CN219660029U - Circuit pattern processing structure of thick copper circuit board - Google Patents
Circuit pattern processing structure of thick copper circuit board Download PDFInfo
- Publication number
- CN219660029U CN219660029U CN202321145146.6U CN202321145146U CN219660029U CN 219660029 U CN219660029 U CN 219660029U CN 202321145146 U CN202321145146 U CN 202321145146U CN 219660029 U CN219660029 U CN 219660029U
- Authority
- CN
- China
- Prior art keywords
- thick copper
- pattern
- circuit pattern
- dry film
- copper circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 123
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 123
- 239000010949 copper Substances 0.000 title claims abstract description 123
- 238000012545 processing Methods 0.000 title claims abstract description 38
- 230000000153 supplemental effect Effects 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 7
- 230000000295 complement effect Effects 0.000 abstract description 16
- 238000009413 insulation Methods 0.000 abstract description 4
- 238000003475 lamination Methods 0.000 abstract description 3
- 230000001502 supplementing effect Effects 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000013589 supplement Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
The utility model provides a circuit pattern processing structure of a thick copper circuit board, which comprises the following steps: the insulation medium layer is provided with a thick copper circuit pattern on one side, a first dry film layer is arranged on the thick copper circuit pattern, a second dry film layer is arranged on the first dry film layer, a supplementary circuit pattern is arranged in the side edge area of the thick copper circuit pattern, a second dry film layer is arranged on the supplementary circuit pattern, and the thickness of the supplementary circuit pattern is smaller than that of the thick copper circuit pattern; the complementary circuit patterns are used for supplementing the sunk positions generated by the overlarge gaps among the thick copper circuit patterns, so that the problems that a dielectric layer is too thin, even the dielectric layer is extruded through by the circuit top angle and the like easily occur in the subsequent lamination processing are solved, and the technical problems that the total thickness of a circuit board exceeds the standard or the dielectric layer cannot effectively cover the circuit top angle due to the technical problems in the prior art are solved.
Description
Technical Field
The utility model relates to the field of circuit board manufacturing, in particular to a circuit pattern processing structure of a thick copper circuit board.
Background
Circuit boards with circuit copper thicknesses of > 70 μm are generally called thick copper circuit boards, but with the promotion of application demand technology and processing technology, thick copper circuit boards with copper thicknesses of > 105 μm and even > 175 μm gradually appear; the thick copper circuit board has the characteristics of high current bearing capacity, high heat dissipation capacity, high strength bearing capacity and the like, and is widely applied to the fields of industrial control, power systems and the like.
For a thick copper circuit board which cannot exceed the standard on the total thickness requirement of the circuit board, the thickness of the circuit copper layer cannot be thinned, and meanwhile, the thickness of the insulating medium layer is limited, so that when a stacked structure is formed, the thickness of the insulating medium layer needs to be strictly controlled, but if the thickness of the insulating medium layer is thinner, the insulating medium layer forms a flow state under the high-temperature and high-pressure condition of lamination during processing, a part of the flow is filled in gaps between copper circuits, and under the high-pressure extrusion effect of lamination, the thickness of the insulating medium layer at the circuit vertex angle position of a circuit pattern is insufficient to cover the circuit vertex angle, so that the problems that the insulating medium layer is too thin, even the insulating medium layer is extruded through by the circuit vertex angle and the like easily occur.
At present, a mode of pressing by increasing the thickness of an insulating medium layer or a mode of performing screen printing and welding (or resin) on the side surface or a gap of a thick copper circuit is generally adopted for processing.
However, when the thickness of the insulating medium layer is increased to meet the covering requirement of the insulating medium layer at the top angle position of the circuit, the problem that the total thickness of the circuit board exceeds the standard is easily generated in a large copper area or a circuit dense area; the method is characterized in that a part of height fall of the thick copper circuit is filled with the solder resist (or resin) in advance, a buffer area of the thick copper circuit is set, and then an insulating medium layer is pressed to form a required circuit board.
Disclosure of Invention
The utility model provides a circuit pattern processing structure of a thick copper circuit board, which is used for solving the technical problems that the total thickness of the circuit board exceeds standard or an insulating medium layer cannot effectively cover the top angle of a circuit in the prior art.
The utility model provides a processing structure of a circuit pattern of a thick copper circuit board, which comprises the following components: the insulation medium layer is provided with a thick copper circuit pattern on one side, a first dry film layer is arranged on the thick copper circuit pattern, a second dry film layer is arranged on the first dry film layer, a supplementary circuit pattern is arranged in the side edge area of the thick copper circuit pattern, a second dry film layer is arranged on the supplementary circuit pattern, and the thickness of the supplementary circuit pattern is smaller than that of the thick copper circuit pattern.
The beneficial effects of the utility model are as follows: the utility model supplements the overlarge drop of the side area of the thick copper circuit pattern by supplementing the circuit pattern, plays a role of buffering the drop, can give better and sufficient filling effect to the insulating medium layer when other insulating medium layers are pressed in the follow-up process, and avoids the technical problems that the thickness of the insulating medium layer is increased or silk screen welding (or resin) is printed on the side surface or the gap of the thick copper circuit, the total thickness of the generated circuit board exceeds the standard or the insulating medium layer cannot effectively cover the top angle of the circuit in order to ensure that the thickness does not exceed the standard.
On the basis of the technical scheme, the utility model can be further improved as follows.
Further, the thickness of the supplemental wiring pattern is 1/3 to 1/2 of the thickness of the thick copper wiring pattern.
Further, the thickness of the first dry film layer is smaller than that of the second dry film layer.
Further, the width of the supplementary wiring pattern is 50 μm to 100 μm.
Further, the above-mentioned supplemental wiring pattern is 50 μm to 127 μm from the thick copper wiring pattern.
Further alternatively, the thick copper line pattern is more than one line pattern.
Further alternatively, the gaps between adjacent thick copper line patterns are less than 150 μm, and the gaps between the thick copper line patterns are not provided with supplemental line patterns.
Further alternatively, the gap between the adjacent thick copper line patterns is 150 μm or more.
Further alternatively, the gaps between the adjacent thick copper line patterns are provided with one or two complementary line patterns.
Further, the other surface of the insulating medium layer is provided with a thick copper circuit board circuit pattern processing structure.
The beneficial effects of adopting the further scheme are as follows: the thickness and the width of the complementary circuit pattern and the distance between the complementary circuit pattern and the thick copper circuit pattern are limited by a further scheme, so that the method meets the existing technical level, and meanwhile, the problems that an insulating medium layer is too thin, even the insulating medium layer is extruded through by a circuit vertex angle and the like can be solved to the greatest extent; the situation that a plurality of supplementary circuit patterns are arranged under gaps of different sizes between adjacent thick copper circuit patterns is limited, the purpose is to most effectively utilize the supplementary circuit patterns, and the situation that the weight or the thickness of a circuit board exceeds standard due to multiple arrangements or the problem of the prior art cannot be solved due to fewer arrangements is avoided.
Drawings
In order to more clearly illustrate the embodiments of the utility model or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the utility model, and that other drawings can be obtained according to these drawings without inventive faculty for a person skilled in the art.
FIG. 1 is a schematic diagram of a circuit pattern processing structure of a thick copper circuit board according to a first embodiment of the present utility model.
Fig. 2 is a schematic diagram of a circuit pattern processing structure of a thick copper circuit board according to a second embodiment of the present utility model.
Fig. 3 is a schematic diagram of a circuit pattern processing structure of a thick copper circuit board according to a third embodiment of the present utility model.
Fig. 4 is a schematic diagram of a circuit pattern processing structure of a thick copper circuit board according to a fourth embodiment of the present utility model.
The reference numerals are explained as follows:
01-insulating dielectric layer, 02-thick copper circuit pattern, 03-first dry film layer, 04-second dry film layer and 05-supplementary circuit pattern.
Description of the embodiments
The following describes the embodiments of the present utility model further with reference to the drawings. The description of these embodiments is provided to assist understanding of the present utility model, but is not intended to limit the present utility model. In addition, the technical features of the embodiments of the present utility model described below may be combined with each other as long as they do not collide with each other.
Referring to fig. 1, fig. 1 is a schematic diagram of a circuit pattern processing structure of a thick copper circuit board according to a first embodiment of the present utility model.
The circuit pattern processing structure of the thick copper circuit board comprises: the insulation dielectric layer 01, one side of the insulation dielectric layer 01 is provided with a thick copper circuit pattern 02, the thick copper circuit pattern 02 is provided with a first dry film layer 03, and the first dry film layer 03 is provided with a second dry film layer 04; a supplementary circuit pattern 05 is arranged on the side edge area of the thick copper circuit pattern 02; the second dry film layer 03 is arranged on the supplementary circuit pattern 05; the thickness of the supplemental wiring pattern 05 is less than the thickness of the thick copper wiring pattern 02.
Referring to fig. 2, fig. 2 is a schematic diagram of a circuit pattern processing structure of a thick copper circuit board according to a second embodiment of the present utility model.
The circuit pattern processing structure of the thick copper circuit board comprises: the insulating medium layer 01, the thick copper circuit pattern 02 is arranged on the insulating medium layer 01, the first dry film layer 03 is arranged on the thick copper circuit pattern 02, the second dry film layer 04 is arranged on the first dry film layer 03, the first dry film layer 03 is a thin dry film, the thickness is 0.8mil or 1.2mil, the second dry film layer 04 is a thick dry film, and the thickness is 1.5mil or 2.0mil.
The gap between two adjacent thick copper line patterns 02 is smaller than 150 mu m, the outer sides of the adjacent thick copper line patterns 02 are respectively provided with a complementary line pattern 05, the inner sides of the adjacent thick copper line patterns 02 are not provided with complementary line patterns 05, and the complementary line patterns 05 are provided with a second dry film layer 04; the thickness of the supplemental wiring pattern 05 is 1/3 to 1/2 of the thickness of the thick copper wiring pattern 02; the width of the supplementary wiring pattern 05 is 50 μm to 100 μm; the supplemental wiring pattern 05 is 50 μm to 127 μm from the thick copper wiring pattern 02.
Due to the above limitation on the width of the supplemental wiring pattern 05 and the distance from the thick copper wiring pattern 02, it is desirable to provide a supplemental wiring pattern at a minimum distance from the middle position inside the adjacent thick copper wiring pattern 02 as follows: the minimum width of the supplemental wiring pattern 50 μm plus the minimum distance of two supplemental wiring patterns 05 from the thick copper wiring pattern 02 50 μm, resulted in 150 μm; therefore, when the thickness is smaller than 150 μm, the supplemental wiring pattern 05 is not provided inside the adjacent thick copper wiring pattern 02.
Referring to fig. 3, fig. 3 is a schematic diagram of a circuit pattern processing structure of a thick copper circuit board according to a third embodiment of the present utility model.
The circuit pattern processing structure of the thick copper circuit board comprises: the insulating medium layer 01, the thick copper circuit pattern 02 is arranged on the insulating medium layer 01, the first dry film layer 03 is arranged on the thick copper circuit pattern 02, the second dry film layer 04 is arranged on the first dry film layer 03, the first dry film layer 03 is a thin dry film, the thickness is 0.8mil or 1.2mil, the second dry film layer 04 is a thick dry film, and the thickness is 1.5mil or 2.0mil.
The gap between two adjacent thick copper line patterns 02 is larger than or equal to 150 mu m and smaller than 250 mu m, the outer sides of the adjacent thick copper line patterns 02 are respectively provided with a supplementary line pattern 05, the middle position of the inner side of the adjacent thick copper line patterns 02 is provided with a supplementary line pattern 05, and the supplementary line pattern 05 is provided with a second dry film layer 04; the thickness of the supplemental wiring pattern 05 is 1/3 to 1/2 of the thickness of the thick copper wiring pattern 02; the width of the supplementary wiring pattern 05 is 50 μm to 100 μm; the supplemental wiring pattern 05 is 50 μm to 127 μm from the thick copper wiring pattern 02;
due to the above limitation on the width of the supplemental wiring pattern 05 and the distance from the thick copper wiring pattern 02, it is desirable to provide two supplemental wiring patterns at the middle position inside the adjacent thick copper wiring pattern 02 with the minimum distance: the minimum width of two supplemental wiring patterns 05 was 50 μm plus the minimum distance of three supplemental wiring patterns 05 from the thick copper wiring pattern 02 was 50 μm, resulting in 250 μm; therefore, when the thickness of the line pattern is 150 μm or more and less than 250 μm, only one supplementary line pattern 05 can be provided in the middle of the inner side of the adjacent thick copper line pattern 02, and when the thickness of the line pattern is 250 μm or more, two supplementary line patterns 05 can be provided in the inner side of the adjacent thick copper line pattern 02.
Referring to fig. 4, fig. 4 is a schematic diagram of a circuit pattern processing structure of a thick copper circuit board according to a fourth embodiment of the present utility model.
The circuit pattern processing structure of the thick copper circuit board comprises: the insulating medium layer 01, the thick copper circuit pattern 02 is arranged on the insulating medium layer 01, the first dry film layer 03 is arranged on the thick copper circuit pattern 02, the second dry film layer 04 is arranged on the first dry film layer 03, the first dry film layer 03 is a thin dry film, the thickness is 0.8mil or 1.2mil, the second dry film layer 04 is a thick dry film, and the thickness is 1.5mil or 2.0mil.
The gap between two adjacent thick copper line patterns 02 is larger than or equal to 250 mu m, one complementary line pattern 05 is arranged on the outer side of each adjacent thick copper line pattern 02, two complementary line patterns 05 are arranged on the inner side of each adjacent thick copper line pattern 02, and a second dry film layer 04 is arranged on each complementary line pattern 05; the thickness of the supplemental wiring pattern 05 is 1/3 to 1/2 of the thickness of the thick copper wiring pattern 02; the width of the supplementary wiring pattern 05 is 50 μm to 100 μm; the supplemental wiring pattern 05 is 50 μm to 127 μm from the thick copper wiring pattern 02.
The manufacturing process of the embodiment of the utility model is briefly described as follows:
firstly, taking a thick copper-clad plate, attaching a first dry film layer 03 on the front surface of the thick copper layer, and forming a half-thick copper circuit pattern through first exposure, first development and first pattern transfer processing of first etching, wherein the first exposure is used for exposing according to exposure data of the thick copper circuit pattern 02, and the thickness of the first etching (namely, the thickness of the half-thick copper circuit pattern) is the thickness of the thick copper circuit pattern 02 minus the thickness of the complementary circuit pattern 05.
And secondly, forming a semi-finished product without film stripping treatment in the first step, attaching a second dry film layer 04 on the whole surface of one surface of the half-thick copper circuit pattern, performing second exposure, second development and second pattern transfer processing of second etching to form a pattern structure of the thick copper circuit pattern 02 and the complementary circuit pattern 05, wherein the second exposure is used for manufacturing exposure data of the thick copper circuit pattern 02 according to the requirement, the exposure data of the complementary circuit pattern 05 is required to be manufactured for exposure, the second etching is used for completely etching the thick copper circuit pattern 02, and the complementary circuit pattern 05 is also etched.
A second stripping process may then be performed to form a thick copper circuit core to be laminated.
It should be noted that, in the above embodiment, the first dry film layer 03 uses a thinner dry film, which can meet the manufacturing requirement of the first pattern transfer processing, and the thinner first dry film layer 03 does not cause the problem of excessively increasing the thickness (i.e. the height) of the circuit surface, so that the second dry film layer 04 can be better attached to the circuit surface, and the problems of poor film adhesion, film adhesion cavity and the like are not generated; the second dry film layer 04 adopts a thicker dry film layer, so that on one hand, the bonding effect of the dry film and the copper surface is better, the problems of poor film pasting, film pasting cavity and film body crushing are avoided, and on the other hand, the bonding force of the first dry film layer 03 after exposure is better, and a good and more reliable processing effect can be provided for the thick copper circuit pattern 02 and the complementary circuit pattern 05.
As can be seen from the above embodiments, the side area of the thick copper circuit pattern 02 is provided with the supplementary circuit pattern 05 to supplement the excessive drop of the side area of the thick copper circuit pattern 02, so as to play a role in buffering the drop, and the insulating medium layer can be better and more fully filled when other insulating medium layers are pressed in the subsequent steps; for different embodiments, the thickness, the width and the distance between the two adjacent thick copper line patterns 02 are adopted, and the situation that a plurality of the complementary line patterns 05 are arranged in gaps of different sizes between the adjacent thick copper line patterns 02 is adopted, so that the optimal effect of solving the existing problems with the least additional patterns is realized under the conditions of the existing process level and the existing process capability, namely, the thickness, the coverage and the weight compliance of the product are ensured.
The foregoing description of the preferred embodiments of the utility model is not intended to limit the utility model to the precise form disclosed, and any modifications, equivalents, and alternatives falling within the spirit and principles of the utility model are intended to be included within the scope of the utility model.
Claims (10)
1. A thick copper circuit board line pattern processing structure, the processing structure comprising: an insulating medium layer, wherein one surface of the insulating medium layer is provided with a thick copper circuit pattern;
the method is characterized in that a first dry film layer is arranged on the thick copper circuit pattern, and a second dry film layer is arranged on the first dry film layer;
a supplementary circuit pattern is arranged in the side area of the thick copper circuit pattern;
the second dry film layer is arranged on the supplementary circuit pattern;
the thickness of the supplemental wiring pattern is less than the thickness of the thick copper wiring pattern.
2. The thick copper circuit board wiring pattern processing structure according to claim 1, wherein the thickness of the supplemental wiring pattern is 1/3 to 1/2 of the thickness of the thick copper wiring pattern.
3. The thick copper circuit board wiring pattern processing structure of claim 1, wherein a thickness of the first dry film layer is less than a thickness of the second dry film layer.
4. The thick copper circuit board wiring pattern processing structure according to claim 1, wherein the width of the supplemental wiring pattern is 50 μm to 100 μm.
5. The thick copper circuit board wiring pattern processing structure as claimed in claim 4, wherein said supplemental wiring pattern is 50 μm to 127 μm from said thick copper wiring pattern.
6. The structure of claim 5, wherein the thick copper circuit pattern is more than one circuit pattern.
7. The thick copper circuit board wiring pattern processing structure of claim 6, wherein a gap between adjacent thick copper wiring patterns is less than 150 μm, and the gap between the thick copper wiring patterns is free of the supplemental wiring patterns.
8. The thick copper circuit board wiring pattern processing structure as claimed in claim 6, wherein a gap between adjacent thick copper wiring patterns is 150 μm or more.
9. The thick copper circuit board wiring pattern processing structure as claimed in claim 8, wherein a gap between adjacent ones of said thick copper wiring patterns is provided with one or two of said supplementary wiring patterns.
10. A thick copper circuit board wiring pattern processing structure according to any one of claims 1 to 9, wherein said thick copper circuit board wiring pattern processing structure is provided on the other surface of said insulating dielectric layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321145146.6U CN219660029U (en) | 2023-05-12 | 2023-05-12 | Circuit pattern processing structure of thick copper circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321145146.6U CN219660029U (en) | 2023-05-12 | 2023-05-12 | Circuit pattern processing structure of thick copper circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219660029U true CN219660029U (en) | 2023-09-08 |
Family
ID=87859729
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321145146.6U Active CN219660029U (en) | 2023-05-12 | 2023-05-12 | Circuit pattern processing structure of thick copper circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219660029U (en) |
-
2023
- 2023-05-12 CN CN202321145146.6U patent/CN219660029U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5461323B2 (en) | Manufacturing method of semiconductor package substrate | |
| US20220346217A1 (en) | Manufacturing method for pcb with thermal conductor embedded therein, and pcb | |
| JPWO2008146487A1 (en) | Circuit board and manufacturing method thereof | |
| JP2006332449A (en) | Multilayer printed wiring board and method for manufacturing the same | |
| US9894780B2 (en) | Method of manufacturing resin multilayer substrate | |
| TWI463928B (en) | Package substrate, package structure and methods for manufacturing same | |
| JP2002541680A (en) | Printed wiring board with metal core substrate for heat strengthening of ball grid array package and method of manufacturing the same | |
| CN104349570A (en) | Rigid-flexible-combined circuit board and manufacturing method thereof | |
| CN102573278A (en) | Multilayer wiring substrate | |
| CN110621123A (en) | Manufacturing method of heat-conducting PCB and PCB | |
| TW201410093A (en) | Rigid-flexible circuit substrate, rigid-flexible circuit board and method for manufacturing same | |
| JP2004087624A (en) | Process for manufacturing multilayer wiring board | |
| US7807215B2 (en) | Method of manufacturing copper-clad laminate for VOP application | |
| CN219660029U (en) | Circuit pattern processing structure of thick copper circuit board | |
| CN109195363B (en) | Manufacturing method of PCB (printed Circuit Board) interconnected in Z direction and PCB | |
| CN111465219A (en) | Circuit board processing method | |
| CN105764244A (en) | Circuit board and manufacturing method thereof | |
| TW201336367A (en) | Printed circuit board and method for manufacturing same | |
| JP4033157B2 (en) | Conducting path forming method | |
| KR100803960B1 (en) | Package on package substrate and the manufacturing method thereof | |
| KR20100097913A (en) | Printed-circuit-board including buried pattern and method for fabricating the same | |
| US20220322534A1 (en) | Circuit board, method for manufacturing circuit board, and electronic device | |
| CN103635007A (en) | Rigid-flexible circuit substrate, rigid-flexible circuit board and manufacturing method thereof | |
| JP2011040648A (en) | Method of manufacturing circuit board, and the circuit board | |
| CN215420914U (en) | Low-cost PCB board laminated structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |