost is reduced, the different requirements of more clients are met, the competitiveness of products is improved, and development and manufacturing costs are reduced.

The following describes the scheme of the present utility model in detail:

the utility model provides a high-density modularized server case based on a 2U case, which comprises a case 16, wherein a plurality of hard disk modules 1, a fan module 17, full-height PCIE modules 13 and 14, a half-height PCIE module 11,2.5 rear hard disk module 10, OCP3.0 modules 8 and 9, a BMC module 7, a fan power adapter plate 2, a core plate 3, an expansion plate 6 and a power supply module 12 are arranged in the case 16; the PCIE module comprises a half-height half-length PCIE module and a full-height full-length PCIE module; the core board 3 is located at the rear part of the chassis, the core board 3 is provided with a dual processor, namely a CPU18 and a memory bank 19, the PCIE slot on the expansion board 6 is located at the rear side of the expansion board 6, the PCIE module is connected with the PCIE slot on the expansion board 6, and the PCIE module is exposed from the rear panel of the chassis; the fan module 17 is arranged between the hard disk module 1 and the fan power supply adapter plate 2, and the fan module 17 comprises a plurality of fans which are connected with the fan power supply adapter plate 2; the power supply module 12 is positioned at the rear part of the chassis, and the power supply module 12 is connected with the expansion board 6 for supplying power; the hard disk modules 1 are respectively connected with the core plate 3, the expansion plate 6 and the power supply module 12 through hard disk back plates.

By adopting the technical scheme, the expansion board 6 is provided with the half-height half-length PCIE module and the full-height full-length PCIE module, so that the plugging requirements of a plurality of different PCIE cards can be met; and each full-length PCIE module can support three single-width full-length PCIE cards, and also can support one double-width full-length PCIE card and one single-width full-length PCIE card, and each half-height half-length PCIE module can support two half-height half-length PCIE cards, so that the variety and the number of the PCIE cards which can be supported are increased, and the user can use the PCIE card conveniently. In addition, PCIE slots on the expansion board 6 are positioned at the rear side of the expansion board 6, and PCIE modules are exposed from the rear panel of the chassis, so that maintenance can be performed without disassembling the chassis, the use is more convenient, and the time is saved.

As a further improvement of the present utility model, the half-height and half-length PCIE module includes a first half-height and half-length PCIE module and a second half-height and half-length PCIE module, where the first half-height and half-length PCIE module is connected to the PCIE slot of the expansion board 6 through the first Riser adapter board, and the second half-height and half-length PCIE module is connected to the PCIE slot of the core board 3 through the second Riser adapter board through a wire.

As a further improvement of the present utility model, the first half-high and half-long PCIE module is connected to a cable through a connector interface 21 provided on the first Riser adapter board, and the cable is connected to a PCIE slot of the expansion board 6.

As a further improvement of the present utility model, the half-height and half-length PCIE module is located above the power module 12.

As a further improvement of the present utility model, the PCIE modules include two groups of full-length PCIE modules and two groups of half-length PCIE modules; and a Riser adapter board used for being connected with the full-length PCIE card is arranged on one side of the PCIE slot of the expansion board 6, and the Riser adapter board is connected with the PCIE slot of the expansion board 6. By adopting the technical scheme, a plurality of PCIE cards can be supported in the 2U server case, so that the functions of the server are more powerful.

As a further improvement of the present utility model, the PCIE module includes a PCIE blade frame, where the PCIE blade frame is fixed on the box 16 in a combined manner with a screw; in the 2U space, the size of the box 16 can be 830mm multiplied by 87.8mm multiplied by 444.4mm, 12 rear PCIE cards and 1 BMC are accommodated, the advantage of the configuration scheme is obvious, and most parts are in a tool-free installation mode, so that the method is convenient and efficient.

The hard disk modules 1 can be 8 x 3.5 hard disk modules, 12 x 3.5 hard disk modules and 25 2.5 hard disk modules are compatible so as to meet the universality of products. The fan module 17 can be exchanged for an 8038 fan and an 8056 fan, so that the requirements of customers on product configuration are met.

As a further improvement of the present utility model, the hard disk module 1 includes a front hard disk module disposed at the front of the chassis and a rear hard disk module disposed at the rear of the chassis, the front hard disk module being disposed at the front of the chassis and the rear hard disk module being disposed at the rear of the chassis and above the power module 12. By adopting the technical scheme, the space is fully utilized, when the PCIE cards are not needed to be used, the positions of the two groups of half-height and half-length PCIE modules can be replaced by two rear hard disk modules, the two rear hard disk modules can be respectively provided with two 2.5-inch hard disks, at most 4 rear 2.5-inch hard disks are supported, and the two rear hard disk modules can be matched according to the needs of customers to make various combinations.

As a further development of the utility model, the fan module 17 is located between the front hard disk module 1 and the core plate 3.

As a further improvement of the present utility model, the fan module 17 is connected with a connector provided on the fan power adapter board 2 in an opposite-plug manner; the fan module 17 is provided with a fan cover 4 module above. The fan is provided with power and signals by the power adapter plate, air is taken in from the direction of the front hard disk module 1, and the fan is blown backward to the rear of the case after being sucked.

As a further development of the utility model, the rear side of the expansion board 6 is provided with an expansion board 6 power interface for connection with a power module 12.

As a further improvement of the utility model, the memories are evenly distributed on two sides of the dual processor; the core board 3 is provided with a U-shaped notch which is convenient for the direct insertion of 2 OCP cards and the extension board 6 of 1 BMC module 7. Further preferably, two PCI slots may be provided at the U-shaped notch, and two half-height and half-length PCI cards may be inserted.

As a further improvement of the present utility model, the PCI slots are reasonably arranged on the expansion board 6, and one side and the rear side of the expansion board 6 are respectively arranged with the PCI slots.

Compared with the prior art, the utility model has the beneficial effects that: by adopting the technical scheme of the utility model, a plurality of hard disks and a plurality of PCIE modules can be installed, the modularized design is realized, hot plug maintenance or replacement of the hard disks, PCIE module replacement, OCP3.0 module interchange and BMC module interchange are facilitated, the combination of different types of requirements can be met, the maintenance difficulty of a server is greatly reduced, the maintenance cost is reduced, the different requirements of more clients are met, the competitiveness of products is improved, and the development and manufacturing cost is reduced.

According to the high-density modularized server case disclosed by the utility model, in a 2U space, the size of the case 16 can be 830mm multiplied by 87.8mm multiplied by 444.4mm, 12 rear PCIE cards and 1 BMC are accommodated, the advantage of the configuration scheme is obvious, and most of parts are in a tool-free installation mode, so that the high-density modularized server case is convenient and efficient.

More specifically, the high-density flexible expansion 2U system is based on a 2U rack server architecture, and realizes flexible expansibility by matching a high-density flexible variable 2U chassis with different boards and a plurality of variable modules; and the module adopts a tool-free maintenance design, so that the high-flexibility variable configuration of the server is realized.

Example 1:

the embodiment provides a high-density flexible expansion 2U system, which can meet the configuration requirements of different applications by installing a core board 3, an expansion board 6, a fan power supply adapter board 2, a chassis and a bracket with different expansion cards; to ensure ease of use, the expansion card, chassis, hood 4, front window, etc. all employ a modular tool-free design. As shown in fig. 1, the structure of the 2U system includes a 2U chassis, a plurality of independent replaceable modules, and a high-density core board 3; wherein the 2U chassis: as an architectural main body part of the system, for carrying the core board 3 and the expansion board 6, the installation of various expansion brackets can be supported.

In the 2U system of this embodiment, the plurality of independent replaceable modules: the device mainly comprises a wind scooper 4, a 2.5 rear hard disk module 10, a rear window module, a network sub-card module and a front window module. The wind scooper 4 is used for guiding wind flow, solving the problem of system heat dissipation, and adopts a plastic part which is in a tool-free buckle design with the case; different PCIE cards can be supported by matching with CPU radiators with different heights. The 2.5 rear hard disk module 10 is a module for installing a hard disk at the rear part of the case; the rear window module is used for matching with brackets made by the motherboard IO, the power supply, the PCIE card and the 2.5 rear hard disk module 10; the network sub-card module is a variety of network cards which meet the requirements of different network functions of users; the front window module is used for installing frames of different numbers of hard disks with the size of 2.5 inches and 3.5 inches.

In the 2U system of this embodiment, the high-density core board 3: a server system main board which is provided with a plurality of expansion interfaces and can be commonly used for other platform architectures; this section will be referred to simply for descriptive purposes as: and a main board.

Therefore, the high-density flexible expansion 2U system in this embodiment mainly realizes flexible expansibility by matching a main board of a high-density multi-expansion interface with a common 2U chassis and a plurality of variable modules. In terms of usability, the modularized board is used for realizing easy installation and maintenance of the modularized structural components, and realizing quick assembly and disassembly.

Example 2:

the difference between the high-density flexible expansion 2U system of the present embodiment and the embodiment 1 is that, as shown in fig. 2, a core board 3 of the 2U system adopts a high-density motherboard capable of being commonly used with other system platforms, 4 PCIE X24 expansion interfaces are reserved on the motherboard, and different adapter cards and brackets can be matched to realize maximum 6 full-height PCIE expansion and 4 half-height PCIE expansion support in the 2U chassis space; 2 groups of X8+X1PCIE expansion ports are reserved for supporting 2 network daughter cards.

In the 2U system of this embodiment, the front window module adopts a tool-free disassembly mode, and matches with different types and numbers of hard disks, so that 4 different highest configurations can be realized; 2.5X24, 2.5X25, 3.5X8, 3.5X12, respectively.

In the 2U system of this embodiment, a tool-free maintenance mode is adopted between the extension bracket and the chassis of the rear window module, and each full-height bracket supports at most 3 full-height cards; at most, one case adopts two full-height expansion brackets to realize 6 full-height card configuration. Each half-height bracket supports 2 half-height cards at most; at most, one case adopts two half-height expansion brackets to realize 4 half-height card configuration.

In the 2U system of this embodiment, the wind scooper 4 module adopts a tool-free disassembly mode, and is respectively matched with 1U and 2U high-level radiators, so as to realize the switching support of the GPU and the common card.

In the 2U system of this embodiment, the 2.5 rear hard disk module 10 reserves two groups of rear windows above the power module, and also adopts a tool-free design manner to support at most 4 hard disks with 2.5 inches.

The foregoing description is only of the preferred embodiments of the present utility model and is not intended to limit the scope of the utility model, and all equivalent structural changes made by the description of the present utility model and the accompanying drawings or direct/indirect application in other related technical fields are included in the scope of the utility model.

Claims (10)

1. A high-density modular server chassis, the high-density modular server chassis comprising: the power supply module and the PCIE module are arranged in the box body, and the PCIE module comprises a half-height half-length PCIE module and a full-height full-length PCIE module; at least one PCIE module is arranged above the power supply module; and a PCB guide bracket and a CPU are also arranged in the box body.

2. The high-density modularized server chassis of claim 1, wherein a half-height half-length PCIE module and 2.5 hard disk modules, or 2 half-height half-length PCIE modules or 2 2.5 hard disk modules are arranged above the power module.

3. The high-density modularized server chassis of claim 1, wherein an expansion board is further arranged in the chassis, a PCIE slot position is arranged at the rear side of the expansion board, the PCIE module is connected with the PCIE slot on the expansion board, and the PCIE module is exposed from the rear panel of the chassis.

4. The high-density modular server chassis of claim 3, wherein a core board, a fan module, a hard disk module, and a fan power adapter board are further disposed in the chassis, the core board is located at the rear of the chassis, and the core board is provided with a dual processor and a memory; the fan module is arranged between the hard disk module and the fan power supply adapter plate and comprises a plurality of fans which are connected with the fan power supply adapter plate; the power supply module is positioned at the rear part of the chassis and is connected with the expansion board for supplying power; the hard disk modules are respectively connected with the core plate, the expansion plate and the power supply module through the hard disk backboard.

5. The high-density modular server chassis of claim 4, wherein each full-length-to-full-height PCIE module supports three single-width full-length PCIE cards or each full-length-to-full-height PCIE module supports one double-width full-length PCIE card and one single-width full-length PCIE card. Each half-height half-length PCIE module supports two half-height half-length PCIE cards.

6. The high-density modular server chassis of claim 5, wherein the half-height and half-length PCIE module comprises a first half-height and half-length PCIE module and a second half-height and half-length PCIE module, wherein the first half-height and half-length PCIE module is connected with the PCIE slot of the expansion board through a first Riser adapter board, and the second half-height and half-length PCIE module is connected with the PCIE slot of the core board through a second Riser adapter board through a wire.

7. The high-density modular server chassis of claim 6, wherein the first half-height and half-length PCIE module connects a cable through a connector interface provided on the first Riser patch panel, the cable being connected to a PCIE slot of the expansion board.

8. The high-density modular server chassis of claim 5, wherein the PCIE modules comprise two groups of full-length PCIE modules and two groups of half-length PCIE modules; and one side of the PCIE slot of the expansion board is provided with a Riser adapter board used for being connected with the full-length PCIE card, and the Riser adapter board is connected with the PCIE slot of the expansion board.

9. The high-density modular server chassis of claim 4, wherein the hard disk modules comprise a front hard disk module disposed at a front of the chassis and a rear hard disk module disposed at a rear of the chassis, the rear hard disk module being located above the power module; the fan module is positioned between the front hard disk module and the core board; the fan module is in opposite plug connection with a connector arranged on the fan power supply adapter plate; a wind scooper module is arranged above the fan module; and an expansion board power interface used for being connected with the power supply module is arranged on the rear side of the expansion board.

10. The high-density modular server chassis of claim 4, wherein the chassis is further provided with an OCP module and a BMC module, and the memories are evenly distributed on two sides of the dual processor; the core board is provided with a U-shaped notch which is convenient for the direct insertion of 2 OCP cards and the placement of 1 BMC module on the expansion board; two PCI slots are arranged at the U-shaped notch and are used for inserting two half-height half-length PCI cards; PCI slots are respectively distributed on at least two sides of the expansion board.