CN219631832U - Photovoltaic silicon chip assembly and spreading machine thereof - Google Patents
Photovoltaic silicon chip assembly and spreading machine thereof Download PDFInfo
- Publication number
- CN219631832U CN219631832U CN202320487755.3U CN202320487755U CN219631832U CN 219631832 U CN219631832 U CN 219631832U CN 202320487755 U CN202320487755 U CN 202320487755U CN 219631832 U CN219631832 U CN 219631832U
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- Prior art keywords
- silicon wafer
- photovoltaic silicon
- embedded
- photovoltaic
- wafer frame
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 138
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 138
- 239000010703 silicon Substances 0.000 title claims abstract description 138
- 230000007480 spreading Effects 0.000 title abstract description 11
- 238000003892 spreading Methods 0.000 title abstract description 11
- 230000007246 mechanism Effects 0.000 claims abstract description 80
- 238000003825 pressing Methods 0.000 claims abstract description 57
- 238000007906 compression Methods 0.000 claims abstract description 52
- 230000006835 compression Effects 0.000 claims abstract description 19
- 239000003292 glue Substances 0.000 claims abstract description 17
- 238000004026 adhesive bonding Methods 0.000 claims abstract description 15
- 238000007373 indentation Methods 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 3
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 230000002265 prevention Effects 0.000 description 9
- 238000010073 coating (rubber) Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010985 leather Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
Landscapes
- Photovoltaic Devices (AREA)
Abstract
The utility model discloses a photovoltaic silicon wafer assembly and a glue spreader thereof, which comprises a built-in photovoltaic silicon wafer assembly mechanism, wherein an embedded silicon wafer frame is arranged in the built-in photovoltaic silicon wafer assembly mechanism, embedded rails penetrate through two sides of the embedded silicon wafer frame, a glue spreading photovoltaic silicon wafer frame is arranged at the rear end of the embedded silicon wafer frame, a built-in photovoltaic silicon wafer groove is arranged in the glue spreading photovoltaic silicon wafer frame, a compression mark resisting mechanism is arranged at the top end of the glue spreading photovoltaic silicon wafer frame, pressing mechanisms are distributed and arranged around the compression mark resisting mechanism, and pneumatic tubes penetrate through two sides of the outer part of the glue spreading photovoltaic silicon wafer frame, and the beneficial effects are that: according to the utility model, a user can embed the embedded silicon wafer frame into the gluing photovoltaic silicon wafer frame and the built-in photovoltaic silicon wafer groove through the embedded rail, effectively isolate and protect the embedded silicon wafer frame from adhering on a photovoltaic silicon wafer assembly produced by a gluing machine, and simultaneously, the embedded rail and the embedded silicon wafer frame are manually pulled by the user to clean the built-in photovoltaic silicon wafer.
Description
Technical Field
The utility model relates to the field of gumming machines, in particular to a photovoltaic silicon wafer assembly and a gumming machine thereof.
Background
The spreading machine is mainly used for spreading liquid glue on textile, paper box or leather surface, and the existing spreading machine has various modes, such as: drum type gumming machine, double-acting gumming machine, double-station lifting gumming machine, etc. The coater is to spray a liquid such as glue or paint onto a desired product by air pressure. The device adopts three-axis linkage, is automatically operated, is simultaneously provided with a computer programming control path for spraying, but is produced by a gumming machine, and the photovoltaic silicon chip assembly has gummed indentations.
However, when the existing gumming machine is used for producing the photovoltaic silicon chip assembly for gumming, the built-in gumming assembly is not easy to replace, the photovoltaic silicon chip assembly is easy to adhere, in the gumming process, the roller adsorption force is easy to bring away the photovoltaic silicon chip, so that gumming deviation, gumming indentation and the like are caused.
Disclosure of Invention
The utility model aims to provide a photovoltaic silicon wafer assembly and a glue spreader thereof, which are used for solving the problems in the background technology.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a photovoltaic silicon wafer subassembly, includes built-in photovoltaic silicon wafer equipment mechanism, built-in photovoltaic silicon wafer equipment mechanism's inside is provided with interior embedded silicon wafer frame, and the both sides of interior embedded silicon wafer frame are run through there is embedded rail, and the rear end of interior embedded silicon wafer frame is provided with rubber coating photovoltaic silicon wafer frame, and rubber coating photovoltaic silicon wafer frame's internally mounted has built-in photovoltaic silicon wafer groove, and rubber coating photovoltaic silicon wafer frame's top is provided with resistance to compression trace mechanism, and pressing mechanism is installed to resistance to compression trace mechanism's distribution all around, and the outside both sides of rubber coating photovoltaic silicon wafer frame are run through there is the pneumatic tube.
Preferably, the embedded rail is movably connected with the inner embedded silicon wafer frame, and the embedded rail and the built-in photovoltaic silicon wafer groove form a sliding structure through the inner embedded silicon wafer frame.
Preferably, the gluing photovoltaic silicon wafer frame is movably connected with the anti-indentation mechanism, and the anti-indentation mechanism is attached to the pressing mechanism.
Preferably, the pressing mechanism is composed of a rubber pressing plate and a pneumatic telescopic rod, the rubber pressing plate is installed in the pressing mechanism, and the pneumatic telescopic rod is arranged below the rubber pressing plate.
Preferably, a vertical structure is arranged between the rubber pressing plate and the pneumatic telescopic rod, and the rubber pressing plate and the pressing mechanism form a lifting structure through the pneumatic telescopic rod.
Preferably, the anti-compression mark mechanism is formed by a photovoltaic silicon chip component embedded groove and an anti-compression reset spring, the photovoltaic silicon chip component embedded groove is formed in the anti-compression mark mechanism, and the anti-compression reset spring is distributed in the photovoltaic silicon chip component embedded groove.
Preferably, the photovoltaic silicon chip assembly embedded groove is fixedly connected with the compression-resistant reset spring, and the photovoltaic silicon chip assembly embedded groove forms an elastic structure with the compression-resistant trace mechanism through the compression-resistant reset spring.
A glue applicator provided with a photovoltaic silicon wafer assembly as described.
Compared with the prior art, the utility model has the beneficial effects that:
according to the utility model, a user can embed the embedded silicon wafer frame into the gluing photovoltaic silicon wafer frame and the built-in photovoltaic silicon wafer groove through the embedded rail, effectively isolate and protect the embedded silicon wafer frame from adhering on a photovoltaic silicon wafer assembly produced by a gluing machine, and simultaneously, the embedded rail and the embedded silicon wafer frame are manually pulled by the user to clean the built-in photovoltaic silicon wafer.
According to the utility model, the pneumatic telescopic rod and the rubber pressing plate which can move up and down can be elastically pressed around the anti-indentation mechanism assembly, and the photovoltaic silicon wafer is placed in the anti-indentation mechanism, so that the pneumatic telescopic rod and the rubber pressing plate can achieve the anti-indentation effect when the pressing mechanism is attached to and movably pressed.
The photovoltaic silicon wafer is placed in the anti-compression mark mechanism, so that when the pressing mechanism is attached to the pressing mechanism for movable pressing, the photovoltaic silicon wafer can be supported below the photovoltaic silicon wafer assembly by means of elasticity of the embedded groove of the photovoltaic silicon wafer assembly and the anti-compression reset spring, and when glue coating pressing is carried out by glue coating machine equipment, the embedded groove of the photovoltaic silicon wafer assembly and the anti-compression reset spring play a role in anti-compression elastic space, and direct glue coating pressing of the indentation is avoided.
Drawings
FIG. 1 is a schematic perspective view of the present utility model;
FIG. 2 is a schematic view of the internal structure of the pressing mechanism of the present utility model;
FIG. 3 is a schematic view of the internal structure of the anti-tracking mechanism of the present utility model.
In the figure: built-in photovoltaic silicon wafer assembling mechanism 1, embedded rail 101, built-in silicon wafer frame 102, rubberized photovoltaic silicon wafer frame 2, built-in photovoltaic silicon wafer groove 3, pressing mechanism 4, rubber pressing plate 401, pneumatic telescopic rod 402, anti-indentation mechanism 5, photovoltaic silicon wafer assembly embedded groove 501, anti-compression reset spring 502 and pneumatic tube 6.
Detailed Description
In order to make the objects, technical solutions, and advantages of the present utility model more apparent, the embodiments of the present utility model will be further described in detail with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are some, but not all, embodiments of the present utility model, are intended to be illustrative only and not limiting of the embodiments of the present utility model, and that all other embodiments obtained by persons of ordinary skill in the art without making any inventive effort are within the scope of the present utility model.
In the description of the present utility model, it should be noted that the terms "center," "middle," "upper," "lower," "left," "right," "inner," "outer," "top," "bottom," "side," "vertical," "horizontal," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate description of the present utility model and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "a," an, "" the first, "" the second, "" the third, "" the fourth, "" the fifth, "and the sixth" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
For purposes of brevity and description, the principles of the embodiments are described primarily by reference to examples. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the embodiments. It will be apparent, however, to one of ordinary skill in the art that the embodiments may be practiced without limitation to these specific details. In some instances, well-known methods and structures have not been described in detail so as not to unnecessarily obscure the embodiments. In addition, all embodiments may be used in combination with each other.
Referring to fig. 1 to 3, the present utility model provides a technical solution: the photovoltaic silicon wafer assembly comprises a built-in photovoltaic silicon wafer assembly mechanism 1, an inner embedded silicon wafer frame 102 is arranged inside the built-in photovoltaic silicon wafer assembly mechanism 1, embedded rails 101 are penetrated through two sides of the inner embedded silicon wafer frame 102, a gluing photovoltaic silicon wafer frame 2 is arranged at the rear end of the inner embedded silicon wafer frame 102, a built-in photovoltaic silicon wafer groove 3 is arranged inside the gluing photovoltaic silicon wafer frame 2, a compression mark prevention mechanism 5 is arranged at the top end of the gluing photovoltaic silicon wafer frame 2, pressing mechanisms 4 are distributed and installed around the compression mark prevention mechanism 5, pneumatic tubes 6 penetrate through two sides of the outer of the gluing photovoltaic silicon wafer frame 2, a sliding structure is formed between the embedded rails 101 and the inner embedded silicon wafer frame 102 through the inner embedded silicon wafer frame 102, the embedded rails 101 are movably installed inside the built-in photovoltaic silicon wafer assembly mechanism 1, the embedded rails 101 are movably installed on two sides of the inner embedded silicon wafer frame 102, a user can install the inner embedded silicon wafer frame 102 through the embedded rails 101, the gluing photovoltaic silicon wafer frame 2 and the inside the photovoltaic silicon wafer groove 3, the compression mark prevention mechanism 5 is effectively isolated from the inner embedded silicon wafer frame 2 and the photovoltaic silicon wafer frame 3, the compression mark prevention mechanism is movably attached to the compression mark prevention mechanism 5, the compression mark prevention mechanism is enabled to be in contact with the inner side of the built-in the photovoltaic silicon wafer assembly, the compression mark prevention mechanism 5 is movably attached to the silicon wafer assembly, and the compression mark prevention mechanism is enabled to be in contact with the inner side of the silicon wafer assembly, and the compression mark prevention mechanism is enabled to be movably attached to the inner side of the silicon wafer frame 5.
The pressing mechanism 4 is composed of a rubber pressing plate 401 and a pneumatic telescopic rod 402, the rubber pressing plate 401 is arranged in the pressing mechanism 4, the pneumatic telescopic rod 402 is arranged below the rubber pressing plate 401, a vertical structure is formed between the rubber pressing plate 401 and the pneumatic telescopic rod 402, the rubber pressing plate 401 and the pressing mechanism 4 form a lifting structure through the pneumatic telescopic rod 402, the pressing mechanism 4 is pressed in a laminating mode, when the pressing mechanism 5 assembly is arranged around, the pneumatic pipe 6 is communicated with the outside of the pressing mechanism 4, the pneumatic telescopic rod 402 is pushed to perform lifting movement by means of power of the pneumatic pipe 6, meanwhile, the rubber pressing plate 401 is arranged at the top end of the pneumatic telescopic rod 402, the pneumatic telescopic rod 402 and the rubber pressing plate 401 capable of performing lifting movement are pressed around the pressing mechanism 5 assembly, a photovoltaic silicon wafer is placed in the pressing mechanism 5, and when the pressing mechanism 4 is pressed in a laminating mode, the pneumatic telescopic rod 402 and the rubber pressing plate 401 can achieve the anti-indentation effect.
The anti-compression mark mechanism 5 is formed by a photovoltaic silicon wafer assembly embedded groove 501 and an anti-compression reset spring 502, the photovoltaic silicon wafer assembly embedded groove 501 is formed in the anti-compression mark mechanism 5, the anti-compression reset spring 502 is distributed in the photovoltaic silicon wafer assembly embedded groove 501, the photovoltaic silicon wafer assembly embedded groove 501 and the anti-compression reset spring 502 are fixedly connected, the photovoltaic silicon wafer assembly embedded groove 501 and the anti-compression reset spring 502 form an elastic structure through the anti-compression reset spring 502, the photovoltaic silicon wafer assembly embedded groove 501 is formed in the anti-compression mark mechanism 5, the anti-compression reset spring 502 is distributed and installed in the photovoltaic silicon wafer assembly embedded groove 501, the photovoltaic silicon wafer is placed in the anti-compression mark mechanism 5, when the pressing mechanism 4 is attached to the press body, the photovoltaic silicon wafer assembly embedded groove 501 and the anti-compression reset spring 502 are elastic, the photovoltaic silicon wafer assembly can be supported below, and glue spreader equipment is used for glue spreading and pressing, the photovoltaic silicon wafer assembly embedded groove 501 and the anti-compression reset spring 502 play an anti-compression elastic space, and direct glue spreading and pressing indentation are avoided.
A glue applicator provided with a photovoltaic silicon wafer assembly as described.
Working principle: during actual use, firstly, the embedded silicon wafer frame 102 is movably arranged inside the built-in photovoltaic silicon wafer assembling mechanism 1, the embedded rails 101 are movably arranged on two sides of the embedded silicon wafer frame 102, a user can embed and install the embedded silicon wafer frame 102 inside the glued photovoltaic silicon wafer frame 2 and the built-in photovoltaic silicon wafer groove 3 through the embedded rails 101, the photovoltaic silicon wafer assembly embedded groove 501 is formed in the anti-compression trace mechanism 5, the anti-compression reset springs 502 are distributed and installed inside the photovoltaic silicon wafer assembly embedded groove 501, the photovoltaic silicon wafer is placed inside the anti-compression trace mechanism 5, when the pressing mechanism 4 is attached to the pressing mechanism, the anti-compression trace mechanism 4 is elastically attached to the anti-compression reset springs 502, when the anti-compression trace mechanism 5 is assembled around, the pneumatic tube 6 is connected and installed outside the pressing mechanism 4, and the pneumatic telescopic rod 402 is pushed to perform lifting motion by virtue of power of the pneumatic telescopic rod 402, and meanwhile, the rubber pressing plate 401 is installed on the top end of the pneumatic telescopic rod 402.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. A photovoltaic silicon wafer assembly comprises a built-in photovoltaic silicon wafer assembly mechanism (1);
the method is characterized in that: an embedded silicon wafer frame (102) is arranged in the built-in photovoltaic silicon wafer assembling mechanism (1), and embedded rails (101) penetrate through two sides of the embedded silicon wafer frame (102);
the back end of the embedded silicon wafer frame (102) is provided with a gluing photovoltaic silicon wafer frame (2), a built-in photovoltaic silicon wafer groove (3) is arranged in the gluing photovoltaic silicon wafer frame (2), and the top end of the gluing photovoltaic silicon wafer frame (2) is provided with a pressure mark resisting mechanism (5);
the periphery of the anti-indentation mechanism (5) is provided with pressing mechanisms (4);
pneumatic tubes (6) penetrate through two sides of the outer part of the gluing photovoltaic silicon wafer frame (2).
2. The photovoltaic silicon module of claim 1, wherein: the embedded rail (101) is movably connected with the embedded silicon wafer frame (102), and the embedded rail (101) and the embedded photovoltaic silicon wafer groove (3) form a sliding structure through the embedded silicon wafer frame (102).
3. The photovoltaic silicon module of claim 1, wherein: the gluing photovoltaic silicon wafer frame (2) is movably connected with the anti-indentation mechanism (5), and the anti-indentation mechanism (5) is attached to the pressing mechanism (4).
4. The photovoltaic silicon module of claim 1, wherein: the pressing mechanism (4) is composed of a rubber pressing plate (401) and a pneumatic telescopic rod (402), the rubber pressing plate (401) is installed in the pressing mechanism (4), and the pneumatic telescopic rod (402) is arranged below the rubber pressing plate (401).
5. The photovoltaic silicon module according to claim 4, wherein: the rubber pressing plate (401) and the pneumatic telescopic rod (402) are of a vertical structure, and the rubber pressing plate (401) and the pressing mechanism (4) form a lifting structure through the pneumatic telescopic rod (402).
6. The photovoltaic silicon module of claim 1, wherein: the anti-compression mark mechanism (5) is characterized in that the anti-compression mark mechanism (5) is formed by a photovoltaic silicon wafer assembly embedded groove (501) and an anti-compression reset spring (502), the photovoltaic silicon wafer assembly embedded groove (501) is formed in the anti-compression mark mechanism (5), and the anti-compression reset spring (502) is distributed in the photovoltaic silicon wafer assembly embedded groove (501).
7. The photovoltaic silicon module of claim 6, wherein: the photovoltaic silicon chip assembly embedded groove (501) is fixedly connected with the compression-resistant reset spring (502), and the photovoltaic silicon chip assembly embedded groove (501) and the compression-resistant trace mechanism (5) form an elastic structure through the compression-resistant reset spring (502).
8. A glue spreader, characterized in that: the gumming machine is provided with the photovoltaic silicon chip assembly as claimed in any one of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320487755.3U CN219631832U (en) | 2023-03-14 | 2023-03-14 | Photovoltaic silicon chip assembly and spreading machine thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320487755.3U CN219631832U (en) | 2023-03-14 | 2023-03-14 | Photovoltaic silicon chip assembly and spreading machine thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219631832U true CN219631832U (en) | 2023-09-05 |
Family
ID=87811212
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320487755.3U Active CN219631832U (en) | 2023-03-14 | 2023-03-14 | Photovoltaic silicon chip assembly and spreading machine thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219631832U (en) |
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2023
- 2023-03-14 CN CN202320487755.3U patent/CN219631832U/en active Active
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