CN219678884U

CN219678884U - Controller and power utilization device

Info

Publication number: CN219678884U
Application number: CN202320283836.1U
Authority: CN
Inventors: 张安君
Original assignee: Contemporary Amperex Technology Co Ltd; Contemporary Amperex Intelligence Technology Shanghai Ltd
Current assignee: Contemporary Amperex Technology Co Ltd; Contemporary Amperex Intelligence Technology Shanghai Ltd
Priority date: 2023-02-21
Filing date: 2023-02-21
Publication date: 2023-09-12
Anticipated expiration: 2033-02-21

Abstract

The application is suitable for the technical field of electric devices, and provides a controller and an electric device, which comprise a power module, a supporting structure and a transportation pipeline, wherein the supporting structure is provided with a mounting groove, the mounting groove comprises a mounting opening, the power module is covered at the mounting opening along a first direction, and a heat exchange cavity for accommodating a heat exchange medium is formed between the power module and the mounting groove; the mounting groove is provided with a transportation opening, and the transportation pipeline is communicated with the heat exchange cavity through the transportation opening, so that a heat exchange medium can be transported between the transportation pipeline and the heat exchange cavity; the transportation opening is located the diapire of mounting groove, and the transportation pipeline extends along the second direction and follows first direction intercommunication in the heat transfer chamber, and the second direction intersects in first direction. Because the transportation opening in the controller is arranged at the bottom wall of the mounting groove, the transportation pipeline and the heat exchange cavity are at least partially overlapped in the first direction, and when the transportation pipeline is of a certain length, the size of the transportation pipeline in the second direction is relatively reduced, so that the size of the controller in the second direction is relatively reduced.

Description

Controller and power utilization device

Technical Field

The application relates to the technical field of electric devices, in particular to a controller and an electric device.

Background

In a new energy automobile, a controller of a driving motor is a core component of the new energy automobile, and the motor controller needs to provide important functions such as inversion, energy recovery and the like. The controller is provided with a power module which is a core component for providing energy conversion and control in the controller. The power module can produce a large amount of heat in the course of working, in order to improve power module's heat exchange efficiency, is provided with heat exchange structure in the controller, and heat exchange structure has the heat transfer chamber, and power module's partial region stretches into the heat transfer chamber. The side wall of the heat exchange structure is provided with an opening, the opening is connected with a pipeline, the extending direction of the pipeline is the same as that of the opening, a heat exchange medium is sent into the heat exchange cavity through the pipeline, and the heat exchange medium in the heat exchange cavity flows out through the pipeline.

Currently, the controller is miniaturized, but the pipe connected to the heat exchange structure occupies a relatively large space, thereby being disadvantageous to the miniaturization of the controller.

Disclosure of Invention

The embodiment of the utility model aims to provide a controller and aims to solve the technical problem that the size of the controller is large in the prior art.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

There is provided a controller comprising:

a power module;

the power module is covered at the mounting opening along the first direction, and a heat exchange cavity for accommodating a heat exchange medium is formed between the power module and the mounting groove;

the transportation pipeline is used for transporting the heat exchange medium, the mounting groove is further provided with a transportation opening, and the transportation pipeline is communicated with the heat exchange cavity through the transportation opening so that the heat exchange medium can be transported between the transportation pipeline and the heat exchange cavity;

the transportation opening is positioned at the bottom wall of the mounting groove, the transportation pipeline extends along a second direction and is communicated with the heat exchange cavity along the first direction, and the second direction is intersected with the first direction.

In the technical scheme provided by the embodiment of the application, the heat exchange cavity is formed between the supporting structure and the power module, the transportation pipeline is used for the heat exchange medium to enter and exit the heat exchange cavity, and the transportation pipeline extends along the second direction and is communicated with the heat exchange cavity along the first direction, so that the heat exchange medium in the transportation pipeline enters the heat exchange cavity from the transportation opening of the bottom wall of the mounting groove along the first direction, and the heat exchange medium in the heat exchange cavity enters the transportation pipeline from the transportation opening of the bottom wall of the mounting groove along the first direction. In this arrangement, since the transport opening is provided in the bottom wall of the mounting groove, the transport duct and the heat exchange chamber at least partially overlap in the first direction, and when the transport duct is of a certain length, the transport duct is relatively reduced in size in the second direction, so that the controller can be relatively reduced in size in the second direction.

In one possible design, the transportation pipeline includes an input pipeline and an output pipeline, the transportation opening includes an inlet communicated with the input pipeline and an outlet communicated with the output pipeline, the inlet and the outlet are respectively located at two ends of the bottom wall of the installation groove along a third direction, the third direction intersects with the second direction, and a dimension of the heat exchange cavity along the second direction is smaller than a dimension of the heat exchange cavity along the third direction.

In this kind of setting method, heat transfer medium gets into the heat transfer chamber at the entry, and heat transfer medium flows by entry to export direction in the heat transfer chamber to finally follow the export and flow out the heat transfer chamber, because entry and export are located the both ends along the third direction of mounting groove diapire respectively, and the heat transfer chamber is greater than along the size of second direction along the size of third direction, consequently heat transfer medium flows the regional bigger in the heat transfer chamber, and the heat transfer is more even.

In one possible design, at least one of the inlet and the outlet is centrally disposed in the second direction at the mounting slot bottom wall.

In the arrangement mode, the heat exchange medium flows relatively more uniformly in the heat exchange cavity, and the heat dissipation effect is better.

In one possible design, the controller further comprises a flow guide mounted between the transport duct and the support structure, the transport duct communicating with the transport opening through the flow guide.

In this arrangement, the provision of the flow guide facilitates the flow of the heat exchange medium between the transport conduit and the heat exchange chamber.

In one possible design, the flow guide is provided with a flow guide hole which communicates with the transport pipe, and the flow guide is provided with a buffer space which communicates with the flow guide hole and the transport opening, respectively.

In the arrangement mode, the arrangement of the buffer space improves the uniformity of flow of the heat exchange medium in the heat exchange cavity.

In one possible design, a maximum dimension of the buffer space along the first direction is greater than a maximum dimension of the heat exchange cavity along the first direction.

In this arrangement, the heat exchange medium enters the heat exchange chamber after accumulating a certain amount in the buffer space.

In one possible design, the area of the cross section of the buffer space perpendicular to the first direction increases gradually from the end near the transport pipe towards the end near the transport opening.

In this arrangement, the volume of the buffer space at the end closer to the transport conduit is relatively small per unit length in the first direction, so that the heat exchange medium is moved relatively faster in the first direction at the side closer to the transport conduit.

In one possible design, a heat exchange area is provided on a surface of the power module facing the mounting groove, heat exchange fins are arranged on the heat exchange area, the heat exchange fins are projected along the first direction, and at least part of the projection of the buffer space is located on the outer side of the projection of the heat exchange area along the third direction.

In this kind of setting method, because the buffer memory space communicates with the heat transfer chamber, under the certain circumstances of size along first direction heat transfer region and buffer memory space, along first direction projection, buffer memory space is less with the coincidence region in heat transfer region for the heat transfer chamber is bigger with the heat transfer region coincidence region, so as to improve the heat transfer effect.

In one possible design, the area of the cross section of the buffer space perpendicular to the third direction increases gradually in a direction approaching the heat exchange area.

In this kind of setting scheme, when getting into the heat transfer chamber, the heat transfer medium is nearer with the distance between two lateral walls of perpendicular to third direction to make the heat transfer medium flow along the direction of third direction in the flow, can flow along the direction of perpendicular to third direction sooner, thereby reduce the dead angle area of heat transfer medium in the heat transfer chamber, improve heat exchange efficiency.

In one possible design, the controller further comprises a mounting shell formed with the transport conduit, the support structure being connected to the mounting shell in the first direction such that the transport conduit interfaces with the transport opening.

In this kind of setting method, the installation shell is integrated as an organic whole structure with the transportation pipeline, and the integrated level is high, reduces the assembly step.

In one possible design, the controller further includes a flow guiding member provided by the above technical solution, and the controller further includes a first sealing member, and the transportation pipeline is connected to the flow guiding member in a sealing manner through the first sealing member.

In this arrangement, the provision of the first sealing element can improve the sealing effect between the transport conduit and the flow guide element.

In one possible design, the transportation pipeline is provided with an annular groove towards one end of the flow guiding piece, the flow guiding piece is provided with an annular convex column, the annular convex column stretches into the annular groove, and the first sealing piece is clamped between the side wall of the annular groove and the side wall of the annular convex column.

In this kind of setting scheme, annular projection and ring channel cooperation installation can play radial relative spacing effect between transportation pipeline and water conservancy diversion spare on the one hand, and on the other hand is convenient for the installation of first sealing member through first annular projection and ring channel cooperation.

The application also provides an electric device, which comprises the controller provided by the technical scheme.

Because the power utilization device comprises the controller, the power utilization device has at least all the beneficial effects of the controller, and is not described herein.

The foregoing description is only an overview of the present application, and is intended to be implemented in accordance with the teachings of the present application in order that the same may be more clearly understood and to make the same and other objects, features and advantages of the present application more readily apparent.

Drawings

Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the application. Also, like reference numerals are used to designate like parts throughout the accompanying drawings. In the drawings:

FIG. 1 is a schematic view of a controller according to an embodiment of the present application;

FIG. 2 is an exploded schematic view of a controller provided by one embodiment of the present application;

FIG. 3 is a schematic diagram of a power module in a controller according to an embodiment of the present application;

FIG. 4 is a schematic diagram of another view angle structure of a controller according to an embodiment of the present application;

FIG. 5 is a cross-sectional view at A-A in FIG. 4;

FIG. 6 is a cross-sectional view at B-B in FIG. 4;

fig. 7 is an enlarged view at C in fig. 6;

FIG. 8 is a schematic view of a supporting structure in a controller according to an embodiment of the present application;

FIG. 9 is a schematic view of the assembly of a baffle on a support structure in a controller according to an embodiment of the present application;

FIG. 10 is a schematic view of a view angle structure of a flow guiding member in a controller according to an embodiment of the present application;

FIG. 11 is a schematic view of another view of a baffle in a controller according to an embodiment of the present application;

FIG. 12 is another perspective view of a support structure in a controller according to one embodiment of the present application;

FIG. 13 is a schematic illustration of an assembly of a mounting shell, a support structure, and a baffle in a controller according to one embodiment of the present application;

FIG. 14 is a second schematic view of the assembly of a mounting shell, support structure and baffle in a controller according to one embodiment of the present application;

FIG. 15 is a cross-sectional view taken at D-D in FIG. 14;

fig. 16 is an enlarged view at E in fig. 15;

FIG. 17 is a schematic view of a mounting case in a controller according to an embodiment of the present application;

Fig. 18 is a schematic view of another view of a mounting case in a controller according to an embodiment of the present application.

Reference numerals related to the above figures are as follows:

100. a power module; 110. a heat exchange fin; 120. a power assembly; 130. a heat exchange plate;

200. a support structure; 210. a mounting groove; 211. a mounting opening; 212. a transport opening; 2121-inlet; 2122. an outlet; 220. a heat exchange cavity; 230. a clamping groove;

300. a transport pipe; 310. sealing grooves;

400. a flow guide; 410. a buffer space; 420. a deflector aperture; 430. an annular convex column;

500. a mounting shell; 510. an avoidance groove;

610. a first seal; 620. a second seal;

700. a pipe joint;

z-a first direction; y-a second direction; x-third direction.

Detailed Description

In order to make the technical problems, technical schemes and beneficial effects to be solved more clear, the application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the application.

It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

It is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are merely for convenience in describing and simplifying the description based on the orientation or positional relationship shown in the drawings, and do not indicate or imply that the controllers or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the application.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In order to explain the technical scheme of the application, the following is a detailed description with reference to the specific drawings and embodiments.

In the related art, in the controller, in order to improve the radiating effect of power module, be provided with heat exchange structure generally, heat exchange structure has diapire and lateral wall, and diapire and lateral wall enclose to establish and form the heat transfer chamber, and heat exchange structure's lateral wall is provided with the opening, and heat exchange structure's lateral wall is connected with liquid pipeline, and liquid pipeline passes through heat exchange structure's opening and heat transfer chamber intercommunication, through liquid pipeline to heat transfer intracavity input heat transfer medium to and pass through liquid pipeline with heat transfer medium discharge. The power module stretches into the heat exchange cavity, and exchanges heat for the power module through a heat exchange medium in the heat exchange cavity. As the controller gradually develops toward miniaturization, integration and platformization, the internal structure of the controller needs to be more compact in layout, and the space utilization rate is increased, so that the miniaturization development of the controller is facilitated. The liquid pipeline occupies a large space in the controller, which is unfavorable for the miniaturization development of the controller.

In order to solve the problem that the liquid pipeline occupies a large space in the controller and is not beneficial to the miniaturization development of the controller, the application provides a controller which comprises a power module, a supporting structure and a transportation pipeline, wherein the supporting structure is provided with a mounting groove, a heat exchange cavity is formed between the mounting groove and the power module, the transportation pipeline is connected to the bottom wall of the mounting groove of the supporting structure, namely, a heat exchange medium enters the heat exchange cavity through a transportation opening of the bottom wall of the mounting groove. When the controller is placed to be a power module and located above the supporting structure, the bottom wall of the mounting groove is located in the lower area of the supporting structure, and at least part of the area of the transportation pipeline is located below the supporting structure due to the fact that the transportation opening communicated with the transportation pipeline is located in the bottom wall of the mounting groove, so that the extending length of the transportation pipeline along the horizontal direction is reduced under the condition that the total length of the transportation pipeline is fixed, the outer contour size of the controller can be reduced, and the miniaturized development of the controller can be conveniently realized.

As shown in fig. 1-7, one embodiment of the present application provides a controller including a power module 100, a support structure 200, and a transport conduit 300; the support structure 200 is provided with a mounting groove 210, the mounting groove 210 comprises a mounting opening 211, the power module 100 is covered at the mounting opening 211 along a first direction (Z direction), and a heat exchange cavity 220 for containing a heat exchange medium is formed between the power module 100 and the mounting groove 210; the transportation pipeline 300 is used for transporting the heat exchange medium, the installation groove 210 is also provided with a transportation opening 212, and the transportation pipeline 300 is communicated with the heat exchange cavity 220 through the transportation opening 212, so that the heat exchange medium can be transported between the transportation pipeline 300 and the heat exchange cavity 220; the transport opening 212 is located at the bottom wall of the mounting groove 210, and the transport pipe 300 extends in a second direction (Y direction) and communicates with the heat exchange chamber 220 in a first direction (Z direction), and the second direction (Y direction) intersects the first direction (Z direction).

The first direction (Z direction) is the thickness direction of the controller, i.e., the Z direction in fig. 1 and 2, and the second direction (Y direction) intersects the first direction (Z direction), i.e., the second direction (Y direction) is not parallel to the first direction (Z direction), or the second direction (Y direction) is inclined with respect to the first direction (Z direction). In fig. 1 and 2, the second direction (Y direction) is perpendicular to the first direction (Z direction), and in this embodiment, the angle between the first direction (Z direction) and the second direction (Y direction) is included as 90 °, and the angle between the first direction (Z direction) and the second direction (Y direction) is within a relatively small range adjacent to 90 °, such as 88 °, 89 °, 91 °, 92 °, and the like. It should be noted that the second direction (Y direction) may be any direction in a plane perpendicular to the first direction (Z direction), and in fig. 1 and 2, when the projection of the controller in the plane perpendicular to the first direction is square or similar to a square (e.g., rounded rectangle), the controller has a thickness direction along the first direction (Z direction), and a length direction and a width direction in the plane perpendicular to the first direction (Z direction), and a dimension of the controller in the length direction is larger than a dimension in the width direction. The second direction (Y direction) may be parallel to the length direction or the width direction of the controller, and for convenience of description, in the following embodiments, the second direction (Y direction) and the width direction of the controller are both described as parallel examples.

The power module 100 is a core component in a controller for providing energy conversion, control, such as an IGBT (Insulated Gate Bipolar Transistor ) module. In one possible embodiment, the power module 100 includes a power assembly 120 and a heat exchange plate 130, the power assembly 120 is mounted on the heat exchange plate 130, one side of the heat exchange plate 130 extends into the heat exchange cavity 220, and heat of the power assembly 120 is transferred to the heat exchange cavity 220 via the heat exchange plate 130 and is taken away by a heat exchange medium in the heat exchange cavity 220, so that a heat dissipation effect of the power assembly 120 is improved. One or more power modules 120 may be mounted on one heat exchange plate 130. In fig. 3, three power modules 120 are mounted on one heat exchange plate 130, and the three power modules 120 are spaced apart on the heat exchange plate 130. Heat dissipation can be achieved for three power assemblies 120 through the heat exchange plates 130 and the heat exchange cavities 220.

The support structure 200 is used to route the mounting slots 210, and the support structure 200 is used to support the power module 100. The supporting structure 200 may be manufactured from a plate-shaped material, a mounting groove 210 is formed in the supporting structure 200, the mounting groove 210 has a mounting opening 211, the mounting opening 211 is located at one side of the mounting groove 210 along the first direction (Z direction), the side of the mounting groove 210 opposite to the mounting opening 211 is called the bottom wall of the mounting groove 210, the side wall intersecting the bottom wall in the mounting groove 210 is the side wall, and a cavity is defined by the bottom wall and the side wall in the mounting groove 210. After the power structure is capped at the mounting opening 211, the cavity defined by the power structure, the bottom wall and the side wall of the mounting groove 210 is the heat exchange cavity 220. Other areas of the support structure 200 that are located at the periphery of the mounting slot 210 may also be used to mount other components within the controller.

The transport pipe 300 is communicated with the heat exchange cavity 220 through the transport opening 212, the heat exchange medium reaches the transport opening 212 through the transport pipe 300, and enters the heat exchange cavity 220 through the transport opening 212, and the heat exchange medium in the heat exchange cavity 220 enters the transport pipe 300 through the transport opening 212 and flows out through the transport pipe 300. The transport pipe 300 communicates the heat exchange chamber 220 with the outside so that the heat exchange medium in the heat exchange chamber 220 can be replaced or circulated.

The heat exchange medium is used for improving the heat dissipation efficiency of the power module 100. The heat exchange medium may be a low temperature medium, and absorbs heat of the power module 100 through a heat difference between the heat exchange medium and the power module 100, so that heat of the power module 100 is reduced. Alternatively, the heat exchange medium may be a medium with a large specific heat capacity, and a smaller flow rate may take away a larger amount of heat. The heat exchange medium may be a gas or a liquid. When the heat exchange medium is a liquid, the heat exchange medium may be water or other cooling liquid.

In the controller provided by the embodiment of the application, a heat exchange cavity 220 is formed between the support structure 200 and the power module 100, the transportation pipeline 300 is used for allowing a heat exchange medium to enter and exit the heat exchange cavity 220, and because the transportation pipeline 300 extends along the second direction (Y direction) and is communicated with the heat exchange cavity 220 along the first direction (Z direction), the heat exchange medium in the transportation pipeline 300 enters the heat exchange cavity 220 along the first direction (Z direction) from the transportation opening 212 of the bottom wall of the installation groove 210, and the heat exchange medium in the heat exchange cavity 220 enters the transportation pipeline 300 along the first direction (Z direction) from the transportation opening 212 of the bottom wall of the installation groove 210. In this arrangement, since the transport opening 212 is provided at the bottom wall of the installation groove 210, the transport duct 300 and the heat exchange chamber 220 at least partially overlap in the first direction (Z direction), and when the transport duct 300 is of a certain length, the transport duct 300 is relatively reduced in size in the second direction (Y direction), so that the controller can be relatively reduced in size in the second direction (Y direction).

As shown in fig. 4 and 5, fig. 4 is a top view of the controller along a first direction (Z direction), which is a direction perpendicular to the drawing sheet, and fig. 4 is a second direction (Y direction) parallel to the first direction (Z direction). Fig. 5 is a cross-sectional view of the controller of fig. 4, in which fig. 5 it can be seen that the flow direction of the heat exchange medium, as indicated by the dotted arrow in fig. 5, is moved a distance in the second direction (Y-direction) via the transport pipe 300 when the heat exchange medium is caused to flow into the heat exchange chamber 220, and then turned in the transport pipe 300 to move in the first direction (Z-direction) and enter the heat exchange chamber 220 from the transport opening 212. In the controller provided in the embodiment of the present application, if the bottom wall of the installation groove 210 is rectangular, that is, the installation groove 210 includes a long side and a short side, even if the transportation opening 212 is opened in a region of the bottom wall of the installation groove 210 near the middle of the short side (that is, the distance between the transportation opening 212 and the two long sides of the bottom wall of the installation groove 210 is equal or approximately equal), so as to improve the heat exchange effect, the transportation pipeline 300 does not need to extend along the long side direction, so that the extending direction of the transportation pipeline 300 is set according to the internal layout requirement of the controller, so that the avoidance of components installed in other controllers is facilitated, and the utilization rate of the internal space of the controller is improved.

To further improve the heat dissipation effect of the power module 100, in some embodiments, a heat exchange area is disposed on a surface of the power module 100 facing the mounting groove 210, and heat exchange fins 110 are disposed on the heat exchange area, where the heat exchange area of the power module 100 is increased and the area contacted with the heat exchange medium in the heat exchange cavity 220 is increased, thereby improving heat exchange efficiency. When the power module 100 includes the power assembly 120 and the heat exchange plate 130, the power assembly 120 is installed at one side of the heat exchange plate 130, and the heat exchange fins are installed at the other side of the heat exchange plate 130. The heat exchange fins may have a plate-like or column-like structure, and a plurality of heat exchange fins are arranged in an array on a side of the heat exchange plate 130 facing the mounting groove 210. A plurality of heat exchange fins 110 may be grouped, with one power assembly 120 disposed opposite a group of heat exchange fins 110. When the number of the power modules 120 mounted on the heat exchange plate 130 is three, three sets of heat exchange fins 110 are provided on the other side of the heat exchange plate 130. The projection of a set of heat exchange fins 110 onto heat exchange plate 130 is within the projection of its corresponding power assembly 120 onto heat exchange plate 130. The different heat exchange fins 110 in a set of heat exchange fins 110 may be the same size or may be different sizes.

In order to improve the sealing effect between the power module 100 and the support structure 200, in some embodiments, as shown in fig. 2 and 7, a second sealing member 620 is disposed between the power module 100 and the support structure 200, the second sealing member 620 is an annular structure, and the second sealing member 620 is disposed around the mounting opening 211, so as to prevent the medium between the heat exchange cavities 220 from flowing out through the gap between the power module 100 and the support structure 200. The second sealing member 620 may be a sealing ring, and the sealing ring may be made of elastic waterproof material such as rubber, silica gel, etc.

In some embodiments, as shown in fig. 4, the transport conduit 300 includes an input conduit and an output conduit, and as shown in fig. 8, the transport opening 212 includes an inlet 2121 communicating with the input conduit and an outlet 2122 communicating with the output conduit, the inlet 2121 and the outlet 2122 being located at respective ends of a bottom wall of the mounting groove 210 along a third direction (X-direction) intersecting the second direction (Y-direction), and a dimension of the heat exchange chamber 220 along the second direction (Y-direction) being smaller than a dimension of the heat exchange chamber 220 along the third direction (X-direction).

The input pipeline is used for conveying the heat exchange medium into the heat exchange cavity 220, and the output pipeline is used for discharging the heat exchange medium in the heat exchange cavity 220. Because the transportation pipeline 300 comprises the input pipeline and the output pipeline, the installation groove 210 is respectively communicated with the input pipeline and the output pipeline, so that the heat exchange medium in the heat exchange cavity 220 can conveniently realize circulating flow through the input pipeline and the output pipeline, and new heat exchange medium can be facilitated to continuously enter the heat exchange cavity 220, so that the flow speed of the heat exchange medium in the heat exchange cavity 220 is improved, and the heat dissipation effect is improved. The direction of extension of the inlet and outlet pipes may be the same or different.

The third direction (X-direction) intersects the second direction (Y-direction), i.e. the third direction (X-direction) is inclined relative to the second direction (Y-direction), e.g. the third direction (X-direction) is relatively perpendicular to the second direction (Y-direction). As shown in fig. 4 and 5, in one possible embodiment, the third direction (X-direction) and the second direction (Y-direction) are both directions parallel to the bottom wall of the mounting groove 210, and the first direction (Z-direction) is a direction perpendicular to the bottom wall of the mounting groove 210. When the bottom wall of the mounting groove 210 is rectangular, the second direction (Y direction) may be a width direction of the mounting groove 210, and the third direction (X direction) may be a length direction of the mounting groove 210.

Since the outlet 2122 and the inlet 2121 are installed on two sides of the bottom wall of the installation groove 210 in a relatively larger dimension, the heat exchange medium flows in the direction of the outlet 2122 after entering the heat exchange cavity 220 through the inlet 2121, and gradually flows in the second direction (Y direction) during moving in the third direction (X direction), and the heat exchange cavity 220 is smaller in the second direction (Y direction) than the heat exchange cavity 220 in the third direction (X direction), so that the heat exchange medium flows to a higher speed in contact with two inner walls of the heat exchange cavity in the second direction (Y direction), and dead angles generated by the heat exchange medium in the heat exchange cavity 220 are smaller, namely the heat exchange medium flows in the heat exchange cavity 220 with higher uniformity and better heat dissipation effect.

In forming the mounting slots 210 in the support structure 200, the following may be used: the method comprises the steps of obtaining a plate-shaped material, penetrating the plate-shaped material along a first direction (Z direction), arranging a through hole in the plate-shaped material, connecting a bottom plate to one end of the through hole along the first direction (Z direction), wherein the thickness of the bottom plate is smaller than that of the plate-shaped material, gaps exist between the bottom plate and two sides of the through hole along a third direction (X direction), in the arrangement mode, an installation groove 210 is formed by surrounding the inner walls of the bottom plate and the through hole, and an inlet 2121 and an outlet 2122 are respectively formed on two sides of the bottom plate. One side wall of the bottom plate is the bottom wall of the mounting groove 210. Alternatively, the following means may be employed: the plate-like material is obtained, a groove is dug in one side of the plate-like material, the depth of the groove is smaller than the thickness of the plate-like material, through holes are provided in both ends in the third direction (X direction) of the groove, and thus an inlet 2121 and an outlet 2122 are formed, and the groove is the mounting groove 210.

In this arrangement, the heat exchange medium enters the heat exchange chamber 220 at the inlet 2121, flows from the inlet 2121 to the outlet 2122 in the heat exchange chamber 220, and finally flows out of the heat exchange chamber 220 from the outlet 2122, and since the inlet 2121 and the outlet 2122 are respectively located at two ends of the bottom wall of the mounting groove 210 along the third direction (X direction), and the dimension of the heat exchange chamber 220 along the third direction (X direction) is larger than the dimension along the second direction (Y direction), the uniformity of the flow of the heat exchange medium in the heat exchange chamber 220 is larger, and the heat exchange effect is better.

In some embodiments, at least one of the inlet 2121 and the outlet 2122 is centered in the second direction (Y-direction) at the bottom wall of the mounting groove 210. That is, only the inlet 2121 may be arranged centrally in the second direction (Y direction) at the bottom wall of the mounting groove 210, only the outlet 2122 may be arranged centrally in the second direction (Y direction) at the bottom wall of the mounting groove 210, or the inlet 2121 and the outlet 2122 may be arranged centrally in the second direction (Y direction) at the bottom wall of the mounting groove 210, respectively. Taking the inlet 2121 as an example, the fact that the inlet 2121 is centrally disposed in the second direction (Y direction) on the bottom wall of the mounting groove 210 means that the center point of the inlet 2121 is equal or approximately equal to the distance between the two side edges of the bottom wall of the mounting groove 210 in the second direction (Y direction). In this arrangement, the heat exchange medium flows relatively more uniformly in the heat exchange chamber 220, and the heat dissipation effect is better.

As shown in fig. 2, 7, 9-11, in some embodiments, the controller further includes a baffle 400, the baffle 400 being mounted between the transport conduit 300 and the support structure 200, the transport conduit 300 being in communication with the transport opening 212 through the baffle 400. The flow guide 400 is used to provide a buffer space 410 for the heat exchange medium, so as to change the flow direction of the heat exchange medium, so as to improve the flow uniformity of the heat exchange medium after entering the transportation opening 212. The flow guide 400 may be fixedly connected with the transport pipe 300, or the flow guide 400 may be fixedly connected with the support structure 200. Illustratively, the flow guide 400 and the supporting structure 200 may be connected by welding (e.g., friction stir welding or laser welding, etc.), and the flow guide 400 is inserted into the transportation pipeline 300. As shown in fig. 12, in order to facilitate installation of the guide member 400, a clamping groove 230 is provided on a side of the support structure 200 away from the power module 100, the shape of the clamping groove 230 matches with the shape of the outer contour of the guide member 400, and a partial region of the guide member 400 extends into the clamping groove 230, thereby achieving initial positioning of the guide member 400 and the support structure 200. In this arrangement, the flow guide 400 is provided to facilitate the flow of heat exchange medium between the transport conduit 300 and the heat exchange chamber 220.

In some embodiments, the baffle 400 is provided with a baffle hole 420, the baffle hole 420 is in communication with the transport conduit 300, the baffle 400 is provided with a buffer space 410, and the buffer space 410 is in communication with the baffle hole 420 and the transport opening 212, respectively.

The deflector aperture 420 is used to communicate the transport opening 212 of the heat exchange chamber 220 with the transport conduit 300. When the transport opening 212 includes an inlet 2121 and an outlet 2122, in one embodiment, the number of the flow guiding members 400 is one, and the number of the flow guiding holes 420 on the flow guiding members 400 is two, and the two flow guiding holes 420 are respectively communicated with the inlet 2121 and the outlet 2122 in a one-to-one correspondence manner. In another embodiment, the number of baffle members 400 is two, one baffle member 400 includes one baffle hole 420, one baffle hole 420 is respectively communicated with the inlet 2121 and the input pipe, and the other baffle hole 420 is respectively communicated with the outlet 2122 and the output pipe. The heat exchange medium in the input pipe enters the inlet 2121 through the diversion hole 420 to flow into the heat exchange cavity 220, and the heat exchange medium in the heat exchange cavity 220 flows into the output pipe through the other diversion hole 420 after exiting the outlet 2122.

The buffer space 410 is used for providing a short residence space for the heat exchange medium, so that the heat exchange medium is accumulated in the buffer space 410 to a certain extent. Since the use of a general-sized pipe as the transport pipe 300 facilitates the manufacturing process, the size of the transport pipe 300 may be limited to a relatively small size. In addition, since the relatively smaller inner diameter dimension of the transport pipe 300 facilitates higher pressure and higher velocity medium flow, the inner diameter dimension of the transport pipe 300 is generally smaller than the edge dimensions of both sides of the bottom wall of the installation groove 210 in the third direction (X direction). For example, the bottom wall of the mounting slot 210 is rectangular or generally rectangular in shape. The bottom wall of the mounting groove 210 has two long sides and two short sides, the length of the short sides is smaller than that of the long sides, the long sides are oppositely arranged along the third direction (X direction), and the short sides are oppositely arranged along the second direction (Y direction). The inner diameter of the transport pipe 300 is smaller than the length of the short side. After the flow guide member 400 is arranged, the size of the transportation opening 212 can be increased, and the flow guide hole 420 of the flow guide member 400 is communicated with the transportation pipeline 300, the inner diameter of the flow guide hole 420 is the same as or similar to the inner diameter of the transportation pipeline 300, the buffer space 410 is positioned between the flow guide hole 420 and the transportation opening 212, and the heat exchange medium is guided, so that the heat exchange medium can flow into the buffer space 410 through the smaller flow guide hole 420 and accumulate a certain amount, and can flow into the heat exchange cavity 220 through the transportation opening 212 with a relatively larger size. The buffer space 410 is used to guide the heat exchange medium in the direction of the transport pipe 300 when the heat exchange medium in the heat exchange chamber 220 flows in the direction of the transport pipe 300.

In one embodiment, in the second direction (Y-direction), the transport opening 212 is the same size as or similar to the size of the mounting slot 210, and the aperture of the deflector aperture 420 is smaller than the size of the transport opening 212. When the buffer space 410 is provided, the flow guiding hole 420 may be disposed at a central position of a region close to the short side of the bottom wall of the installation groove 210 (i.e., the flow guiding hole 420 is disposed centrally with respect to the installation groove 210 along the second direction (Y direction)), or may be disposed at a non-central position, and only the region where the buffer space 410 is engaged with the installation groove 210 is disposed centrally with respect to the installation groove 210 along the second direction (Y direction), so that the flow of the heat exchange medium in the heat exchange cavity 220 may be more uniform.

As shown in fig. 13, in some embodiments, the largest dimension of the buffer space 410 in the first direction (Z-direction) is greater than the largest dimension of the heat exchange cavity 220 in the first direction (Z-direction). When the controller is placed to the bottom wall of the installation groove 210 below the heat exchange cavity 220, the depth of the buffer space 410 is greater than the depth of the heat exchange cavity 220, or the plane of the lowest position of the bottom wall of the buffer space 410 is below the plane of the lowest position of the bottom wall of the installation groove 210. Fig. 14 is an assembly schematic view of the flow guiding member 400, the transportation channel and the supporting structure 200, fig. 15 is a sectional view along the direction D-D in fig. 14, fig. 16 is an enlarged view along the direction E in fig. 15, and as shown in fig. 16, taking the bottom wall of the buffer space 410 being parallel to the bottom wall of the mounting groove 210 as an example, the distance between the bottom wall of the buffer space 410 and the bottom wall of the mounting groove 210 in the first direction (Z direction) is L, so that the accumulation depth of the heat exchange medium in the buffer space 410 does not flow into the heat exchange cavity 220 when the accumulation depth is smaller than L, thereby realizing buffer storage of the heat exchange medium.

In some embodiments, the area of the cross-section of the buffer space 410 perpendicular to the first direction (Z-direction) gradually increases from one end near the transport pipe 300 toward one end near the transport opening 212. Illustratively, in one possible embodiment, the bottom wall of the buffer space 410 is a sloping surface that is disposed obliquely with respect to the first direction (Z-direction).

In this arrangement, in the first direction (Z direction), the volume of the buffer space 410 near the transportation pipe 300 is relatively small, and the volume near one end of the transportation opening 212 is relatively large, that is, the storage amount of the heat exchange medium near one side of the transportation pipe 300 is relatively small, and the storage amount of the heat exchange medium near one side of the transportation opening 212 is relatively large in the first direction (Z direction), so that the heat exchange medium in the buffer space 410 can be quickly moved in the first direction (Z direction) in the buffer space 410, so that the heat exchange medium in the buffer space 410 can be more quickly accumulated and flow into the heat exchange cavity 220, and the buffer space 410 plays a role of guiding and buffering between the transportation pipe 300 and the transportation opening 212.

In some embodiments, the surface of the power module 100 facing the mounting groove 210 is provided with a heat exchanging region, the heat exchanging region is provided with heat exchanging fins 110, and the projection is projected along the first direction (Z direction), and the buffer space 410 is at least partially projected outside the projection of the heat exchanging region along the third direction (X direction). The arrangement is such that the relative area between the heat exchange area and the buffer space 410 is reduced, so that more area of the heat exchange area is located in the heat exchange cavity 220, so as to dissipate heat for the heat exchange area through the heat exchange medium in the heat exchange cavity 220.

In some embodiments, the area of the cross section of the buffer space 410 perpendicular to the third direction (X-direction) gradually increases in a direction approaching the heat exchange area. The deflector hole 420 is disposed at a side of the buffer space 410 away from the heat exchange area, such that the heat exchange medium entering the buffer space 410 through the deflector hole 420 moves toward the heat exchange area on one side during accumulation of the buffer space 410, and the heat exchange medium gradually increases in area of a cross section perpendicular to the third direction (X direction) during movement of the heat exchange medium toward the heat exchange area on the other side. Illustratively, the size of the buffer space 410 in the second direction (Y-direction) gradually increases in a direction approaching the heat exchange area. So set up, after heat transfer medium gets into the heat transfer chamber, when removing along third direction (X), heat transfer medium also flows along second direction (Y), because buffer memory space 410 is great relatively in the size of second direction (Y), thereby make when heat transfer medium just gets into the heat transfer chamber, the heat transfer medium is nearer relatively with the distance between the inner wall of heat transfer chamber in second direction (Y), so that heat transfer medium flows fast to the inner wall contact with heat transfer chamber in second direction (Y), reduce the dead angle area of heat transfer medium in the heat transfer chamber, improve the flow uniformity of heat transfer medium in the heat transfer chamber, improve the heat transfer effect.

In one embodiment, the size of the buffer space 410 in the second direction (Y direction) gradually increases from the side where the deflector hole 420 is provided to the side near the transport opening 212, and in the second direction (Y direction), the size of the buffer space 410 at the side near the transport opening 212 is the same as the size of the transport opening 212, and the size of the transport opening 212 is the same as the size of the installation groove 210. In this arrangement, when the heat exchange medium flows to the heat exchange cavity 220 through the buffer space 410, the heat exchange medium covers the entire heat exchange cavity 220 in the second direction (Y direction), so that the contact area between the heat exchange medium and the heat exchange area in the second direction (Y direction) is increased, and the heat dissipation efficiency is improved. In this arrangement, since the buffer space 410 is provided, the flow guide hole 420 may not be limited to be provided in the middle in the second direction (Y direction) and may also achieve uniform flow of the heat exchange medium in the heat exchange chamber 220. In the second direction (Y direction), the flow guiding holes 420 may be disposed at any position of the buffer space 410.

In some embodiments, as shown in fig. 13, 14, 17 and 18, the controller further includes a mounting case 500, and the mounting case 500 is used to construct an internal space of the controller to provide a receiving space for the internal structure of the controller. The installation housing 500 and the transport pipe 300 may be integrally or separately constructed. For example, in one embodiment, the installation shell 500 and the transportation pipeline 300 are in a split structure, the transportation pipeline 300 is installed in the inner cavity of the installation shell 500, and the transportation pipeline 300 and the installation shell 500 can be fixedly connected or detachably connected. For example, the transportation pipe 300 and the installation case 500 may be connected by welding, gluing, or the like, or may be connected by auxiliary connectors such as bolts, clips, or the like.

In another embodiment, the mounting case 500 is integrally formed with the transport duct 300, and the mounting case 500 is illustratively formed with the transport duct 300, and the support structure 200 is coupled to the mounting case 500 in a first direction (Z direction) such that the transport duct 300 is abutted to the transport opening 212. The transport pipe 300 and the mounting case 500 may be die-cast. In this arrangement, the installation housing 500 is integrated with the transport pipe 300 into a single structure, so that the integration level is high, and the assembly steps are reduced. The support structure 200 and the mounting case 500 may be coupled by bolts.

In some embodiments, the controller further includes a pipe joint 700, the inner cavity of the transportation pipe 300 penetrates through one side wall of the installation case 500, the pipe joint 700 is provided at the outer side of the installation case 500, and one end of the pipe joint 700 protrudes into the transportation pipe 300. The pipe joint 700 is used to connect external pipes, valves or other equipment interfaces to facilitate the entry of heat exchange medium into the transport pipe 300 or the exit thereof via the transport pipe 300.

As shown in fig. 17, a relief groove 510 may be provided on the outside of the mounting case 500 for relieving other structures mounted on the outside of the mounting case 500.

In some embodiments, as shown in fig. 16, when the controller includes the flow guide 400, the controller further includes a first seal 610, and the transport pipe 300 is sealingly connected to the flow guide 400 by the first seal 610. The first sealing member 610 serves to seal between the transport pipe 300 and the flow guide 400 to prevent the heat exchange medium from flowing out through the gap between the transport pipe 300 and the flow guide 400. In this arrangement, the first seal 610 may be provided to enhance the sealing effect between the transport conduit 300 and the baffle 400. The first sealing member 610 may be a sealing ring, such as an O-ring or V-ring, and the first sealing member 610 may be made of an elastic waterproof material such as rubber or silica gel. The first sealing member 610 may be first assembled to the transport pipe 300 between the transport pipe 300 and the flow guide 400 during the assembly of the transport pipe 300 and the flow guide 400, or may be first assembled to the flow guide 400 between the transport pipe 300 and the flow guide 400 after the assembly of the flow guide 400 to the transport pipe 300.

In some embodiments, as shown in fig. 7 and 11, an end of the transport pipe 300 facing the flow guide 400 is provided with an annular groove, the flow guide 400 is provided with an annular protrusion 430, the annular protrusion 430 protrudes into the annular groove, and the first sealing member 610 is interposed between a sidewall of the annular groove and a sidewall of the annular protrusion 430. When the first sealing member 610 is a sealing ring, the first sealing member 610 may be sleeved outside the annular protrusion 430, or the first sealing member 610 may be embedded in a side wall of the annular groove, when the flow guiding member 400 is assembled to the transportation pipeline 300, the annular protrusion 430 of the flow guiding member 400 extends into the annular groove, and a certain gap is formed between an outer side surface of the annular protrusion 430 and the side wall of the annular groove, so that an annular gap is formed between the annular protrusion 430 and the annular groove, and the first sealing member 610 is installed in the annular gap. The distance between the outer side surface of the annular convex column 430 and the side wall of the annular groove is slightly smaller than the wall thickness of the first sealing element 610, so that the first sealing element 610 is in a compressed state between the annular convex column 430 and the annular groove, and the sealing effect is better. The annular protrusion 430 is fitted with the annular groove to provide a radial relative limit between the transportation pipe 300 and the flow guide 400, and the first seal 610 is conveniently installed by the first annular protrusion 430 being fitted with the annular groove.

In a specific implementation manner of this embodiment, the controller includes a mounting case 500, a power module 100, a supporting structure 200, a transportation pipe 300 and a flow guiding member 400, where the mounting case 500 has a receiving space, the mounting case 500 and the transportation pipe 300 are integrally formed into an integral structure, and the supporting structure 200 is installed in the receiving space of the mounting case 500. The supporting structure 200 is provided with a mounting groove 210, the mounting groove 210 is provided with a mounting opening 211, one side of the mounting groove 210 opposite to the mounting opening 211 is a bottom wall, the power module 100 is provided with a heat exchange area, the heat exchange area is provided with heat exchange fins 110, the power module 100 is buckled on the supporting structure 200, the power module 100 and the supporting structure 200 are sealed through a second sealing piece 620, a heat exchange cavity 220 is formed by surrounding the power module 100 and the inner wall of the mounting groove 210 of the supporting structure 200, and the heat exchange fins 110 extend into the heat exchange cavity 220. The support structure 200 has two transport openings 212, one inlet 2121 and the other outlet 2122. The mounting groove 210 is a rectangular groove, the depth direction of the mounting groove 210 is a first direction (Z direction), the mounting opening 211 is provided opposite to the bottom wall of the mounting groove 210 in the first direction (Z direction), the mounting groove 210 has a length direction and a width direction in a plane perpendicular to the first direction (Z direction), and the length direction of the mounting groove is greater than the width direction. The second direction (Y direction) is parallel to the width direction, and the third direction (X direction) is parallel to the length direction. The outlet 2122 and the inlet 2121 are provided at both ends of the bottom wall of the mounting groove 210 in the third direction (X direction), the outlet 2122 and the inlet 2121 are rectangular, and in the second direction (Y direction), the size of the outlet 2122 and the size of the inlet 2121 are equal to the size of the bottom wall of the mounting groove 210. When the heat exchange fins 110 on the power module 100 are distributed in an array, in the third direction (X direction), the size of the heat exchange fin 110 is n1, the interval between two adjacent heat exchange fins is n2, the sum of n1 and n2 is s, and the size of the outlet 2122 and the size of the inlet 2121 are both greater than or equal to s.

The flow guide 400 has a flow guide hole 420 and a buffer space 410, and the flow guide hole 420 is communicated with the buffer space 410. The buffer space 410 communicates with the transport opening 212, and the diversion holes 420 communicate with the transport conduit 300. The area of the buffer space 410 in a cross section perpendicular to the first direction gradually increases from one end near the transport duct 300 to one end near the transport opening 212. Also, the area of the cross section of the buffer space 410 perpendicular to the third direction gradually increases from the side away from the transport opening 212 to the side closer to the transport opening 212. When the projection is along the first direction, the area of the cross section of the buffer space 410 perpendicular to the third direction increases gradually from the side far from the heat exchange area to the side near to the heat exchange area when the projection of the buffer space 410 is at least partially projected to the outside of the projection of the heat exchange area along the third direction.

The number of the flow guiding elements 400 is two, the two flow guiding elements 400 are fixedly connected with the supporting structure 200, the buffer space 410 of one flow guiding element 400 is communicated with the inlet 2121, the flow guiding hole 420 of the flow guiding element 400 is communicated with one of the transportation pipelines 300, and the flow guiding element 400 and the transportation pipeline 300 are sealed through the first sealing element 610. The buffer space 410 of the other baffle 400 communicates with the outlet 2122, the baffle hole 420 of the other baffle 400 communicates with the other transport pipe 300, and the space between the other baffle 400 and the other transport pipe 300 is sealed by the other first seal 610.

In the controller provided in this embodiment, since the transport pipe 300 is connected to the bottom wall of the installation groove through the flow guide 400, the transport pipe 300 and the heat exchange chamber 220 are at least partially overlapped in the first direction (Z direction), and when the transport pipe 300 is of a certain length, the transport pipe 300 is relatively reduced in size in the second direction (Y direction), so that the controller can be relatively reduced in size in the second direction (Y direction), thereby enabling further miniaturization development of the controller. Since the dimensions of the outlet 2122 and the inlet 2121 are equal to the dimensions of the bottom wall of the mounting groove 210 in the second direction (Y direction), after the heat exchange medium enters the heat exchange cavity through the inlet 2121, the heat exchange medium directly contacts with the side walls of the two sides of the heat exchange cavity 220 in the second direction (Y direction), that is, the heat exchange medium does not need to move in the second direction (Y direction) but only moves in the third direction (X direction), and no dead angle (dead angle is an area where the heat exchange medium cannot flow) is almost present in the heat exchange cavity 220, so that the uniformity of the heat exchange medium in the heat exchange cavity 220 is improved, and the heat exchange effect is improved. Since the size of the outlet 2122 and the size of the inlet 2121 are both greater than or equal to s in the third direction (X direction), the influence of the resistance of the heat exchange fin 110 can be reduced when the heat exchange medium flows in the third direction (X direction), and the flow speed of the heat exchange medium in the third direction (X direction) can be increased, thereby improving the heat exchange effect. In summary, the controller provided in this embodiment has better heat exchange effect on the basis of meeting the miniaturization development requirement.

The embodiment of the application also provides an electric device, which comprises the controller provided by the technical scheme.

The powered device may be, but is not limited to, an electric toy with a controller, an electric tool, a battery car, an electric car, a ship, a spacecraft, etc. Among them, electric toys may include electric car toys, electric ship toys, electric plane toys, and the like, and spacecraft may include planes, rockets, space planes, and spacecraft, and the like.

For convenience of description, the following embodiments will take an electric device according to some embodiments of the present application as an electric vehicle.

The electric automobile includes a motor including a controller.

In one embodiment, the motor further comprises a motor housing, and the controller is mounted within the motor housing.

In another embodiment, the motor further includes a motor housing, and the mounting housing 500 of the controller is integrated with the motor housing into a unitary structure.

In some embodiments, the electric vehicle further includes a gearbox reducer, drive wheels, and axle shafts for transferring torque between the gearbox reducer and the drive wheels. The mounting shell 500 of the controller is provided with an avoidance groove 510, the structural shape of the avoidance groove 510 is matched with the structural shape of the upper region of the half shaft, the controller is mounted above the half shaft, and the upper region of the half shaft passes through the avoidance groove 510 of the mounting shell 500. So configured, the total footprint of the controller and axle half is reduced in the first direction (Z-direction), thereby reducing the size of the controller in the first direction (Z-direction).

The above description is illustrative of the various embodiments of the application and is not intended to be limiting, but is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the application.

Claims

1. A controller, comprising:

a power module;

2. The controller of claim 1, wherein the transport conduit comprises an input conduit and an output conduit, the transport opening comprises an inlet in communication with the input conduit and an outlet in communication with the output conduit, the inlet and the outlet are respectively located at both ends of a bottom wall of the mounting slot along a third direction, the third direction intersecting the second direction, and a dimension of the heat exchange chamber along the second direction is less than a dimension of the heat exchange chamber along the third direction.

3. The controller of claim 2, wherein at least one of the inlet and the outlet is centrally disposed in the second direction at the mounting slot bottom wall.

4. The controller of claim 2, further comprising a baffle mounted between the transport conduit and the support structure, the transport conduit communicating with the transport opening through the baffle.

5. The controller of claim 4, wherein the deflector is provided with a deflector aperture in communication with the transport conduit, the deflector being provided with a buffer space in communication with the deflector aperture and the transport opening, respectively.

6. The controller of claim 5, wherein a maximum dimension of the buffer space in the first direction is greater than a maximum dimension of the heat exchange chamber in the first direction.

7. The controller of claim 5, wherein the area of the cross-section of the buffer space perpendicular to the first direction increases gradually from an end near the transport conduit toward an end near the transport opening.

8. The controller of claim 5, wherein a surface of the power module facing the mounting groove is provided with a heat exchanging region, the heat exchanging region is provided with heat exchanging fins, the heat exchanging region is projected in the first direction, and the buffer space is at least partially projected outside the projection of the heat exchanging region in the third direction.

9. The controller of claim 8, wherein the area of a cross section of the buffer space perpendicular to the third direction increases gradually in a direction approaching the heat exchange area.

10. The controller of any one of claims 1-9, further comprising a mounting shell formed with the transport conduit, the support structure being connected to the mounting shell in the first direction to interface the transport conduit with the transport opening.

11. The controller of claim 10, further comprising a baffle of claim 4, the controller further comprising a first seal, the transport conduit being sealingly connected to the baffle by the first seal.

12. The controller of claim 11, wherein an annular groove is provided in an end of the transport conduit facing the flow guide member, the flow guide member is provided with an annular projection extending into the annular groove, and the first seal is sandwiched between a sidewall of the annular groove and a sidewall of the annular projection.

13. An electrical device comprising a controller as claimed in any one of claims 1 to 12.