CN219660095U

CN219660095U - Cabinet for placing server

Info

Publication number: CN219660095U
Application number: CN202320379361.6U
Authority: CN
Inventors: 苏伟明
Original assignee: Individual
Current assignee: Individual
Priority date: 2023-03-03
Filing date: 2023-03-03
Publication date: 2023-09-08
Anticipated expiration: 2033-03-03

Abstract

The utility model relates to the technical field of server cabinets and discloses a cabinet for placing servers, which comprises a cabinet main body, wherein a heat dissipation shell is fixedly arranged on the inner wall of the cabinet main body, a first partition plate is attached to the inner wall of the cabinet main body, a main flow pipe is fixedly arranged at the bottom of the heat dissipation shell, a circulating water pump is fixedly arranged at the other end of the main flow pipe, a return pipe is fixedly arranged at the other end of the circulating water pump, which is far away from the main flow pipe, and an electric valve is fixedly arranged on the return pipe. This a rack for placing server utilizes semiconductor fin one side low temperature to cool down, when the coolant liquid does not need to cool down, then opens electric valve and closes semiconductor fin and motor simultaneously for the coolant liquid is direct to flow into circulating water pump inside, when can guaranteeing the radiating effect, can energy saving and emission reduction, the power loss that uses when reducing the heat dissipation, and need not to add complicated manual operation such as ice-cube.

Description

Cabinet for placing server

Technical Field

The utility model relates to the technical field of server cabinets, in particular to a cabinet for placing servers.

Background

The server cabinet is used for combining and installing the panel, the plug-in unit, the plug-in box, the electronic element, the device, the mechanical part and the component to form an integral installation box, and consists of a frame and a cover plate door, and generally has a cuboid shape and is placed on the ground.

The chinese patent with publication number CN213214195U discloses a cabinet for placing network server, which comprises a fixing plate and a cabinet body, wherein the cabinet body is fixed at one end of the top of the fixing plate, the cabinet body is internally provided with a plurality of storage mechanisms from top to bottom, the storage mechanisms comprise a T-shaped chute, a storage plate and a T-shaped sliding block, the middle part of one side of the inner cavity of the cabinet body is fixedly provided with a temperature sensor, the top and the bottom of the other side of the inner cavity of the cabinet body are both provided with through holes, and the interiors of the two through holes are both provided with heat dissipation mechanisms. The water pump can transmit water in the water tank to the inside of the guide pipe, the cabinet body is cooled through the guide pipe, meanwhile, the water for cooling is placed in the water tank at one side of the outside of the cabinet body, thus the water for cooling can not be warmed in the storage process, the best cooling effect can be achieved, by arranging the two fans, the outside air can be sucked into the inside of the cabinet body to cool, and meanwhile, the air mixed with heat in the inside of the cabinet body is pumped out, so that a better heat dissipation effect can be achieved.

In the present utility model it was found that this patent had at least the following problems: the water tank is added with ice blocks to assist in cooling, so that the water tank cannot be cooled automatically and cannot adapt to long-time heat dissipation, and the water tank can be improved.

Disclosure of Invention

(one) solving the technical problems

Aiming at the defects of the prior art, the utility model provides a cabinet for placing a server, which has the advantages of real-time monitoring and cooling of cooling liquid and the like, and solves the problem of complex cooling operation with the assistance of adding ice cubes.

(II) technical scheme

In order to achieve the purposes of monitoring and cooling the heat dissipation in real time, the utility model provides the following technical scheme:

the utility model provides a rack for placing server, includes the rack main part, rack main part inner wall fixed mounting has the heat dissipation shell, rack main part inner wall laminating has first baffle, heat dissipation shell bottom fixed mounting has the main current pipe, main current pipe other end fixed mounting has circulating water pump, circulating water pump keeps away from the other end fixed mounting of main current pipe has the back flow, back flow fixed mounting has electric valve, back flow outer wall and is provided with temperature sensor in electric valve left side, back flow top fixed mounting has the cooling branch pipe, the other end fixed mounting that the back flow was kept away from to the cooling branch pipe has the temporary storage water tank, temporary storage water tank inner wall fixed mounting has the second baffle, second baffle top fixed mounting has the semiconductor fin, semiconductor fin top fixed mounting has the heat-conducting plate, semiconductor fin outer wall fixed mounting has the fin shell, fin outer wall fixed mounting has the exhaust section of thick bamboo, rack main part inner wall fixed mounting has the singlechip controller.

Preferably, the through hole has been seted up to the inside of rack main part, the inside grafting of through hole of rack main part has the bolt, the bolt screw thread of rack main part is installed inside first baffle, and first baffle can keep apart the air temperature between top bottom radiator unit and the top server, avoids influencing temperature sensor's temperature detection effect.

Preferably, the main flow pipe is fixedly arranged on the inner wall of the cabinet main body, the through hole is formed in the first partition plate, the main flow pipe is positioned in the through hole of the first partition plate, and the existence of the first partition plate does not influence the transmission of cooling liquid of the main flow pipe and the return pipe.

Preferably, the back flow fixed mounting is in cabinet main part inner wall, cooling branch flow pipe fixed mounting is in cabinet main part inner wall, semiconductor fin top is provided with the heat dissipation silica gel, and the heat dissipation silica gel can play the preliminary cooling of semiconductor fin back.

Preferably, the supporting block is fixedly arranged at the top of the radiating fin shell, the radiating fin shell is rotatably provided with the exhaust fan through the supporting block, one side of the exhaust fan is fixedly provided with the motor output shaft, and the exhaust fan discharges high temperature generated at the back of the semiconductor radiating fin into air outside the cabinet main body.

Preferably, the hole is set up inside the exhaust cylinder, the electric valve is electric installation with the singlechip controller output, temperature sensor is electric installation with the singlechip controller, the hole of exhaust cylinder lateral wall opening for the exhaust fan is from the inside air of inhaling of rack main part and with the air discharge to the rack main part outside, takes away the hot air that the singlechip back produced in-process.

Preferably, the motor is electric installation with singlechip controller output, semiconductor fin is electric installation with singlechip controller output, the air vent has been seted up to rack main part lateral wall, and the section of thick bamboo of airing exhaust is located inside the air vent, the rack main part openly is provided with the dodge gate, and the dodge gate is convenient daily maintenance.

(III) beneficial effects

Compared with the prior art, the utility model provides a cabinet for placing servers, which has the following beneficial effects:

this a rack for placing server carries out real-time detection temperature through temperature sensor to the cooling liquid of backward flow, whether open the control electric valve, consequently, whether can confirm cooling liquid according to the real-time supervision of temperature and need cool off, when needs cooling liquid need cool off, it is inside to close electric valve and make cooling liquid get into cooling branch pipe, and utilize semiconductor fin one side low temperature to cool down, when the cooling liquid does not need cool down, then open electric valve and close semiconductor fin and motor simultaneously, make the cooling liquid directly flow into circulating water pump inside, when can ensure the radiating effect, can energy saving and emission reduction, the electric power loss that uses when reducing the heat dissipation, and need not to add complicated manual operation such as ice-cube.

Drawings

Fig. 1 is a schematic diagram of a front view structure of a cabinet for placing a server according to the present utility model;

FIG. 2 is a schematic cross-sectional view of a rack for accommodating servers according to the present utility model;

fig. 3 is an enlarged schematic view of the structure of the cabinet a in fig. 2 for placing a server according to the present utility model.

In the figure: 1. a cabinet body; 2. a heat dissipation housing; 3. a first separator; 4. a main flow tube; 5. a circulating water pump; 6. a return pipe; 7. an electric valve; 8. a temperature sensor; 9. cooling branch flow pipes; 10. a singlechip controller; 11. temporary storage water tank; 12. a second separator; 13. a semiconductor heat sink; 14. a heat conductive plate; 15. a motor; 16. an exhaust fan; 17. a heat sink housing.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-2, in a first embodiment:

a cabinet for placing servers comprises a cabinet main body 1, wherein a heat dissipation shell 2 is fixedly arranged on the inner wall of the cabinet main body 1, a first partition plate 3 is attached to the inner wall of the cabinet main body 1, a main flow pipe 4 is fixedly arranged at the bottom of the heat dissipation shell 2, a circulating water pump 5 is fixedly arranged at the other end of the main flow pipe 4, the model number of the circulating water pump 5 is G9020-47030, and a return pipe 6 is fixedly arranged at the other end of the circulating water pump 5 away from the main flow pipe 4.

Further, the through-hole has been seted up to cabinet main part 1 inside, and the inside grafting of through-hole of cabinet main part 1 has the bolt, and the bolt screw thread of cabinet main part 1 installs inside first baffle 3, and main flow pipe 4 fixed mounting is in cabinet main part 1 inner wall, and the through-hole has been seted up to first baffle 3 inside, and main flow pipe 4 is located the through-hole of first baffle 3 inside, and the through-hole size of first baffle 3 is the same with main flow pipe 4, and cabinet main part 1 openly is provided with the dodge gate, and the dodge gate is used for convenient daily maintenance.

Referring to fig. 1-3, in a second embodiment:

the electric valve 7 is fixedly installed on the return pipe 6, the model number of the electric valve 7 is Q941F-16P, a temperature sensor 8 is arranged on the outer wall of the return pipe 6 and on the left side of the electric valve 7, the model number of the temperature sensor 8 is Pt100, the cooling branch pipe 9 is fixedly installed on the top of the return pipe 6, the temporary storage water tank 11 is fixedly installed on the other end, far away from the return pipe 6, of the cooling branch pipe 9, the second partition plate 12 is fixedly installed on the inner wall of the temporary storage water tank 11, the semiconductor radiating fin 13 is fixedly installed on the top of the second partition plate 12, the heat conducting plate 14 is used for conducting heat and increasing the contact area between heat and air, the radiating fin shell 17 is fixedly installed on the outer wall of the semiconductor radiating fin 13, the ventilating duct 18 is fixedly installed on the outer wall of the radiating fin shell 17, the single-chip microcomputer controller 10 is fixedly installed on the inner wall of the cabinet body 1, and the model number of the single-chip microcomputer controller 10 is 80C31.

Further: the back flow 6 fixed mounting is in cabinet main part 1 inner wall, cooling branch pipe 9 fixed mounting is in cabinet main part 1 inner wall, semiconductor fin 13 top is provided with the heat dissipation silica gel, fin shell 17 top fixed mounting has the supporting shoe, fin shell 17 rotates through the supporting shoe and installs exhaust fan 16, exhaust fan 16 one side fixed mounting has motor 15 output shaft, the hole has been seted up to exhaust section of thick bamboo 18 inside, electrically operated valve 7 is electric installation with singlechip controller 10 output, temperature sensor 8 is electric installation with singlechip controller 10, motor 15 is electric installation with singlechip controller 10 output, semiconductor fin 13 is electric installation with singlechip controller 10 output, the air vent has been seted up to cabinet main part 1 lateral wall, exhaust section of thick bamboo 18 is located the air vent inside.

Working principle: firstly, a server is placed on the inner wall of a cabinet main body 1, cooling liquid is arranged on the inner wall of the cabinet main body 1 and used for cooling the server, then a circulating water pump 5 is started in the working process of the server to enable the cooling liquid to flow into a heat dissipation shell 3 from a main flow pipe 4, then flow out of the heat dissipation shell 3, the cooling liquid is circulated through a return pipe 6 and reenters the inside of the circulating water pump 5, a temperature sensor 8 senses the temperature of the cooling liquid in the circulating process, when the cooling liquid temperature is higher and the heat dissipation effect of the server is weakened, the temperature sensor 8 outputs a signal to a singlechip controller 10, the singlechip controller 10 controls an electric valve 7 to be closed, a semiconductor cooling fin 13 and a motor 15 are started at the same time, so that a return water passage of the return pipe 6 is closed, the cooling liquid in the cooling device flows to the upper cooling branch pipe 9 under the pressure of the circulating water pump 5 against the gravity, the cooling liquid is cooled by the transmission of the second partition plate 12 after reaching the inside of the cooling fin shell 17, the high temperature on the back of the semiconductor cooling fin 13 is sucked out by the exhaust fan 16 and discharged to the outside of the cabinet main body 1, then the cooling liquid is cooled by the cooling fin shell 17 and discharged to the inside of the return pipe 6 from the other side pipeline of the cooling branch pipe 9, the cooling liquid is circulated into the inside of the server again by the circulating water pump 5, the electric valve 7 is opened to realize the return water path of the return pipe 6 when the temperature sensor 8 measures that the temperature of the cooling liquid in the return pipe 6 at the left side of the electric valve 7 is proper, and the semiconductor cooling fin 13 and the motor 15 are controlled to be closed by the singlechip controller 10, the electric valve 7 is opened, so that the cooling liquid can not enter the cooling branch pipe 9 against the gravity.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A cabinet for placing servers, comprising a cabinet body (1), characterized in that: the utility model discloses a heat dissipation device, including cabinet main part (1), cabinet main part (1) inner wall fixed mounting has radiator housing (2), cabinet main part (1) inner wall laminating has first baffle (3), radiator housing (2) bottom fixed mounting has main flow pipe (4), main flow pipe (4) other end fixed mounting has circulating water pump (5), circulating water pump (5) are kept away from the other end fixed mounting of main flow pipe (4) has back flow (6), back flow (6) fixed mounting has electric valve (7), back flow (6) outer wall and be provided with temperature sensor (8) in electric valve (7) left side, back flow (6) top fixed mounting has cooling branch pipe (9), the other end fixed mounting that back flow (6) were kept away from to cooling branch pipe (9) has temporary storage water tank (11), temporary storage water tank (11) inner wall fixed mounting has second baffle (12), second baffle (12) top fixed mounting has semiconductor fin (13), semiconductor fin (13) top fixed mounting has heat-conducting plate (14), semiconductor fin (13) outer wall fixed mounting has radiator housing (17), radiator housing (17) fixed mounting has radiator drum (17), the inner wall of the cabinet main body (1) is fixedly provided with a singlechip controller (10).

2. A cabinet for holding servers as claimed in claim 1, wherein: the cabinet is characterized in that a through hole is formed in the cabinet body (1), bolts are inserted into the through hole of the cabinet body (1), and the bolts of the cabinet body (1) are installed inside the first partition plate (3) in a threaded mode.

3. A cabinet for holding servers as claimed in claim 1, wherein: the main flow pipe (4) is fixedly arranged on the inner wall of the cabinet main body (1), a through hole is formed in the first partition plate (3), and the main flow pipe (4) is positioned in the through hole of the first partition plate (3).

4. A cabinet for holding servers as claimed in claim 1, wherein: the back flow (6) fixed mounting is in cabinet main part (1) inner wall, cooling branch flow pipe (9) fixed mounting is in cabinet main part (1) inner wall, semiconductor fin (13) top is provided with the heat dissipation silica gel.

5. A cabinet for holding servers as claimed in claim 1, wherein: the top of the radiating fin shell (17) is fixedly provided with a supporting block, the radiating fin shell (17) is rotatably provided with an exhaust fan (16) through the supporting block, and one side of the exhaust fan (16) is fixedly provided with an output shaft of the motor (15).

6. A cabinet for holding servers as claimed in claim 1, wherein: the exhaust cylinder (18) is internally provided with a hole, the electric valve (7) is electrically installed with the output end of the single-chip microcomputer controller (10), and the temperature sensor (8) is electrically installed with the single-chip microcomputer controller (10).

7. A cabinet for housing servers as recited in claim 5, wherein: the motor (15) is electrically installed with the output end of the single-chip microcomputer controller (10), the semiconductor radiating fin (13) is electrically installed with the output end of the single-chip microcomputer controller (10), the side wall of the cabinet main body (1) is provided with a vent hole, the exhaust cylinder (18) is located inside the vent hole, and the front face of the cabinet main body (1) is provided with a movable door.