CN219603663U

CN219603663U - Vacuum coating device

Info

Publication number: CN219603663U
Application number: CN202320362018.0U
Authority: CN
Inventors: 王怀民; 姜友松; 葛鹤龄
Original assignee: Anhui Qimang Photoelectric Technology Co ltd
Current assignee: Anhui Qimang Photoelectric Technology Co ltd
Priority date: 2023-02-27
Filing date: 2023-02-27
Publication date: 2023-08-29
Anticipated expiration: 2033-02-27

Abstract

The utility model discloses a vacuum coating device which comprises a reaction container, a coating umbrella stand, an evaporation coating mechanism, a sputtering coating mechanism and a vacuumizing mechanism. The reaction vessel has a vacuum chamber. The film coating umbrella frame is arranged in the reaction container. The film coating umbrella stand rotates around a vertical axis, and the diameter of the holding surface linearly increases from top to bottom. The evaporation coating mechanism and the sputtering coating mechanism are arranged in the vacuum chamber and face the holding surface. The evaporation coating mechanism and the sputtering coating mechanism are positioned on the same side of the coating umbrella stand. The vacuumizing mechanism comprises a cold trap assembly, a containing cavity, a communication channel and a pump assembly. The cold trap body of the cold trap assembly is positioned within the containment chamber. The communication channel is provided with a port which is communicated with the accommodating chamber, the plane of the port is perpendicular to the horizontal direction, and the vertical projection of the cold trap main body on the plane of the port surrounds the outer side of the port. The vacuum coating device combines evaporation plating and sputtering plating, can save the space of a vacuum chamber and avoid pollution of a cold trap main body.

Description

Vacuum coating device

Technical Field

The specification relates to the field of vacuum coating technology, and in particular relates to a vacuum coating device.

Background

In the optical and semiconductor fields, many devices require a coating process, and currently, widely used coating methods are vacuum evaporation and sputtering.

The deposition rate of vacuum evaporation is high, however, the energy of deposited particles of vacuum evaporation is low, and evaporation of some specific film layers cannot be completed. The microstructure of the film formed by vacuum evaporation is a typical columnar body and gap structure, the compactness of the film is insufficient, and even if the ion beam assisted deposition coating (Ion Beam Assisted Deposition, IAD) technology is adopted, the sufficient compactness cannot be achieved. Some specific films, such as DIAMOND-LIKE CARBON (DLC) films, nitride films, etc., cannot be formed by vacuum evaporation.

The film obtained by sputtering plating is well combined with the substrate, and the energy of sputtered atoms is 1-2 orders of magnitude higher than that of evaporated atoms, so that the film has strong adhesive force with the substrate, and the film aggregation density is close to 1; and the sputtering can complete some films which can not be completed by evaporation, such as diamond-like film, and the sputtering is easy to form various nitride films, such as Si ₃ N ₄ AlN, gaN, etc. However, the deposition rate of sputter plating is low.

Also, during high vacuum acquisition, a cold trap is typically required to trap water vapor or oil vapor in the cavity. A cold trap is a device that prevents vapor or liquid from entering the measuring instrument from the system, or from the measuring instrument, and provides a very low temperature surface on which molecules can condense and can increase the vacuum level by one to two orders of magnitude. The cold trap is typically placed between the vacuum chamber and the vacuum pump.

Under the prior art, the mounting mode of the cold trap occupies the space of the vacuum chamber, so that the volume of the vacuum chamber is reduced, and the cold trap is easy to pollute, thereby forming a new pollution source; also, heating is typically required within the vacuum chamber, while the cold trap is refrigerated, thus causing a dual loss of energy for both heating and refrigeration. Other mounting modes of the cold trap occupy the exhaust passage, and the exhaust efficiency is affected.

Disclosure of Invention

In view of the shortcomings of the prior art, an object of the present specification is to provide a vacuum coating device, which combines evaporation plating and sputtering plating, improves production efficiency, and can save space of a vacuum chamber, avoid pollution of a cold trap main body, reduce energy consumption loss, and not occupy an exhaust channel.

In order to achieve the above object, embodiments of the present disclosure provide a vacuum coating apparatus, including:

a reaction vessel with a vacuum chamber for coating, wherein a coating umbrella stand capable of keeping a substrate on a keeping surface is arranged in the reaction vessel, the coating umbrella stand rotates around a vertical axis, and the diameter of the keeping surface linearly increases from top to bottom; the cross section of the holding surface is circular or polygonal;

the evaporation coating mechanism is arranged in the vacuum chamber and used for evaporating and coating the substrate, and the evaporation coating mechanism is arranged towards the holding surface;

the sputtering coating mechanism is arranged in the vacuum chamber and used for performing sputtering coating on the substrate, the sputtering coating mechanism is arranged towards the holding surface, and the evaporation coating mechanism and the sputtering coating mechanism are positioned on the same side of the coating umbrella stand;

the vacuum pumping mechanism is used for vacuumizing the vacuum chamber and comprises a cold trap assembly, a containing chamber for installing the cold trap assembly, a communication channel for communicating the containing chamber and the vacuum chamber and a pump assembly for communicating the containing chamber; the cold trap assembly includes a cold trap body having a cold trap pipe extending spirally in a horizontal direction; the cold trap body is positioned in the accommodating cavity; the communication channel extends along the horizontal direction, and the central axis of the communication channel is perpendicular to the vertical axis of the film plating umbrella stand; the communication channel is communicated with the upstream of the accommodating chamber; the communication channel is provided with a port which is communicated with the accommodating cavity, the plane of the port is perpendicular to the horizontal direction, the vertical projection of the communication channel on the plane of the port coincides with the port, and the vertical projection of the cold trap main body on the plane of the port surrounds the outer side of the port.

As a preferred embodiment, the cold trap assembly further comprises a first mounting frame fixedly mounted within the containment chamber carrying the cold trap body; a vertical projection of the first mounting frame on the plane surrounds a vertical projection of the communication channel or outside the port; the vertical projection of the cold trap body on the plane is positioned between the vertical projection of the first mounting frame and the vertical projection of the communication channel or between the vertical projection of the first mounting frame and the port.

As a preferred embodiment, the port is a first rectangle, and the vertical projection of the inner wall surface of the first mounting frame on the plane is a second rectangle; the ratio of the area of the first rectangle to the area of the second rectangle is 0.5-0.8, and the ratio of the length of the long side of the first rectangle to the length of the long side of the second rectangle is 0.6-0.9.

As a preferred embodiment, the vacuum pumping mechanism is provided with a second mounting frame at the other side of the accommodating chamber relative to the communication channel, and the pump assembly comprises a first pump body communicated with the accommodating chamber and a second pump body mounted on the second mounting frame; the second pump body is a molecular pump with higher adjustment precision than the first pump body; the port, the first mounting frame, and the second mounting frame are sequentially arranged in the horizontal direction.

As a preferred embodiment, the housing chamber has a blocking wall perpendicular to the horizontal direction surrounding the port peripheral side, and the cold trap body is blocked and positioned on a side of the blocking wall facing away from the communication passage.

As a preferred embodiment, the sputter coating mechanism comprises a sputter cathode arranged in the vacuum chamber and connected with the side wall of the vacuum chamber, and a target material arranged on the sputter cathode; the target material is provided with a target material surface facing the holding surface, a longitudinal section passing through the vertical axis exists, the contour line of the target material surface on the longitudinal section is parallel to the contour line of the holding surface on the longitudinal section, and the distance between the contour line of the target material surface and the contour line of the holding surface is 10 cm-15 cm; the longitudinal section passes through a circumferential middle position of the target surface.

As a preferred embodiment, the communication channel is connected to a side wall of the vacuum chamber, and the communication channel and the sputtering cathode are staggered in a vertical direction.

As a preferred embodiment, the distance between the evaporation coating mechanism and the coating umbrella stand is more than 2 times of the distance between the sputtering coating mechanism and the coating umbrella stand; the included angle between the target surface and the side wall of the adjacent reaction container is an acute angle.

As a preferred embodiment, the evaporation coating mechanism includes an evaporation source and an ion source, the evaporation source and the ion source being disposed at a bottom of the vacuum chamber, an outlet of the evaporation source and an outlet of the ion source being disposed toward the holding surface; the ion source is close to the vertical axis relative to the evaporation source; the ion source is positioned at one side of the evaporation source, which is close to the sputtering film plating mechanism; the orientation of the ion source and the orientation of the target are tilted with respect to the vertical axis.

As a preferred embodiment, the irradiation area of the evaporation coating mechanism and the irradiation area of the sputtering coating mechanism are at least partially staggered; the evaporation coating mechanism is positioned outside the irradiation area of the sputtering coating mechanism, and the sputtering coating mechanism is positioned outside the irradiation area of the evaporation coating mechanism; taking the vertical axis as a central line, the irradiation area of the evaporation coating mechanism covers the outline of the holding surface on a first longitudinal half section, and the irradiation area of the sputtering coating mechanism covers the outline of the holding surface on a second longitudinal half section; and an included angle between the first longitudinal half section and the second longitudinal half section is more than 20 degrees and less than or equal to 180 degrees.

The beneficial effects are that:

according to the vacuum coating device provided by the embodiment, the coating umbrella stand capable of holding the substrate on the holding surface, the evaporation coating mechanism arranged towards the holding surface and the sputtering coating mechanism arranged towards the holding surface are arranged in the vacuum chamber, the coating umbrella stand rotates around a vertical axis, the diameter of the holding surface is linearly increased from top to bottom, the cross section of the holding surface is circular or polygonal, the evaporation coating mechanism and the sputtering coating mechanism are positioned on the same side of the coating umbrella stand, so that the evaporation coating mechanism can perform evaporation coating on the substrate, and the sputtering coating mechanism can perform sputtering coating on the substrate.

And the vacuumizing mechanism is provided with a containing chamber for containing the cold trap main body, the upstream of the containing chamber is communicated with the vacuum chamber through a communication channel, the containing chamber is also communicated with a pump assembly, and the pump assembly can vacuumize the vacuum chamber. The cold trap main body is not arranged in the vacuum chamber, so that the space of the vacuum chamber can be saved, the cold trap main body is prevented from being polluted, and the energy consumption loss is reduced. The communication channel extends along the horizontal direction, the communication channel is provided with a port which is communicated with the accommodating cavity, the plane of the port is perpendicular to the horizontal direction, the vertical projection of the communication channel on the plane of the port coincides with the port, the vertical projection of the cold trap main body on the plane of the port surrounds the outer side of the port, so that when the pump assembly vacuumizes the vacuum cavity, the exhaust channel consists of the communication channel and the space with the radial dimension equal to the size of the communication channel or the port in the accommodating cavity, and the cold trap main body does not occupy the exhaust channel, thereby avoiding the pollution of the cold trap main body and improving the exhaust efficiency without obstructing the exhaust channel.

Specific embodiments of the utility model are disclosed in detail below with reference to the following description and drawings, indicating the manner in which the principles of the utility model may be employed. It should be understood that the embodiments of the utility model are not limited in scope thereby.

Features that are described and/or illustrated with respect to one embodiment may be used in the same way or in a similar way in one or more other embodiments in combination with or instead of the features of the other embodiments.

It should be emphasized that the term "comprises/comprising" when used herein is taken to specify the presence of stated features, integers, steps or components but does not preclude the presence or addition of one or more other features, integers, steps or components.

Drawings

In order to more clearly illustrate the embodiments of the utility model or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the utility model, and that other drawings can be obtained from these drawings without inventive faculty for a person skilled in the art.

Fig. 1 is a schematic structural diagram of a vacuum coating apparatus according to the present embodiment;

FIG. 2 is a cross-sectional view taken along the A-A plane of FIG. 1;

FIG. 3 is a cross-sectional view of the B-B plane of FIG. 1;

fig. 4 is a schematic structural view of a film-coated umbrella stand according to the present embodiment.

Reference numerals illustrate:

1. a reaction vessel; 11. a vacuum chamber; 12. a sidewall;

2. a film plating umbrella stand; 21. a holding surface; 22. a vertical axis; 23. a clamping hole; 24. evaporating a coating area; 25. sputtering a coating area;

3. an evaporation coating mechanism; 31. an evaporation source; 32. an ion source;

4. a sputtering coating mechanism; 41. sputtering a cathode; 42. a target material; 421. a target surface;

5. a vacuum pumping mechanism; 51. a cold trap assembly; 511. a cold trap body; 512. a first mounting frame; 513. a second rectangle; 52. a housing chamber; 521. a retaining wall; 53. a communication passage; 531. a port; 532. a first rectangle; 533. a central axis; 54. a pump assembly; 541. a first pump body; 542. a second pump body; 55. a second mounting frame;

6. a rotation mechanism; 7. a control mechanism; 8. a substrate.

Detailed Description

In order to make the technical solution of the present utility model better understood by those skilled in the art, the technical solution of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, shall fall within the scope of the utility model.

It will be understood that when an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

Please refer to fig. 1 to 4. The embodiment of the utility model provides a vacuum coating device which comprises a reaction container 1, a coating umbrella stand 2, an evaporation coating mechanism 3, a sputtering coating mechanism 4 and a vacuumizing mechanism 5.

Wherein the reaction vessel 1 has a vacuum chamber 11 for coating. A film plating umbrella stand 2 capable of holding a substrate 8 on a holding surface 21 is provided in a reaction vessel 1. The film-plating umbrella stand 2 rotates around a vertical axis 22, and the diameter of the holding surface 21 increases linearly from top to bottom. The cross section of the holding surface 21 is circular or polygonal. The evaporation coating mechanism 3 is disposed in the vacuum chamber 11 for evaporation coating the substrate 8. The evaporation mechanism 3 is disposed toward the holding surface 21. The sputter coating mechanism 4 is disposed in the vacuum chamber 11 for sputter coating the substrate 8. The sputter coating mechanism 4 is disposed toward the holding surface 21. The evaporation coating mechanism 3 and the sputtering coating mechanism 4 are positioned on the same side of the coating umbrella stand 2, namely, the evaporation coating mechanism 3 and the sputtering coating mechanism 4 realize coating on the same side of the substrate 8. The evacuation mechanism 5 is used to evacuate the vacuum chamber 11. The evacuation mechanism 5 includes a cold trap assembly 51, a housing chamber 52 to which the cold trap assembly 51 is mounted, a communication passage 53 for communicating the housing chamber 52 with the vacuum chamber 11, and a pump assembly 54 communicating the housing chamber 52. The cold trap assembly 51 includes a cold trap body 511 having cold trap pipes extending helically in a horizontal direction. The cold trap body 511 is located within the containment chamber 52. The communication passage 53 extends in the horizontal direction. The communication passage 53 has a central axis 533 extending in the horizontal direction, and the central axis 533 is perpendicular to the vertical axis 22 of the coating film umbrella stand 2. The communication passage 53 communicates upstream of the accommodating chamber 52. The communication passage 53 has a port 531 opening into the accommodating chamber 52, a plane in which the port 531 is located is perpendicular to the horizontal direction, a vertical projection of the communication passage 53 on the plane in which the port 531 is located coincides with the port 531, and a vertical projection of the cold trap body 511 on the plane in which the port 531 is located surrounds the outside of the port 531.

In the vacuum coating apparatus provided in this embodiment, by arranging the coating umbrella stand 2 capable of holding the substrate 8 on the holding surface 21, the evaporation coating mechanism 3 arranged toward the holding surface 21, and the sputtering coating mechanism 4 arranged toward the holding surface 21 in the vacuum chamber 11, and rotating the coating umbrella stand 2 around a vertical axis 22, the diameter of the holding surface 21 linearly increases from top to bottom, the cross section of the holding surface 21 is circular or polygonal, and the evaporation coating mechanism 3 and the sputtering coating mechanism 4 are located on the same side of the coating umbrella stand 2, so that the evaporation coating mechanism 3 can perform evaporation coating on the substrate 8, and the sputtering coating mechanism 4 can perform sputtering coating on the substrate 8.

Also, the evacuation mechanism 5 is provided with a housing chamber 52 for housing the cold trap body 511, and the upstream of the housing chamber 52 is communicated with the vacuum chamber 11 through a communication passage 53, and the housing chamber 52 is also communicated with a pump assembly 54, and the pump assembly 54 can evacuate the vacuum chamber 11. The cold trap body 511 is not arranged in the vacuum chamber 11, so that the space of the vacuum chamber 11 can be saved, the cold trap body 511 is prevented from being polluted, and the energy consumption loss is reduced. The communication channel 53 extends along the horizontal direction, the communication channel 53 is provided with a port 531 which is led into the accommodating chamber 52, the plane of the port 531 is perpendicular to the horizontal direction, the vertical projection of the communication channel 53 on the plane of the port 531 coincides with the port 531, the vertical projection of the cold trap main body 511 on the plane of the port 531 surrounds the outer side of the port 531, so that when the pump assembly 54 vacuumizes the vacuum chamber 11, the exhaust channel consists of a space with the radial dimension equal to the size of the communication channel 53 or the port 531 in the communication channel 53 and the accommodating chamber 52, the cold trap main body 511 does not occupy the exhaust channel, the pollution of the cold trap main body 511 is avoided, and the exhaust channel is not blocked, so that the exhaust efficiency can be improved. The central axis 533 of the communication channel 53 is perpendicular to the vertical axis 22 of the film plating umbrella stand 2, so that the structure of the vacuum film plating device can be further simplified, and the working efficiency of the vacuum film plating device can be improved.

In this embodiment, the cold trap assembly 51 further includes a first mounting frame 512 fixedly mounted within the receiving chamber 52 carrying the cold trap body 511. The first mounting frame 512 is located between the wall surface of the accommodating chamber 52 and the cold trap body 511, and the cold trap body 511 is disposed along the inner wall of the first mounting frame 512, and the first mounting frame 512 may fix the cold trap body 511 inside the accommodating chamber 52. The vertical projection of the first mounting frame 512 on the plane of the port 531 surrounds the vertical projection of the communication channel 53 or the outside of the port 531, so that the vertical projection of the cold trap body 511 disposed inside the first mounting frame 512 in the horizontal direction surrounds the vertical projection of the communication channel 53 or the outside of the port 531.

As shown in fig. 3, the vertical projection of the cold trap body 511 on the plane where the port 531 is located between the vertical projection of the first mounting frame 512 and the vertical projection of the communication channel 53 or between the vertical projection of the first mounting frame 512 and the port 531, and the cold trap body 511 is located entirely outside the vertical projection of the communication channel 53 or the port 531, so that the cold trap body 511 does not obstruct the exhaust channel, the cold trap body 511 is prevented from being contaminated, and the exhaust efficiency can be improved.

In the present embodiment, in order to make the exhaust efficiency higher and to secure a sufficient installation space for the cold trap body 511, the ratio of the area of the installation port 531 to the area of the vertical projection of the inner wall surface of the first installation frame 512 on the plane on which the port 531 is located is 0.5 to 0.8. Preferably, the ratio of the area of the port 531 to the area of the vertical projection of the inner wall surface of the first mounting frame 512 on the plane of the port 531 is 0.7.

Specifically, the shape of the port 531 is one of rectangular, circular, or oval. The vertical projection of the inner wall surface of the first mounting frame 512 on the plane of the port 531 is one of rectangular, circular, or elliptical.

In one embodiment, as shown in fig. 3, the port 531 is a first rectangle 532, and a perpendicular projection of an inner wall surface of the first mounting frame 512 on a plane on which the port 531 is located is a second rectangle 513. The ratio of the area of the first rectangle 532 to the area of the second rectangle 513 is 0.5 to 0.8. Further, the ratio of the area of the first rectangle 532 to the area of the second rectangle 513 is 0.7.

Specifically, in order to make the exhaust efficiency higher and to secure a sufficient installation space of the cold trap body 511, the ratio of the length of the long side of the first rectangle 532 to the length of the long side of the second rectangle 513 is 0.6 to 0.9. Preferably, the ratio of the length of the long side of the first rectangle 532 to the length of the long side of the second rectangle 513 is 0.7 or 0.8. The long sides of the first rectangle 532 and the long sides of the second rectangle 513 may each extend in the horizontal direction.

As shown in fig. 1, the evacuation mechanism 5 may be provided with a second mounting frame 55 on the other side of the accommodation chamber 52 with respect to the communication passage 53. The pump assembly 54 includes a first pump body 541 that communicates with the accommodating chamber 52 and a second pump body 542 that is mounted on the second mounting frame 55. The second pump body 542 is a molecular pump with higher adjustment accuracy than the first pump body 541.

Specifically, the first pump body 541 may be a rough pump, the second pump body 542 may be a molecular pump capable of pumping high vacuum, and both the first pump body 541 and the second pump body 542 are used for pumping vacuum to the vacuum chamber 11 to form a vacuum system. By providing the cold trap body 511, the lifetime of the molecular pump can be extended.

In a preferred embodiment, the port 531, the first mounting frame 512 and the second mounting frame 55 are sequentially arranged in a horizontal direction, and the extracted gas does not contaminate the cold trap body 511 while the cold trap body 511 is operating normally. One end of the first pump body 541 communicating with the accommodating chamber 52 may be located at the top end of the accommodating chamber 52 so as to be rationally laid out.

As shown in fig. 1, the accommodating chamber 52 has a blocking wall 521 perpendicular to the horizontal direction around the peripheral side of the port 531, and the cold trap body 511 is blocked from being positioned on the side of the blocking wall 521 facing away from the communication passage 53. The blocking wall 521 may make the size of the accommodating chamber 52 larger than that of the communication channel 53, so as to facilitate the subsequent installation of the cold trap body 511 in the accommodating chamber 52, and ensure that the vertical projection of the cold trap body 511 in the horizontal direction surrounds the vertical projection outside the communication channel 53 or is located outside the port 531.

In the present embodiment, the evaporation coating mechanism 3 and the sputter coating mechanism 4 may be located at the lower side of the coating umbrella stand 2. A rotating mechanism 6 for driving the film coating umbrella stand 2 to rotate around a vertical axis 22 is connected above the film coating umbrella stand 2. The part of the rotating mechanism 6 is positioned outside the reaction container 1 and at the top of the reaction container 1, and the part of the rotating mechanism 6 extends into the vacuum chamber 11 and is connected with the film coating umbrella stand 2. The rotation mechanism 6 may comprise a motor. Preferably, the vertical axis 22 of the film plating umbrella stand 2 passes through the center of the film plating umbrella stand 2, and the film plating umbrella stand 2 can be formed by rotating a length of wire around the vertical axis 22 by 360 °.

As shown in fig. 1, the sputter coating mechanism 4 includes a sputter cathode 41 provided in the vacuum chamber 11 and connected to the side wall 12 of the vacuum chamber 11, and a target 42 mounted on the sputter cathode 41. The whole sputter coating mechanism 4 is placed in the vacuum chamber 11. The target 42 has a target surface 421 facing the holding surface 21. There is a longitudinal section through the vertical axis 22, the contour of the target surface 421 in this longitudinal section being parallel to the contour of the holding surface 21 in this longitudinal section. The longitudinal section is a section parallel to the vertical direction and passing through the vertical axis 22.

In this embodiment, the minimum distance between the sputter coating mechanism 4 and the coating umbrella stand 2 is less than 20cm and greater than 5cm, so as to ensure that the sputter coating mechanism 4 can effectively sputter coat the substrate 8. The vacuum coating device organically combines the two coating modes, and overcomes the defects of the two coating modes while fully playing the advantages of the two coating modes, thereby meeting the deposition requirements of some special coating layers while achieving the maximum production efficiency.

Preferably, the communication channel 53 is connected to the side wall 12 of the vacuum chamber 11, and the communication channel 53 and the sputtering cathode 41 are staggered in the vertical direction, so that the layout is more reasonable. In one embodiment, the communication channel 53 and the sputtering cathode 41 are connected to opposite sides of the reaction vessel 1 in the horizontal direction, respectively. In the present embodiment, the radial dimension of the communication passage 53 is kept constant in the horizontal direction, that is, the radial dimension of the communication passage 53 at each place is equal to the dimension at the port 531, so that the vertical projection of the cold trap body 511 on the plane is ensured to surround the outside of the vertical projection of the communication passage 53. The cold trap body 511 is installed inside the accommodating chamber 52 in a fully concealed manner, and has a maintenance-free effect due to the avoidance of contamination.

Preferably, as shown in fig. 1, the distance H between the contour line of the target surface 421 and the contour line of the holding surface 21 is 10cm to 15cm, so that the uniformity of the sputter coating rate is ensured over the entire length of the target surface 421. Further, the longitudinal section passes through the circumferential middle position of the target surface 421, that is, at least one line segment passing through the center of the target surface 421 on the target surface 421 is parallel to one line segment on the holding surface 21 of the film plating umbrella stand 2. The included angle alpha between the target surface 421 and the side wall 12 of the adjacent reaction container 1 is equal to the included angle between the surface of the film coating umbrella stand 2 and the side wall 12.

Alternatively, the sputtering cathode 41 may be a direct current cathode, an intermediate frequency cathode, or a radio frequency cathode. Preferably, the sputtering cathode 41 is a magnetron twin cathode. Specifically, the sputtering cathode 41 is connected with a direct current power supply or an alternating current power supply, the film plating umbrella stand 2 is grounded, the sputtering cathode 41 and the film plating umbrella stand 2 are respectively used as a cathode and an anode, inert gas (generally Ar) is introduced between the cathode and the anode, the gas glow discharge is utilized to generate dotted particles, the dotted particles bombard the target surface 421 after being accelerated by an electromagnetic field, the escape of atoms of the target 42 is realized, and the escaped atoms of the target 42 are deposited on the surface of the substrate 8 to form a film layer.

In the present embodiment, the areas where the evaporation coating mechanism 3 and the sputter coating mechanism 4 are located are configured to have the same vacuum degree, that is, no partition or other partition structure for partitioning the evaporation coating mechanism 3 and the sputter coating mechanism 4 is provided in the vacuum chamber 11, and the evaporation coating mechanism 3 and the sputter coating mechanism 4 are provided in the same vacuum system. At the same time, the vacuum degree of the vacuum chamber 11 in which the evaporation coating mechanism 3 and the sputtering coating mechanism 4 are located is the same.

Specifically, the vacuum degree of the evaporation coating mechanism 3 and the sputtering coating mechanism 4 (i.e. different positions of the vacuum chamber 11) is regulated and controlled by the same vacuum pump, so that the vacuum degree in the vacuum chamber 11 is conveniently controlled, and the effective evaporation coating and sputtering coating are ensured.

Preferably, the evaporation coating mechanism 3 and the sputtering coating mechanism 4 are configured to be started in a staggered manner, namely, the evaporation coating mechanism 3 is started for evaporation coating, and then the sputtering coating mechanism 4 is started for sputtering coating; or firstly starting the sputtering coating mechanism 4 to perform sputtering coating, and then starting the evaporation coating mechanism 3 to perform evaporation coating. The reaction vessel 1 may also be provided with a vacuum pump communicating with the vacuum chamber 11 and a controller (not shown). The controller is configured to cause the evaporation coating mechanism 3 and the sputter coating mechanism 4 to be in vacuum chambers 11 of different vacuum degrees at different times by controlling the vacuum pump to ensure that the vacuum degree of the vacuum chamber 11 performing the evaporation coating is different from the vacuum degree of the vacuum chamber 11 performing the sputter coating.

In the present embodiment, in order to make the evaporation coating more uniform, the distance between the evaporation coating mechanism 3 and the coating umbrella stand 2 is made greater than 2 times the distance between the sputter coating mechanism 4 and the coating umbrella stand 2. As shown in fig. 1, the position of the sputter coating mechanism 4 is higher than the position of the evaporation coating mechanism 3, the evaporation coating mechanism 3 is arranged at the bottom of the vacuum chamber 11, and the sputter coating mechanism 4 is arranged on the side wall 12 of the vacuum chamber 11.

As shown in fig. 2 and 4, in the present embodiment, the cross section of the holding surface 21 is circular or polygonal, and the diameter of the holding surface 21 increases linearly from top to bottom, so that the vertical section of the holding surface 21 is an inclined line segment as shown in fig. 1. In this longitudinal section, the target surface 421 is parallel to the holding surface 21, and the angle α between the target surface 421 and the side wall 12 of the reaction vessel 1 adjacent thereto is acute. Preferably, the cross section of the retaining surface 21 is circular.

As shown in fig. 2 and 4, the film plating umbrella stand 2 is provided with a plurality of holding holes 23 for holding and fixing the substrate 8, the shape of the holding holes 23 is matched with the shape of the substrate 8 and the plating surface of the substrate 8 is exposed. The coated surface of the substrate 8 is the lower surface of the substrate 8 in fig. 1. The shape of the clamping hole 23 may be circular or other shapes. Specifically, the shape of the holding hole 23 is set correspondingly to the size and shape of the substrate 8. The vacuum chamber 11 in the present embodiment has a rectangular parallelepiped structure, and in other examples, the vacuum chamber 11 may have other shapes, such as a cylindrical shape, a polygonal column shape, and the like.

As shown in fig. 1 and 2, the irradiation area of the evaporation coating mechanism 3 and the irradiation area of the sputtering coating mechanism 4 are at least partially staggered, the evaporation coating mechanism 3 is positioned outside the irradiation area of the sputtering coating mechanism 4, and the sputtering coating mechanism 4 is positioned outside the irradiation area of the evaporation coating mechanism 3, so that the evaporation coating mechanism 3 and the sputtering coating mechanism 4 are ensured not to be blocked by each other, and the respective coating can be realized.

Specifically, with the vertical axis 22 of the film plating umbrella stand 2 as the center line, the irradiation area of the evaporation film plating mechanism 3 covers the outline of the holding surface 21 on the first longitudinal half section, and the irradiation area of the sputtering film plating mechanism 4 covers the outline of the holding surface 21 on the second longitudinal half section. The first longitudinal half-section and the second longitudinal half-section are each half of a section parallel to the vertical direction and passing through the vertical axis 22, and are on one side with the vertical axis 22. The included angle between the first longitudinal half section and the second longitudinal half section is more than 20 degrees and less than or equal to 180 degrees. As shown in fig. 1, the first longitudinal half section is a left half section of the longitudinal section, the second longitudinal half section is a right half section of the longitudinal section, and an included angle between the first longitudinal half section and the second longitudinal half section is 180 degrees.

As shown in fig. 2, the holding surface 21 of the film plating umbrella stand 2 includes an evaporation film plating region 24 and a sputtering film plating region 25. The sputter coating area 25 is the area facing the target surface 421 of the sputter coating mechanism 4, and the evaporation coating area 24 may be other areas of the holding surface 21 than the sputter coating area 25, so as to maximize the coating efficiency.

In the present embodiment, the evaporation coating mechanism 3 includes an evaporation source 31 and an ion source 32. The evaporation source 31 and the ion source 32 are provided at the bottom of the vacuum chamber 11, and the outlet of the evaporation source 31 and the outlet of the ion source 32 are provided toward the holding surface 21. The ion source 32 is close to the vertical axis 22 of the film plating umbrella stand 2 with respect to the evaporation source 31. Further, the ion source 32 is located on the side of the evaporation source 31 close to the sputter coating mechanism 4. The ion source 32 may be located on an extension of the vertical axis 22.

In particular, the evaporation source 31 may be an electron gun with a rotating crucible system or a molybdenum boat employing resistive evaporation. The ion source 32 may be a radio frequency coupled ion source or other form of ion source. The evaporated medicine is placed on the evaporation source 31, and evaporation or sublimation is performed on the evaporation source 31. The vapor generated by the evaporation or sublimation of the drug is eventually deposited on the surface of the substrate 8. The ion source 32 is mainly used for bombarding and cleaning the substrate during the film forming process by the generated plasma, and can improve the mechanism of the film layer and play a role of ion-assisted evaporation.

As shown in fig. 1, the orientation of the ion source 32 and the orientation of the target 42 are tilted with respect to the vertical axis 22, and the component directions of the orientation of the ion source 32 and the target 42 in the horizontal plane are opposite. The evaporation source 31 may be oriented vertically upward, the ion source 32 may be oriented obliquely upward and leftward, and the target 42 may be oriented obliquely upward and rightward.

As shown in fig. 1, the thin film deposition apparatus may further include a control mechanism 7 disposed outside the reaction vessel 1, wherein the control mechanism 7 may control the start and stop of the evaporation coating mechanism 3 and the sputtering coating mechanism 4, and may control the rotation of the coating umbrella stand 2. The controller for controlling the vacuum pump described above may also be integrated in the control means 7.

The vacuum coating device provided by the embodiment can improve the coating quality and the coating speed, in practical application, the evaporation coating mechanism 3 can be utilized to realize rapid deposition of the film, the characteristics of high sputtering particle energy of the sputtering coating mechanism 4 are utilized to tamp the evaporated film during sputtering coating, so that the aggregation density of the evaporated film is increased, the deposition particles with weaker adsorption on the evaporation surface are sputtered, and the gaps in the evaporated film are filled by bombarding and collapsing. The vacuum coating device can also realize the deposition of some special film systems, DLC film layers which cannot be realized by vapor deposition and the like can be deposited by utilizing the sputtering coating mechanism 4, and other film layers can be deposited by utilizing the evaporation coating mechanism 3.

It should be noted that, in the description of the present specification, the terms "first," "second," and the like are used for descriptive purposes only and to distinguish between similar objects, and there is no order of preference therebetween, nor should it be construed as indicating or implying relative importance. In addition, in the description of the present specification, unless otherwise indicated, the meaning of "a plurality" is two or more.

Any numerical value recited herein includes all values of the lower and upper values that are incremented by one unit from the lower value to the upper value, as long as there is a separation of at least two units between any lower value and any higher value. For example, if it is stated that the number of components or the value of a process variable (e.g., temperature, pressure, time, etc.) is from 1 to 90, preferably from 20 to 80, more preferably from 30 to 70, then the purpose is to explicitly list such values as 15 to 85, 22 to 68, 43 to 51, 30 to 32, etc. in this specification as well. For values less than 1, one unit is suitably considered to be 0.0001, 0.001, 0.01, 0.1. These are merely examples that are intended to be explicitly recited in this description, and all possible combinations of values recited between the lowest value and the highest value are believed to be explicitly stated in the description in a similar manner.

Unless otherwise indicated, all ranges include endpoints and all numbers between endpoints. "about" or "approximately" as used with a range is applicable to both endpoints of the range. Thus, "about 20 to 30" is intended to cover "about 20 to about 30," including at least the indicated endpoints.

All articles and references, including patent applications and publications, disclosed herein are incorporated by reference for all purposes. The term "consisting essentially of …" describing a combination shall include the identified element, ingredient, component or step as well as other elements, ingredients, components or steps that do not substantially affect the essential novel features of the combination. The use of the terms "comprises" or "comprising" to describe combinations of elements, components, or steps herein also contemplates embodiments consisting essentially of such elements, components, or steps. By using the term "may" herein, it is intended that any attribute described as "may" be included is optional.

Multiple elements, components, parts or steps can be provided by a single integrated element, component, part or step. Alternatively, a single integrated element, component, part or step may be divided into separate plural elements, components, parts or steps. The disclosure of "a" or "an" to describe an element, component, section or step is not intended to exclude other elements, components, sections or steps.

It is to be understood that the above description is intended to be illustrative, and not restrictive. Many embodiments and many applications other than the examples provided will be apparent to those of skill in the art upon reading the above description. The scope of the present teachings should, therefore, be determined not with reference to the above description, but instead should be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled. The disclosures of all articles and references, including patent applications and publications, are incorporated herein by reference for the purpose of completeness. The omission of any aspect of the subject matter disclosed herein in the preceding claims is not intended to forego such subject matter, nor should the inventors regard such subject matter as not be considered to be part of the disclosed subject matter.

Claims

1. A vacuum coating apparatus, comprising:

2. The vacuum coating apparatus of claim 1, wherein the cold trap assembly further comprises a first mounting frame fixedly mounted within the containment chamber carrying the cold trap body; a vertical projection of the first mounting frame on the plane surrounds a vertical projection of the communication channel or outside the port; the vertical projection of the cold trap body on the plane is positioned between the vertical projection of the first mounting frame and the vertical projection of the communication channel or between the vertical projection of the first mounting frame and the port.

3. The vacuum coating apparatus according to claim 2, wherein the port is a first rectangle, and a perpendicular projection of an inner wall surface of the first mounting frame on the plane is a second rectangle; the ratio of the area of the first rectangle to the area of the second rectangle is 0.5-0.8, and the ratio of the length of the long side of the first rectangle to the length of the long side of the second rectangle is 0.6-0.9.

4. The vacuum coating apparatus according to claim 2, wherein the vacuum-pumping mechanism is provided with a second mounting frame on the other side of the accommodation chamber with respect to the communication passage, and the pump assembly includes a first pump body communicating with the accommodation chamber and a second pump body mounted on the second mounting frame; the second pump body is a molecular pump with higher adjustment precision than the first pump body; the port, the first mounting frame, and the second mounting frame are sequentially arranged in the horizontal direction.

5. The vacuum plating device according to claim 1, wherein the accommodation chamber has a blocking wall perpendicular to the horizontal direction around a peripheral side of the port, the cold trap body being blocked and positioned on a side of the blocking wall facing away from the communication passage.

6. The vacuum coating apparatus according to claim 1, wherein the sputter coating mechanism comprises a sputter cathode provided in the vacuum chamber and connected to a side wall of the vacuum chamber, and a target mounted on the sputter cathode; the target is provided with a target surface facing the holding surface, a longitudinal section passing through the vertical axis exists, the contour line of the target surface on the longitudinal section is parallel to the contour line of the holding surface on the longitudinal section, and the distance between the contour line of the target surface and the contour line of the holding surface is 10 cm-15 cm; the longitudinal section passes through a circumferential middle position of the target surface.

7. The vacuum coating apparatus according to claim 6, wherein the communication passage is connected to a side wall of the vacuum chamber, and the communication passage and the sputtering cathode are disposed in a staggered manner in a vertical direction.

8. The vacuum coating apparatus according to claim 6, wherein a distance between the evaporation coating mechanism and the coating umbrella stand is greater than 2 times a distance between the sputtering coating mechanism and the coating umbrella stand; the included angle between the target surface and the side wall of the adjacent reaction container is an acute angle.

9. The vacuum coating apparatus according to claim 8, wherein the evaporation coating mechanism comprises an evaporation source and an ion source, the evaporation source and the ion source being disposed at a bottom of the vacuum chamber, an outlet of the evaporation source and an outlet of the ion source being disposed toward the holding surface; the ion source is close to the vertical axis relative to the evaporation source; the ion source is positioned at one side of the evaporation source, which is close to the sputtering film plating mechanism; the orientation of the ion source and the orientation of the target are tilted with respect to the vertical axis.

10. The vacuum coating apparatus according to claim 1, wherein the irradiation area of the evaporation coating mechanism and the irradiation area of the sputtering coating mechanism are at least partially staggered; the evaporation coating mechanism is positioned outside the irradiation area of the sputtering coating mechanism, and the sputtering coating mechanism is positioned outside the irradiation area of the evaporation coating mechanism; taking the vertical axis as a central line, the irradiation area of the evaporation coating mechanism covers the outline of the holding surface on a first longitudinal half section, and the irradiation area of the sputtering coating mechanism covers the outline of the holding surface on a second longitudinal half section; and an included angle between the first longitudinal half section and the second longitudinal half section is more than 20 degrees and less than or equal to 180 degrees.