CN219642860U

CN219642860U - SMD (surface mounted device) patch type LED (light emitting diode) based on integrated die-top process

Info

Publication number: CN219642860U
Application number: CN202320383154.8U
Authority: CN
Inventors: 任文龙
Original assignee: Ningbo Hui Liang Photoelectric Co ltd
Current assignee: Ningbo Hui Liang Photoelectric Co ltd
Priority date: 2023-03-03
Filing date: 2023-03-03
Publication date: 2023-09-05
Anticipated expiration: 2033-03-03

Abstract

The utility model belongs to the field of SMD patch type LEDs, in particular to an SMD patch type LED based on a integrated die-top process, aiming at the problem that the conventional patch type LED needs to be subjected to die bonding and wire bonding manually before being placed into a die-top machine, the conventional patch type LED has the greatest influence on the production efficiency when being subjected to wire bonding and welding in manual calibration in the production process, the utility model provides a scheme which comprises a substrate, two groups of connecting plates are symmetrically arranged on one side of the substrate, the other side of the substrate is fixedly connected with a plug board, the plug board is positioned between the two groups of connecting plates, the two groups of connecting plates and the top of the plug board are respectively provided with a plurality of groups of connecting holes, and the positions of an inner frame and a shell can be prevented from being deviated through the insertion of welding pins in a through groove, so that the inner frame and the shell can be rapidly positioned when being welded and installed, and the problem that the production efficiency is most influenced when the conventional patch type LED is welded in the production process, the manual calibration patch type LED is welded is solved.

Description

SMD (surface mounted device) patch type LED (light emitting diode) based on integrated die-top process

Technical Field

The utility model relates to the technical field of SMD (surface mounted device) patch type LEDs, in particular to an SMD patch type LED based on a integrated die-top process.

Background

The LED lamp beads are LEDs for short, the production cost of the current lens covering process is high, the lens is required to be covered, the process is troublesome, the existing die top process is very mature, the production cost is low, long baking can be carried out by directly die top forming, the die top machine for covering the die strips is quite cheap, the manufacturing cost is greatly reduced, the die top process does not need lenses, the die strips are not needed, a bracket with fixed crystal welded wires is placed in the die top machine, the die is directly ejected for long baking, and the production efficiency is quite high;

the chip-type LED needs to be manually subjected to die bonding and wire bonding before being placed into a die-top machine, and the production efficiency is most affected when the chip-type LED is manually calibrated and subjected to wire bonding in the production process of the traditional chip-type LED.

In view of the above problems, the present document proposes an SMD patch LED based on a integrated die-top process.

Disclosure of Invention

The utility model provides an SMD patch type LED based on a integrated die-top process, which solves the defect that the production efficiency is most affected when the patch type LED is manually calibrated in the production process of the traditional patch type LED by manually fixing and welding wires to the patch type LED before the patch type LED is placed into a die-top machine in the prior art.

The utility model provides the following technical scheme:

SMD paster type LED based on integrated die top technology includes:

two groups of connecting plates are symmetrically arranged on one side of the base plate, a plugboard is fixedly connected to the other side of the base plate, the plugboard is positioned between the two groups of connecting plates, and a plurality of groups of connecting holes are formed in the tops of the two groups of connecting plates and the plugboard;

the locating ring, locating ring fixed connection is in the top of base plate, the top fixedly connected with LED chip of base plate, the LED chip is located the locating ring, the inside casing has been placed at the top of base plate, the inner wall of inside casing and the laminating of the outer wall of locating ring, the cover is equipped with the shell on the outer wall of inside casing, the bottom of inside casing and the bottom of shell symmetry respectively are connected with multiunit first leg and second leg.

In one possible design, the top of the substrate is symmetrically provided with a plurality of groups of first through grooves for accommodating the plurality of groups of first welding pins in a plugging manner, and the top of the substrate is symmetrically provided with a plurality of groups of second through grooves for accommodating the second welding pins.

In one possible design, the interior of the inner frame is filled with a sealant, and the inner wall of the inner frame is provided with an annular groove for accommodating the sealant.

In one possible design, the sealant is provided as a transparent epoxy sealant.

In one possible design, the housing is provided as a transparent PP plastic housing.

In one possible design, the substrate is provided as a thermally conductive copper sheet substrate.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the utility model as claimed.

According to the utility model, through the arrangement of the first welding leg, the second welding leg and the first through groove, the inner frame and the outer shell can be inserted into the through groove through the welding leg when being welded, so that the position of the inner frame and the outer shell can be prevented from being deviated, the inner frame and the outer shell can be positioned quickly when being welded and installed, the time for manual correction is saved, and the production efficiency is improved.

According to the utility model, the welding legs are inserted into the through grooves, so that the positions of the inner frame and the outer shell can be prevented from being deviated, the inner frame and the outer shell can be rapidly positioned when being welded and installed, and the problem that the production efficiency is most affected when the conventional patch type LED is welded by welding wires in the process of manually calibrating the patch type LED is avoided.

Drawings

Fig. 1 is a schematic diagram of a front view and a perspective structure of an SMD patch LED based on an integrated die-top process according to an embodiment of the present utility model;

fig. 2 is a schematic bottom perspective view of an SMD patch LED based on an integrated die-top process according to an embodiment of the present utility model;

fig. 3 is an exploded perspective view of an SMD patch LED based on an integrated die-top process according to an embodiment of the present utility model;

fig. 4 is a schematic diagram of a cross-sectional exploded perspective view of an SMD patch LED based on an integrated die-top process according to an embodiment of the present utility model.

Reference numerals:

1. a substrate; 2. a positioning ring; 3. an LED chip; 4. an inner frame; 5. an annular groove; 6. sealing glue; 7. a housing; 8. a first leg; 9. a second leg; 10. a first through groove; 11. a second through slot; 12. a connecting plate; 13. a plug board; 14. and a connection hole.

Detailed Description

Embodiments of the present utility model will be described below with reference to the accompanying drawings in the embodiments of the present utility model.

In describing embodiments of the present utility model, it should be noted that, unless explicitly stated and limited otherwise, the terms "coupled" and "mounted" should be interpreted broadly, and for example, "coupled" may or may not be detachably coupled; may be directly connected or indirectly connected through an intermediate medium. In addition, "communication" may be direct communication or may be indirect communication through an intermediary. Wherein, "fixed" means that the relative positional relationship is not changed after being connected to each other. References to orientation terms, such as "inner", "outer", "top", "bottom", etc., in the embodiments of the present utility model are merely to refer to the orientation of the drawings and, therefore, the use of orientation terms is intended to better and more clearly illustrate and understand the embodiments of the present utility model, rather than to indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be construed as limiting the embodiments of the present utility model.

In embodiments of the present utility model, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature.

In the embodiment of the present utility model, "and/or" is merely an association relationship describing an association object, and indicates that three relationships may exist, for example, a and/or B may indicate: a exists alone, A and B exist together, and B exists alone. In addition, the character "/" herein generally indicates that the front and rear associated objects are an "or" relationship.

Reference in the specification to "one embodiment" or "some embodiments" or the like means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the utility model. Thus, appearances of the phrases "in one embodiment," "in some embodiments," "in other embodiments," and the like in the specification are not necessarily all referring to the same embodiment, but mean "one or more but not all embodiments" unless expressly specified otherwise. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless expressly specified otherwise.

Example 1

Referring to fig. 1-4, an smd patch type LED includes:

two groups of connecting plates 12 are symmetrically arranged on one side of the base plate 1, a plugboard 13 is fixedly connected to the other side of the base plate 1, the plugboard 13 is positioned between the two groups of connecting plates 12, and a plurality of groups of connecting holes 14 are formed in the tops of the two groups of connecting plates 12 and the plugboard 13;

the locating ring 2, locating ring 2 fixed connection is in the top of base plate 1, and the top fixedly connected with LED chip 3 of base plate 1, LED chip 3 are located locating ring 2, and inside casing 4 has been placed at the top of base plate 1, and the inner wall of inside casing 4 is laminated with the outer wall of locating ring 2, and the cover is equipped with shell 7 on the outer wall of inside casing 4, and the bottom of inside casing 4 and the bottom of shell 7 symmetry respectively are connected with multiunit first weld leg 8 and second weld leg 9.

The technical scheme can achieve the technical effects that the two groups of connecting plates 12 and the plugboard 13 can be positioned when being connected between the two groups of patch type LEDs, the welding efficiency is improved through the plurality of groups of connecting holes 14, the inner frame 4 can be positioned through the positioning ring 2, and the LED chips 3 are protected.

Example 2

Referring to fig. 1-4, an SMD patch type LED based on an integrated die-top process, comprising:

the LED chip 3 is prepared by adopting a die-top process consistent with the bulletin number CN110854258B, the LED chip 3 is positioned in the positioning ring 2, an inner frame 4 is placed at the top of the substrate 1, the inner wall of the inner frame 4 is attached to the outer wall of the positioning ring 2, a shell 7 is sleeved on the outer wall of the inner frame 4, and a plurality of groups of first welding legs 8 and second welding legs 9 are symmetrically connected at the bottom of the inner frame 4 and the bottom of the shell 7 respectively.

Referring to fig. 3 and 4, a plurality of groups of first through grooves 10 for accommodating the plugging of the plurality of groups of first soldering legs 8 are symmetrically formed in the top of the substrate 1, and a plurality of groups of second through grooves 11 for accommodating the second soldering legs 9 are symmetrically formed in the top of the substrate 1.

The technical scheme can achieve the technical effects that the inner frame 4 and the outer shell 7 can be positioned in the through groove through the welding legs when being welded through the arrangement of the first welding legs 8, the second welding legs 9 and the first through groove 10 and the second through groove 11, and the position deviation is avoided.

Referring to fig. 3 and 4, the inner part of the inner frame 4 is filled with sealant 6, and an annular groove 5 for accommodating the sealant 6 is formed in the inner wall of the inner frame 4.

The technical scheme can achieve the technical effects that after the sealant 6 is filled in the inner frame 4 and solidified through the annular groove 5 formed in the inner frame 4, a circle of protruding blocks are added on the outer wall of the sealant 6, the sealant 6 can not be separated from the inner frame 4 through the protruding blocks, and the sealant is stably fixed in the inner frame 4.

Referring to fig. 3 and 4, the sealant 6 is provided as a transparent epoxy sealant.

The technical scheme can achieve the technical effects that the sealant 6 has excellent chemical resistance, better heat resistance and electrical insulation through the arrangement of transparent epoxy resin materials.

Referring to fig. 1-4, the housing 7 is provided as a transparent PP plastic housing.

The technical scheme can achieve the technical effects that the transparent PP plastic material is arranged, so that the light transmittance of the shell 7 is high, and the patch type LED can not be influenced by the shell 7 when being lightened.

Referring to fig. 1-4, the substrate 1 is provided as a thermally conductive copper sheet substrate.

The technical scheme can achieve the technical effect that the base plate 1 can conduct heat conduction and heat dissipation to the LED chip 3 through the arrangement of the heat conduction copper sheet material.

However, as well known to those skilled in the art, the working principle and the wiring method of the LED chip 3 are common, and they are all common in conventional means or common general knowledge, and will not be described herein in detail, and any choice may be made by those skilled in the art according to their needs or convenience.

The working principle and the using flow of the technical scheme are as follows:

in the production process, the second welding legs 9 of the inner frame 4 are aligned with the second through grooves 11 to be inserted into the substrate 1, then a plurality of groups of second welding legs 9 are welded on the substrate 1, then the inner frame 4 is filled with the sealant 6, after the sealant 6 is solidified, a plurality of groups of first welding legs 8 at the bottom of the outer shell 7 are aligned with the first through grooves 10 to be inserted into the substrate 1, the inner frame 4 is sleeved in the outer shell 7, and then a plurality of groups of first welding legs 8 are welded at the bottom of the substrate 1, so that the manual welding line welding process can be completed;

and through the arrangement of the first welding leg 8, the second welding leg 9 and the first through groove 10 and the second through groove 11, the inner frame 4 and the outer shell 7 can be positioned in the through groove through the welding leg in a plugging manner when being welded, and the position deviation is avoided.

The present utility model is not limited to the above embodiments, and any person skilled in the art can easily think about the changes or substitutions within the technical scope of the present utility model, and the changes or substitutions are intended to be covered by the scope of the present utility model; embodiments of the utility model and features of the embodiments may be combined with each other without conflict. Therefore, the protection scope of the utility model is subject to the protection scope of the claims.

Claims

1. SMD paster type LED based on integrated die top technology, its characterized in that includes:

two groups of connecting plates (12) are symmetrically arranged on one side of the base plate (1), a plugboard (13) is fixedly connected to the other side of the base plate (1), the plugboard (13) is positioned between the two groups of connecting plates (12), and a plurality of groups of connecting holes (14) are formed in the tops of the two groups of connecting plates (12) and the plugboard (13);

the locating ring (2), locating ring (2) fixedly connected with top of base plate (1), the top fixedly connected with LED chip (3) of base plate (1), LED chip (3) are located locating ring (2), inside casing (4) have been placed at the top of base plate (1), the inner wall of inside casing (4) is laminated with the outer wall of locating ring (2), the cover is equipped with shell (7) on the outer wall of inside casing (4), the bottom of inside casing (4) and the bottom of shell (7) symmetry respectively are connected with multiunit first leg (8) and second leg (9).

2. The SMD patch LED of claim 1 based on an integrated die-top process, wherein: the top of base plate (1) symmetry has seted up multiunit and is used for holding first lead-through groove (10) of multiunit first leg (8) grafting, the top of base plate (1) symmetry has seted up multiunit second lead-through groove (11) that are used for holding second leg (9).

3. The SMD patch LED based on integrated die top process of any of claims 1-2, characterized in that: the inner part of the inner frame (4) is filled with sealant (6), and an annular groove (5) for accommodating the sealant (6) is formed in the inner wall of the inner frame (4).

4. The SMD patch LED of claim 3 based on an integrated die-top process, wherein: the sealant (6) is transparent epoxy resin sealant.

5. The SMD patch LED of claim 1 based on an integrated die-top process, wherein: the shell (7) is a transparent PP plastic shell.

6. The SMD patch LED of claim 1 based on an integrated die-top process, wherein: the substrate (1) is arranged as a heat conducting copper sheet substrate.