CN219676948U - Soft coupling mechanism with heat dissipation mechanism - Google Patents
Soft coupling mechanism with heat dissipation mechanism Download PDFInfo
- Publication number
- CN219676948U CN219676948U CN202223579467.5U CN202223579467U CN219676948U CN 219676948 U CN219676948 U CN 219676948U CN 202223579467 U CN202223579467 U CN 202223579467U CN 219676948 U CN219676948 U CN 219676948U
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- CN
- China
- Prior art keywords
- flexible
- flexible connection
- connecting plate
- heat dissipation
- fixedly connected
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 24
- 230000007246 mechanism Effects 0.000 title claims abstract description 22
- 230000008878 coupling Effects 0.000 title claims description 16
- 238000010168 coupling process Methods 0.000 title claims description 16
- 238000005859 coupling reaction Methods 0.000 title claims description 16
- 239000004065 semiconductor Substances 0.000 claims abstract description 28
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 17
- 239000000741 silica gel Substances 0.000 claims abstract description 17
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 28
- 229910052802 copper Inorganic materials 0.000 claims description 16
- 239000010949 copper Substances 0.000 claims description 16
- 239000011889 copper foil Substances 0.000 claims description 11
- 238000005057 refrigeration Methods 0.000 claims description 10
- 239000005030 aluminium foil Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 abstract description 13
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 13
- 238000005452 bending Methods 0.000 abstract description 12
- 239000011888 foil Substances 0.000 abstract description 12
- 238000009434 installation Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 5
- 238000007254 oxidation reaction Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005253 cladding Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003137 locomotive effect Effects 0.000 description 1
- 238000005272 metallurgy Methods 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a flexible connection mechanism with a heat dissipation mechanism, which comprises a flexible connection main body, wherein the top of the flexible connection main body is fixedly connected with a top arc bending piece, one side of the top arc bending piece is fixedly connected with a top connecting plate, the bottom of the flexible connection main body is fixedly connected with a bottom arc bending piece, one side of the bottom arc bending piece is fixedly connected with a bottom connecting plate, the flexible connection main body comprises a flexible connection part, the surface of the flexible connection part is coated with a heat conduction silica gel layer, the surface of the heat conduction silica gel layer is coated with a heat conduction aluminum foil layer, two sides of the heat conduction aluminum foil layer are fixedly provided with flexible semiconductor refrigerating sheets, one side of each flexible semiconductor refrigerating sheet is fixedly connected with a plurality of heat dissipation fins at equal intervals, and heat dissipation gaps are formed between two adjacent heat dissipation fins.
Description
Technical Field
The utility model relates to the technical field of soft connecting mechanisms, in particular to a soft connecting mechanism with a heat dissipation mechanism.
Background
The soft connection of the copper bar soft connection tinned copper braided wire is made by a cold pressing method by adopting bare copper wires or tinned copper braided wires (stranded wires) which are suitable for soft connection of various high-voltage electrical appliances, vacuum electrical appliances, mining explosion-proof switches, automobiles, locomotives and other related products. The bonding surface of the copper bar flexible connection is formed by one-time welding by adopting a molecular diffusion welding technology, and the copper bar flexible connection has the characteristics of good product quality, strong conductivity, large bearing current, small resistance value, durability and the like. The method is widely applied to metallurgy (such as electrolytic aluminum, electrolytic zinc and electrolytic copper), chemical industry (such as electroplating), wheel transformation engineering (such as power plant power station), and power equipment (such as transformers and power distribution cabinets).
The prior published Chinese utility model patent has the following patent publication number: CN210607446U, a flexible connection structure of a bent safety copper bar, comprising a flexible connection main body, wherein the flexible connection main body is formed by stacking multiple layers of copper foils, the flexible connection main body comprises a first installation part, the right end of the first installation part is bent downwards to form a connection part, the lower end of the connection part is bent rightwards to form a second installation part, the first installation part is connected with the connection part through a first arc part, the connection part is connected with the second installation part through a second arc part, the first installation part and the second installation part are respectively formed with an installation hole, and the second installation part is positioned at the rear lower part of the first installation part; the first installation part, the first arc part, the second arc part and the second installation part are all arranged as welding areas, the connecting part is arranged as a separation area, and the front lower end and the rear upper end of the connecting part are respectively provided with a first round angle. The utility model aims to provide a bending type safe copper bar flexible connection structure which greatly reduces the possibility of the puncture of a plastic heat shrinkage sleeve and is beneficial to improving the use safety.
The copper bar flexible connection can generate more heat in the use process, the copper foil strips are of a laminated structure, the heat dissipation capacity is poor, the flexible connection main body is directly exposed in the air, and the flexible connection main body and the moist air generate oxidation reaction to easily cause corrosion damage of the flexible connection main body.
Disclosure of Invention
The utility model aims to provide a flexible connection mechanism with a heat dissipation mechanism, which solves the problems that the copper bar flexible connection provided in the background art can generate more heat in the use process, the copper foil strips are of a laminated structure, the heat dissipation capability is poor, the flexible connection main body is directly exposed in the air, and the flexible connection main body and the moist air are subjected to oxidation reaction, so that the flexible connection main body is easy to corrode and damage.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a flexible coupling mechanism with cooling mechanism, includes the flexible coupling main part, the top fixedly connected with top arc piece of buckling of flexible coupling main part, one side fixedly connected with top connecting plate of buckling of top arc piece, the bottom fixedly connected with bottom arc piece of buckling of flexible coupling main part, one side fixedly connected with bottom connecting plate of buckling of bottom arc piece, the flexible coupling main part includes flexible coupling portion, the surface coating of flexible coupling portion has the heat conduction silica gel layer, the surface coating of heat conduction silica gel layer has the heat conduction aluminium foil layer, the equal fixed mounting in both sides on heat conduction aluminium foil layer has flexible semiconductor refrigeration piece, one side equidistance fixedly connected with a plurality of radiating fins of flexible semiconductor refrigeration piece, fixed mounting has temperature detect switch between heat conduction silica gel layer and the heat conduction aluminium foil layer, encloses into the heat dissipation gap between two adjacent radiating fins.
Preferably, the flexible connection part comprises a plurality of copper foils, and a plurality of copper foils are stacked to form the flexible connection part capable of conducting bending.
Preferably, a top connecting hole is formed in the surface of the top connecting plate, and an inner cavity of the top connecting hole is rotationally connected with a top rotating sleeve for being connected with an external device.
Preferably, the bottom connecting holes are formed in the two ends of the surface of the bottom connecting plate, and the inner cavity of each bottom connecting hole is rotationally connected with a bottom rotating sleeve for being connected with an external device.
Preferably, the flexible semiconductor refrigeration sheet is electrically connected with an external power supply through a temperature control switch, and the flexible semiconductor refrigeration sheet is subjected to switch control.
Preferably, the top connecting plate and the bottom connecting plate are made of metal copper materials, and the corners of the top connecting plate and the corners of the bottom connecting plate are provided with rounded corners.
Compared with the prior art, the utility model has the beneficial effects that:
(1) The heat generated in the process of conducting electricity of the flexible connection part is conducted to the refrigerating end of the flexible semiconductor refrigerating sheet through the heat conducting silica gel layer and the heat conducting aluminum foil layer, the temperature control switch controls the flexible semiconductor refrigerating sheet to work, at the moment, the refrigerating end of the flexible semiconductor refrigerating sheet and the heat conducting aluminum foil layer perform cold and heat replacement, so that the flexible connection part is cooled, and the heat of the heating end of the flexible semiconductor refrigerating sheet performs cold and heat replacement with external air through the radiating fins, so that the purpose of circulating heat dissipation is achieved;
(2) Through the surface cladding heat conduction silica gel layer at the soft connecting portion to isolate the surface of soft connecting portion with outside moist air, reduce the possibility that soft connecting portion outside air contact takes place oxidation reaction, improve the life of soft connecting portion.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a cross-sectional view of the flexible connection body of the present utility model;
FIG. 3 is an enlarged view of section A of the present utility model;
fig. 4 is a partial cross-sectional view of a flexible connection unit of the present utility model.
In the figure: 1. a flexible connecting body; 2. a top arc bending piece; 3. a top connection plate; 4. a bottom arc bending piece; 5. a bottom connecting plate; 6. a flexible connection part; 7. a thermally conductive silicone layer; 8. a thermally conductive aluminum foil layer; 9. a flexible semiconductor refrigeration sheet; 10. a heat radiation fin; 11. a temperature control switch; 12. copper foil; 13. a top connection hole; 14. a top rotating sleeve; 15. a bottom connecting hole; 16. a bottom rotating sleeve; 17. a heat dissipation slit; 18. and (5) chamfering.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-4, the utility model provides a flexible connection mechanism with a heat dissipation mechanism, which comprises a flexible connection main body 1, wherein a top arc bending piece 2 is fixedly connected to the top of the flexible connection main body 1, a top connecting plate 3 is fixedly connected to one side of the top arc bending piece 2, a bottom arc bending piece 4 is fixedly connected to the bottom of the flexible connection main body 1, a bottom connecting plate 5 is fixedly connected to one side of the bottom arc bending piece 4, the flexible connection main body 1 comprises a flexible connection part 6, the surface of the flexible connection part 6 is coated with a heat conducting silica gel layer 7, the surface of the heat conducting silica gel layer 7 is coated with a heat conducting aluminum foil layer 8, two sides of the heat conducting aluminum foil layer 8 are fixedly provided with flexible semiconductor refrigerating sheets 9, a plurality of heat dissipation fins 10 are fixedly connected to one side of the flexible semiconductor refrigerating sheets 9 at equal intervals, a temperature control switch 11 is fixedly arranged between the heat conducting silica gel layer 7 and the heat conducting aluminum foil layer 8, a heat dissipation gap 17 is formed between two adjacent heat dissipation fins 10, heat can be generated in the process of the flexible connection part 6, heat is conducted to the surface of the heat conducting layer 8 through the heat conducting silica gel layer 7, heat is conducted to the surface of the heat conducting semiconductor refrigerating sheet 9, and the heat conducting end of the flexible semiconductor refrigerating sheet 9 is cooled by the heat conducting aluminum foil layer 8, and the heat conducting end is cooled down by the heat conducting semiconductor refrigerating sheet 8, and the heat conducting end is cooled down.
The flexible connection 6 comprises a plurality of copper foils 12, and the plurality of copper foils 12 are stacked.
When in use, the soft connecting part 6 is formed by stacking a plurality of copper foils 12, so that the soft connecting part 6 can be freely bent.
The top connecting hole 13 has been seted up on the surface of top connecting plate 3, and the inner chamber rotation of top connecting hole 13 is connected with top and rotates cover 14, and bottom connecting hole 15 has all been seted up at the both ends on bottom connecting plate 5 surface, and the inner chamber rotation of bottom connecting hole 15 is connected with bottom and rotates cover 16.
When the flexible connection device is used, the flexible connection main body 1 is connected with a connecting device through the top rotating sleeve 14 on the top connecting plate 3 and the bottom rotating sleeve 16 on the bottom connecting plate 5, the top rotating sleeve 14 is arranged in the top connecting hole 13, the bottom rotating sleeve 16 is arranged in the bottom connecting hole 15, and the top connecting plate 3 and the bottom connecting plate 5 can rotate to perform angle adjustment when being connected with an external connecting device, so that the flexible connection device is more convenient to install.
The flexible semiconductor refrigerating sheet 9 is electrically connected with an external power supply through a temperature control switch 11.
When the automatic switching device is used, the temperature control switch 11 is used for controlling the switch of the flexible semiconductor refrigerating sheet 9, so that the automatic switching of the flexible semiconductor refrigerating sheet 9 is realized.
The top connecting plate 3 and the bottom connecting plate 5 are made of metal copper materials, and the corners of the top connecting plate 3 and the corners of the bottom connecting plate 5 are provided with fillets 18.
When the metal copper material is used, the metal copper material has good electric conduction and corrosion resistance, and the rounded corners 18 chamfer the corners of the top connecting plate 3 and the corners of the bottom connecting plate 5, so that the corners are prevented from hurting hands.
When the flexible connection device is specifically used, the flexible connection main body 1 is connected with a connection device through the top rotating sleeve 14 on the top connection plate 3 and the bottom rotating sleeve 16 on the bottom connection plate 5, so that the flexible connection part 6 in the flexible connection main body 1 is electrified, heat can be generated in the electric conduction process of the flexible connection part 6, at the moment, the heat conduction silica gel layer 7 conducts the heat to the surface of the heat conduction aluminum foil layer 8, the heat is conducted to the refrigerating end of the flexible semiconductor refrigerating sheet 9 through the heat conduction aluminum foil layer 8, when the temperature near the heat conduction silica gel layer 7 reaches the stable range set by the temperature control switch 11, the temperature control switch 11 controls the operation of the flexible semiconductor refrigerating sheet 9, at the moment, the refrigerating end of the flexible semiconductor refrigerating sheet 9 performs cold and hot replacement with the heat conduction aluminum foil layer 8, thereby cool down soft connecting portion 6, and the heat conduction of flexible semiconductor refrigeration piece 9 heating end is to the surface of a plurality of fin 10, enlarge radiating area through fin 10, utilize fin 10 and outside air to carry out cold and hot replacement, thereby reach cyclic heat dissipation's purpose, soft connecting portion 6's surface cladding has heat conduction silica gel layer 7, thereby isolate soft connecting portion 6's surface and outside moist air, thereby reduce soft connecting portion 6 outside air contact, the possibility of oxidation reaction takes place, improve soft connecting portion 6's life, flexible semiconductor refrigeration piece 9 is prior art, it has been disclosed in "a superconductive hot flexible semiconductor refrigeration piece", chinese patent publication No.: CN217541125U, the present document is not disclosed.
Although the present utility model has been described with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described, or equivalents may be substituted for elements thereof, and any modifications, equivalents, improvements and changes may be made without departing from the spirit and principles of the present utility model.
Claims (6)
1. The utility model provides a flexible coupling mechanism with cooling mechanism, includes flexible coupling main part (1), its characterized in that: the top fixedly connected with top arc of flexible coupling main part (1) buckles piece (2), one side fixedly connected with top connecting plate (3) of piece (2) is buckled to the top arc, bottom fixedly connected with bottom arc of flexible coupling main part (1) buckles piece (4), one side fixedly connected with bottom connecting plate (5) of piece (4) is buckled to the bottom arc, flexible coupling main part (1) includes flexible coupling portion (6), the surface coating of flexible coupling portion (6) has heat conduction silica gel layer (7), the surface coating of heat conduction silica gel layer (7) has heat conduction aluminium foil layer (8), the equal fixed mounting in both sides of heat conduction aluminium foil layer (8) has flexible semiconductor refrigeration piece (9), one side equidistance fixedly connected with fin (10) of flexible semiconductor refrigeration piece (9), fixed mounting has temperature detect switch (11) between heat conduction silica gel layer (7) and heat conduction aluminium foil layer (8), encloses into heat dissipation gap (17) between two adjacent fin (10).
2. A flexible connection unit with a heat dissipation mechanism as defined in claim 1, wherein: the flexible connection part (6) comprises a plurality of copper foils (12), and the copper foils (12) are stacked.
3. A flexible connection unit with a heat dissipation mechanism as defined in claim 1, wherein: the surface of the top connecting plate (3) is provided with a top connecting hole (13), and the inner cavity of the top connecting hole (13) is rotationally connected with a top rotating sleeve (14).
4. A flexible connection unit with a heat dissipation mechanism as defined in claim 1, wherein: the two ends of the surface of the bottom connecting plate (5) are provided with bottom connecting holes (15), and the inner cavity of the bottom connecting holes (15) is rotationally connected with a bottom rotating sleeve (16).
5. A flexible connection unit with a heat dissipation mechanism as defined in claim 1, wherein: the flexible semiconductor refrigerating sheet (9) is electrically connected with an external power supply through a temperature control switch (11).
6. A flexible connection unit with a heat dissipation mechanism as defined in claim 1, wherein: the top connecting plate (3) and the bottom connecting plate (5) are made of metal copper materials, and the corners of the top connecting plate (3) and the corners of the bottom connecting plate (5) are provided with fillets (18).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223579467.5U CN219676948U (en) | 2022-12-31 | 2022-12-31 | Soft coupling mechanism with heat dissipation mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223579467.5U CN219676948U (en) | 2022-12-31 | 2022-12-31 | Soft coupling mechanism with heat dissipation mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219676948U true CN219676948U (en) | 2023-09-12 |
Family
ID=87895603
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223579467.5U Active CN219676948U (en) | 2022-12-31 | 2022-12-31 | Soft coupling mechanism with heat dissipation mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219676948U (en) |
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2022
- 2022-12-31 CN CN202223579467.5U patent/CN219676948U/en active Active
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