CN219632104U

CN219632104U - Wafer chuck cleaning device

Info

Publication number: CN219632104U
Application number: CN202320154294.8U
Authority: CN
Inventors: 郑文祥
Original assignee: Yuexin Semiconductor Technology Co ltd
Current assignee: Yuexin Semiconductor Technology Co ltd
Priority date: 2023-01-17
Filing date: 2023-01-17
Publication date: 2023-09-05
Anticipated expiration: 2033-01-17

Abstract

The utility model relates to the technical field of semiconductor equipment and discloses a wafer chuck cleaning device, wherein a chuck and a bridge are arranged on a CP probe testing machine, the bridge is positioned above the chuck and is in sliding connection with the CP probe testing machine, one end of the bridge is detachably connected with a nitrogen input pipe, a shunting cavity which is connected and communicated with the nitrogen input pipe is formed in the bridge, a plurality of cleaning pieces are arranged on one side of the bridge, which faces the chuck, of the bridge, each cleaning piece comprises a connecting part and a purging part, an assembly hole matched with the connecting part is formed in the bridge, the assembly hole is detachably connected with the connecting part, the assembly hole is connected and communicated with the shunting cavity, and the purging part protrudes out of the bridge and is of a flat-mouth structure design. The utility model improves the cleanliness of the chuck of the CP probe machine, saves labor, improves the daily average operation time of the machine, and improves the CP testing precision and the testing efficiency.

Description

Wafer chuck cleaning device

Technical Field

The utility model relates to the technical field of semiconductor equipment, in particular to a wafer chuck cleaning device.

Background

In the semiconductor manufacturing process, a wafer of a TMOS (metal-oxide semiconductor field effect transistor) product needs to be subjected to CP (chipprobing) test, namely, a wafer chip which is not packaged yet is tested, qualified products are screened, whether packaging is carried out or not is determined, the basic principle is that a probe is excited by a signal, in the CP probe machine test, the problems that test items such as RDSON/IDSS (on-resistance/inter-source-drain leakage) and the like are poor in stability and large in fluctuation exist, and the problems are caused because in test loops such as RDSON/IDSS and the like, the back of the wafer is conducted with a Chuck, and particles carried out by the probe pricked into the wafer Pad of the CP test are attached to the surface of the Chuck in combination with abrasion of a test environment and a conveying system, so that the back of the wafer and the Chuck cannot reach good contact.

The prior solution is to use IPA (isopropyl alcohol dry cleaning) or dust-free cloth and the like to periodically clean a Chuck of a CP probe machine to remove particles adsorbed on the surface of the Chuck, so that a wafer is better in contact with a Chuck, and the effect of stabilizing an RDSON/IDSS test item is achieved, but the frequency of cleaning the Chuck by the method is about once per day, each time takes about 30 minutes, the labor is greatly consumed, the operation time of test equipment is influenced, a machine Stage cover plate is frequently opened, particles generated by abrasion also influence the cleanliness of the Chuck, and the resistance test data is unstable, so that the situation needs to be changed.

Disclosure of Invention

In view of the above, the utility model provides a wafer chuck cleaning device, which is used for improving the chuck cleanliness of a CP probe machine, saving labor, improving the daily average operation time of the machine and improving the CP test accuracy and test efficiency.

In order to achieve the above purpose, the technical scheme adopted is as follows:

the utility model provides a wafer chuck cleaning device, includes the CP probe test board, be equipped with chuck and crane span structure on the CP probe test board, the crane span structure is located chuck top and with CP probe test board sliding connection, the one end of crane span structure can be dismantled and be connected with nitrogen gas input tube, set up in the crane span structure with nitrogen gas input tube is connected and the reposition of redundant personnel chamber of intercommunication, the crane span structure is facing one side of chuck is equipped with a plurality of cleaning member, the cleaning member includes connecting portion and sweeps the portion, still set up on the crane span structure with connecting portion assorted pilot hole, the pilot hole with connecting portion can dismantle and be connected, the pilot hole with the reposition of redundant personnel chamber is connected and is communicated, sweep the portion protrusion in the crane span structure design just is flat mouthful.

The utility model is further provided with: the nitrogen gas input pipe is the hose structure of PVC material, the one end of nitrogen gas input pipe inserts to the crane span structure, and the one end of inserting with crane span structure interference connection or threaded connection.

The utility model is further provided with: the side of the bridge, which faces the chuck, is a plane, and the side of the bridge, which faces the chuck, is parallel to the chuck.

The utility model is further provided with: the cleaning pieces are staggered relative to the bridge frame.

The utility model is further provided with: the connecting portion and the purge portion are integrally formed.

The utility model is further provided with: the purging part is gradually reduced from one end of the purging part far away from the connecting part to one end of the purging part connected with the connecting part.

The utility model is further provided with: and a camera is further arranged in the center of one side of the bridge frame, which faces the chuck, and the nitrogen input pipe is externally connected with a factory nitrogen access machine.

The utility model is further provided with: the outer diameter of the chuck is 300mm, the width of the bridge is 180mm, and the length of the bridge is larger than the outer diameter of the chuck.

The utility model is further provided with: the external diameter of connecting portion is 20mm, the height of sweeping the portion is 30mm, sweep the portion keep away from the width of connecting portion's one end is 30mm.

The utility model is further provided with: the number of the cleaning pieces is 16, under the premise that the center point of the chuck is used as an origin coordinate, the center point of the chuck coincides with the center point of the bridge, and the coordinate units are mm, the center coordinates of the 16 cleaning pieces are respectively as follows: (-100, 60), (-60, 60), (0,60), (60, 60), (100, 60), (-120, 0), (-80, 0), (-40, 0), (80, 0), (120, 0), (-100, -60), (-60 ), (0, -60), (60, -60), (100, -60) for a staggered arrangement of the cleaning elements with respect to the bridge.

In summary, compared with the prior art, the utility model discloses a wafer chuck cleaning device, the chuck and the bridge are arranged on the CP probe testing machine, the bridge is positioned above the chuck and is in sliding connection with the CP probe testing machine, a plurality of cleaning pieces are arranged on one side of the bridge facing the chuck, each cleaning piece comprises a connecting part and a purging part, wherein a nitrogen input pipe and an assembly hole are connected and communicated with a shunt cavity, the assembly hole is detachably connected with the connecting part, the purging part is in a flat port structural design, namely, through the arrangement, manual periodic cleaning is replaced, the cleanliness of the chuck of the CP probe testing machine is improved, the daily average operation time of the machine is prolonged, and the CP testing precision and the testing efficiency are improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the following description will briefly explain the drawings needed in the description of the embodiments, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is an assembly view of the overall structure of a wafer chuck cleaning apparatus of the present embodiment;

FIG. 2 is an assembled bottom view of the bridge and chuck of the present embodiment;

FIG. 3 is a perspective block diagram of FIG. 2;

fig. 4 is a cross-sectional view of the internal structure of the bridge of the present embodiment;

FIG. 5 is a side view structural diagram of the cleaning member of the present embodiment;

fig. 6 is a top view of the cleaning member of the present embodiment.

Detailed Description

Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numbers in different drawings refer to the same or similar elements, unless otherwise indicated. The implementations described in the following exemplary examples do not represent all implementations consistent with the utility model. Rather, they are merely examples of apparatus and methods consistent with aspects of the utility model as detailed in the accompanying claims.

It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, the element defined by the phrase "comprising one … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element, and furthermore, elements having the same name in different embodiments of the utility model may have the same meaning or may have different meanings, the particular meaning of which is to be determined by its interpretation in this particular embodiment or by further combining the context of this particular embodiment.

It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.

In the following description, suffixes such as "module", "part" or "unit" for representing elements are used only for facilitating the description of the present utility model, and have no specific meaning per se. Thus, "module," "component," or "unit" may be used in combination.

In the description of the present utility model, it should be noted that the positional or positional relationship indicated by the terms such as "upper", "lower", "left", "right", "inner", "outer", etc. are based on the positional or positional relationship shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the apparatus or element in question must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

The technical scheme shown in the utility model will be described in detail through specific examples. The following description of the embodiments is not intended to limit the priority of the embodiments.

As described in the background art, the wafer chuck in the prior art is cleaned by using IPA or dust-free cloth, etc., the frequency of cleaning the chuck is about once per day, each time is about 30 minutes, the manpower is greatly consumed, the operation time of the test equipment is influenced, and the test precision and efficiency of the test equipment are influenced.

Referring to fig. 1-4, the wafer chuck cleaning device of the utility model comprises a CP probe testing machine 1, wherein a chuck 2 and a bridge 3 are arranged on the CP probe testing machine 1, the bridge 3 is positioned above the chuck 2 and is in sliding connection with the CP probe testing machine 1, one end of the bridge 3 is detachably connected with a nitrogen input pipe 4, a split cavity 31 connected and communicated with the nitrogen input pipe 4 is arranged in the bridge 3, a plurality of cleaning pieces 5 are arranged on one side of the bridge 3 facing the chuck 2, each cleaning piece 5 comprises a connecting part 51 and a purging part 52, an assembly hole 32 matched with the connecting part 51 is further arranged on the bridge 3, the assembly hole 32 is detachably connected with the connecting part 51, the assembly hole 32 is connected and communicated with the split cavity 31, the purging part 52 protrudes out of the bridge 3 and is in a flat structure design, and the purging part 52 is kept at a certain distance from the chuck 2.

In the specific implementation process, the bridge 3 in sliding connection with the CP probe testing machine table 1 is used as a movable arm for cleaning the chuck 2, under the nitrogen supply of the nitrogen input pipe 4, nitrogen is converged into the flow distribution cavity 31 and sequentially output for cleaning and purging through the cleaning piece 5, the cleaning piece 5 moves along with the bridge 3 to cover the whole chuck 2, so that the cleanliness of the chuck 2 is ensured.

Further, the assembly hole 32 and the connecting portion 51 may be detachably connected, specifically, may be an interference connection, a threaded connection, or an adhesive connection, so as to ensure the air-conveying stability of the cleaning member 5.

Further, the bridge 3 may be connected with the nitrogen input tube 4 in a detachable manner, specifically, interference connection or threaded connection or adhesion may be adopted, in this embodiment, one end of the nitrogen input tube 4 is inserted into the bridge 3, the nitrogen input tube 4 may be a flexible tube structure made of PVC material or a metal bellows or a spring tube, so as to improve the practicability of the nitrogen input tube 4, ensure stable nitrogen supply, and it should be noted that the nitrogen input tube 4 is externally connected with a plant nitrogen access machine, so as to serve as a nitrogen supply source, that is, the plant nitrogen of the production chain is utilized to reduce the cost of the device, and improve the cost performance.

It will be appreciated that the nitrogen inlet 4 is not limited to one end of the bridge 3, i.e. the nitrogen inlet 4 may be disposed on a side or back of the bridge 3 and connected to and in communication with the flow splitting chamber 31 to improve the flexibility of the structure.

In this embodiment, the side of the bridge 3 facing the chuck 2 is a plane, and the side of the bridge 3 facing the chuck 2 is parallel to the chuck 2, so as to ensure that the nitrogen gas output by the cleaning member 5 is uniform, and improve the cleaning effect.

It should be noted that, the plurality of cleaning elements 5 are staggered with respect to the bridge 3, so as to ensure staggered coverage of the cleaning elements 5 with respect to the chuck 2, and improve the cleaning effect.

With reference to fig. 5 and 6, the connection portion 51 and the purge portion 52 of the cleaning member 5 are integrally formed, so as to improve structural strength, and the purge portion 52 is gradually reduced from one end of the purge portion 52 away from the connection portion 51 to one end of the purge portion connected with the connection portion 51, that is, the purge portion 52 protrudes from the bridge 3 and is in a flat-mouth structural design, while the connected connection portion 51 is in a cylindrical structure, air flow is released from a cylindrical pipeline to a flat air outlet, so that purge force is increased, cleaning effect is enhanced, and on the premise of achieving cleaning effect of the Chuck 2, the Chuck 2 and a wafer loaded and electrically connected with the Chuck can not be influenced by environmental particles, further, the wafer back and the Chuck 2 (Chuck) can not be in good contact, and effective performance of the test items such as RDSON/IDSS of the CP probe machine 1 is ensured, so that the Chuck cleanliness of the CP probe machine is improved, the average operation time of the machine is prolonged, and the CP test accuracy and the test efficiency are improved.

In particular, a camera 33 is also provided in the center of the side of the bridge 3 facing the chuck 2, in order to facilitate remote observation of the cleaning effect of the cleaning device.

In some embodiments, the outer diameter of the chuck 2 is 300mm, the width of the bridge 3 is 180mm, and the length of the bridge 3 is greater than the outer diameter of the chuck 2, so as to facilitate staggered coverage of the cleaning member 5 relative to the chuck 2, wherein the outer diameter of the connecting portion 51 is 20mm, the height of the purging portion 52 is 30mm, and the width of the end of the purging portion 52 away from the connecting portion 51 is 30mm, so as to achieve the flat port structural design effect of the purging portion 52.

In some embodiments, the number of the cleaning elements 5 is 16, and on the premise that the center point of the chuck 2 is taken as an origin coordinate, the center point of the chuck 2 coincides with the center point of the bridge 3, and the coordinate units are mm, the center coordinates of the 16 cleaning elements 5 are respectively: (-100, 60), (-60, 60), (0,60), (60, 60), (100, 60), (-120, 0), (-80, 0), (-40, 0), (80, 0), (120, 0), (-100, -60), (-60 ), (0, -60), (60, -60), (100, -60) for the staggered arrangement of the cleaning members 5 relative to the bridge 3, thereby refining the cleaning effect of the cleaning device, ensuring good contact of the wafer with the chuck 2, and improving the testing accuracy and the testing efficiency of the CP probe testing machine 1.

In summary, the utility model discloses a wafer chuck cleaning device, chuck 2 and bridge 3 are arranged on a CP probe testing machine 1, the bridge 3 is located above the chuck 2 and is slidably connected with the CP probe testing machine 1, one side of the bridge 3 facing the chuck 2 is provided with a plurality of cleaning pieces 5, each cleaning piece 5 comprises a connecting part 51 and a purging part 52, wherein a nitrogen input pipe 4 and an assembly hole 32 are connected and communicated with a shunt cavity 31, the assembly hole 32 is detachably connected with the connecting part 51, the purging part 52 is in a flat-mouth structural design, namely, through the arrangement, manual periodic cleaning is replaced, the chuck cleanliness of the CP probe testing machine is improved, daily average operation time length of the machine is prolonged, and CP testing accuracy and testing efficiency are improved.

The foregoing has outlined rather broadly the more detailed description of the utility model in order that the detailed description of the principles and embodiments of the utility model may be implemented in conjunction with the detailed description of the embodiments that follow; meanwhile, as those skilled in the art will have variations in the specific embodiments and application scope in light of the ideas of the present utility model, the present description should not be construed as limiting the present utility model.

Claims

1. The utility model provides a wafer chuck cleaning device, includes CP probe test board, its characterized in that: be equipped with chuck and crane span structure on the CP probe test board, the crane span structure is located chuck top and with CP probe test board sliding connection, the one end of crane span structure can be dismantled and be connected with nitrogen gas input tube, seted up in the crane span structure with nitrogen gas input tube connects and the reposition of redundant personnel chamber of intercommunication, the crane span structure towards one side of chuck is equipped with a plurality of cleaning member, the cleaning member includes connecting portion and sweeps the portion, still set up on the crane span structure with connecting portion assorted pilot hole, the pilot hole with connecting portion can dismantle the connection, the pilot hole with the reposition of redundant personnel chamber is connected and is communicated, sweep the portion protrusion in the crane span structure and be flat mouthful structural design.

2. The wafer chuck cleaning apparatus of claim 1, wherein the nitrogen gas input pipe is a hose structure made of PVC material, one end of the nitrogen gas input pipe is inserted into the bridge, and the inserted end is in interference connection or screw connection with the bridge.

3. The wafer chuck cleaning apparatus as set forth in claim 1, wherein a side of the bridge facing the chuck is planar, and a side of the bridge facing the chuck is parallel to the chuck.

4. The wafer chuck cleaning apparatus as set forth in claim 1, wherein a plurality of said cleaning members are staggered with respect to said bridge.

5. The wafer chuck cleaning apparatus as set forth in claim 1, wherein said connection section and said purge section are integrally formed.

6. The wafer chuck cleaning apparatus as set forth in claim 1, wherein the purge portion tapers from an end thereof remote from the connection portion to an end thereof to which the connection portion is connected.

7. The wafer chuck cleaning apparatus of claim 1, wherein a camera is further provided at a center of a side of the bridge facing the chuck, and the nitrogen gas input pipe is externally connected with a factory nitrogen gas access machine.

8. The wafer chuck cleaning apparatus as set forth in any one of claims 1 to 7, wherein the outer diameter of the chuck is 300mm, the width of the bridge is 180mm, and the length of the bridge is greater than the outer diameter of the chuck.

9. The wafer chuck cleaning apparatus as set forth in any one of claims 1 to 7, wherein the outer diameter of the connection section is 20mm, the height of the purge section is 30mm, and the width of the end of the purge section remote from the connection section is 30mm.

10. The wafer chuck cleaning apparatus as set forth in any one of claims 1 to 7, wherein the number of cleaning members is 16, and on the premise that a center point of the chuck is set as an origin coordinate, the center point of the chuck coincides with a center point of the bridge, and the coordinates of centers of the circles of the 16 cleaning members are respectively: (-100, 60), (-60, 60), (0,60), (60, 60), (100, 60), (-120, 0), (-80, 0), (-40, 0), (80, 0), (120, 0), (-100, -60), (-60 ), (0, -60), (60, -60), (100, -60) for a staggered arrangement of the cleaning elements with respect to the bridge.