CN219683157U

CN219683157U - Silicon wafer rotating device of silicon wafer gumming machine

Info

Publication number: CN219683157U
Application number: CN202321026976.7U
Authority: CN
Inventors: 胡情华; 刘芳亮; 唐文璇
Original assignee: Nanjing Jingsheng Technology Co ltd
Current assignee: Nanjing Jingsheng Technology Co ltd
Priority date: 2023-05-04
Filing date: 2023-05-04
Publication date: 2023-09-15
Anticipated expiration: 2033-05-04

Abstract

The utility model relates to the technical field of silicon wafer gumming machines and discloses a silicon wafer rotating device of a silicon wafer gumming machine. According to the utility model, when one side of the silicon wafer is coated with the glue, the first motor is started to drive the rotating rod to rotate, so that the first clamping plate can be driven by the silicon wafer to rotate together with the second clamping plate, the surface of the silicon wafer can be changed, the second motor is started to drive the rotating mechanism to be matched with the rotating mechanism, so that the rotating plate can rotate, and the glue is coated on the rotating plate, so that one side of the silicon wafer can be uniformly coated with the glue.

Description

Silicon wafer rotating device of silicon wafer gumming machine

Technical Field

The utility model belongs to the technical field of silicon wafer gumming machines, and particularly relates to a silicon wafer rotating device of a silicon wafer gumming machine.

Background

The utility model discloses a silicon wafer rotating device of a silicon wafer gumming machine through retrieval CN217342145U, which comprises a workbench, wherein a vertically through mounting hole is arranged on the workbench, a rotating shaft is movably mounted in the mounting hole, a wafer support for adsorbing and supporting a silicon wafer is fixedly arranged at the upper end of the rotating shaft, the wafer support comprises a metal support body, a microporous ceramic support body is mounted on the support body, a negative pressure cavity is arranged on the microporous ceramic support body, and the negative pressure cavity is communicated with the negative pressure device; the bottom of the workbench is provided with a rotary power device for controlling the rotation of the rotary shaft and a lifting device for controlling the lifting of the rotary shaft; be provided with at least three support column that is used for supporting the silicon chip on the workstation, be provided with the through-hole that makes things convenient for the support column to run through on the sheet support, the device makes the silicon chip level adsorb and carries out the rubber coating on the sheet support through using micropore ceramic bearing body, and adsorption affinity evenly distributes in whole plane, can not produce the deformation, makes the chip yield of production higher.

But the present inventors have found that this technical solution still has at least the following drawbacks:

according to the silicon wafer rotating device of the silicon wafer gumming machine, although the silicon wafer can be rotated and gummed, the silicon wafer is sticky in real life and has two sides, so that the device can not touch one side of the silicon wafer after gumming the other side of the silicon wafer, and thus staff is required to wait.

The present utility model has been made in view of this.

Disclosure of Invention

In order to solve the technical problems, the utility model adopts the basic conception of the technical scheme that:

the utility model provides a silicon chip rotary device of silicon chip spreading machine, includes base and mounting panel, the mounting panel is located the base top, and the mounting panel has four telescopic links of mutual symmetry between the base, and there is slide mechanism base top all around, slide mechanism includes spout and first slider, two the spout is seted up respectively on the base, and mutual symmetry, two equal slidable mounting of spout inner chamber has two first sliders of mutual symmetry, four equal fixed mounting in two upper sides of first slider has the baffle, two the relative lateral wall of baffle is provided with actuating mechanism, and actuating mechanism other end fixed mounting has first grip block, first grip block is provided with the second grip block in the middle of the base vertical symmetry, and the second grip block is kept away from a lateral wall fixed mounting of first grip block and is provided with the rotary rod, the rotary rod other end movable mounting is on the baffle, the draw-in groove has all been seted up in the middle of first grip block and the second grip block.

As a preferred implementation mode of the utility model, a rotating mechanism is arranged in the middle above the base, the rotating mechanism comprises a second motor, the second motor is arranged on the base, a threaded screw rod is fixedly arranged at the output end above the second motor, threaded sleeves are meshed and arranged on the threaded screw rod, connecting rods which are circumferentially distributed are fixedly arranged on the threaded sleeves, and a mounting plate is fixedly arranged at the other end of the connecting rod.

As a preferable implementation mode of the utility model, a spring rod is fixedly arranged above the threaded screw rod, the spring rod movably penetrates through the mounting plate, a rotating plate is fixedly arranged at the other end of the spring rod, and a rotating mechanism is arranged at the bottom of the rotating plate.

As a preferred implementation mode of the utility model, the rotating mechanism comprises a circular groove, the circular groove is arranged at the bottom of the rotating plate, four connecting rods which are circumferentially distributed are movably arranged in the circular groove, and the other ends of the four connecting rods are fixedly arranged above the mounting plate.

As a preferred embodiment of the present utility model, the driving mechanism includes a first motor, a rotating rod is fixedly mounted at an output end of the first motor, and the other end of the rotating rod is fixedly mounted on the first clamping plate.

As a preferred implementation mode of the utility model, two symmetrical second sliding blocks are slidably arranged in the inner cavities of the two sliding grooves on one side, opposite to the four symmetrical first sliding blocks, of each other, movable rods are movably arranged on one side wall, close to the two baffle plates, of each of the four second sliding blocks, and fixed rods are fixedly arranged on the four second sliding blocks, opposite to each other, of each of the four second sliding blocks.

Compared with the prior art, the utility model has the following beneficial effects:

according to the utility model, when one side of the silicon wafer is coated with the glue, the first motor is started to drive the rotating rod to rotate, so that the first clamping plate can be driven by the silicon wafer to rotate together with the second clamping plate, the surface of the silicon wafer can be changed, the second motor is started to drive the rotating mechanism to be matched with the rotating mechanism, so that the rotating plate can rotate, and the glue is coated on the rotating plate, so that one side of the silicon wafer can be uniformly coated with the glue.

The following describes the embodiments of the present utility model in further detail with reference to the accompanying drawings.

Drawings

In the drawings:

FIG. 1 is a schematic perspective view of a silicon wafer rotating device of a silicon wafer gumming machine;

FIG. 2 is a schematic side view of a silicon wafer rotating device of a silicon wafer gumming machine;

FIG. 3 is a schematic view of a partial structure of a silicon wafer rotating device A of a silicon wafer gumming machine;

FIG. 4 is a schematic view of a part of a silicon wafer rotating device of a silicon wafer gumming machine;

fig. 5 is a schematic view of a partial structure of a C-position of a silicon wafer rotating device of a silicon wafer gumming machine.

In the figure: 1. a base; 2. a baffle; 3. a first motor; 4. a rotating rod; 5. a first clamping plate; 6. a clamping groove; 7. a second clamping plate; 8. a rotating rod; 9. a rotating plate; 10. a mounting plate; 11. a telescopic rod; 12. a chute; 13. a first slider; 14. a second motor; 15. a threaded screw rod; 16. a threaded sleeve; 17. a connecting rod; 18. a connecting rod; 19. a second slider; 20. a movable rod; 21. a fixed rod; 22. a circular groove; 23. a spring rod.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions in the embodiments will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and the following embodiments are used to illustrate the present utility model.

As shown in fig. 1 to 5, a silicon wafer rotating device of a silicon wafer glue spreader comprises a base 1 and a mounting plate 10, wherein the mounting plate 10 is positioned above the base 1, four telescopic rods 11 which are symmetrical to each other are fixedly arranged between the mounting plate 10 and the base 1, sliding mechanisms are arranged around the upper side of the base 1, each sliding mechanism comprises a sliding groove 12 and a first sliding block 13, the two sliding grooves 12 are respectively arranged on the base 1 and are symmetrical to each other, two first sliding blocks 13 which are mutually symmetrical are respectively arranged in the inner cavities of the two sliding grooves 12 in a sliding manner, a baffle plate 2 is fixedly arranged above each of the four first sliding blocks 13, a driving mechanism is arranged on one side wall opposite to each of the two baffle plates 2, a first clamping plate 5 is fixedly arranged at the other end of the driving mechanism, a second clamping plate 7 is vertically and symmetrically arranged in the middle of the base 1, a rotating rod 8 is fixedly arranged on one side wall of the second clamping plate 7 far away from the first clamping plate 5, the other end of the rotating rod 8 is movably arranged on the baffle plate 2, and a clamping groove 6 is respectively arranged in the middle of the first clamping plate 5 and the second clamping plate 7.

The middle of the upper part of the base 1 is provided with a rotating mechanism, the rotating mechanism comprises a second motor 14, the second motor 14 is arranged on the base 1, a threaded screw rod 15 is fixedly arranged at the output end of the upper part of the second motor 14, threaded sleeves 16 are installed on the threaded screw rod 15 in a meshed mode, connecting rods 17 which are installed in a circumferential distribution mode are fixedly installed on the threaded sleeves 16, and a mounting plate 10 is fixedly installed at the other end of each connecting rod 17. In this setting, through the second motor 14 of start below, make it drive screw 15 and rotate, because screw 15 is rotatory to can drive screw sleeve 16 and reciprocate, thereby can drive the connecting rod 17 of top through screw sleeve 16 and remove, thereby electric mounting panel 10 removes.

A spring rod 23 is fixedly arranged above the threaded screw rod 15, the spring rod 23 movably penetrates through the mounting plate 10, the other end of the spring rod 23 is fixedly provided with a rotating plate 9, and the bottom of the rotating plate 9 is provided with a rotating mechanism. In this arrangement, when the mounting plate 10 is moved, the upper rotating plate 9 can be pushed to move by the connecting rod 18.

The rotating mechanism comprises a circular groove 22, the circular groove 22 is formed in the bottom of the rotating plate 9, four connecting rods 18 which are circumferentially distributed are movably mounted in the circular groove 22, and the other ends of the four connecting rods 18 are fixedly mounted above the mounting plate 10. In this arrangement, the mounting plate 10 is not rotated because the rotation plate 9 is rotated and the connecting rod 18 is rotatably connected to the circular groove 22 formed in the bottom of the rotation plate 9.

The driving mechanism comprises a first motor 3, a rotating rod 4 is fixedly arranged at the output end of the first motor 3, and the other end of the rotating rod 4 is fixedly arranged on a first clamping plate 5. In this setting, drive bull stick 4 through starting first motor 3 and rotate for first grip block 5 can make second grip block 7 rotatory together under the drive of silicon chip, thereby make can trade the face with the silicon chip.

Two symmetrical second sliding blocks 19 are slidably arranged on one side, opposite to the four first sliding blocks 13, of the inner cavity of the two sliding grooves 12, two movable rods 20 are movably arranged on one side wall, close to the two baffle plates 2, of the four second sliding blocks 19, and fixing rods 21 are fixedly arranged on the four second sliding blocks 19. In this setting, make it through removing dead lever 21 and remove in spout 12 through second slider 19 to can drive two baffles 2 and remove under the drive of movable rod 20, can place the draw-in groove 6 that sets up in first grip block 5 and second grip block 7 with the silicon chip this moment.

The implementation principle of the silicon wafer rotating device of the silicon wafer gumming machine in this embodiment is as follows: firstly, the fixing rod 21 is moved in the sliding groove 12 through the second sliding block 19, so that the two baffles 2 can be driven to move under the drive of the movable rod 20, at the moment, silicon wafers can be placed in the clamping grooves 6 formed in the first clamping plate 5 and the second clamping plate 7, at the moment, the lower second motor 14 is started to enable the threaded screw rod 15 to rotate, the threaded screw rod 15 is enabled to rotate, the threaded sleeve 16 can be driven to move up and down, the upper connecting rod 17 can be driven to move through the threaded sleeve 16, the electric mounting plate 10 is enabled to move, when the mounting plate 10 moves, the upper rotating plate 9 can be driven to move through the connecting rod 18, at the moment, the silicon wafers 9 can be fixedly connected between the threaded screw rods 15 through the spring rods 23 (at the moment, the spring rods 23 can be stretched under the elasticity of the springs, the spring rods 23 can also enable the rotating plate 9 to rotate (the circular grooves 22 formed in the bottom of the rotating plate 9 are enabled to rotate when the rotating plate 9 rotates, the connecting rod 18 is enabled to rotate, the mounting plate 10 cannot be enabled to rotate), the mounting plate 16 can be driven to move up and down, the connecting rod 17 can be driven to drive the upper connecting rod 17 through the threaded sleeve 16, the silicon wafers can be driven to rotate, the second clamping plate 7 can be enabled to rotate, the silicon wafers can be clamped on the side of the silicon wafers 5, the silicon wafers can be clamped by the rotating plate 4, and the silicon wafers can be clamped by the rotating plate 4 repeatedly, and the first clamping plate 4 can be clamped by the rotating plate 4, and the silicon wafers can be clamped by the rotating on the side, and the first clamping plate 4 can be clamped by the rotating plate 4, and the rotating after the silicon wafers are evenly clamped by the rotating after the silicon wafers are clamped by the rotating. Therefore, the situation of rapidly gluing the two sides of the silicon wafer can be realized, and the situation that waiting is not needed in the process of gluing the silicon wafer is ensured.

Claims

1. The utility model provides a silicon chip rotary device of silicon chip spreading machine, includes base (1) and mounting panel (10), its characterized in that, mounting panel (10) are located base (1) top, and mounting panel (10) are provided with four telescopic links (11) of mutual symmetry between base (1), and there is slide mechanism in base (1) top all around, slide mechanism includes spout (12) and first slider (13), two spout (12) are seted up respectively on base (1), and mutual symmetry, two spout (12) inner chamber equal slidable mounting has two first sliders (13) of mutual symmetry, four equal fixed mounting in two equal two top of first slider (13) have baffle (2), two baffle (2) are provided with actuating mechanism in relative one side wall, and actuating mechanism other end fixed mounting has first grip block (5), first grip block (5) are provided with second grip block (7) in the middle vertical symmetry of base (1), and second grip block (7) keep away from one side wall (8) of first grip block (5), and second grip block (8) are installed in the equal fixed mounting of second grip block (8) on the middle of baffle (6).

2. The silicon wafer rotating device of the silicon wafer glue spreader according to claim 1, wherein a rotating mechanism is arranged in the middle of the upper part of the base (1), the rotating mechanism comprises a second motor (14), the second motor (14) is arranged on the base (1), a threaded screw rod (15) is fixedly arranged at the output end of the upper part of the second motor (14), threaded sleeves (16) are meshed and arranged on the threaded screw rod (15), connecting rods (17) which are circumferentially distributed and arranged are fixedly arranged on the threaded sleeves (16), and a mounting plate (10) is fixedly arranged at the other end of each connecting rod (17).

3. The silicon wafer rotating device of the silicon wafer glue spreader according to claim 2, wherein a spring rod (23) is fixedly arranged above the threaded screw rod (15), the spring rod (23) movably penetrates through the mounting plate (10), a rotating plate (9) is fixedly arranged at the other end of the spring rod (23), and a rotating mechanism is arranged at the bottom of the rotating plate (9).

4. A silicon wafer rotating device of a silicon wafer glue spreader according to claim 3, wherein the rotating mechanism comprises a circular groove (22), the circular groove (22) is arranged at the bottom of the rotating plate (9), four connecting rods (18) which are circumferentially distributed are movably arranged in the circular groove (22), and the other ends of the four connecting rods (18) are fixedly arranged above the mounting plate (10).

5. The silicon wafer rotating device of the silicon wafer glue spreader according to claim 1, wherein the driving mechanism comprises a first motor (3), a rotating rod (4) is fixedly arranged at the output end of the first motor (3), and the other end of the rotating rod (4) is fixedly arranged on a first clamping plate (5).

6. The silicon wafer rotating device of the silicon wafer glue spreader according to claim 1, wherein two symmetrical second sliding blocks (19) are slidably arranged in the inner cavities of the two sliding grooves (12) on the opposite sides of the four symmetrical first sliding blocks (13), movable rods (20) are movably arranged on the four second sliding blocks (19) close to one side wall of the two baffle plates (2) respectively, and fixed rods (21) are fixedly arranged on the four opposite second sliding blocks (19).