CN219640518U - Cooling mechanism - Google Patents
Cooling mechanism Download PDFInfo
- Publication number
- CN219640518U CN219640518U CN202223416880.XU CN202223416880U CN219640518U CN 219640518 U CN219640518 U CN 219640518U CN 202223416880 U CN202223416880 U CN 202223416880U CN 219640518 U CN219640518 U CN 219640518U
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- CN
- China
- Prior art keywords
- shell
- plate
- cooling mechanism
- round
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000001816 cooling Methods 0.000 title claims abstract description 32
- 230000007246 mechanism Effects 0.000 title claims abstract description 15
- 239000004065 semiconductor Substances 0.000 claims abstract description 37
- 238000005057 refrigeration Methods 0.000 claims abstract description 29
- 239000003292 glue Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 241000883990 Flabellum Species 0.000 description 3
- 238000005192 partition Methods 0.000 description 3
- 238000004378 air conditioning Methods 0.000 description 2
- 238000004887 air purification Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000779 smoke Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a cooling mechanism, comprising: the semiconductor refrigerating plate is positioned in the mounting hole, the annular plate is clamped outside the clamping groove, and the refrigerating surface of the semiconductor refrigerating plate faces to the inside of the shell; the semiconductor refrigeration plate is electrically connected with a power line through the temperature control switch; according to the utility model, when the temperature control switch detects that the temperature in the shell reaches the set value, the power supply simultaneously supplies power to the semiconductor refrigeration plate and the motor, so that the cooling efficiency in the shell is improved, no gap is reserved between the annular plate and the shell, and the temperature control effect is improved.
Description
Technical Field
The utility model relates to the technical field of cooling, in particular to a cooling mechanism.
Background
In production life, the power distribution cabinet or other mechanisms can be subjected to the condition of overhigh temperature when in use, such as a totally-enclosed ring main unit and the like, and the power distribution cabinet or other mechanisms need to be cooled when in specific use.
The power distribution cabinet smoke sensing, cooling and dehumidifying device is applicable to the technical field of power distribution cabinets and comprises a power distribution cabinet body, wherein a smoke alarm, a temperature sensor and a humidity sensor are arranged in the power distribution cabinet body; the cooling assembly is arranged on the inner side wall of the power distribution cabinet body and used for cooling the inside of the power distribution cabinet body, and the dehumidifying assembly is arranged on one side, far away from the cooling assembly, of the inner wall of the power distribution cabinet body and used for dehumidifying the power distribution cabinet body, and the installing frame is internally provided with a lifting assembly, so that the intelligent power distribution cabinet has the advantages of real-time monitoring, rapid cooling, reciprocating lifting and dehumidifying and improving the working efficiency.
This patent adopts to draw condensate 207 in the cooling box 201, through catheter 205, leads condensate 207 to the input of condensing pump 206 from the output of drawing liquid pump 204, at condensate 207 water conservancy diversion in-process, can effectively absorb the heat in the switch board body 1, carries out the cooling operation to the switch board body 1 inside.
The design needs to be communicated with a plurality of pipelines, and a liquid pump, a condensing pump and the like are also designed, so that the installation complexity is greatly increased, the tightness of the cabinet body is likely to be damaged, and certain hidden danger exists.
Disclosure of Invention
The present utility model is directed to a cooling mechanism, which solves the above-mentioned problems in the prior art.
In order to achieve the above purpose, the present utility model provides the following technical solutions: a cooling mechanism comprising: the semiconductor refrigerating plate is positioned in the mounting hole, the annular plate is clamped outside the clamping groove, and the refrigerating surface of the semiconductor refrigerating plate faces to the inside of the shell;
the outside of casing is installed and is used for detecting its inside temperature's temperature detect switch, the semiconductor refrigeration board passes through temperature detect switch and power cord electric connection.
By adopting the technical scheme: when the temperature control switch detects that the temperature in the shell reaches a set value, the temperature control switch automatically energizes to supply power to the semiconductor refrigeration plate, and the semiconductor refrigeration plate generates cold air to cool the inside of the shell, so that the damage of elements in the shell caused by overhigh temperature in the shell is prevented.
Preferably, the inside diagonal angle of casing all installs the rectangular plate through the bolt, the pipe is all installed through the bolt to the inboard of rectangular plate, the motor is installed through the bolt to the inside of pipe, install the flabellum through the screw on the motor, the motor passes through temperature detect switch and power cord electric connection.
By adopting the technical scheme: when temperature detect switch on, the power is semiconductor refrigeration board and motor power supply simultaneously, and the motor drives the flabellum rotation for two motors are installed in the inside diagonal angle department of casing for the inside air conditioning of casing forms the flow, has further improved the inside cooling efficiency of casing.
Preferably, a filter screen is installed in the opening of the circular tube, which is close to the fan blade.
By adopting the technical scheme: the filter screen not only can protect motor and flabellum, can also play certain air purification effect.
Preferably, the T-shaped rod is further included, external threads are formed on the outer wall of the inner end of the round rod of the T-shaped rod, round holes are formed in the top of the annular plate and the top of the annular plate, threaded holes are formed in the inner side of the round holes in the shell, and the inner end of the round rod penetrates through the round holes to be installed in the threaded holes.
By adopting the technical scheme: the inside at the screw hole is installed to the round bar's of T shape pole inner, because the one section of T shape pole adopts the round bar design, and the tail end adopts the screw thread section to set up, not only can install the semiconductor refrigeration board, can also fasten the semiconductor refrigeration board, can not leave the space between annular plate and the casing like this, has improved the control by temperature change effect.
Preferably, the bottom of the clamping groove is provided with a downward inclined notch.
By adopting the technical scheme: this design prevents water from remaining inside the card slot.
Preferably, six baffles are at least equidistantly arranged in the shell, and four through holes are at least equidistantly formed in the baffles.
By adopting the technical scheme: through the effect of through-hole, be favorable to the inside air conditioning of casing to form the flow, further improved the inside cooling efficiency of casing.
Compared with the prior art, the utility model has the beneficial effects that:
when the temperature control switch detects that the temperature in the shell reaches a set value, the power supply supplies power to the semiconductor refrigeration plate and the motor at the same time, and the temperature control switch automatically energizes to supply power to the semiconductor refrigeration plate, so that cold air in the shell flows, and the cooling efficiency in the shell is further improved;
the inner end of the round rod of the T-shaped rod penetrates through the round hole to be installed in the threaded hole, and the tail end of the T-shaped rod is provided with the threaded section due to the fact that one section of the T-shaped rod is designed to be the round rod, so that a semiconductor refrigeration plate can be installed, the semiconductor refrigeration plate can be fastened, a gap is not reserved between the annular plate and the shell, and the temperature control effect is improved;
the bottom of the clamping groove is provided with a downward inclined notch, so that water is prevented from remaining in the clamping groove.
Drawings
FIG. 1 is a front view in section of the present utility model;
FIG. 2 is an enlarged view of the portion A in the front view;
fig. 3 is an enlarged view of a portion B in a front view of the present utility model.
In the figure: 1. a housing; 101. a mounting hole; 102. a clamping groove; 1021. a notch; 11. a partition plate; 12. a through hole; 21. a semiconductor refrigeration plate; 211. a threaded hole; 22. an annular plate; 221. a round hole; 23. a temperature control switch; 3. a T-bar; 31. a round bar; 311. an external thread; 41. a rectangular plate; 42. a round tube; 43. a motor; 44. a fan blade; 45. and (3) a filter screen.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-3, the present utility model provides a technical solution:
a cooling mechanism comprising: the semiconductor refrigeration plate 21 and the shell 1, the periphery of the semiconductor refrigeration plate 21 is stuck with the annular plate 22 through glue, the shell 1 is provided with the mounting hole 101, the outside of the mounting hole 101 is provided with the clamping groove 102, the semiconductor refrigeration plate 21 is positioned in the mounting hole 101, the annular plate 22 is clamped outside the clamping groove 102, and the refrigeration surface of the semiconductor refrigeration plate 21 faces to the inside of the shell 1;
the outside of the housing 1 is provided with a temperature control switch 23 for detecting the internal temperature thereof, and the semiconductor refrigeration plate 21 is electrically connected with the power line through the temperature control switch 23.
Referring to fig. 1-2, the installation principle of the semiconductor refrigeration plate 21 is as follows:
still include T shape pole 3, the external screw thread 311 has been seted up to the inner outer wall of the round bar 31 of T shape pole 3, and round hole 221 has all been seted up at the top and the top of annular plate 22, and screw hole 211 has been seted up to the inboard casing 1 of round hole 221, and the inside of round bar 31 passes round hole 221 and installs in the inside of screw hole 211.
The inner end of the round rod 31 of the T-shaped rod 3 penetrates through the round hole 221 to be installed in the threaded hole 211, and because one section of the T-shaped rod 3 is designed by the round rod 31, the tail end of the T-shaped rod is arranged by the threaded section, the semiconductor refrigeration plate 21 can be installed, the semiconductor refrigeration plate 21 can be fastened, and therefore a gap is not reserved between the annular plate 22 and the shell 1, and the temperature control effect is improved.
Referring to fig. 1 and 3, in order to further improve the cooling efficiency of the interior of the casing 1, the rectangular plate 41 is mounted on the opposite angles of the interior of the casing 1 through bolts, the round tube 42 is mounted on the inner side of the rectangular plate 41 through bolts, the motor 43 is mounted on the interior of the round tube 42 through bolts, the fan blade 44 is mounted on the motor 43 through screws, the motor 43 is electrically connected with the power line through the temperature control switch 23, when the temperature control switch 23 is turned on, the power is simultaneously supplied to the semiconductor cooling plate 21 and the motor 43, the motor 43 drives the fan blade 44 to rotate, and as the two motors 43 are mounted on the opposite angles of the interior of the casing 1, the cold air in the casing 1 flows, so that the cooling efficiency of the interior of the casing 1 is further improved.
In order to improve the protection of the motor 43 and the fan blades 44, a filter screen 45 is arranged in the opening, close to the fan blades 44, of the circular tube 42, and the filter screen 45 not only can protect the motor 43 and the fan blades 44, but also can play a certain role in air purification.
Referring to fig. 2, in order to prevent water from remaining in the inside of the clamping groove 102, a downward inclined notch 1021 is formed at the bottom of the clamping groove 102, so as to prevent water from remaining in the inside of the clamping groove 102.
Referring to fig. 1, six partition plates 11 are at least equidistantly installed in the casing 1, and four through holes 12 are at least equidistantly formed in the partition plates 11, so that cold air in the casing 1 flows through the through holes 12, and the cooling efficiency of the casing 1 is further improved.
Working principle: when the temperature control switch 23 detects that the temperature inside the shell 1 reaches the set value, the temperature control switch 23 is automatically electrified, the power supply supplies power to the semiconductor refrigeration plate 21 and the motor 43 simultaneously, the temperature control switch 23 is automatically electrified to supply power to the semiconductor refrigeration plate 21, the semiconductor refrigeration plate 21 generates cold air to cool the inside of the shell 1, the motor 43 drives the fan blades 44 to rotate, and the two motors 43 are arranged at opposite angles inside the shell 1, so that the cold air inside the shell 1 flows, and the cooling efficiency inside the shell 1 is further improved.
In summary, when the temperature control switch 23 detects that the temperature inside the casing 1 reaches the set value, the power supply supplies power to the semiconductor refrigeration plate 21 and the motor 43 at the same time, and the temperature control switch 23 automatically energizes to supply power to the semiconductor refrigeration plate 21, so that cold air inside the casing 1 flows, and the cooling efficiency inside the casing 1 is further improved;
the inner end of the round rod 31 of the T-shaped rod 3 passes through the round hole 221 and is arranged in the threaded hole 211, and because one section of the T-shaped rod 3 is designed by the round rod 31 and the tail end of the T-shaped rod is arranged by adopting a threaded section, the semiconductor refrigeration plate 21 can be arranged and fastened, so that a gap is not reserved between the annular plate 22 and the shell 1, and the temperature control effect is improved;
the bottom of the clamping groove 102 is provided with a downward inclined notch 1021 to prevent water from remaining in the clamping groove 102.
The utility model can not only cool the totally-enclosed ring main unit, but also be applied to other related cooling fields.
None of the utility models are related to the same or are capable of being practiced in the prior art. Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. A cooling mechanism, comprising: the semiconductor refrigerating plate (21) and the shell (1), wherein an annular plate (22) is stuck to the periphery of the semiconductor refrigerating plate (21) through glue, a mounting hole (101) is formed in the shell (1), a clamping groove (102) is formed in the outer side of the mounting hole (101), the semiconductor refrigerating plate (21) is located in the mounting hole (101), the annular plate (22) is clamped outside the clamping groove (102), and the refrigerating face of the semiconductor refrigerating plate (21) faces the inside of the shell (1);
the outside of casing (1) is installed and is used for detecting its inside temperature's temperature detect switch (23), semiconductor refrigeration board (21) pass through temperature detect switch (23) and power cord electric connection.
2. A cooling mechanism according to claim 1, wherein: rectangular plates (41) are mounted on opposite angles in the shell (1) through bolts, round tubes (42) are mounted on inner sides of the rectangular plates (41) through bolts, motors (43) are mounted in the round tubes (42) through bolts, fan blades (44) are mounted on the motors (43) through screws, and the motors (43) are electrically connected with a power line through the temperature control switch (23).
3. A cooling mechanism according to claim 2, wherein: a filter screen (45) is arranged in an opening of the circular tube (42) close to the fan blade (44).
4. A cooling mechanism according to claim 1, wherein: still include T shape pole (3), external screw thread (311) have been seted up to the inner outer wall of round bar (31) of T shape pole (3), round hole (221) have all been seted up at the top and the top of annular plate (22), the inboard of round hole (221) threaded hole (211) are seted up to casing (1), the inner of round bar (31) passes round hole (221) are installed the inside of threaded hole (211).
5. A cooling mechanism according to claim 3, wherein: the bottom of the clamping groove (102) is provided with a downward inclined notch (1021).
6. The cooling mechanism of claim 5, wherein: six clapboards (11) are at least equidistantly arranged in the shell (1), and four through holes (12) are at least equidistantly formed in the clapboards (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223416880.XU CN219640518U (en) | 2022-12-20 | 2022-12-20 | Cooling mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223416880.XU CN219640518U (en) | 2022-12-20 | 2022-12-20 | Cooling mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219640518U true CN219640518U (en) | 2023-09-05 |
Family
ID=87812230
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223416880.XU Active CN219640518U (en) | 2022-12-20 | 2022-12-20 | Cooling mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219640518U (en) |
-
2022
- 2022-12-20 CN CN202223416880.XU patent/CN219640518U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |