CN219642810U - Electronic component and module - Google Patents

Electronic component and module Download PDF

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Publication number
CN219642810U
CN219642810U CN202190000657.1U CN202190000657U CN219642810U CN 219642810 U CN219642810 U CN 219642810U CN 202190000657 U CN202190000657 U CN 202190000657U CN 219642810 U CN219642810 U CN 219642810U
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China
Prior art keywords
electronic component
bump electrode
insulating film
signal
shielding film
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CN202190000657.1U
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Chinese (zh)
Inventor
冈部凉平
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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    • H—ELECTRICITY
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    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
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  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Wire Bonding (AREA)

Abstract

An electronic component (101) is provided with: an electronic component main body (1) having a first surface (1 a); a signal bump electrode (5) that is arranged on the first surface (1 a) of the electronic component body (1) so as to protrude from the first surface (1 a); and a protective film having an opening (2) that exposes a part of the signal bump electrode (5), and configured to cover a portion of the signal bump electrode (5) other than the portion exposed by the opening (2). The protective film includes: a first insulating film (7), a second insulating film (9) covering the first insulating film (7), and a first shielding film (8) disposed between the first insulating film (7) and the second insulating film (9). The first shielding film (8) is covered with at least one of the first insulating film (7) and the second insulating film (9) so that the first shielding film is not exposed on the inner surface of the opening (2).

Description

Electronic component and module
Technical Field
The utility model relates to an electronic component and a module.
Background
Japanese patent application laid-open No. 2008-108868 (patent document 1) describes a structure including protruding electrodes. A conductive layer is formed on the surface of a protrusion made of resin. The counter electrode provided on the substrate is pressed against the protruding electrode.
Japanese patent application laid-open No. 2009-59819 (patent document 2) describes a structure including a conductive terminal provided so as to protrude from a wiring layer.
Patent document 1: japanese patent laid-open No. 2008-108868
Patent document 2: japanese patent laid-open No. 2009-59819
A module is sometimes manufactured by mounting electronic components on a substrate. Signal wiring is arranged on a substrate of the module. Signal noise is generated from the signal wiring. Since the signal noise is generated from the signal wiring on the surface of the substrate, a shielding film is required to prevent the influence of the signal noise on the electronic component.
Disclosure of Invention
Accordingly, an object of the present utility model is to provide an electronic component and a module capable of shielding noise generated from a substrate.
In order to achieve the above object, an electronic component according to the present utility model includes: an electronic component main body having a first surface; a signal bump electrode protruding from the first surface of the electronic component main body and disposed on the first surface; and a protective film having an opening exposing a part of the signal bump electrode and configured to cover a part of the signal bump electrode other than the part exposed by the opening. The protective film includes: a first insulating film, a second insulating film covering the first insulating film, and a first shielding film interposed between the first insulating film and the second insulating film. The first shielding film is covered with at least one of the first insulating film and the second insulating film so that the first shielding film is not exposed on the inner surface of the opening.
In the electronic component according to the present utility model, the electronic component includes a ground bump electrode connected to a portion of the electronic component main body to be at a ground potential, the ground bump electrode being disposed so as to protrude from the first surface, and the first shielding film being electrically connected to the ground bump electrode.
In the electronic component according to the present utility model, a distance between an end of the first shielding film closest to the opening and the first surface is longer than a distance between a point of the signal bump electrode farthest from the first surface and the first surface.
In the electronic component according to the present utility model, when the signal bump electrode and the protective film are viewed from a direction perpendicular to the first surface, the signal bump electrode and the first shielding film have a portion overlapping with each other.
In the electronic component according to the present utility model, the electronic component main body has an upper surface and a side surface, and the upper surface and the side surface are covered with the second shielding film.
In order to achieve the above object, a module according to the present utility model includes: a substrate provided with a signal electrode and a ground electrode; and an electronic component in which the signal bump electrode exposed from the opening is electrically connected to the signal electrode, and the first shielding film is electrically connected to the ground electrode.
According to the present utility model, an electronic component capable of shielding noise generated from a substrate can be realized.
Drawings
Fig. 1 is a cross-sectional view of an electronic component according to embodiment 1 of the present utility model.
Fig. 2 is an enlarged view of the Z1 portion in fig. 1.
Fig. 3 is an enlarged partial cross-sectional view of the electronic component according to embodiment 2 of the present utility model.
Fig. 4 is a perspective plan view of a mounting surface of an electronic component according to embodiment 3 of the present utility model.
Fig. 5 is a cross-sectional view of a module according to embodiment 4 of the present utility model.
Fig. 6 is an enlarged view of the Z2 portion in fig. 5.
Fig. 7 is an explanatory diagram of a first step of the method for manufacturing an electronic component according to embodiment 5 of the present utility model.
Fig. 8 is an explanatory diagram of a second step of the method for manufacturing an electronic component according to embodiment 5 of the present utility model.
Fig. 9 is an explanatory diagram of a third step of the method for manufacturing an electronic component according to embodiment 5 of the present utility model.
Fig. 10 is an explanatory view of a first example of a fourth step of the method for manufacturing an electronic component according to embodiment 5 of the present utility model.
Fig. 11 is a first explanatory view of a second example of a fourth step of the method for manufacturing an electronic component according to embodiment 5 of the present utility model.
Fig. 12 is a second explanatory diagram of a second example of a fourth step of the method for manufacturing an electronic component according to embodiment 5 of the present utility model.
Fig. 13 is a third explanatory diagram of a second example of a fourth step of the method for manufacturing an electronic component according to embodiment 5 of the present utility model.
Fig. 14 is an explanatory diagram of a fifth step of the method for manufacturing an electronic component according to embodiment 5 of the present utility model.
Fig. 15 is an explanatory diagram of a sixth step of the method for manufacturing an electronic component according to embodiment 5 of the present utility model.
Fig. 16 is a cross-sectional view of a modification of an electronic component obtained by the method for manufacturing an electronic component according to embodiment 5 of the present utility model.
Fig. 17 is an explanatory diagram of a first step of the method for manufacturing an electronic component according to embodiment 6 of the present utility model.
Fig. 18 is an explanatory diagram of a second step of the method for manufacturing an electronic component according to embodiment 6 of the present utility model.
Fig. 19 is an enlarged view of the Z3 portion in fig. 18.
Reference numerals illustrate: 1 … electronic component body; 1a … first side; 2 … opening portions; 3 … parts; 5 … signal bump electrodes; 6 … ground bump electrodes; 7 … first insulating films; 8 … first shielding films; 18 … second shielding film; 9 … a second insulating film; 10 … substrate; 12 … signal wiring; 13 … ground wiring; 14 … ground via conductors; 15 … signal electrodes; 16 … ground electrode; 17 … signal via conductors; 20 … sealing resin; 21. 22 … solder; 25 … inkjet nozzles; 26 … resin droplets; 27 … sacrificial layer; 28 … photomask; 29 … laser; 91 … (representing the propagation of noise); 101. 102, 103, 104 … electronic components; 201 … module.
Detailed Description
The dimensional ratios shown in the drawings are not necessarily expressed faithfully in reality, and may be exaggerated for convenience of explanation. In the following description, when referring to the concept of up or down, it is not limited to mean absolute up or down, but may mean relative up or down in the illustrated posture.
(embodiment 1)
An electronic component according to embodiment 1 of the present utility model will be described with reference to fig. 1 to 2. Fig. 1 shows a cross-sectional view of an electronic component 101 in the present embodiment. Fig. 2 shows an enlarged view of the Z1 portion in fig. 1.
The electronic component 101 includes: an electronic component main body 1 having a first surface 1a; the signal bump electrode 5 is arranged protruding from the first surface 1a of the electronic component main body 1 on the first surface 1a; and a protective film having an opening 2 exposing a part of the signal bump electrode 5 and configured to cover a part of the signal bump electrode 5 other than the part exposed by the opening 2. The protective film includes: a first insulating film 7, a second insulating film 9 covering the first insulating film 7, and a first shielding film 8 interposed between the first insulating film 7 and the second insulating film 9. The first shielding film 8 is covered with at least one of the first insulating film 7 and the second insulating film 9 so that the first shielding film 8 is not exposed to the inner surface of the opening 2. In the example shown here, the first surface 1a is a lower surface of the electronic component main body 1. The signal bump electrode 5 is an electrode provided for exchanging some kind of electrical signal. The signal bump electrode 5 may be formed of, for example, solder. The signal bump electrode 5 may be formed as a spherical electrode, for example.
As shown in fig. 1, the protective film is arranged to cover the side face of the signal bump electrode 5.
In the present embodiment, the signal bump electrode 5 is arranged on the first surface 1a, and therefore the first surface 1a can be said to be a mounting surface. A protective film is provided on the mounting surface, and the first shielding film 8 is included in the protective film, so that noise generated from the substrate can be shielded by the first shielding film 8. That is, an electronic component capable of shielding noise generated from the substrate can be realized. Further, since the first shielding film 8 is not exposed on the inner surface of the opening 2, it is possible to avoid a short circuit to the first shielding film 8 when the signal bump electrode 5 is electrically connected through the opening 2.
As shown in the present embodiment, the distance between the end of the first shielding film 8 closest to the opening 2 and the first surface 1a is preferably longer than the distance between the point of the signal bump electrode 5 farthest from the first surface 1a and the first surface 1 a. By adopting this structure, the signal bump electrode 5 can be shielded more reliably by the first shielding film 8.
As shown in the present embodiment, it is preferable that the signal bump electrode 5 and the first shielding film 8 have a portion overlapping each other when the signal bump electrode 5 and the protective film are viewed from a direction perpendicular to the first surface 1 a. By adopting this structure, the signal bump electrode 5 can be shielded more reliably.
(embodiment 2)
An electronic component according to embodiment 2 of the present utility model will be described with reference to fig. 3. Fig. 3 shows an enlarged partial cross-sectional view of the electronic component in the present embodiment. The electronic component according to the present embodiment has the structure described in embodiment 1 and further has the following structure.
The electronic component includes a ground bump electrode 6, and the ground bump electrode 6 is connected to a portion of the electronic component body 1 to be at a ground potential and is arranged to protrude from the first surface 1 a. The first shielding film 8 is electrically connected to the ground bump electrode 6. The ground bump electrode 6 may be formed of the same material as the signal bump electrode 5. The ground bump electrode 6 may be formed in the same shape as the signal bump electrode 5. However, unlike the signal bump electrode 5 provided for exchanging electric signals, the ground bump electrode 6 is provided for the purpose of becoming a ground potential.
In the electronic component of the present embodiment, the effects described in embodiment 1 can be obtained, and the portion of the electronic component body 1 to be the ground potential can be efficiently grounded by the ground bump electrode 6.
Embodiment 3
An electronic component according to embodiment 3 of the present utility model will be described with reference to fig. 4. Fig. 4 shows a case where the mounting surface of the electronic component 102 in the present embodiment is observed. In fig. 4, a perspective top view is shown for ease of illustration. That is, the first shielding film 8 is displayed in a state in which portions other than the first shielding film are removed from the protective film. Thus, in fig. 4, the first shielding film 8 is visible in many portions. The electronic component 102 has the structure described in embodiment 2 and also has the following structure.
The electronic component 102 has a square outer shape in a plan view. In the electronic component 102, a plurality of bump electrodes are annularly arranged along the outer edge. The plurality of bump electrodes includes a plurality of signal bump electrodes 5 and a plurality of ground bump electrodes 6. In each of the plurality of signal bump electrodes 5, the first shielding film 8 is isolated from the signal bump electrode 5. Among the plurality of ground bump electrodes 6, the first shielding film 8 is in contact with the ground bump electrode 6.
In this embodiment, the effects described in embodiment 2 can be obtained.
In the present embodiment, the external shape of the electronic component in plan view is described as a square, but this is merely an example. The outer shape of the electronic component in plan view may be another shape. The outer shape in plan view may be rectangular, polygonal, or the like, for example.
Embodiment 4
A module 201 according to embodiment 4 of the present utility model will be described with reference to fig. 5 to 6. Fig. 5 shows a cross-sectional view of a module 201 in the present embodiment. Fig. 6 shows an enlarged view of the Z2 portion in fig. 5.
The module 201 includes: a substrate 10 having a signal electrode 15 and a ground electrode 16, and an electronic component 103. The electronic component 103 is mounted on the substrate 10. A signal wiring 12 and a ground wiring 13 are arranged inside the substrate 10. The ground wiring 13 is connected to a ground electrode 16 provided on the surface of the substrate 10 via a ground via conductor 14. The signal bump electrode 5 of the electronic component 103 exposed from the opening 2 is electrically connected to the signal electrode 15 via the solder 21. The first shielding film 8 is electrically connected to the ground electrode 16 via solder 22. An opening is provided in the second insulating film 9 so that the first shielding film 8 is exposed. Solder 22 is arranged to fill the opening. The component 3 is also mounted on the surface of the substrate 10. A sealing resin 20 is disposed on the surface of the substrate 10 to cover the component 3 and the electronic component 103.
In the electronic component 103, the first shielding film 8 has a structure for electrically connecting to the ground electrode 16 disposed on the substrate 10 to which the electronic component 103 is mounted. The "structure for electrically connecting with the ground electrode 16" in this case refers to a portion exposed from the second insulating film 9. In the electronic component 103, as a "structure for electrically connecting to the ground electrode 16", the first shielding film 8 has a portion exposed for such connection.
In this embodiment, the effects described in embodiment 1 can be obtained. In the present embodiment, the first shielding film 8 and the portion of the substrate 10 at the ground potential can be connected to each other even at the portion where the bump electrode is not arranged.
In the module 201 of the present embodiment, when noise propagates as indicated by the arrow 91, the propagation of the noise to the electronic component main body 1 can be shielded by the first shielding film 8.
In the present embodiment, the signal bump electrode 5 is connected to the signal electrode 15 via the solder 21, but may be connected by using a conductive resin adhesive containing Cu, ag, or the like instead of the solder 21.
Here, the module 201 having the electronic component 103 is shown, but any of the electronic components described above may be provided instead of the electronic component 103. Any of the electronic components described above may be mounted on the surface of the substrate 10. In addition, a plurality of electronic components may be included in one module. Different kinds of electronic components may be combined and mounted on the surface of the common 1-piece substrate.
Embodiment 5
A method for manufacturing an electronic component according to embodiment 5 of the present utility model will be described with reference to fig. 7 to 15.
The method for manufacturing an electronic component according to the present embodiment includes the steps of: preparing a first structure including an electronic component main body having a first surface, and a signal bump electrode protruding from the first surface of the electronic component main body and disposed on the first surface; forming a first insulating film to cover the first surface of the first structure and the signal bump electrode; forming a first shielding film to cover the first insulating film; grinding to expose a part of the signal bump electrode; disposing a sacrificial layer to cover the exposed portion of the signal bump electrode; forming a second insulating film to cover the first shielding film and the sacrificial layer; and removing the sacrificial layer and a portion of the second insulating film overlapping the sacrificial layer to partially expose the signal bump electrode.
The steps of the production method will be described in detail below with reference to the drawings.
First, a first structure including an electronic component body 1 having a first surface 1a and signal bump electrodes 5 arranged on the first surface 1a so as to protrude from the first surface 1a of the electronic component body 1 is prepared.
Next, as shown in fig. 7, a first insulating film 7 is formed to cover the first face 1a of the first structure and the signal bump electrode 5. As shown in fig. 8, a first shielding film 8 is formed to cover the first insulating film 7. As shown in fig. 9, grinding is performed so that a part of the signal bump electrode 5 is exposed.
Next, as shown in fig. 10, a sacrificial layer 27 is disposed so as to cover the exposed portions of the signal bump electrodes 5. In fig. 10, as a first example of this step, the sacrificial layer 27 is formed by an inkjet method. That is, the resin droplets 26 are discharged from the inkjet nozzles 25. The sacrificial layer 27 is formed by attaching the resin droplets 26 to a desired region. In this way, by adopting the inkjet method, the sacrifice layer 27 can be formed so as to cover the exposed portion of the signal bump electrode 5.
As a second example of this step, as shown in fig. 11 to 13, a photolithography method may be used. In this case, as the sacrifice layer 27, a photoresist material is used. First, as shown in fig. 11, the sacrifice layer 27 is formed so as to cover the entire area of the mounting surface. The exposed portions of the signal bump electrodes 5 are also covered with the sacrificial layer 27. As shown in fig. 12, a photomask 28 is superimposed and a laser beam 29 is irradiated. An opening is provided in the photomask 28 so as to correspond to the exposed region of the signal bump electrode 5. The laser light 29 is incident on the sacrifice layer 27 through the opening. The sacrificial layer 27 is locally exposed at this portion. As shown in fig. 13, the photomask 28 is removed, and the portions of the sacrificial layer 27 other than the exposed portions are removed. This can be done by immersion in a developer solution. Arrows in fig. 13 indicate the supply of the developer. Thus, as shown in fig. 13, the sacrifice layer 27 can be formed so as to cover the exposed portion of the signal bump electrode 5.
In the case where the sacrifice layer 27 is formed in either of the first example and the second example, next, as shown in fig. 14, the second insulating film 9 is formed so as to cover the first shielding film 8 and the sacrifice layer 27.
Next, as shown in fig. 15, the signal bump electrode 5 is partially exposed by removing the sacrificial layer 27 and the portion of the second insulating film 9 overlapped with the sacrificial layer 27. In order to remove the sacrifice layer 27, for example, the second insulating film 9 may be subjected to grinding until the sacrifice layer 27 is exposed, and then the sacrifice layer 27 may be removed by using an aqueous alkali solution, acetone, or another organic solvent. Thus, the electronic component 104 can be obtained.
According to the manufacturing method of the present embodiment, an electronic component having the structure described in embodiment 1 can be obtained. That is, an electronic component capable of shielding noise generated from the substrate can be obtained.
Further, as shown in fig. 16, the second shielding film 18 may be formed so as to cover the upper surface and the side surfaces of the electronic component main body 1. By adopting this structure, the second shielding film 18 can shield the electronic component main body 1 from the electromagnetic waves above and laterally. Therefore, noise can be prevented more reliably. Noise reaching the electronic component main body 1 can be prevented, and noise coming out of the electronic component main body 1 can also be prevented.
Embodiment 6
A method for manufacturing an electronic component according to embodiment 6 of the present utility model will be described with reference to fig. 7 to 9 and fig. 17 to 19.
The method for manufacturing an electronic component according to the present embodiment includes the steps of: preparing a first structure including an electronic component main body having a first surface, and bump electrodes protruding from the first surface of the electronic component main body and arranged on the first surface; forming a first insulating film to cover the first surface of the first structure and the signal bump electrode; forming a first shielding film to cover the first insulating film; grinding to expose a part of the signal bump electrode; forming a second insulating film to cover the first shielding film and the exposed portion of the signal bump electrode; and partially removing the second insulating film by laser processing to partially expose the signal bump electrode.
The steps of the production method will be described in detail below with reference to the drawings.
In this manufacturing method, the steps up to the steps shown in fig. 7 to 9 are the same as those described in embodiment 5. That is, as shown in fig. 9, grinding is performed until a part of the signal bump electrode 5 is exposed, as in the manufacturing method described in embodiment 5.
Next, as shown in fig. 17, a second insulating film 9 is formed to cover the signal bump electrode 5 and the first shielding film 8. As shown in fig. 18, the region corresponding to the signal bump electrode 5 is irradiated with laser light to form the opening 2. In the laser-irradiated region, the second insulating film 9 is removed, and further, a part of the signal bump electrode 5 is also removed. That is, the signal bump electrode 5 is dug down to some extent. Thus, an electronic component was obtained.
Fig. 19 shows an enlarged view of the Z3 portion in fig. 18. The irregularities are formed on the surface of the signal bump electrode 5 at the portions where a part of the signal bump electrode 5 is removed by laser processing. The irregularities are marks of laser processing.
As a method of mounting electronic components on the substrate 10 to form the module 201 shown in fig. 5, there is a method of mounting electronic components and reflowing the electronic components after applying solder paste on the substrate 10 side, for example. If the surface of the signal bump electrode 5 has irregularities, the contact area between the signal bump electrode 5 and the solder paste increases, so that the signal bump electrode 5 and the solder paste are more easily and reliably bonded, and the bonding reliability between the electronic component and the substrate 10 increases.
According to the manufacturing method of the present embodiment, an electronic component having the structure described in embodiment 1 can be obtained. That is, an electronic component capable of shielding noise generated from the substrate can be obtained.
In this manufacturing method, since the step of finally removing a part of the signal bump electrode 5 by laser processing and performing the undercut is performed, the signal bump electrode 5 may not be exposed immediately after the grinding processing.
In the electronic component, as described with reference to fig. 16 in embodiment 5, the second shielding film 18 may be formed so as to cover the upper surface and the side surfaces of the electronic component main body 1.
In addition, a plurality of the above embodiments may be appropriately combined and used.
Further, the above-described embodiments of the present disclosure are illustrative in all respects, and not restrictive. The scope of the present utility model is defined by the claims, and all changes that come within the meaning and range of equivalency of the claims are intended to be embraced therein.

Claims (6)

1. An electronic component, comprising:
an electronic component main body having a first surface;
a signal bump electrode protruding from the first surface of the electronic component main body and disposed on the first surface; and
a protective film having an opening for exposing a part of the signal bump electrode and configured to cover a part of the signal bump electrode other than the part exposed by the opening,
the protective film includes: a first insulating film, a second insulating film covering the first insulating film, and a first shielding film interposed between the first insulating film and the second insulating film,
the first shielding film is covered with at least one of the first insulating film and the second insulating film so that the first shielding film is not exposed on the inner surface of the opening portion.
2. The electronic component according to claim 1, wherein,
the electronic component includes a ground bump electrode connected to a portion of the electronic component main body that is to be at a ground potential and configured to protrude from the first surface,
the first shielding film is electrically connected with the grounding bump electrode.
3. The electronic component according to claim 1 or 2, wherein,
the distance between the end of the first shielding film closest to the opening and the first surface is longer than the distance between the point of the signal bump electrode farthest from the first surface and the first surface.
4. The electronic component according to claim 1 or 2, wherein,
in the case where the signal bump electrode and the protective film are viewed from a direction perpendicular to the first face, the signal bump electrode has a portion overlapping the first shielding film.
5. The electronic component according to claim 1 or 2, wherein,
the electronic component main body has an upper surface and a side surface, the upper surface and the side surface being covered with a second shielding film.
6. A module, comprising:
a substrate provided with a signal electrode and a ground electrode; and
the electronic component according to claim 1 to 5,
the signal bump electrode of the electronic component exposed from the opening is electrically connected to the signal electrode, and the first shielding film is electrically connected to the ground electrode.
CN202190000657.1U 2020-08-26 2021-08-12 Electronic component and module Active CN219642810U (en)

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Publication number Priority date Publication date Assignee Title
JPH11345905A (en) * 1998-06-02 1999-12-14 Mitsubishi Electric Corp Semiconductor device
JP2003243439A (en) * 2002-02-21 2003-08-29 Hitachi Ltd Semiconductor device and manufacturing method therefor
JPWO2009110355A1 (en) * 2008-03-05 2011-07-14 日本電気株式会社 Mounting structure and manufacturing method thereof
FR2975529B1 (en) * 2011-05-20 2013-09-27 Soc Fr Detecteurs Infrarouges Sofradir DETECTION CIRCUIT WITH LOW FLOW AND LOW NOISE
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