CN219659898U - double-DSP and multi-frequency division household KTV sound circuit structure - Google Patents
double-DSP and multi-frequency division household KTV sound circuit structure Download PDFInfo
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- CN219659898U CN219659898U CN202320901860.7U CN202320901860U CN219659898U CN 219659898 U CN219659898 U CN 219659898U CN 202320901860 U CN202320901860 U CN 202320901860U CN 219659898 U CN219659898 U CN 219659898U
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Abstract
The utility model relates to a double-DSP and multi-frequency division household KTV sound circuit structure, wherein a wireless microphone receiving circuit is connected with a wireless microphone and a first DSP processing circuit, and the first DSP processing circuit is connected with a high-pitch frequency division circuit and a medium-pitch frequency division circuit; the wired audio input circuit is connected with the high-pitch frequency dividing circuit and the medium-pitch frequency dividing circuit through the second DSP processing circuit; the Gao Yingong discharge circuit is respectively connected with the high-pitch frequency division circuit and the high-pitch loudspeaker, and the midrange power amplifier circuit is connected with the midrange frequency division circuit and the midrange loudspeaker; the first DSP processing circuit and the second DSP processing circuit are connected with a wireless audio transmitting circuit which is connected with a wireless audio receiving circuit; the wireless audio receiving circuit is connected with the woofer through the bass frequency dividing circuit and the bass power amplifier circuit. The wireless low-audio frequency playing device has the advantages that the wired audio frequency input end and the wireless audio frequency input end are respectively and independently processed by the corresponding DSP processing circuit, the wired audio frequency input end and the wireless audio frequency input end are not mutually influenced, the wireless low-audio frequency playing is realized, the long-distance low-audio frequency playing can be realized, and the flexibility and the practicability are good.
Description
Technical Field
The utility model relates to the technical field of household KTV sound circuit structures, in particular to a household KTV sound circuit structure with double DSPs and multiple frequency dividers.
Background
KTV, in a narrow sense, is understood to be: provide the place of karaoke audio-visual equipment and video space.
The main business of karaoke and providing wine services is in the broad sense a nighttime casino. KTV can also be said to be a small-size singing bar of family type, can dance, singing can also drink wine, is first choice to small-size party, and the stereo set makes the very important electrical apparatus in the KTV.
Existing home KTV sound systems have some drawbacks, such as: whether the wireless microphone or the limited microphone is processed by only one dsp processing chip, and bass is played through a loudspeaker after frequency division and power amplification through a wire, so that long-distance playing is difficult to realize, and the flexibility is poor.
Accordingly, in the present application, the applicant has studied a circuit structure of a dual DSP and multi-frequency division home type KTV audio system to solve the above problems.
Disclosure of Invention
Aiming at the defects of the prior art, the utility model mainly aims at providing a double-DSP and multi-frequency division household KTV sound circuit structure, which enables a wired audio input end and a wireless audio input end to be respectively and independently processed by a corresponding DSP processing circuit, and the wired audio input end and the wireless audio input end are not mutually influenced; the wireless low-audio playing is realized, the long-distance low-audio playing can be realized, and the flexibility and the practicability are good.
In order to achieve the above purpose, the present utility model adopts the following technical scheme:
a family type KTV sound circuit structure with double DSPs and multiple frequency divisions comprises a wireless microphone, a wireless microphone receiving circuit, a first DSP processing circuit, a high-pitch frequency division circuit, a Gao Yingong amplifying circuit, a high-pitch loudspeaker, a medium-pitch frequency division circuit, a medium-pitch power amplification circuit, a medium-pitch loudspeaker, a wireless audio transmitting circuit, a wireless audio receiving circuit, a wired audio input circuit, a second DSP processing circuit, a low-pitch power amplification circuit, a low-pitch loudspeaker and a low-pitch frequency division circuit for low-pitch amplification and frequency division;
the wireless microphone receiving circuit is respectively connected with the wireless microphone and the first DSP processing circuit, and the first DSP processing circuit is respectively connected with the high-pitch frequency dividing circuit and the middle-pitch frequency dividing circuit;
the wired audio input circuit is connected with a second DSP processing circuit, and the second DSP processing circuit is respectively connected with a high-pitch frequency dividing circuit and a medium-pitch frequency dividing circuit;
the Gao Yingong discharge circuit is respectively connected with the high-pitch frequency division circuit and the high-pitch loudspeaker, and the midrange power amplifier circuit is respectively connected with the midrange frequency division circuit and the midrange loudspeaker;
the first DSP processing circuit and the second DSP processing circuit are respectively connected with a wireless audio transmitting circuit, and the wireless audio transmitting circuit is in wireless connection with the wireless audio receiving circuit;
the wireless audio receiving circuit is connected with the bass frequency dividing circuit, and the bass frequency dividing circuit is connected with the woofer through the bass power amplifier circuit.
As a preferred solution, the wired audio input circuit includes an AUX input circuit, a USB input circuit, an optical fiber input circuit, a coaxial input circuit, and an HDMI input circuit, where the AUX input circuit, the USB input circuit, the optical fiber input circuit, the coaxial input circuit, and the HDMI input circuit are respectively connected to the second DSP processing circuit.
As a preferable scheme, the intelligent control system further comprises a display screen and a remote controller, wherein the display screen and the remote controller are respectively connected with the second DSP processing circuit.
As a preferable scheme, the power supply circuit also comprises a DC/DC power supply circuit for supplying power, wherein the DC/DC power supply circuit consists of a chip U1 with the model of TD2786 and the periphery thereof.
As a preferable scheme, the second DSP processing circuit is composed of a chip U3 with a built-in DSP and bluetooth chip and its periphery.
As a preferred solution, the midrange frequency divider circuit is composed of a chip U15 of model WS742133 and its periphery, and the high-range frequency divider circuit is composed of a chip U16 of model WS742133 and its periphery.
As a preferable scheme, the midrange power amplifier circuit is composed of a chip U13 with the model number of TPA3116D2 and the periphery thereof, and the Gao Yingong power amplifier circuit is composed of a chip U14 with the model number of TPA3116D2 and the periphery thereof.
Compared with the prior art, the utility model has obvious advantages and beneficial effects, in particular: the wireless microphone is characterized in that a wired audio input circuit and a second DSP processing circuit are connected and matched with a wireless microphone receiving circuit to be connected with a first DSP processing circuit, so that the wired audio input end and the wireless audio input end are respectively and independently processed by a corresponding DSP processing circuit, and the wired audio input end and the wireless audio input end are not influenced by each other; particularly, the wireless low-audio frequency is played through the wireless audio frequency transmitting and receiving circuit, so that the long-distance low-audio frequency can be played, and the flexibility and the practicability are good;
secondly, the wireless audio transmitting and receiving circuits are in a frequency band switchable mode, so that the serial frequency of KTV sound of a user and KTV sound of adjacent families can be avoided, and the stability and reliability in the use process are ensured;
and the whole circuit structure is ingenious and reasonable in design, and has good reliability and stability.
In order to more clearly illustrate the structural features and efficacy of the present utility model, a detailed description thereof will be given below with reference to the accompanying drawings and examples.
Drawings
FIG. 1 is a general control block diagram of an embodiment of the present utility model;
FIG. 2 is a schematic diagram of a DC/DC power supply circuit according to an embodiment of the utility model;
FIG. 3 is a schematic diagram of a second DSP processing circuit according to an embodiment of the utility model;
FIG. 4 is a schematic diagram of an HDMI input circuit according to an embodiment of the present utility model;
FIG. 5 is a schematic diagram of a coaxial input circuit in accordance with an embodiment of the present utility model;
FIG. 6 is a schematic diagram of a USB input circuit according to an embodiment of the present utility model;
FIG. 7 is a schematic diagram of a fiber optic input circuit according to an embodiment of the present utility model;
FIG. 8 is a schematic diagram of an AUX input circuit according to an embodiment of the present utility model;
FIG. 9 is a schematic diagram of a wireless audio transmission circuit according to an embodiment of the present utility model;
FIG. 10 is a schematic diagram of a midrange divider circuit according to an embodiment of the utility model;
FIG. 11 is a schematic diagram of a midrange power amplifier circuit according to an embodiment of the utility model;
FIG. 12 is a schematic diagram of a high-frequency divider circuit according to an embodiment of the present utility model;
FIG. 13 is a schematic diagram of a high-pitched power amplifier circuit according to an embodiment of the present utility model;
FIG. 14 is a schematic diagram of a first DSP processing circuit according to an embodiment of the utility model;
fig. 15 is a schematic diagram of a first wireless microphone circuit in accordance with an embodiment of the utility model;
fig. 16 is a schematic diagram of a second wireless microphone circuit in accordance with an embodiment of the utility model;
fig. 17 is a schematic diagram of a wireless microphone receiving circuit according to an embodiment of the utility model;
FIG. 18 is a schematic diagram of a bass power amplifier circuit according to an embodiment of the present utility model;
FIG. 19 is a schematic diagram of a bass divide circuit in accordance with an embodiment of the present utility model;
FIG. 20 is a schematic diagram of a wireless audio receiving circuit according to an embodiment of the present utility model;
fig. 21 is a schematic diagram of a band reception switching circuit according to an embodiment of the present utility model.
Reference numerals illustrate:
11. first wireless microphone
12. Second wireless microphone
13. Wireless microphone receiving circuit
14. First DSP processing circuit
211. AUX input circuit 212 and USB input circuit
213. Optical fiber input circuit 214, coaxial input circuit
215. HDMI input circuit
22. Second DSP processing circuit
23. Display screen 24 and remote controller
31. High-pitch frequency dividing circuit 32, gao Yingong discharging circuit
33. Tweeter
34. Midrange frequency division circuit 35 and midrange power amplifier circuit
36. Midrange loudspeaker
40. Wireless audio transmitting circuit
51. Wireless audio receiving circuit
52. Bass frequency dividing circuit
53. Bass power amplifier circuit
531. Bass power amplifier output circuit 532 and bass power supply circuit
54. A woofer.
Description of the embodiments
The utility model is further described below with reference to the drawings and detailed description.
As shown in fig. 1 to 21, a dual-DSP and multi-frequency-division household KTV sound circuit structure includes a wireless microphone, a wireless microphone receiving circuit 13, a first DSP processing circuit 14, a high-pitch frequency division circuit 31, a high-pitch power amplification circuit 32, a high-pitch horn 33, a medium-pitch frequency division circuit 34, a medium-pitch power amplification circuit 35, a medium-pitch horn 36, a wireless audio transmitting circuit 40, a wireless audio receiving circuit 51, a wired audio input circuit, a second DSP processing circuit 22, a low-pitch power amplification circuit 53, a low-pitch horn 54, and a low-pitch frequency division circuit 52 for low-pitch amplification and frequency division;
the wireless microphone receiving circuit 13 is connected to the wireless microphone and the first DSP processing circuit 14, respectively, in this embodiment, two wireless microphones are provided, which are respectively defined as a first wireless microphone 11 and a second wireless microphone 12, and the first wireless microphone 11 and the second wireless microphone 12 are connected to the wireless microphone receiving circuit 13, respectively.
As shown in fig. 15, the first wireless microphone 11 is composed of a chip U8 with a model KT0656M and its periphery; as shown in fig. 16, the second wireless microphone 12 is composed of a chip U11 of model KT0656M and its periphery. As shown in fig. 17, it is a wireless microphone receiving circuit 13.
The first DSP processing circuit 14 is respectively connected to the high-pitch frequency dividing circuit 31 and the middle-pitch frequency dividing circuit 34, and is configured to process a wireless audio signal from the wireless microphone and then respectively send the processed wireless audio signal to the high-pitch frequency dividing circuit 31 and the middle-pitch frequency dividing circuit 34. In this embodiment, as shown in fig. 14, the first DSP processing circuit 14 is composed of a chip U12 with a model KT0708E04 and its periphery.
The wired audio input circuit is connected to the second DSP processing circuit 22. In this embodiment, the wired audio input circuit includes an AUX input circuit 211, a USB input circuit 212, an optical fiber input circuit 213, a coaxial input circuit 214, and an HDMI input circuit 215, where the AUX input circuit 211, the USB input circuit 212, the optical fiber input circuit 213, the coaxial input circuit 214, and the HDMI input circuit 215 are respectively connected to the second DSP processing circuit 22.
In this embodiment, as shown in fig. 8, the AUX input circuit 211 is composed of electronic components J4, D5, D6, L13, L14, C35, C36, R6, R15, C14, C33, R10, and R12.
In the present embodiment, as shown in fig. 4, the HDMI input circuit 215 is composed of electronic components J2, R4, R5, L7, C7, L8, C9, R2, R3, L9, D22, R128, C8, R1, and R125.
In the present embodiment, as shown in fig. 5, the coaxial input circuit 214 is composed of electronic components RCA1, L31, C145, C139, D2, and R53.
In the present embodiment, as shown in fig. 6, the USB input circuit 212 is composed of electronic components USB1, D8, C31, C30, D7, L23, L30, L10, and C32.
In this embodiment, as shown in fig. 7, the optical fiber input circuit 213 is composed of electronic components ED9, C134, D4, L26, L27, C137 and C140.
The second DSP processing circuit 22 is connected to the high-pitch frequency dividing circuit 31 and the middle-pitch frequency dividing circuit 34, respectively; in this embodiment, as shown in fig. 3, the second DSP processing circuit 22 is composed of a chip U3 with a built-in DSP and bluetooth chip and its periphery.
The remote controller is characterized by further comprising a display screen 23, a remote controller 24 and a DC/DC power supply circuit for supplying power, wherein the display screen 23 and the remote controller 24 are respectively connected with the second DSP processing circuit 22. The remote control 24 is wirelessly connected to the bluetooth chip of the second DSP processing circuit 22. The treble, midrange or conversion band is implemented by the remote control 24. As shown in fig. 2, the DC/DC power supply circuit is composed of a chip U1 of model TD2786 and its periphery.
The Gao Yingong discharging circuit 32 is respectively connected to the tweeter frequency dividing circuit 31 and the tweeter 33, in this embodiment, as shown in fig. 12, the tweeter frequency dividing circuit 31 is composed of a chip U16 with model WS742133 and its periphery, as shown in fig. 13, and the Gao Yingong discharging circuit 32 is composed of a chip U14 with model TPA3116D2 and its periphery.
The midrange power amplifier circuit 35 is respectively connected with the midrange frequency divider circuit 34 and the midrange loudspeaker 36; in this embodiment, as shown in fig. 10, the midrange divider circuit 34 is composed of a chip U15 with model WS742133 and its periphery, and as shown in fig. 11, the midrange amplifier circuit 35 is composed of a chip U13 with model TPA3116D2 and its periphery.
The first DSP processing circuit 14 and the second DSP processing circuit 22 are respectively connected with a wireless audio transmitting circuit 40, and the wireless audio transmitting circuit 40 is wirelessly connected with a wireless audio receiving circuit 51;
in this embodiment, as shown in fig. 9, the wireless audio transmitting circuit 40 is composed of an integrated chip U4 and its periphery, an integrated chip U9 and its periphery, and an integrated chip U10 and its periphery, wherein the integrated chip U10 is a memory chip, and stores an a frequency band and a B frequency band, and when the frequency band needs to be switched, the integrated chip U4 switches by calling the corresponding frequency band of the integrated chip U10, so as to prevent the frequency from being in series with another sound. The integrated chip U9 is a voltage stabilizing chip for providing a voltage stabilizing power supply to the integrated chip U4. The integrated chip U4 is a wireless bass transmitting chip and is used for transmitting bass.
The wireless audio receiving circuit 51 is connected to the bass frequency dividing circuit 52.
In this embodiment, the wireless audio receiving circuit 51 includes a wireless audio receiving main circuit and a frequency band receiving switching circuit for switching the frequency band of the wireless audio receiving main circuit.
As shown in fig. 20, the wireless audio receiving main circuit is composed of an interface CON22, an integrated chip U24 and its periphery, the interface CON22 is used for connecting with a receiving antenna, the integrated chip U24 is a wireless bass receiving chip for receiving bass from the wireless audio transmitting circuit 40.
As shown in fig. 21, the frequency band receiving switching circuit is composed of an integrated chip U61 and its periphery, an integrated chip U112 and its periphery, and an integrated chip U111 and its periphery, wherein the integrated chip U61 is a memory chip, which stores a frequency band a and a frequency band B, and when the frequency band needs to be switched, the integrated chip U112 switches the corresponding frequency band of the integrated chip U61 by calling, so as to prevent the frequency band from being crossed with another sound. The integrated chip U111 is a voltage stabilizing chip for providing a voltage stabilizing power supply to the integrated chip U112. The integrated chip U112 is a control chip, when the frequency band needs to be switched, only the key SW1 needs to be pressed, the integrated chip U112 obtains the frequency band needing to be switched from the integrated chip U61, and then sends a control signal to the integrated chip U24.
The woofer frequency divider circuit 52 is connected to a woofer 54 through a woofer power amplifier circuit 53. In this embodiment, as shown in fig. 18, the bass power amplifier circuit 53 includes a bass power amplifier output circuit 531 and a bass power supply circuit 532 for supplying power to the bass power amplifier output circuit 531. The bass power amplifier output circuit 531 is composed of an interface CON4, an integrated chip U13 and the periphery thereof, the integrated chip U13 is a bass power amplifier output chip, and the interface CON4 is used for connecting with a woofer 54.
The bass power supply circuit 532 is composed of an interface CON1, an integrated chip U2 and its periphery, and an integrated chip U3 and its periphery. The integrated chip U3 is an LDO chip, the integrated chip U2 is a DC/DC chip, and the interface CON1 is used for connecting a power socket.
In this embodiment, as shown in FIG. 19, the bass frequency divider circuit 52 is composed of an operational amplifier U8-B, an operational amplifier U8-A, an operational amplifier U7-B, an operational amplifier U7-A and the periphery thereof.
The utility model is characterized in that the wired audio input circuit and the second DSP processing circuit are connected and matched with the wireless microphone receiving circuit to be connected with the first DSP processing circuit, so that the wired audio input end and the wireless audio input end are respectively and independently processed by a corresponding DSP processing circuit, and the wired audio input end and the wireless audio input end are not mutually influenced; particularly, the wireless low-audio frequency is played through the wireless audio frequency transmitting and receiving circuit, so that the long-distance low-audio frequency can be played, and the flexibility and the practicability are good;
secondly, the wireless audio transmitting and receiving circuits are in a frequency band switchable mode, so that the serial frequency of KTV sound of a user and KTV sound of adjacent families can be avoided, and the stability and reliability in the use process are ensured;
and the whole circuit structure is ingenious and reasonable in design, and has good reliability and stability.
The foregoing description is only of the preferred embodiments of the present utility model and is not intended to limit the technical scope of the present utility model, so that any minor modifications, equivalent changes and modifications made to the above embodiments according to the technical principles of the present utility model still fall within the scope of the technical solutions of the present utility model.
Claims (7)
1. A family type KTV sound circuit structure with double DSPs and multiple frequency division is characterized in that: the device comprises a wireless microphone, a wireless microphone receiving circuit, a first DSP processing circuit, a high-pitch frequency division circuit, a Gao Yingong amplifying circuit, a high-pitch loudspeaker, a medium-pitch frequency division circuit, a medium-pitch power amplification circuit, a medium-pitch loudspeaker, a wireless audio transmitting circuit, a wireless audio receiving circuit, a wired audio input circuit, a second DSP processing circuit, a low-pitch power amplification circuit, a low-pitch loudspeaker and a low-pitch frequency division circuit for low-pitch amplification and frequency division;
the wireless microphone receiving circuit is respectively connected with the wireless microphone and the first DSP processing circuit, and the first DSP processing circuit is respectively connected with the high-pitch frequency dividing circuit and the middle-pitch frequency dividing circuit;
the wired audio input circuit is connected with a second DSP processing circuit, and the second DSP processing circuit is respectively connected with a high-pitch frequency dividing circuit and a medium-pitch frequency dividing circuit;
the Gao Yingong discharge circuit is respectively connected with the high-pitch frequency division circuit and the high-pitch loudspeaker, and the midrange power amplifier circuit is respectively connected with the midrange frequency division circuit and the midrange loudspeaker;
the first DSP processing circuit and the second DSP processing circuit are respectively connected with a wireless audio transmitting circuit, and the wireless audio transmitting circuit is in wireless connection with the wireless audio receiving circuit;
the wireless audio receiving circuit is connected with the bass frequency dividing circuit, and the bass frequency dividing circuit is connected with the woofer through the bass power amplifier circuit.
2. The dual DSP and multi-frequency division home KTV audio circuit architecture of claim 1, wherein: the wired audio input circuit comprises an AUX input circuit, a USB input circuit, an optical fiber input circuit, a coaxial input circuit and an HDMI input circuit, wherein the AUX input circuit, the USB input circuit, the optical fiber input circuit, the coaxial input circuit and the HDMI input circuit are respectively connected with the second DSP processing circuit.
3. The dual DSP and multi-frequency division home KTV audio circuit architecture of claim 1, wherein: the intelligent control system also comprises a display screen and a remote controller, wherein the display screen and the remote controller are respectively connected with the second DSP processing circuit.
4. The dual DSP and multi-frequency division home KTV audio circuit architecture of claim 1, wherein: the power supply circuit also comprises a DC/DC power supply circuit for supplying power, wherein the DC/DC power supply circuit consists of a chip U1 with the model of TD2786 and the periphery thereof.
5. The dual DSP and multi-frequency division home KTV audio circuit architecture of claim 1, wherein: the second DSP processing circuit is composed of a chip U3 with a built-in DSP and a Bluetooth chip and the periphery thereof.
6. The dual DSP and multi-frequency division home KTV audio circuit architecture of claim 1, wherein: the middle-tone frequency division circuit consists of a chip U15 with the model of WS742133 and the periphery thereof, and the high-tone frequency division circuit consists of a chip U16 with the model of WS742133 and the periphery thereof.
7. The dual DSP and multi-frequency division home KTV audio circuit architecture of claim 1, wherein: the midrange power amplifier circuit is composed of a chip U13 with the model of TPA3116D2 and the periphery thereof, and the Gao Yingong amplifier circuit is composed of a chip U14 with the model of TPA3116D2 and the periphery thereof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320901860.7U CN219659898U (en) | 2023-04-19 | 2023-04-19 | double-DSP and multi-frequency division household KTV sound circuit structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320901860.7U CN219659898U (en) | 2023-04-19 | 2023-04-19 | double-DSP and multi-frequency division household KTV sound circuit structure |
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| Publication Number | Publication Date |
|---|---|
| CN219659898U true CN219659898U (en) | 2023-09-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320901860.7U Active CN219659898U (en) | 2023-04-19 | 2023-04-19 | double-DSP and multi-frequency division household KTV sound circuit structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219659898U (en) |
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2023
- 2023-04-19 CN CN202320901860.7U patent/CN219659898U/en active Active
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