CN219658688U - Chip packaging structure - Google Patents

Abstract

The utility model relates to a chip packaging structure, which comprises a packaging shell and a plurality of electric connection modules, wherein each electric connection module is embedded on the outer surface of the packaging shell and comprises a shell, an elastic piece and a conductive piece; the housing is provided with a containing cavity which is provided with an open end and a closed end which are oppositely arranged in a first direction; the elastic piece is accommodated in the accommodating cavity; the conductive piece is positioned on one side of the elastic piece, which faces the opening end; the elastic piece can be deformed in a recoverable mode in the first direction under the action of external force, so that the conductive piece stretches out of or contracts into the accommodating cavity in the first direction, the chip packaging structure abandons the traditional lead out of the package to realize electric connection, a plurality of electric connection modules are designed, under the scenes of chip testing and the like, the electric connection modules can be inserted into the test seat, the conductive piece is abutted to the test seat under the action of the elastic piece, the chip is quickly fixed under the condition that welding is not needed, and the chip can be electrically connected with the test seat.

Description

Chip packaging structure

Technical Field

The utility model relates to the technical field of semiconductor packaging, in particular to a novel chip packaging structure.

Background

Chip packaging, which is a shell for mounting a semiconductor integrated circuit chip, plays roles of placing, fixing, sealing, protecting the chip and enhancing electric heating performance, is a bridge for communicating the world inside the chip with an external circuit, and along with the development of semiconductor technology, the integrated circuit packaging technology is also continuously and iteratively developed, but the research on the chip packaging technology in the prior art is mostly focused on the directions of packaging area and chip area ratio, the number of pins, the spacing and the like, and the improvement research on the pins of the chip packaging structure is often omitted.

On the other hand, in the stage of chip packaging test, in the prior art, the chip is usually fixed by welding the chip pins on the test board, and when the chip needs to be taken down from the test board, on one hand, the packaging shell can be possibly damaged, and on the other hand, the operation difficulty is high; in addition, in the prior art, the package chip is fixed in the test seat by means of a fixture, for example, the patent document with the authorized publication number of CN214473746U provides an integrated circuit package testing device with good heat dissipation performance, in order to realize a soldering-free fixing chip, the integrated circuit soldering-free testing is realized by designing the device structure, obviously, the patent document is not focused on the improved design of the chip package, which is an independent and important ring in the semiconductor technical field, and the problem faced in the design is completely different from the fixture design or the design of the testing device, so that the structural improvement of the fixture or the testing device itself cannot provide any indication for the structural design of the chip package, and the fixture and other devices are relatively complex, occupy large space, inconvenient to carry and use, and cannot be suitable for the soldering-free fixing test of the chip in the display stage after the chip design is researched.

Therefore, how to realize the welding-free fixing test of the chip at least in the chip test stage or the display stage after the design of the scientific research chip by improving the chip packaging structure.

Disclosure of Invention

Based on this, it is necessary to provide a novel chip packaging structure for solving the technical problems that the packaging shell needs to be welded when in use, and the packaging shell is inconvenient to detach and install rapidly in the prior art.

The utility model provides a chip packaging structure, includes encapsulation casing and a plurality of electric connection module, every electric connection module all inlays to be located encapsulation casing's surface, every electric connection module includes: a housing having a receiving chamber with an open end and a closed end disposed opposite in a first direction; the elastic piece is accommodated in the accommodating cavity; and a conductive member located at a side of the elastic member facing the opening end; the elastic piece can be subjected to recoverable deformation in the first direction under the action of external force, so that the conductive piece stretches out of or retracts into the accommodating cavity along the first direction.

In one embodiment, the conductive member is spherical.

In one embodiment, the electrical connection module further includes a buffer member disposed between the elastic member and the conductive member.

In one embodiment, the surface of the buffer member facing the conductive member is provided with an arc surface having a curvature, and the metal ball can rotate in the arc surface.

In one embodiment, the conductive member has a hemispherical shape, a side surface of the conductive member facing the elastic member is a round surface, and a side surface of the conductive member facing away from the elastic member is a hemispherical surface.

In one embodiment, the edge of the opening of the receiving cavity is bent inwardly to cover the conductive member in a direction from the closed end toward the open end.

In one embodiment, the elastic member is a metal spring or a metal elastic sheet.

In one embodiment, a sliding groove extending along the first direction is formed in the cavity wall of the accommodating cavity, and the electric connection module further comprises a sliding block, wherein the sliding block is embedded in the sliding groove and can move back and forth along the first direction relative to the sliding groove; the sliding piece is matched and connected with the sliding block to move synchronously with the sliding block.

In one embodiment, the package housing includes a mounting surface and a side surface extending from the mounting surface in the same direction, the side surface circumferentially surrounds the mounting surface, the mounting surface is used for mounting a chip, and the electrical connection module is disposed on the side surface.

In one embodiment, all of the electrical connection modules are spaced apart along the circumference of the mounting surface.

Above-mentioned chip packaging structure has abandoned traditional lead wire realization electricity connection of drawing forth in the encapsulation, but has inlayed at the surface of encapsulation casing and has been equipped with a plurality of electric connection module, and every electric connection module all including being equipped with the shell that holds the chamber and acceping in holding the intracavity, still be equipped with the electrically conductive piece in the one end of elastic piece, when show after chip test or scientific research chip design, above-mentioned electric connection module can insert in the test seat, the electrically conductive piece butt is in the test seat under the effect of elastic piece, realize the quick fixed of chip under the circumstances that need not to can also realize being connected with the test seat electricity.

Drawings

FIG. 1 is a schematic diagram of an appearance of a chip package according to an embodiment of the utility model;

FIG. 2 is a schematic diagram of an electrical connection module of a chip package according to an embodiment of the present utility model;

reference numerals:

1. packaging the shell; 11. a side surface; 2. an electrical connection module; 21. a housing; 22. a receiving chamber; 221. necking; 222. a closed end; 23. an elastic member; 24. a conductive member; 25. buffer member

Detailed Description

In order that the above objects, features and advantages of the utility model will be readily understood, a more particular description of the utility model will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model. The present utility model may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the utility model, whereby the utility model is not limited to the specific embodiments disclosed below.

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present utility model, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.

In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present utility model, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.

Fig. 1 is a schematic diagram of a chip package structure according to an embodiment of the present utility model, including a package housing 1 and a plurality of electrical connection modules 2, wherein each electrical connection module 2 is embedded on an outer surface of the package housing 1, so as to replace a conventional pin (i.e. a wire led out from an internal circuit of an integrated circuit (chip) to a peripheral circuit), and to enable the package housing to be quickly assembled and disassembled on a test seat without soldering while electrically connecting the internal circuit and the external circuit.

Specifically, the package housing 1 includes a mounting surface and a side surface 11 extending in the same direction from an edge of the mounting surface, the side surface 11 circumferentially surrounds the mounting surface, a chip is mounted on the mounting surface, and the electrical connection module 2 is embedded in the side surface 11 and electrically connected to the chip inside the package housing 1 to function to transmit an electrical signal of the chip. In some embodiments, the package housing 1 is in a cube-shaped structure, the mounting surface is a rectangular plane, the side surface includes four planes extending from four edges of the mounting surface towards a direction perpendicular to the mounting surface, and the four planes of the side surface 11 are embedded with a plurality of electrical connection modules 2, and the plurality of electrical connection modules 2 are arranged around the mounting surface at intervals, and the number of specific electrical connection modules 2 and the intervals between the electrical connection modules 2 can be correspondingly set according to actual needs.

Referring to fig. 2, the electrical connection module 2 includes a housing 21, an elastic member 23 and a conductive member 24 accommodated in the housing 21. In some embodiments, the housing 21 is formed to extend in a first direction (X direction as shown in fig. 2) with reference to a circular surface, and the radius of the circular surface decreases in the first direction, and takes a "horn" shape with a wide lower and a narrow upper portion surrounding an axis passing through the center of the circular surface. A housing chamber 22 is provided in the housing 21 with the axis as a center line, the housing chamber 22 has a cylindrical shape, the housing chamber 22 has an open end and a closed end 222 disposed opposite to each other in a first direction, and the closed end 222 is located at a large end of the housing 21, and the open end is located at a small end of the housing 21.

The elastic member 23 is accommodated in the accommodating cavity 22 and is located at the closed end 222, and the conductive member 24 is disposed at a side of the elastic member 23 facing the open end. The elastic member 23 is capable of being deformed in a first direction by an external force so that the conductive member 24 is protruded or retracted into the accommodating chamber 22 in the first direction. When the conductive member 24 extends out of the accommodating cavity 22 along the first direction, the conductive member 24 abuts against the test socket outside the accommodating cavity 22, so as to fix the package housing. When the conductive member 24 is retracted into the accommodating cavity 22 along the first direction, the package housing can be quickly detached, so that the chip can be conveniently and quickly replaced in the stages of chip testing and the like.

In some embodiments, in the direction from the closed end 222 to the open end, the edge of the opening of the accommodating cavity 22 is bent and extended inwards to form a shrinkage 221 to cover the conductive member 24, so as to prevent the conductive member 24 from completely separating from the accommodating cavity 22 under the action of the elastic member 23, and the edge of the opening of the accommodating cavity 22 is pressed to form the shrinkage 221 by a rolling bed, and the degree of bending can be determined according to practical needs.

In some embodiments, the conductive member 24 is spherical, and the electrical connection module 2 further includes a buffer member 25, where the buffer member 25 is made of a conductive material and is disposed between the elastic member 23 and the spherical conductive member 24. In some embodiments, the buffer member 25 is plate-shaped and is disposed at one end of the elastic member 23 near the spherical conductive member 24 along the first direction, the elastic member 23 and the spherical conductive member 24 are separated, the surface of the buffer member 25 facing the spherical conductive member 24 is provided with a cambered surface with curvature, the spherical conductive member 24 can rotate and roll in the cambered surface, at this time, the contact mode of the conductive member 24 and the test seat outside the accommodating cavity 22 is point contact, so as to facilitate quick activation operation, and the sliding friction between the package housing 1 and the test seat can be converted into rolling friction, so that protection is provided for the package housing 1, and meanwhile, when the package housing is assembled and disassembled to the test seat, the package housing can be disassembled and assembled quickly by the cooperation of the elastic member 23 and the conductive member 24 without additionally adding a limiting member. In some embodiments, the conductive member 24 comprises a metal ball.

In some embodiments, the conductive element 24 has a hemispherical shape, a side surface 11 of the conductive element 24 facing the elastic element 23 is a round surface, a side surface 11 of the conductive element 24 facing away from the elastic element 23 is a hemispherical surface, the round surface of the conductive element 24 is directly connected with the elastic element 23, stability of the conductive element 24 in the accommodating cavity 22 is enhanced, and all elastic forces directly act on the conductive element 24. In some embodiments, the elastic member 23 is a metal spring or a metal elastic sheet.

The above-described limitation of the shape of the conductive member 24 is only used as a preferred example, and does not limit the technical scope of the present utility model. It will be appreciated that in other embodiments, the conductive member 24 may be formed in a non-spherical or semi-spherical shape, and is not limited herein.

Besides directly providing the elastic member 23 to the conductive member 24 to enable the conductive member 24 to extend or retract into the accommodating cavity 22 along the first direction, so as to realize the disassembly and assembly of the package shell, some embodiments of the present utility model further provide a technical solution, in which two opposite sides of the cavity wall of the accommodating cavity 22 are provided with sliding grooves extending along the first direction, the electrical connection module 2 further includes a slider, which is embedded in the sliding grooves and can reciprocate along the first direction relative to the sliding grooves, and the slider is coupled to the slider to move synchronously with the slider, in some embodiments, the elastic members 23 are respectively provided in the sliding grooves, so that the distribution of the elastic force is more uniform, and the stability of the conductive member 24 extending out of or retracting into the accommodating cavity 22 along the first direction is enhanced. In some embodiments, a stop is provided in the chute to allow the conductive member 24 to extend or retract into the receiving cavity 22 in a first direction by controlling the state of operation of the stop.

The chip packaging structure provided by the utility model has ingenious structural design, excessive extra load is not brought to the packaging shell, and the containing cavity with the open end can also play a role in heat dissipation to a certain extent. In the use process, the conductive piece 24 is extruded to fully or partially enter the accommodating cavity 22, and the elastic piece 23 props against the conductive piece 24 when the conductive piece reaches the assembly position, so that the whole packaging shell is tightly contacted with an external device, and the conductive piece is directly taken out when the conductive piece is required to be detached after the use is finished.

The chip packaging structure is particularly suitable for the improved design of the traditional packaging shell such as the CLCC ceramic packaging shell or the JLCC ceramic packaging shell, aims at improving the chip packaging, replaces the pins of the traditional packaging shell, realizes the welding-free quick assembly and disassembly packaging shell on the basis of not influencing the yield and the characteristics of the chip, and improves the service efficiency of the chip packaging shell in the application scenes such as FT test.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above examples illustrate only a few embodiments of the utility model, which are described in detail and are not to be construed as limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.

Claims (10)

1. The utility model provides a chip packaging structure which characterized in that, includes encapsulation casing and a plurality of electric connection module, every electric connection module all inlays and locates the surface of encapsulation casing, every electric connection module includes:

a housing having a receiving chamber with an open end and a closed end disposed opposite in a first direction;

the elastic piece is accommodated in the accommodating cavity; and

a conductive member located at a side of the elastic member facing the opening end;

the elastic piece can be subjected to recoverable deformation in the first direction under the action of external force, so that the conductive piece stretches out of or retracts into the accommodating cavity along the first direction.

2. The chip package structure of claim 1, wherein the conductive member is spherical.

3. The chip package structure of claim 2, wherein the electrical connection module further comprises a buffer member disposed between the elastic member and the conductive member.

4. The chip package structure according to claim 3, wherein a surface of the buffer member facing the conductive member is a cambered surface having a curvature, and the conductive member is capable of rotating in the cambered surface.

5. The chip package structure according to claim 1, wherein the conductive member has a hemispherical shape, a surface of the conductive member facing the elastic member is a circular surface, and a surface of the conductive member facing away from the elastic member is a hemispherical surface.

6. The chip package structure according to claim 1, wherein an edge of an opening of the accommodation chamber is bent and extended inward to cover the conductive member in a direction from the closed end toward the open end.

7. The chip package structure of claim 1, wherein the elastic member is a metal spring or a metal spring plate.

8. The chip packaging structure according to claim 1, wherein a cavity wall of the accommodating cavity is provided with a sliding groove extending along the first direction, and the electrical connection module further comprises a sliding block embedded in the sliding groove and capable of moving back and forth along the first direction relative to the sliding groove; the conductive piece is matched and connected with the sliding block to move synchronously with the sliding block.

9. The chip package structure according to claim 1, wherein the package housing includes a mounting surface and a side surface extending in the same direction from the mounting surface, the side surface circumferentially surrounds the mounting surface, the mounting surface is used for mounting a chip, and the electrical connection module is provided on the side surface.

10. The chip package structure of claim 9, wherein all of the electrical connection modules are disposed at intervals along a circumference of the mounting surface.