CN219642796U - Full-automatic rib cutting, forming and separating device for semiconductor processing - Google Patents
Full-automatic rib cutting, forming and separating device for semiconductor processing Download PDFInfo
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- CN219642796U CN219642796U CN202321248124.2U CN202321248124U CN219642796U CN 219642796 U CN219642796 U CN 219642796U CN 202321248124 U CN202321248124 U CN 202321248124U CN 219642796 U CN219642796 U CN 219642796U
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 39
- 238000000926 separation method Methods 0.000 claims abstract description 15
- 238000007493 shaping process Methods 0.000 claims abstract description 5
- 238000004140 cleaning Methods 0.000 claims description 9
- 230000000903 blocking effect Effects 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims 1
- 230000000630 rising effect Effects 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 4
- 238000004080 punching Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
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Abstract
The utility model belongs to the technical field of semiconductor processing equipment, and particularly relates to a full-automatic rib cutting, forming and separating device for semiconductor processing. This full-automatic rib shaping separator is cut to semiconductor processing is with setting up through separation structure and cutting structure, utilizes the pneumatic cylinder to drive hydraulic telescoping rod and cutting board downstream, will place in the cutting post and place the semiconductor circuit board of board top surface and effectively cut, after the cutting is accomplished, can carry out effectual separation to the semiconductor through the rising of placing the board.
Description
Technical Field
The utility model relates to the technical field of semiconductor processing equipment, in particular to a full-automatic rib cutting, forming and separating device for semiconductor processing.
Background
Semiconductor materials are a class of electronic materials that have semiconductor properties and can be used to fabricate semiconductor devices and integrated circuits.
As the packaging frame of the integrated circuit is bigger and bigger, the arrangement density of the circuit is higher and higher, and the equipment integrating all punching stations in a single die cannot meet the punching requirement, so that a plurality of manufacturers select to enlarge the size of the die by nearly one time, but enlarging the die directly leads to the rapid increase of the motion inertia during die punching, thereby leading to huge power and power mechanisms and low cost Gao Qi; meanwhile, the increase of the die leads to the increase of the distance between two groups of rollers which are positioned at the left side and the right side of the die and used for conveying the material sheets, so that the unstable conveying is easily caused, and even the situation that the distance is larger than the length of the material sheets and the material sheets cannot be conveyed is easily caused.
An integrated circuit rib cutting forming device as disclosed in chinese patent CN210523515U is provided, the integrated circuit rib cutting forming device is conveyed to the lower part of a forming and separating device through a stepping feeding device, a first motor is started, the first motor drives a first screw rod to rotate, the rotation of the first screw rod drives a first nut to move in the length direction of the first screw rod, so that a first cylinder is driven to move above a workpiece, a pneumatic clamping jaw is started, so that the first cylinder is opened, the first cylinder is started again, the first cylinder drives the pneumatic clamping jaw to move onto the workpiece, then the pneumatic clamping jaw is closed, so that the pneumatic clamping jaw can grasp a cut connecting rib, and then the connecting rib and the workpiece are conveyed to a recovery device, so that the connecting rib is separated from the workpiece, and further the forming and separating process is completed.
However, in the dicing of the semiconductor integrated circuit board in this reference, the semiconductor after dicing needs to be stored and collected during dicing, so that the diced integrated circuit board needs to be effectively separated from the semiconductor to facilitate the collection of the semiconductor.
Therefore, it is needed to provide a full-automatic rib cutting, forming and separating device for semiconductor processing.
Disclosure of Invention
The utility model aims to provide a full-automatic rib cutting, forming and separating device for semiconductor processing, which solves the problems that in the prior art, the cut semiconductor integrated circuit board needs to be stored and collected during cutting, and the cut integrated circuit board needs to be effectively separated from the semiconductor so as to be convenient for collecting the semiconductor.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a semiconductor processing is with full-automatic rib shaping separator that cuts, includes the part case, the processing platform is installed to part case top, part incasement portion is provided with the separation structure, the separation structure top surface is provided with cutting structure, separation structure right side is provided with the clearance structure.
The separation structure comprises a power unit and a lifting unit.
The lifting unit comprises a driven shaft, a bearing is installed at the bottom end of the outer surface of the driven shaft, the outer surface of the bearing is connected with a mounting sleeve, a placing plate is connected in the middle of the outer surface of the driven shaft, a rectangular through hole is formed in the top surface of the placing plate, and a cutting column is connected inside the rectangular through hole.
The power unit comprises a motor case, a rotating motor, a driving shaft, a driving gear and a driven gear.
Preferably, the motor box is internally detachably connected with a rotating motor, the output end of the rotating motor is connected with a driving shaft, a driving gear is fixedly arranged in the middle of the outer surface of the driving shaft, and a driven gear is connected with the outer surface of the driving gear in a meshed mode.
Preferably, the bearing is internally fixedly connected with the bottom end of the outer surface of the driven shaft, the inner wall of the mounting sleeve is fixedly connected with the outer surface of the bearing, a threaded hole is formed in one end, close to the front surface, of the top surface of the placing plate, a threaded portion is formed in the inner wall of the threaded hole and the outer surface of the driven shaft in threaded connection, and the outer surface of the cutting column is in sliding connection with the inner wall of the rectangular through hole formed in the top surface of the placing plate. The outer surface of the driven shaft is fixedly connected with the inside of the driven gear.
Preferably, the cutting structure comprises a hydraulic tank, the hydraulic tank bottom surface is connected with the roof, roof bottom surface fixed mounting has the rotation sleeve, hydraulic tank internally mounted has the pneumatic cylinder, pneumatic cylinder bottom surface mid-mounting has the hydraulic telescoping rod, hydraulic telescoping rod bottom surface fixed mounting has the cutting board, cutting board bottom surface fixed mounting has the cutting knife.
Preferably, the inner wall of the rotary sleeve is rotationally connected with the top of the outer surface of the driven shaft, a rectangular groove is formed in the bottom surface of the cutting knife, the inner wall of the rectangular groove is slidably connected with the outer surface of the cutting column, and the outer surface of the hydraulic telescopic rod is slidably connected with the inner wall of a sliding hole formed in the middle of the top surface of the top plate. The size of the rectangular groove formed in the bottom of the cutting knife is consistent with the size of the cutting column.
Preferably, the cleaning structure comprises a reciprocating motor, a supporting frame is arranged on the bottom surface of the reciprocating motor, a screw rod is connected to the output end of the reciprocating motor, a sleeve is connected to the middle of the outer surface of the screw rod in a threaded mode, a sliding plate is fixedly arranged on the outer surface of the sleeve, a push rod is fixedly arranged on the left side of the sliding plate, a push plate is fixedly arranged on the left side of the push rod, and a blocking block is fixedly arranged on the left side of the screw rod.
Preferably, the bottom surface of the push plate is in sliding connection with the top surface of the placing plate, and the support frame is detachably connected with the reciprocating motor. The condition that sliding connection exists between the bottom surface of the push plate and the top surface of the placing plate when cleaning is needed appears, and no contact exists when cleaning is not performed.
Compared with the prior art, the utility model has the beneficial effects that:
1. this full-automatic rib shaping separator is cut to semiconductor processing is with setting up through separation structure and cutting structure, utilizes the pneumatic cylinder to drive hydraulic telescoping rod and cutting board downstream, will place in the cutting post and place the semiconductor circuit board of board top surface and effectively cut, after the cutting is accomplished, can carry out effectual separation to the semiconductor through the rising of placing the board.
2. This full-automatic rib shaping separator is cut to semiconductor processing is with setting up of clearance structure utilizes reciprocating motor to drive the lead screw and rotates, drives sleeve and slide and push pedal when rotating and is placing the sliding connection of board top surface, promotes the clearance to the integrated circuit board after the cutting.
Drawings
FIG. 1 is a schematic view of the appearance structure of the present utility model;
FIG. 2 is a schematic top view of the internal structure of the present utility model;
FIG. 3 is a schematic bottom view of the internal structure of the present utility model;
FIG. 4 is an enlarged view of the structure of FIG. 1 at A;
fig. 5 is an enlarged view of the structure at B in fig. 2.
In the figure: 1. a parts box; 2. a processing table; 101. a motor case; 102. a rotating electric machine; 103. a drive gear; 104. a driven gear; 105. a driven shaft; 106. a bearing; 107. a mounting sleeve; 108. placing a plate; 109. cutting the column; 110. a driving shaft; 201. a hydraulic tank; 202. a top plate; 203. rotating the sleeve; 204. a hydraulic cylinder; 205. a hydraulic telescopic rod; 206. cutting the plate; 207. a cutting knife; 301. a reciprocating motor; 302. a support frame; 303. a screw rod; 304. a sleeve; 305. a slide plate; 306. a push rod; 307. a push plate; 308. a block.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-5, the present utility model provides a technical solution:
embodiment one:
including part case 1, processing platform 2 is installed to part case 1 top surface, and part case 1 inside is provided with separation structure, and separation structure top surface is provided with cutting structure, and separation structure right side is provided with clearance structure.
The separation structure comprises a power unit and a lifting unit. The lifting unit comprises a driven shaft 105, a bearing 106 is mounted at the bottom end of the outer surface of the driven shaft 105, a mounting sleeve 107 is connected to the outer surface of the bearing 106, a placing plate 108 is connected to the middle of the outer surface of the driven shaft 105, a rectangular through hole is formed in the top surface of the placing plate 108, and a cutting column 109 is connected to the inside of the rectangular through hole. The power unit includes a motor case 101, a rotary electric machine 102, a drive shaft 110, a drive gear 103, and a driven gear 104. The motor case 101 is detachably connected with a rotating motor 102, the output end of the rotating motor 102 is connected with a driving shaft 110, a driving gear 103 is fixedly arranged in the middle of the outer surface of the driving shaft 110, and a driven gear 104 is connected with the outer surface of the driving gear 103 in a meshed mode. The inside of the bearing 106 is fixedly connected with the bottom end of the outer surface of the driven shaft 105, the inner wall of the mounting sleeve 107 is fixedly connected with the outer surface of the bearing 106, one end, close to the front surface, of the top surface of the placing plate 108 is provided with a threaded hole, the inner wall of the threaded hole is in threaded connection with the outer surface of the driven shaft 105, the outer surface of the cutting column 109 is in sliding connection with the inner wall of the rectangular through hole in the top surface of the placing plate 108.
The cutting structure comprises a hydraulic tank 201, a top plate 202 is connected to the bottom surface of the hydraulic tank 201, a rotating sleeve 203 is fixedly arranged on the bottom surface of the top plate 202, a hydraulic cylinder 204 is arranged in the hydraulic tank 201, a hydraulic telescopic rod 205 is arranged in the middle of the bottom surface of the hydraulic cylinder 204, a cutting plate 206 is fixedly arranged on the bottom surface of the hydraulic telescopic rod 205, and a cutting knife 207 is fixedly arranged on the bottom surface of the cutting plate 206. The inner wall of the rotary sleeve 203 is rotationally connected with the top of the outer surface of the driven shaft 105, a rectangular groove is formed in the bottom surface of the cutting knife 207, the inner wall of the rectangular groove is slidably connected with the outer surface of the cutting column 109, and the outer surface of the hydraulic telescopic rod 205 is slidably connected with the inner wall of a sliding hole formed in the middle of the top surface of the top plate 202.
Through the setting of separation structure and cutting structure, utilize pneumatic cylinder 204 to drive hydraulic telescoping rod 205 and cutting board 206 downward movement, will place in cutting post 109 and place the semiconductor circuit board of board 108 top surface and carry out effective cutting, after the cutting is accomplished, can carry out effectual separation through the rising of placing board 108.
When the semiconductor integrated circuit board to be processed is required to be cut and separated, the hydraulic cylinder 204 is started to drive the hydraulic telescopic rod 205 to stretch, the hydraulic telescopic rod 205 drives the cutting plate 206 and the cutting knife 207 to move downwards, cutting work is completed on the integrated circuit board, after cutting, the rotary motor 102 is started to drive the driving shaft 110 to rotate, the driving shaft 110 drives the driving gear 103 and the driven gear 104 to rotate when rotating, so that the driven shaft 105 is driven to rotate, threads formed on the outer surface of the driven shaft 105 are connected with the placing plate 108 in a threaded manner, the placing plate 108 is driven to rise when rotating, and the semiconductor reserved by cutting is still reserved in a rectangular groove formed by the cutting knife 207 and the cutting column 109, so that the placing plate 108 rises to effectively separate the circuit board from the semiconductor. After the cleaning structure is used for cleaning, the rotating motor 102 is used for driving the driven shaft 105 to rotate in the opposite direction, the top surface of the placing plate 108 is adjusted to be the same as the top surface of the cutting column 109, the hydraulic cylinder 204 is used for driving the hydraulic telescopic rod 205 to shrink, the cutting knife 207 is driven to ascend, and the semiconductor after cutting is collected conveniently.
Embodiment two:
the cleaning structure comprises a reciprocating motor 301, a supporting frame 302 is arranged on the bottom surface of the reciprocating motor 301, a screw rod 303 is connected to the output end of the reciprocating motor 301, a sleeve 304 is connected to the middle of the outer surface of the screw rod 303 in a threaded mode, a sliding plate 305 is fixedly arranged on the outer surface of the sleeve 304, a push rod 306 is fixedly arranged on the left side of the sliding plate 305, a push plate 307 is fixedly arranged on the left side of the push rod 306, and a blocking block 308 is fixedly arranged on the left side of the screw rod 303. The bottom surface of the pushing plate 307 is slidably connected with the top surface of the placing plate 108, and the supporting frame 302 is detachably connected with the reciprocating motor 301. The cleaning structure is arranged, the reciprocating motor 301 is utilized to drive the screw rod 303 to rotate, and the screw rod 303 drives the sleeve 304 and the sliding plate 305 to be in sliding connection with the top surface of the placing plate 108 when rotating, so that the integrated circuit board after cutting is pushed and cleaned.
After the placing plate 108 ascends to separate the circuit board from the semiconductor, the reciprocating motor 301 is started to drive the screw rod 303 to rotate, and the screw rod 303 drives the sleeve 304 and the sliding plate 305 to reciprocate when rotating, so that the push rod 306 and the push plate 307 are driven to be in sliding connection with the top surface of the placing plate 108, and the separated circuit board is pushed to move out of the top surface of the placing plate 108.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises an element.
Claims (7)
1. The utility model provides a full-automatic rib shaping separator is cut to semiconductor processing, includes parts case (1), processing platform (2), its characterized in that are installed to parts case (1) top surface: a separating structure is arranged in the part box (1), a cutting structure is arranged on the top surface of the separating structure, and a cleaning structure is arranged on the right side of the separating structure;
the separation structure comprises a power unit and a lifting unit;
the lifting unit comprises a driven shaft (105), a bearing (106) is installed at the bottom end of the outer surface of the driven shaft (105), a mounting sleeve (107) is connected to the outer surface of the bearing (106), a placing plate (108) is connected to the middle of the outer surface of the driven shaft (105), a rectangular through hole is formed in the top surface of the placing plate (108), and a cutting column (109) is connected to the inside of the rectangular through hole;
the power unit comprises a motor case (101), a rotating motor (102), a driving shaft (110), a driving gear (103) and a driven gear (104).
2. The full-automatic rib cutting, forming and separating device for semiconductor processing according to claim 1, wherein: the motor box (101) is internally detachably connected with a rotating motor (102), the output end of the rotating motor (102) is connected with a driving shaft (110), a driving gear (103) is fixedly arranged in the middle of the outer surface of the driving shaft (110), and a driven gear (104) is connected to the outer surface of the driving gear (103) in a meshed mode.
3. The full-automatic rib cutting, forming and separating device for semiconductor processing according to claim 1, wherein: the inside and driven shaft (105) surface bottom fixed connection of bearing (106), installation cover (107) inner wall and bearing (106) surface fixed connection, place threaded hole has been seted up to board (108) top surface near front and back one end, threaded hole inner wall and driven shaft (105) surface set up screw thread part threaded connection, rectangular through-hole inner wall sliding connection is seted up with board (108) top surface to cutting post (109) surface.
4. The full-automatic rib cutting, forming and separating device for semiconductor processing according to claim 1, wherein: the cutting structure comprises a hydraulic tank (201), a top plate (202) is connected to the bottom surface of the hydraulic tank (201), a rotating sleeve (203) is fixedly arranged on the bottom surface of the top plate (202), a hydraulic cylinder (204) is arranged in the hydraulic tank (201), a hydraulic telescopic rod (205) is arranged in the middle of the bottom surface of the hydraulic cylinder (204), a cutting plate (206) is fixedly arranged on the bottom surface of the hydraulic telescopic rod (205), and a cutting knife (207) is fixedly arranged on the bottom surface of the cutting plate (206).
5. The full-automatic rib cutting, forming and separating device for semiconductor processing according to claim 4, wherein: the inner wall of the rotary sleeve (203) is rotationally connected with the top of the outer surface of the driven shaft (105), a rectangular groove is formed in the bottom surface of the cutting knife (207), the inner wall of the rectangular groove is slidably connected with the outer surface of the cutting column (109), and the outer surface of the hydraulic telescopic rod (205) is slidably connected with the inner wall of a sliding hole formed in the middle of the top surface of the top plate (202).
6. The full-automatic rib cutting, forming and separating device for semiconductor processing according to claim 1, wherein: the cleaning structure comprises a reciprocating motor (301), a supporting frame (302) is arranged on the bottom surface of the reciprocating motor (301), a screw rod (303) is connected to the output end of the reciprocating motor (301), a sleeve (304) is connected to the middle of the outer surface of the screw rod (303) in a threaded mode, a sliding plate (305) is fixedly arranged on the outer surface of the sleeve (304), a push rod (306) is fixedly arranged on the left side of the sliding plate (305), a push plate (307) is fixedly arranged on the left side of the push rod (306), and a blocking block (308) is fixedly arranged on the left side of the screw rod (303).
7. The fully automatic bar cutting, forming and separating device for semiconductor processing according to claim 6, wherein: the bottom surface of the push plate (307) is in sliding connection with the top surface of the placing plate (108), and the supporting frame (302) is detachably connected with the reciprocating motor (301).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321248124.2U CN219642796U (en) | 2023-05-23 | 2023-05-23 | Full-automatic rib cutting, forming and separating device for semiconductor processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321248124.2U CN219642796U (en) | 2023-05-23 | 2023-05-23 | Full-automatic rib cutting, forming and separating device for semiconductor processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219642796U true CN219642796U (en) | 2023-09-05 |
Family
ID=87809284
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321248124.2U Active CN219642796U (en) | 2023-05-23 | 2023-05-23 | Full-automatic rib cutting, forming and separating device for semiconductor processing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219642796U (en) |
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2023
- 2023-05-23 CN CN202321248124.2U patent/CN219642796U/en active Active
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