CN219575620U

CN219575620U - Chip heat radiation structure and electronic device

Info

Publication number: CN219575620U
Application number: CN202320711550.9U
Authority: CN
Inventors: 朱彤; 夏云龙
Original assignee: Neusoft Reach Automotive Technology Shenyang Co Ltd
Current assignee: Neusoft Reach Automotive Technology Shenyang Co Ltd
Priority date: 2023-04-03
Filing date: 2023-04-03
Publication date: 2023-08-22
Anticipated expiration: 2033-04-03

Abstract

The utility model provides a chip heat dissipation structure and an electronic device, which relate to the technical field of electronic devices, and the chip heat dissipation structure provided by the utility model comprises: a heat conducting matrix and a heat conducting glue; the heat conducting substrate is provided with a glue filling groove, and the heat conducting glue is filled in the glue filling groove and solidified at the top to form a protruding part higher than the upper surface of the heat conducting substrate. The chip heat radiation structure and the electronic device provided by the utility model can reduce the weight of the heat conduction matrix, increase the contact area of the heat conduction glue and the heat conduction matrix, and further improve the heat transfer efficiency. In addition, the protruding portion is higher than the upper surface of the heat conduction matrix, and the heat dissipation chip is contacted through the protruding portion, so that the chip is prevented from being damaged when external impact is born, assembly tolerance variation can be adapted, and the heat dissipation chip is convenient to detach and overhaul after assembly.

Description

Chip heat radiation structure and electronic device

Technical Field

The present utility model relates to the field of electronic devices, and in particular, to a chip heat dissipation structure and an electronic device.

Background

Along with the enrichment of the electrical functions of the automobile, the power consumption of the vehicle-mounted chip is increased increasingly, and the heat productivity of the chip is improved. In the past, heat dissipation of a chip is conducted by means of die-casting aluminum, a boss is usually formed on a die-casting aluminum shell in a processing mode, heat conducting glue is coated on the surface of the boss, and the boss is enabled to be in contact with the chip, so that heat of the chip can be dissipated to the die-casting aluminum shell. However, since the die-casting molding can cause air holes to be formed inside the boss, and the thickness of the boss is large, not only the weight is large, but also there is a risk of leakage of the cooling liquid when the liquid cooling plate is integrated. In addition, heat conduction boss rigidity butt in the chip not only leads to the chip to damage easily when bearing external impact, is difficult to adapt to the change of assembly tolerance moreover, is inconvenient for carrying out dismouting and maintenance.

Disclosure of Invention

The utility model aims to provide a chip heat dissipation structure and an electronic device, so as to solve the technical problem that the existing chip heat dissipation structure is difficult to adapt to assembly tolerance variation.

In a first aspect, the present utility model provides a chip heat dissipation structure, including: a heat conducting matrix and a heat conducting glue;

and the heat conducting substrate is provided with a glue filling groove, and the heat conducting glue is filled in the glue filling groove and solidified at the top to form a protruding part higher than the upper surface of the heat conducting substrate.

With reference to the first aspect, the present utility model provides a first possible implementation manner of the first aspect, wherein the heat conducting substrate is provided with a groove frame, and the glue filling groove is arranged on the groove frame;

in a natural state, the height difference between the protruding part and the top surface of the groove frame is less than or equal to 2mm.

With reference to the first aspect, the present utility model provides a second possible implementation manner of the first aspect, wherein a cross section of the glue-pouring groove is configured as a rectangle, and corners of the rectangle are provided with first round corners.

With reference to the second possible implementation manner of the first aspect, the present utility model provides a third possible implementation manner of the first aspect, wherein a radius of the first rounded corner is 1mm to 5mm.

With reference to the first aspect, the present utility model provides a fourth possible implementation manner of the first aspect, wherein a partition board is disposed inside the glue-pouring tank, and the partition board partitions the glue-pouring tank to form a plurality of tank cavities with open tops.

With reference to the fourth possible implementation manner of the first aspect, the present utility model provides a fifth possible implementation manner of the first aspect, wherein a second rounded corner is disposed at a connection position between an inner side wall of the glue-pouring groove and the partition board.

With reference to the fourth possible implementation manner of the first aspect, the present utility model provides a sixth possible implementation manner of the first aspect, wherein at least two of the partitions are provided, at least two of the partitions intersect, and a third rounded corner is formed at the intersection.

With reference to the fourth possible implementation manner of the first aspect, the present utility model provides a seventh possible implementation manner of the first aspect, wherein a top surface of the partition plate is lower than a top surface of a side wall of the glue-pouring slot.

With reference to the seventh possible implementation manner of the first aspect, the present utility model provides an eighth possible implementation manner of the first aspect, wherein a difference in height between a top surface of a side wall of the glue-pouring slot and a top surface of the partition plate is 0.5mm to 2mm.

In a second aspect, the present utility model provides an electronic device comprising: a circuit board, a chip and the chip heat dissipation structure described in the first aspect;

the chip is connected to the circuit board and is abutted to the protruding portion.

The embodiment of the utility model has the following beneficial effects: the heat-conducting matrix with the glue filling groove is adopted, the heat-conducting glue is filled in the glue filling groove, and the protruding portion higher than the upper surface of the heat-conducting matrix is formed through top solidification, so that the weight of the heat-conducting matrix can be reduced, the contact area between the heat-conducting glue and the heat-conducting matrix is increased, and the heat transfer efficiency is improved. In addition, the protruding portion is higher than the upper surface of the heat conduction matrix, and the heat dissipation chip is contacted through the protruding portion, so that the chip is prevented from being damaged when external impact is born, assembly tolerance variation can be adapted, and the heat dissipation chip is convenient to detach and overhaul after assembly.

In order to make the above objects, features and advantages of the present utility model more comprehensible, preferred embodiments accompanied with figures are described in detail below.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the related art, the drawings that are required to be used in the description of the embodiments or the related art will be briefly described, and it is apparent that the drawings in the description below are some embodiments of the present utility model, and other drawings may be obtained according to the drawings without inventive effort for those skilled in the art.

Fig. 1 is a front view of a chip heat dissipation structure according to an embodiment of the present utility model;

fig. 2 is a schematic diagram of a heat conducting substrate of a chip heat dissipation structure according to an embodiment of the present utility model;

fig. 3 is a schematic diagram of a heat-conducting adhesive of a chip heat dissipation structure according to an embodiment of the present utility model;

fig. 4 is an enlarged schematic view of a slot frame of a chip heat dissipation structure according to an embodiment of the present utility model;

FIG. 5 is an enlarged schematic view of another slot frame of the chip heat dissipation structure according to the embodiment of the present utility model;

fig. 6 is a schematic diagram of an electronic device according to an embodiment of the present utility model.

Icon: 100-a heat conducting matrix; 101-a glue filling groove; 102-a first rounded corner; 103-second rounded corners; 104-a third rounded corner; 110-a trough rack; 111-slot cavity; 120-separator; 200-heat conducting glue; 201-a boss; 300-a circuit board; 400-chip.

Detailed Description

The following description of the embodiments of the present utility model will be made apparent and fully in view of the accompanying drawings, in which some, but not all embodiments of the utility model are shown. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. Physical quantities in the formulas, unless otherwise noted, are understood to be basic quantities of basic units of the international system of units, or derived quantities derived from the basic quantities by mathematical operations such as multiplication, division, differentiation, or integration.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

As shown in fig. 1, fig. 2, fig. 3 and fig. 6, a chip heat dissipation structure provided by an embodiment of the present utility model includes: a heat conductive base 100 and a heat conductive paste 200; the heat conducting substrate 100 is provided with a glue filling groove 101, and the heat conducting glue 200 is filled in the glue filling groove 101 and solidified at the top to form a protruding part 201 higher than the upper surface of the heat conducting substrate 100.

Specifically, the heat-conducting glue 200 is poured into the glue pouring groove 101, and the pouring amount of the heat-conducting glue 200 is slightly larger than the volume of the glue pouring groove 101, so that the surface tension of the liquid surface of the heat-conducting glue 200 can be utilized to form a cambered surface bulge, and then the bulge 201 is formed by solidification. When the chip 400 is cooled by the chip cooling structure, the heat of the chip 400 is transferred to the heat conducting substrate 100 through the heat conducting glue 200, and the heat conducting substrate 100 can be configured as cast aluminum or other metal devices, and the heat is dissipated through the heat conducting substrate 100. The heat conductive paste 200 is poured and cured inside the paste pouring groove 101, thereby increasing the contact area of the heat conductive paste 200 and the heat conductive substrate 100 and further improving the heat transfer efficiency. In addition, the heat-conducting glue 200 after solidification forms the bellying 201 that has elasticity at the top, and in bellying 201 butt chip 400, and under the circumstances that bellying 201 was compressed properly, not only can ensure bellying 201 and chip 400 laminating closely, can slow down the impact force that chip 400 received moreover, can also adapt to the variation of assembly tolerance, dismantles and overhaul after being convenient for assemble.

In an alternative embodiment, the glue-pouring groove 101 may be recessed on the base surface of the heat conductive substrate 100, thereby reducing the manufacturing cost of the product.

In the embodiment of the utility model, the heat conducting substrate 100 is provided with a groove frame 110, and the glue filling groove 101 is arranged on the groove frame 110; in a natural state, the difference in height between the boss 201 and the top surface of the tub 110 is 2mm or less. The height difference between the top end of the protruding portion 201 and the base surface of the heat conducting base 100 can be increased by the support of the slot frame 110, so that the circuit board 300 and the chip 400 are separated from the heat conducting base 100 by a certain distance, and dimensional tolerance variation of each device can be adapted conveniently. The difference in height between the protruding portion 201 and the top surface of the groove frame 110 is 2mm or less, so that a certain assembly size adjustment space is provided between the chip 400 and the groove frame 110, and heat transferred to the protruding portion 201 can be efficiently conducted to the heat conducting substrate 100.

As shown in fig. 1, 3 and 4, the cross section of the glue filling groove 101 is configured as a rectangle, and the corners of the rectangle are provided with first fillets 102, so that the edge positions of the glue filling groove 101 can form arc surfaces by arranging the first fillets 102, glue materials can be fully infiltrated, bubbles in the glue materials at the corners of the glue filling groove 101 can be avoided, and the heat-conducting glue 200 is tightly bonded with the inner wall of the glue filling groove 101.

The radius of the first round 102 is 1mm to 5mm, and preferably 2mm. On one hand, the rubber material can fully infiltrate into the first round corners 102, so that the heat-conducting rubber 200 is tightly jointed with the inner wall of the rubber filling groove 101; on the other hand, the first rounded corners 102 limit the outer contour of the heat conductive adhesive 200, so that the cross section of the cured protrusion 201 may be approximately circular.

As shown in fig. 1, 3 and 5, a partition board 120 is disposed inside the glue-pouring tank 101, and the partition board 120 partitions the glue-pouring tank 101 to form a plurality of tank cavities 111 with open tops.

Specifically, when the cross-sectional area of the glue filling groove 101 is larger, the partition plate 120 is arranged, so that the glue filling groove 101 can be separated to form a plurality of groove cavities 111, and the side length of the cross section of the groove cavities 111 or the radius of the cross section circumscribing circle is smaller than 2mm, so that the heat conduction glue 200 solidified in the glue filling groove 101 is prevented from having stronger bonding strength, and heat can be efficiently transferred from the heat conduction glue 200 to the body of the heat conduction matrix 100 through the groove frame 110 and the partition plate 120, and therefore the heat dissipation efficiency is improved.

Further, a second round corner 103 is arranged at the connection part between the inner side wall of the glue filling groove 101 and the partition plate 120. In addition, when at least two of the separators 120 are provided, if there are intersections of at least two of the separators 120, the third rounded corners 104 are formed at the intersections. Through addding second fillet 103 and third fillet 104, can further avoid forming the bubble between the lateral wall of heat conduction glue 200 and encapsulating groove 101, and then avoid heat conduction glue 200 laminating in cell frame 110 and baffle 120's effective heat conduction area to appear defect, not only improved structural strength, be favorable to guaranteeing heat transfer efficiency moreover.

Further, the top surface of the partition board 120 is lower than the top surface of the side wall of the glue filling groove 101, so that the heat-conducting glue 200 is collected and solidified at the top of the partition board 120, on one hand, the whole structure of the heat-conducting glue 200 is more stable, and on the other hand, the heat-conducting glue 200 is beneficial to efficiently conducting heat from the chip 400.

The height difference between the top surface of the sidewall of the glue-pouring tank 101 and the top surface of the partition plate 120 is 0.5mm to 2mm, and the height difference may be configured to be 0.8mm, 1.2mm, 1.5mm or 1.8mm, and preferably the height difference is 1mm.

As shown in fig. 6, an electronic device provided in an embodiment of the present utility model includes: the circuit board 300, the chip 400, and the chip heat dissipation structure described in the above embodiments; the chip 400 is connected to the circuit board 300, and the chip 400 abuts against the protruding portion 201.

In the embodiment of the utility model, the circuit board 300 is connected with the heat conducting base body 100 through bolts or buckles, or the circuit board 300 and the chip heat dissipation structure are respectively installed in the box body, and the protruding part 201 is attached to the chip 400 through extrusion of the box body, so that heat dissipation of the chip 400 can be realized, and the heat dissipation device can be adapted to the change of the interval between the circuit board 300 and the heat conducting base body 100, and is convenient to detach and overhaul after assembly.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present utility model, and not for limiting the same; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the utility model.

Claims

1. A chip heat dissipation structure, comprising: a heat conductive substrate (100) and a heat conductive paste (200);

the heat conduction base body (100) is provided with a glue filling groove (101), and the heat conduction glue (200) is filled in the glue filling groove (101) and solidified at the top to form a protruding part (201) higher than the upper surface of the heat conduction base body (100).

2. The chip heat dissipation structure according to claim 1, wherein the heat conductive substrate (100) is provided with a groove frame (110), and the glue filling groove (101) is disposed on the groove frame (110);

in a natural state, the height difference between the protruding part (201) and the top surface of the groove frame (110) is less than or equal to 2mm.

3. The chip heat dissipation structure according to claim 1, wherein the cross section of the glue-pouring groove (101) is configured as a rectangle, and corners of the rectangle are provided with first fillets (102).

4. A chip heat dissipation structure according to claim 3, characterized in that the radius of the first fillet (102) is 1-5 mm.

5. The chip heat dissipation structure according to claim 1, wherein a partition board (120) is disposed inside the glue-pouring groove (101), and the partition board (120) separates the glue-pouring groove (101) to form a plurality of groove cavities (111) with open tops.

6. The chip heat dissipation structure according to claim 5, wherein a second rounded corner (103) is provided at a connection portion between an inner side wall of the glue-pouring groove (101) and the partition plate (120).

7. The chip heat dissipation structure according to claim 5 or 6, characterized in that at least two of the partitions (120) are provided, at least two of the partitions (120) intersect and form a third fillet (104) at the intersection.

8. The chip heat dissipation structure according to claim 5, wherein a top surface of the partition plate (120) is lower than a top surface of a side wall of the glue-pouring groove (101).

9. The chip heat dissipation structure according to claim 8, wherein a height difference between a top surface of a side wall of the glue filling groove (101) and a top surface of the partition plate (120) is 0.5 mm-2 mm.

10. An electronic device, comprising: a circuit board (300), a chip (400) and the chip heat dissipation structure of any one of claims 1-9;

the chip (400) is connected to the circuit board (300), and the chip (400) is abutted against the protruding portion (201).