CN219626632U - Chuck pin assembly and wafer cleaning equipment - Google Patents
Chuck pin assembly and wafer cleaning equipment Download PDFInfo
- Publication number
- CN219626632U CN219626632U CN202320348444.9U CN202320348444U CN219626632U CN 219626632 U CN219626632 U CN 219626632U CN 202320348444 U CN202320348444 U CN 202320348444U CN 219626632 U CN219626632 U CN 219626632U
- Authority
- CN
- China
- Prior art keywords
- chuck
- circumference
- pin assembly
- chuck pin
- clamping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model provides a chuck pin assembly and wafer cleaning equipment, wherein the chuck pin assembly comprises a clamping structure and a driving structure; the clamping structure comprises a chuck and a plurality of clamping pins, the clamping pins are arranged on the chuck in the circumferential direction, the clamping pins can rotate around the tangential line of the circumference, the axial direction of the clamping pins is not parallel to the chuck, the radial dimension of the clamping pins along the circumference is greater than 1.5mm, and the chuck can rotate around the central line of the circumference; the driving structure is connected with the clamping pin and is used for driving the clamping pin to deflect towards the center of the circumference around the tangent line of the circumference. Therefore, the design that the radial dimension of the bayonet lock along the circumference is greater than 1.5mm can ensure that the bayonet lock cannot be broken due to overlarge centrifugal force when rotating in the process that the chuck drives the bayonet lock to rotate synchronously, and the service life of the chuck pin assembly is prolonged.
Description
Technical Field
The utility model relates to the technical field of semiconductor equipment, in particular to a chuck pin assembly and wafer cleaning equipment.
Background
The chuck pin assembly of the wafer cleaning apparatus includes a plurality of chuck pins which are circumferentially distributed and rotated inward to chuck the wafer. The problem in two aspects appears easily in the wafer cleaning process, firstly, the bayonet lock of chuck pin subassembly's width is narrower, easily causes the bayonet lock fracture because centrifugal force is too big in the wafer rotation process is cliied to the chuck pin subassembly, secondly, drives the spare part in the rotatory drive structure of bayonet lock under the condition of drive structure multiple operation easily fracture.
Disclosure of Invention
The utility model aims to provide a chuck pin assembly and wafer cleaning equipment, which are used for solving the problem that a chuck pin in the chuck pin assembly of the wafer cleaning equipment is easy to break in the wafer cleaning process.
In order to solve the above technical problem, according to one aspect of the present utility model, there is provided a chuck pin assembly including:
the clamping structure comprises a chuck and a plurality of clamping pins, wherein the clamping pins are arranged on the chuck in the circumferential direction, the clamping pins can rotate around the tangential line of the circumference, the axial direction of the clamping pins is not parallel to the chuck, the radial dimension of the clamping pins along the circumference is greater than 1.5mm, and the chuck can rotate around the central line of the circumference;
and the driving structure is connected with the clamping pin and is used for driving the clamping pin to deflect towards the center of the circumference around the tangent line of the circumference.
Optionally, the axial direction of the bayonet is perpendicular to the chuck.
Optionally, the radial dimension of the bayonet along the circumference is 3mm.
Optionally, the driving structure is movable along a radial direction of the circumference, and the driving structure moves outwards along the radial direction of the circumference when external force is applied, so as to contact with the bayonet and drive the bayonet to rotate; the driving structure moves radially inward along the circumference to be away from the bayonet when the external force is removed.
Optionally, the drive structure includes piston rod and spring, the axial of piston rod is parallel to the radial of circumference, the spring cover is established on the piston rod, just the one end of spring with the piston rod is connected, the other end of spring is followed the radial position of circumference is fixed.
Optionally, the chuck pin assembly further comprises a rigid member embedded in the piston rod.
Optionally, the rigid member comprises a steel needle.
Optionally, the driving structure further comprises a driving cavity, the piston rod is in closed connection with the driving cavity, and the driving cavity is used for introducing gas.
Optionally, the detent structure includes six detents uniformly distributed circumferentially along the circumferential direction.
In accordance with another aspect of the present utility model, there is also provided a wafer cleaning apparatus including the chuck pin assembly as described above.
In summary, in the chuck pin assembly and the wafer cleaning apparatus provided by the present utility model, the chuck pin assembly includes a clamping structure and a driving structure; the clamping structure comprises a chuck and a plurality of clamping pins, the clamping pins are arranged on the chuck in the circumferential direction, the clamping pins are rotatable around the tangential line of the circumference, the axial direction of the clamping pins is not parallel to the chuck, the radial dimension of the clamping pins along the circumference is greater than 1.5mm, and the chuck is rotatable around the central line of the circumference; the driving structure is connected with the clamping pin and is used for driving the clamping pin to deflect towards the center of the circumference around the tangent line of the circumference.
So configured, in a first aspect, the drive assembly drives the detent pin to deflect toward the center of the circumference such that the detent pin is inclined inwardly to apply pressure to the wafer radially inwardly along the circumference, and the plurality of detent pins in the circumference are inclined inwardly to clamp and fix the wafer for subsequent cleaning operations; in the second aspect, the design that the radial dimension of the bayonet lock along the circumference is greater than 1.5mm can ensure that the bayonet lock cannot be broken due to overlarge centrifugal force when the chuck drives the bayonet lock to rotate synchronously, and the service life of the chuck pin assembly is prolonged.
Drawings
It will be appreciated by those skilled in the art that the drawings are provided for a better understanding of the utility model and do not constitute any limitation on the scope of the utility model. Wherein:
FIG. 1 is a schematic view of a chuck pin assembly according to an embodiment of the present utility model;
FIG. 2 is a schematic diagram of a latch structure according to an embodiment of the utility model;
FIG. 3 is a schematic view of a bayonet according to an embodiment of the present utility model.
In the accompanying drawings:
10-clamping structure; 11-a chuck; 12-bayonet lock; 20-driving structure; 21-a piston rod; 22-springs; 23-driving the cavity; 30-a rigid member; 40-base.
Detailed Description
The utility model will be described in further detail with reference to the drawings and the specific embodiments thereof in order to make the objects, advantages and features of the utility model more apparent. It should be noted that the drawings are in a very simplified form and are not drawn to scale, merely for convenience and clarity in aiding in the description of embodiments of the utility model. Furthermore, the structures shown in the drawings are often part of actual structures. In particular, the drawings are shown with different emphasis instead being placed upon illustrating the various embodiments.
As used in this disclosure, the singular forms "a," "an," and "the" include plural referents, the term "or" are generally used in the sense of comprising "and/or" and the term "several" are generally used in the sense of comprising "at least one," the term "at least two" are generally used in the sense of comprising "two or more," and the term "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying any relative importance or number of features indicated. Thus, a feature defining "first," "second," "third," or "third" may explicitly or implicitly include one or at least two such features, with "one end" and "another end" and "proximal end" and "distal end" generally referring to the respective two portions, including not only the endpoints, but also the terms "mounted," "connected," "coupled," and "connected" are to be construed broadly, e.g., as being either a fixed connection, a removable connection, or as being integral therewith; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. Furthermore, as used in this disclosure, an element disposed on another element generally only refers to a connection, coupling, cooperation or transmission between two elements, and the connection, coupling, cooperation or transmission between two elements may be direct or indirect through intermediate elements, and should not be construed as indicating or implying any spatial positional relationship between the two elements, i.e., an element may be in any orientation, such as inside, outside, above, below, or on one side, of the other element unless the context clearly indicates otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
Fig. 1 is a schematic view of a chuck pin assembly according to an embodiment of the present utility model, fig. 2 is a schematic view of a detent structure according to an embodiment of the present utility model, and fig. 3 is a schematic view of a detent according to an embodiment of the present utility model. Referring to fig. 1, one embodiment of the present utility model schematically illustrates a chuck pin assembly for use with a wafer cleaning apparatus, the chuck pin assembly including a chuck structure 10 and a drive structure 20. The detent structure 10 comprises a chuck 11 and a plurality of detents 12, wherein a plurality of detents 12 are arranged on the chuck 11 in the circumferential direction (shown in fig. 2), the detents 12 are rotatable around a tangent line of the circumference, the axial direction of the detents 12 is not parallel to the chuck 11, preferably, the axial direction of the detents 12 is perpendicular to the chuck 11, and the chuck 11 is rotatable around a central line of the circumference. Referring to fig. 2, in one embodiment, the detent structure 10 includes six detents 12 uniformly distributed circumferentially along the circumferential direction. It should be noted that fig. 1 schematically shows one side of the chuck 11 and the bayonet 12 located on the side, and the arrangement of other bayonet 12 can be further understood by referring to fig. 2. With continued reference to fig. 2, in one embodiment, the chuck 11 has a disk shape, and the pins 12 are circumferentially distributed, that is, the pins 12 are circumferentially distributed along the disk-shaped chuck 11, and the center line of the circumference is the center vertical line of the chuck 11. The driving structure 20 may be connected to the bayonet locks 12, and is used to drive the bayonet locks 12 to deflect around a tangent line of the circumference towards the center of the circumference, so that each bayonet lock 12 may tilt towards the center of the circle (or the center of the chuck 11), thereby clamping and fixing the wafer on the chuck 11, and avoiding the wafer from falling off during the cleaning process.
Preferably, referring to fig. 3, the radial dimension of the bayonet 12 along the circumference is greater than 1.5mm. Thus, the design that the radial dimension of the bayonet 12 along the circumference is greater than 1.5mm can be considered to increase the width of the bayonet 12, and in the process that the chuck 11 drives the bayonet 12 to synchronously rotate, the bayonet 12 can be ensured not to be broken due to the overlarge centrifugal force during rotation, so that the service life of the chuck pin assembly is prolonged. Preferably, the radial dimension of the bayonet 12 along the circumference is 3mm. The inventor found through practice that the design of the radial dimension of the bayonet 12 along the circumference of 3mm can greatly improve the breakage phenomenon of the bayonet 12 due to centrifugal force, and in the prior art, the bayonet 12 of 1.5mm can perform cleaning work of 12000 wafers at maximum, and the bayonet 12 of 3mm can perform cleaning work of 30000 wafers at maximum.
Further, regarding the working principle of the driving structure 20 for driving the bayonet 12 to rotate, specifically, the driving structure 20 is movable along the radial direction of the circumference, and the driving structure 20 is moved outwards along the radial direction of the circumference when an external force is applied, so as to contact with the bayonet 12 and drive the bayonet 12 to rotate; the driving structure 20 moves radially inward along the circumference to be away from the bayonet 12 when the external force is removed, thereby returning to the original position.
In a specific embodiment, the driving structure 20 includes a piston rod 21 and a spring 22, the axial direction of the piston rod 21 is parallel to the radial direction of the circumference, the spring 22 is sleeved on the piston rod 21, one end of the spring 22 is connected with the piston rod 21, and the other end of the spring 22 is fixed along the radial position of the circumference. Thus, when the piston rod 21 is applied with a radially outward force along the circumference, the piston rod 21 moves outward to contact the bayonet 12 to drive the bayonet 12 to rotate, so that the bayonet 12 is inclined inward, and as can be appreciated, the spring 22 gradually compresses to store potential energy during the outward movement of the piston rod 21; when the piston rod 21 is removed from the external force, the spring 22 will release the potential energy, and the piston rod 21 will move radially inwards along the circumference under the action of the spring 22, thereby returning to the initial position. As a further embodiment, the chuck pin assembly further comprises a base 40, the piston rod 21 is movably arranged in the base 40, one end of the spring 22 is connected with the piston rod 21, and the other end of the spring 22 is fixed on the base 40, so that the other end of the spring 22 is fixed along the radial position of the circumference.
Preferably, the chuck pin assembly further includes a rigid member 30, the rigid member 30 being embedded in the piston rod 21 (black filled portion shown in fig. 2). In one embodiment, the rigid member 30 comprises a steel needle. The piston rod 21 in the prior art is usually made of PVDF (polyvinylidene fluoride) material, and after the piston rod 21 reciprocates for several times to drive the bayonet 12 to rotate, the piston rod 21 is easy to break.
In one embodiment, the piston rod 21 may be driven in motion by pneumatic principles. Specifically, the driving structure 20 further includes a driving cavity, the piston rod 21 is closely connected to the driving cavity 23, and the driving cavity 23 is configured to be filled with gas, so that the pressure in the driving cavity 23 can be increased by filling the driving cavity 23 with gas (for example, nitrogen), so as to drive the piston rod 21 to move radially outwards along the circumference.
Based on the chuck pin assembly, the present embodiment further provides a wafer cleaning apparatus, which may specifically be a wafer back surface cleaning apparatus, including the chuck pin assembly as described above. It should be noted that, since the wafer cleaning apparatus includes the chuck pin assembly, the wafer cleaning apparatus also has the beneficial technical effects brought by the chuck pin assembly, and other components and working principles of the wafer cleaning apparatus are not described herein, which are known by those skilled in the art from the prior art.
In summary, in the chuck pin assembly and the wafer cleaning apparatus provided by the present utility model, the chuck pin assembly includes a clamping structure and a driving structure; the clamping structure comprises a chuck and a plurality of clamping pins, the clamping pins are arranged on the chuck in the circumferential direction, the clamping pins are rotatable around the tangential line of the circumference, the axial direction of the clamping pins is not parallel to the chuck, the radial dimension of the clamping pins along the circumference is greater than 1.5mm, and the chuck is rotatable around the central line of the circumference; the driving structure is connected with the clamping pin and is used for driving the clamping pin to deflect towards the center of the circumference around the tangent line of the circumference. So configured, in a first aspect, the drive assembly drives the detent pin to deflect toward the center of the circumference such that the detent pin is inclined inwardly to apply pressure to the wafer radially inwardly along the circumference, and the plurality of detent pins in the circumference are inclined inwardly to clamp and fix the wafer for subsequent cleaning operations; in the second aspect, the design that the radial dimension of the bayonet lock along the circumference is greater than 1.5mm can ensure that the bayonet lock cannot be broken due to overlarge centrifugal force when the chuck drives the bayonet lock to rotate synchronously, and the service life of the chuck pin assembly is prolonged.
The foregoing description is only illustrative of the preferred embodiments of the present utility model, and is not intended to limit the scope of the present utility model in any way, and any changes and modifications made by those skilled in the art in light of the foregoing disclosure will be deemed to fall within the scope and spirit of the present utility model.
Claims (10)
1. A chuck pin assembly, comprising:
the clamping structure comprises a chuck and a plurality of clamping pins, wherein the clamping pins are arranged on the chuck in the circumferential direction, the clamping pins can rotate around the tangential line of the circumference, the axial direction of the clamping pins is not parallel to the chuck, the radial dimension of the clamping pins along the circumference is greater than 1.5mm, and the chuck can rotate around the central line of the circumference;
and the driving structure is connected with the clamping pin and is used for driving the clamping pin to deflect towards the center of the circumference around the tangent line of the circumference.
2. The chuck pin assembly of claim 1, wherein an axial direction of the chuck pin is perpendicular to the chuck.
3. The chuck pin assembly of claim 1, wherein the radial dimension of the chuck pin along the circumference is 3mm.
4. The chuck pin assembly of claim 1, wherein the drive structure is movable in a radial direction along the circumference and the drive structure moves radially outward along the circumference when an external force is applied to contact and drive rotation of the chuck pin; the driving structure moves radially inward along the circumference to be away from the bayonet when the external force is removed.
5. The chuck pin assembly of claim 4, wherein the drive structure comprises a piston rod and a spring, an axial direction of the piston rod is parallel to a radial direction of the circumference, the spring is sleeved on the piston rod, one end of the spring is connected with the piston rod, and the other end of the spring is fixed along the radial position of the circumference.
6. The chuck pin assembly of claim 5, further comprising a rigid member embedded in the piston rod.
7. The chuck pin assembly of claim 6, wherein the rigid member comprises a steel needle.
8. The chuck pin assembly of claim 5, wherein the drive structure further comprises a drive cavity, the piston rod being in close connection with the drive cavity, the drive cavity being for the passage of a gas.
9. The chuck pin assembly of claim 1, wherein said detent structure comprises six of said detents evenly circumferentially distributed along a circumferential direction.
10. Wafer cleaning apparatus comprising a chuck pin assembly according to any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320348444.9U CN219626632U (en) | 2023-02-28 | 2023-02-28 | Chuck pin assembly and wafer cleaning equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320348444.9U CN219626632U (en) | 2023-02-28 | 2023-02-28 | Chuck pin assembly and wafer cleaning equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219626632U true CN219626632U (en) | 2023-09-01 |
Family
ID=87794510
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320348444.9U Active CN219626632U (en) | 2023-02-28 | 2023-02-28 | Chuck pin assembly and wafer cleaning equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219626632U (en) |
-
2023
- 2023-02-28 CN CN202320348444.9U patent/CN219626632U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111063654B (en) | Thimble mechanism and semiconductor processing equipment | |
| CN219626632U (en) | Chuck pin assembly and wafer cleaning equipment | |
| CN210702643U (en) | Clamp for machining shaft sleeve | |
| JPH1015764A (en) | Internal periphery chucking device for ring member | |
| CN116397093B (en) | Rim spoke processing transfer device | |
| CN110539248B (en) | Polishing head and grinding tool | |
| CN110962044B (en) | Diamond millstone positioning device | |
| CN210672515U (en) | Brush head installation assembly and equipment convenient for replacing brush head | |
| CN218364095U (en) | Burr removing device for rivet production | |
| CN211161979U (en) | Chuck structure with rotary oil cylinder | |
| CN113967859A (en) | Hole grinding device and plugging robot with same | |
| CN209986761U (en) | Vertical grinding alloy blade edge grinding clamp | |
| CN219113880U (en) | Self-centering high-coaxiality chuck clamp for expanding spring | |
| CN211516691U (en) | Clamping device is used in processing of rear-axle housing lid excircle | |
| CN219526110U (en) | Jacking device for vehicle | |
| CN211439694U (en) | Industrial robot clamp | |
| CN211220239U (en) | Polycrystalline diamond grinding head | |
| CN218905188U (en) | Sealing ring taking-out device | |
| CN215035717U (en) | Clamping mechanism for processing circular workpiece | |
| CN220806860U (en) | Numerical control pipe hole honing anchor clamps | |
| CN220516485U (en) | Bushing positioning equipment convenient to switch | |
| CN117506587B (en) | Grinding equipment for spring processing | |
| CN217992100U (en) | Sealing washer polishing equipment | |
| CN219131536U (en) | Product stub bar remove device | |
| CN217195411U (en) | Bernoulli manipulator for placing and taking wafer on vacuum chuck |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |