CN219601911U - Silicon chip packing box - Google Patents

Abstract

The utility model provides a silicon wafer packaging box, which comprises: a case body; the accommodating grooves are formed in the box body and are used for accommodating target silicon wafers; the plurality of accommodating grooves are divided into at least two parts along the length direction of the accommodating grooves by at least one second partition plate; the box cover is connected with the box body; the box body comprises a bottom plate and side plates, the side plates are arranged on the periphery of the bottom plate in a surrounding manner, and the side plates are arranged between the bottom plate and the box cover; the side plates comprise a first side plate and a second side plate, the first side plate is connected with one end of the second partition plate, and the second side plate is connected with the other end of the second partition plate; the thickness of the first side plate at the end part and the thickness of the position connected with the second partition plate are larger than those of other positions, and/or the thickness of the second side plate at the end part and the thickness of the position connected with the second partition plate are larger than those of other positions. The thickening treatment is respectively carried out at specific positions, and the materials are saved on the basis of ensuring the mechanical strength through local thickening.

Description

Silicon chip packing box

Technical Field

The utility model relates to the technical field of semiconductors, in particular to a silicon wafer packaging box.

Background

The silicon chip packaging box is used for protecting the silicon chip and plays an important role in the storage and transportation of the silicon chip.

The silicon wafer packaging box in the prior art comprises a box body for accommodating a silicon wafer and a box cover which is arranged on the box body in a covering manner to cover the silicon wafer. In order to improve the utilization rate of the silicon wafer packaging box, a partition plate is generally additionally arranged to divide the interior of the box body into two parts, and the two parts are respectively used for accommodating the silicon wafers. However, the silicon wafer packaging box adopting the partition plate may not be ensured in mechanical strength due to the volume increase, and is easy to damage.

Disclosure of Invention

Aiming at the defects existing in the prior art, the utility model provides a silicon wafer packaging box.

In one embodiment, the present utility model provides a silicon wafer package comprising:

a case body;

the accommodating grooves are formed in the box body and are used for accommodating target silicon wafers; the plurality of accommodating grooves are divided into at least two parts along the length direction of the accommodating grooves by at least one second partition plate;

the box cover is connected with the box body;

the box body comprises a bottom plate and side plates, the side plates are arranged on the periphery of the bottom plate in a surrounding manner, and the side plates are arranged between the bottom plate and the box cover;

the side plates comprise a first side plate and a second side plate, the first side plate is connected with one end of the second partition plate, and the second side plate is connected with the other end of the second partition plate;

the thickness of the first side plate at the end part and the thickness of the position connected with the second partition plate are larger than those of other positions, and/or the thickness of the second side plate at the end part and the thickness of the position connected with the second partition plate are larger than those of other positions.

In one embodiment, the silicon wafer package further comprises:

the through holes are formed in the box cover, and one through hole is aligned with and communicated with one containing groove.

In one embodiment, each through hole is near an end of the groove bottom of the corresponding receiving groove.

In one embodiment, the plurality of portions divided by the second partition plate in the length direction of the accommodation groove each include a plurality of accommodation grooves, respectively, the plurality of accommodation grooves in each portion being spaced apart from each other in the width direction thereof, and adjacent two of the accommodation grooves being separated by the first partition plate;

the bottom of each receiving groove in each section includes a first target end in the same direction, and each through hole is adjacent to the first target end of the bottom of the corresponding receiving groove.

In one embodiment, the end part of each first partition plate, which is close to the box cover, is provided with a groove, the height of each first partition plate at a position outside the groove is not smaller than the height of the target silicon wafer, and the height of each first partition plate at the position of the groove is smaller than the height of the target silicon wafer;

each through hole corresponds to a position of the corresponding first partition plate outside the groove.

In one embodiment, the bottom of each receiving groove includes a second target end proximate to the second divider plate, and each through hole is proximate to the second target end of the bottom of the corresponding receiving groove.

In one embodiment, the receiving grooves on both sides of the second partition plate are symmetrical with respect to the second partition plate.

In one embodiment, the bottom plate and the side plates are made of pearl wool material, and the bottom plate and the side plates are fixed by gluing.

In one embodiment, the silicon wafer package further comprises:

a first locking part arranged on the box cover;

the second locking part is arranged on the box body and matched with the first locking part to lock the box cover and the box body.

In one embodiment, the first locking portion comprises a ring member and the second locking portion comprises a protrusion, and the ring member is configured to be sleeved on an outer side surface of the protrusion.

Through above-mentioned silicon chip packing carton, carry out the thickening to first curb plate and second curb plate respectively in specific position and handled, through local thickening, on the basis of guaranteeing mechanical strength, saved the material.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic view of a silicon wafer package according to one embodiment of the present utility model;

FIG. 2 is a schematic view of a silicon wafer package with a through hole adjacent to a second divider in accordance with one embodiment of the present utility model;

FIG. 3 is a schematic view of a silicon wafer package with a locking portion according to one embodiment of the present utility model;

fig. 4 to 6 are schematic views showing the structure of the receiving groove divided into different numbers of portions and different numbers of receiving grooves per portion according to the present utility model in different embodiments.

In the above figures: 1. a case body; 2. a receiving groove; 3. a box cover; 4. a through hole; 5. a first partition plate; 6. a first target end; 7. a groove; 8. a second partition plate; 9. a second target end; 10. a side plate; 101. a first side plate; 102. a second side plate; 11. a bottom plate; 12. a ring member; 13. and a bump.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to fall within the scope of the utility model.

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise. In the present utility model, the word "exemplary" is used to mean "serving as an example, instance, or illustration. Any embodiment described as "exemplary" in this disclosure is not necessarily to be construed as preferred or advantageous over other embodiments. The following description is presented to enable any person skilled in the art to make and use the utility model. In the following description, details are set forth for purposes of explanation. It will be apparent to one of ordinary skill in the art that the present utility model may be practiced without these specific details. In other instances, well-known structures and processes have not been described in detail so as not to obscure the description of the utility model with unnecessary detail. Thus, the present utility model is not intended to be limited to the embodiments shown, but is to be accorded the widest scope consistent with the principles and features disclosed herein.

As shown in fig. 1, in one embodiment, the present utility model provides a silicon wafer packing box, including:

a case 1;

the accommodating grooves 2 are formed in the box body 1, and the accommodating grooves 2 are used for accommodating target silicon wafers;

the box cover 3 is connected with the box body 1;

at least two through holes 4, the through holes 4 are arranged on the box cover 3, and one through hole 4 is aligned with and communicated with one containing groove 2.

The target silicon wafer refers to a silicon wafer of a target size that can be accommodated by the silicon wafer packaging box in the embodiment, that is, the silicon wafer packaging boxes of different sizes correspond to the silicon wafers of different sizes, and the silicon wafer packaging box in the embodiment is not limited to any size and shape, that is, for the silicon wafers of different sizes and shapes, the silicon wafer packaging box in the embodiment is of a corresponding size.

The target silicon wafer is generally square and vertically placed in the accommodating groove 2, and the width of the accommodating groove 2 is slightly larger than the thickness of the target silicon wafer, and it should be noted that in practical situations, a whole wafer is put into one accommodating groove 2, so that the target silicon wafer can be a whole wafer or a whole wafer, and the number is not limited.

After the placement of the target silicon wafer is completed, the box cover 3 may cover the top of the box body 1 to shield the target silicon wafer in the accommodating groove 2, and the through hole 4 is aligned with the accommodating groove 2, so as to avoid the target silicon wafer in the accommodating groove 2 from leaking out of the through hole 4 in the subsequent transferring and storing process, the size of the through hole 4 is generally far smaller than that of the accommodating groove 2, specifically, the width of the through hole 4 may be equal to the width of the accommodating groove 2, and the length of the accommodating groove 2 may be several times, such as 5 times, the length of the through hole 4.

In this embodiment, the through hole 4 is only limited to align with and communicate with the accommodating groove 2, and only the purpose of 'checking the target silicon wafer in the accommodating groove 2' is guaranteed, but the specific position of the through hole 4 is not limited; in other embodiments, the specific position of the through hole 4 may be determined according to the actual inspection requirement, for example, the through hole 4 may be aligned with the middle of the bottom of the accommodating groove 2 or may be near the end of the bottom of the groove with reference to the bottom of the accommodating groove.

Through above-mentioned silicon chip packing carton, offer on lid 3 with holding tank 2 counterpoint and the through-hole 4 of intercommunication to when needs examining the target silicon chip in the holding tank 2, directly can realize through this through-hole 4, need not to additionally open lid 3 again, improved actual operating efficiency.

As shown in fig. 1, in one embodiment, each through hole 4 is near the end of the groove bottom of the corresponding accommodation groove 2;

in fig. 1, the dashed box on the lid 3 shows the projection of the bottom of the receiving groove 2, whereby it can be seen that the projection of the edge of the through-hole 4 in the depth direction of the through-hole 4 is substantially flush with the end of the bottom of the receiving groove 2.

The position of the through hole 4 is set to be close to the end part of the bottom of the accommodating groove 2, so that the chamfer of the target silicon wafer in the accommodating groove 2 can be observed through the through hole 4, and then the quality of the target silicon wafer can be checked preliminarily and accurately.

As shown in fig. 1, in one embodiment, a plurality of accommodating grooves 2 are provided, the plurality of accommodating grooves 2 are spaced apart from each other in the width direction thereof, and adjacent two accommodating grooves 2 are separated by a first partition plate 5;

the bottom of each receiving groove 2 includes a first target end 6 in the same direction (as in the previous embodiment, in order to make the position of the through holes 4 more clear, the vertical projection of the bottom of the receiving groove 2 is indicated by the dotted line box on the lid 3), and each through hole 4 is adjacent to the first target end 6 of the bottom of the corresponding receiving groove 2.

In other embodiments, the first target end 6 may be the other end of the groove bottom.

When holding tank 2 is equipped with a plurality of, the through-hole 4 that corresponds also is equipped with a plurality of, sets up a plurality of through-holes 4 in same one end, has realized the purpose of "the chamfer department of observing the target silicon chip" promptly, has still simplified the operation and the cost of trompil, can carry out the trompil operation to a plurality of through-holes 4 in same side, need not the switching trompil position of great scope.

As shown in fig. 1, in one embodiment, a groove 7 is formed at the end of each first partition plate 5 near the lid 3, the height of each first partition plate 5 at a position other than the groove 7 is not less than the height of the target silicon wafer, and the height of each first partition plate 5 at the position of the groove 7 is less than the height of the target silicon wafer.

The height of the first partition plate 5 at the position other than the groove 7, that is, the maximum height of the first partition plate 5 is not smaller than the height of the target silicon wafer, so that the accommodating groove 2 can accommodate the target silicon wafer in the vertical direction, that is, the box cover 3 does not need to provide any accommodating space; in the prior art, a containing space is commonly provided by a box body and a cover body, and when a silicon wafer is placed, a certain amount of filling materials are required to be filled, so that the silicon wafer is stable in the box body, but because the box body has certain elasticity, if the box body is partially filled too tightly, the phenomenon that the cover body is difficult to cover can occur, and the box cover 3 of the silicon wafer packaging box in the embodiment does not need to provide the containing space and only needs to cover the box body 1, so that the phenomenon that the silicon wafer is difficult to cover can not occur; in addition, the silicon chip packing box can appear the condition of upper and lower separation in the transportation, if adopt the silicon chip packing box among the prior art, owing to provide accommodation space in order to protect the silicon chip jointly with the lid, when appear separating from top to bottom the back, the guard action to the silicon chip subtracts suddenly, and the silicon chip packing box in this embodiment only has box body 1 to provide accommodation space, consequently appears separating from top to bottom the back, also only slightly reduces the guard action to the silicon chip.

Wherein, since the accommodating groove 2 accommodates all the target silicon wafers, the width of the accommodating groove 2 is usually smaller, and when the target silicon wafers in the accommodating groove 2 need to be taken, certain operation inconvenience exists; therefore, in this embodiment, for this case, the corresponding groove 7 is formed at the top end of the accommodating groove 2 near the lid 3, so that the height of the accommodating groove 2 at the position of the groove 7 is smaller than the height of the target silicon wafer, and thus the target silicon wafer can be taken by means of the groove 7, and the efficiency and convenience of taking are improved.

Each through hole 4 corresponds to a position of the corresponding first partition plate 5 outside the groove 7.

Wherein in fig. 1 the dashed box on the lid 3 represents the projection of the recess 7 in the vertical direction, whereby it can be seen that in the vertical direction the through hole 4 does not coincide with the recess 7.

Since the grooves 7 and the through holes 4 are obtained through material removal, the mechanical strength is reduced, and therefore, the through holes 4 and the grooves 7 are arranged in a staggered manner, so that the mechanical strength of the silicon wafer packaging box is not further reduced.

As shown in fig. 2, in one embodiment, the accommodating groove 2 is provided in plurality, and the plurality of accommodating grooves 2 are divided into at least two portions along the length direction of the accommodating groove 2 by at least one second dividing plate 8.

Wherein, the second partition plate 8 divides the accommodating groove 2 into at least two parts, and two adjacent parts share one side plate (namely the second partition plate 8), thereby improving the proportion of the accommodating space and the material consumption and having lower comprehensive cost.

The bottom of each containing groove 2 comprises a second target end 9 adjacent to the second dividing wall 8, each through hole 4 being adjacent to the second target end 9 of the bottom of the corresponding containing groove 2.

Wherein, as in the above-described embodiment, in fig. 2, the dashed box on the lid 3 represents the projection of the bottom of the accommodation groove 2 in the vertical direction, whereby it can be seen that each through hole 4 is substantially flush with the end of the corresponding groove bottom and the direction of the second target end 9 of the accommodation groove 2 divided into two parts by the second dividing plate 8 is opposite.

The width direction of the accommodating groove 2 refers to the direction in which one side wall of the accommodating groove 2 is relatively short, and similarly, the length direction of the accommodating groove 2 refers to the direction in which one side wall of the accommodating groove 2 is relatively long.

In this embodiment, the positions of the through holes 4 are set in the same manner as in the above embodiment, so that the plurality of through holes 4 can be opened on the same side without switching the opening positions in a wide range, and thus the operation and cost of opening can be simplified on the basis of realizing the purpose of "observing the chamfer of the target silicon wafer".

As shown in fig. 2, in one embodiment, the case 1 includes a bottom plate 11 and a side plate 10, the side plate 10 is disposed around the periphery of the bottom plate 11, and the side plate 10 is located between the bottom plate 11 and the case cover 3;

the side plate 10 comprises a first side plate 101 and a second side plate 102, the first side plate 101 is connected with one end of the second partition plate 8, and the second side plate 102 is connected with the other end of the second partition plate 8;

the thickness of the first side plate 101 at the end position and the thickness of the position connected with the second partition plate 8 are larger than those at other positions, and the thickness of the second side plate 102 at the end position and the thickness of the position connected with the second partition plate 8 are larger than those at other positions.

In other embodiments, the thickening process may be performed on only one of the first side plate 101 and the second side plate 102.

The first side plate 101 and the second side plate 102 are respectively thickened at specific positions, and materials are saved on the basis of ensuring mechanical strength through local thickening.

As shown in fig. 2, 4, 5 or 6, in one embodiment, the receiving grooves 2 on adjacent sides of the second partition plate 8 are symmetrical with respect to the second partition plate 8;

it can be seen from the figure that the accommodating groove 2 may be divided into two parts or three parts, etc., and one accommodating groove 2 or a plurality of accommodating grooves 2 may be contained in each part.

Wherein the above embodiment has mentioned that by means of the second partition 8, the ratio of accommodation space to material consumption can be increased, resulting in lower overall costs; however, due to the adoption of the two-side distribution, when the distribution condition among the accommodating grooves 2 at the two sides is uneven, the weight of the silicon wafer packaging box is unevenly distributed, so that the falling risk in the transferring process is increased; therefore, in the present embodiment, the accommodation grooves 2 on both sides are uniformly provided for this case, even if the accommodation grooves 2 on both sides are symmetrical with respect to the second partition plate 8, eventually making the weight distribution of the silicon wafer packing box in which the target silicon wafer is placed uniform.

As shown in fig. 2, in one embodiment, the case 1 includes a bottom plate 11 and a side plate 10, the side plate 10 is disposed around the bottom plate 11, and the side plate 10 is disposed between the bottom plate 11 and the case cover 3.

The bottom plate 11 and the side plates 10 are made of pearl cotton material, and the bottom plate 11 and the side plates 10 are fixed by gluing;

the glue may be a glue commonly used in the art, and will not be described herein.

The silicon chip packaging box is made of pearl cotton material, and the mechanical strength of the material is low; therefore, in this embodiment, the previously obtained bottom plate 11 and side plate 10 are bonded by glue to achieve fixation, and the mechanical strength of the bonded portion after glue bonding is higher than that of the material itself, so that it can bear a larger weight than the integrated structure.

In one embodiment, the silicon wafer package further comprises:

a first locking part arranged on the box cover;

the second locking part is arranged on the box body and matched with the first locking part to lock the box cover and the box body.

The first locking part and the second locking part are of matched structures, the first locking part and the second locking part can be combined to form a locking assembly, and the locking assembly can be a commonly used assembly in the prior art and is not repeated here.

Through first locking part and second locking part for after the lid was placed on the box body, can be more firm, reduce the risk that box body and lid break away from in the transportation process.

As shown in fig. 3, in one embodiment, the first locking portion includes a ring member 12, the second locking portion includes a protrusion 13, and the ring member 12 is configured to fit over an outer side surface of the protrusion 13.

The material of the ring 12 and the bump 13 may be the same as that of the case 1 and the case cover 3, for example, pearl wool material, and the material has a certain elasticity, so that in order to make the locking more reliable, the inner diameter of the ring 12 may be slightly smaller than the outer diameter of the bump 13.

Through ring 12 and lug 13, simple structure, and can accomplish the locking of box body 1 and lid 3 fast in the actual application scene.

In the foregoing embodiments, the descriptions of the embodiments are focused on, and the portions of one embodiment that are not described in detail in the foregoing embodiments may be referred to in the foregoing detailed description of other embodiments, which are not described herein again.

The above description of a silicon wafer packing box provided by the utility model has been provided in detail, and specific examples are applied herein to illustrate the principles and embodiments of the utility model, and the above examples are only used to help understand the method and core idea of the utility model; meanwhile, as those skilled in the art will have variations in the specific embodiments and application scope in light of the ideas of the present utility model, the present description should not be construed as limiting the present utility model.

The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

Claims (10)

1. A silicon wafer package, comprising:

a case body;

the accommodating grooves are formed in the box body and are used for accommodating target silicon wafers; the plurality of accommodating grooves are divided into at least two parts along the length direction of the accommodating grooves by at least one second partition plate;

the box cover is connected with the box body;

the box body comprises a bottom plate and side plates, the side plates are arranged around the periphery of the bottom plate, and the side plates are arranged between the bottom plate and the box cover;

the side plates comprise a first side plate and a second side plate, the first side plate is connected with one end of the second partition plate, and the second side plate is connected with the other end of the second partition plate;

the thickness of the first side plate at the end part and the thickness of the second partition plate at the connecting position are larger than those of other positions, and/or the thickness of the second side plate at the end part and the thickness of the second partition plate at the connecting position are larger than those of other positions.

2. The silicon wafer package of claim 1, further comprising:

the through holes are formed in the box cover, and one through hole is aligned with and communicated with one containing groove.

3. The silicon wafer packing box according to claim 2, wherein each of the through holes is near an end of a bottom of the corresponding receiving groove.

4. A silicon wafer packing box according to claim 3, wherein the plurality of portions divided by the second partition plate into the plurality of portions along the length direction of the receiving grooves each include a plurality of the receiving grooves, the plurality of receiving grooves in each portion being spaced apart from each other along the width direction thereof, and adjacent two receiving grooves being spaced apart by the first partition plate;

the bottom of each of the receiving grooves in each section includes a first target end in the same direction, and each of the through holes is adjacent to the first target end of the bottom of the corresponding receiving groove.

5. The silicon wafer packing box according to claim 4, wherein the end of each first partition plate, which is close to the box cover, is provided with a groove, the height of each first partition plate at a position outside the groove is not smaller than the height of the target silicon wafer, and the height of each first partition plate at the position of the groove is smaller than the height of the target silicon wafer;

each through hole corresponds to a position of the corresponding first partition plate outside the groove.

6. The silicon wafer packing box according to claim 3, wherein,

the bottom of each containing groove comprises a second target end close to the second partition plate, and each through hole is close to the second target end of the bottom of the corresponding containing groove.

7. The package of claim 1, wherein adjacent receiving slots on both sides of the second divider are symmetrical about the second divider.

8. The silicon wafer package according to claim 1, wherein the bottom plate and the side plate are both made of pearl wool material, and the bottom plate and the side plate are fixed by gluing.

9. The silicon wafer package according to any one of claims 1 to 8, further comprising:

a first locking portion provided on the cartridge cover;

the second locking part is arranged on the box body and matched with the first locking part to lock the box cover and the box body.

10. The package of claim 9, wherein the first locking portion comprises an annular member and the second locking portion comprises a tab, the annular member being adapted to fit over an outer side of the tab.