CN219575608U - Wafer clamp base - Google Patents
Wafer clamp base Download PDFInfo
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- CN219575608U CN219575608U CN202320696530.9U CN202320696530U CN219575608U CN 219575608 U CN219575608 U CN 219575608U CN 202320696530 U CN202320696530 U CN 202320696530U CN 219575608 U CN219575608 U CN 219575608U
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- partition
- groove
- wafer
- base body
- base
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a wafer clamp base which comprises a base body and at least two partitions arranged on the base body, wherein the different partitions are respectively used for placing wafer clamps with different specifications. Because the base body is provided with at least two partitions, the wafer clamps with at least two different specifications and sizes can be correspondingly placed. Compared with the prior art, when the wafer clamp base disclosed by the embodiment of the utility model is used for working, the wafer clamp base does not need to be frequently replaced, and one wafer clamp base can be suitable for more than 2 wafer clamps with different specification sizes, so that the cost is effectively reduced, and the production efficiency is greatly improved.
Description
Technical Field
The utility model relates to the technical field of semiconductor equipment, in particular to a wafer clamp base.
Background
In the semiconductor wafer processing process, a base for carrying a wafer clamp is often used, and the current base for carrying a wafer clamp is generally only suitable for a wafer clamp with one specification and size, so that a plurality of bases respectively suitable for wafer clamps with different specifications and sizes are needed, the wafer clamps with different specifications and sizes are replaced conveniently, the cost is wasted, and the working efficiency is greatly reduced.
Therefore, how to provide a wafer chuck base, which can be suitable for wafer chucks with different specifications and sizes, so as to reduce the cost and improve the production efficiency is a technical problem that needs to be solved by those skilled in the art.
Disclosure of Invention
Accordingly, the present utility model is directed to a wafer chuck base, which is applicable to wafer chucks of different specifications and sizes, thereby reducing the cost and improving the production efficiency.
In order to achieve the above purpose, the present utility model provides the following technical solutions:
the wafer clamp base comprises a base body and at least two partitions arranged on the base body, wherein different partitions are respectively used for placing wafer clamps of different specifications.
Preferably, the different partitions are respectively arranged at different positions of the base body, and the different partitions are spatially independent on the base body.
Preferably, different partitions are nested.
Preferably, the partitions include a first partition and a second partition, the area of the first partition is smaller than that of the second partition, the first partition is embedded in the second partition, and the first partition is lower than the second partition;
the wafer clamps comprise a first specification wafer clamp and a second specification wafer clamp, the first partition is used for placing the first specification wafer clamp, and the second partition is used for placing the second specification wafer clamp.
Preferably, the base body is of a cuboid structure, and the first partition and the second partition are all arranged along the long axis direction of the base body.
Preferably, the first partition is in profiling arrangement with the first specification wafer clamp;
the first partition comprises a first plane carrying platform, a framework groove and a handle groove, wherein the first plane carrying platform is used for placing a main body of the first specification wafer clamp, the framework groove is used for being matched with a framework of the first specification wafer clamp, the handle groove is used for being matched with a handle of the first specification wafer clamp, the first plane carrying platform and the handle groove are in the same horizontal plane, and the framework groove is lower than the first plane carrying platform.
Preferably, the device further comprises a buckling groove arranged in the first partition, wherein the buckling groove is a through groove, the buckling groove comprises a first groove edge and a second groove edge, and the first groove edge and the second groove edge are arranged oppositely;
one end of the framework groove extends to the edge of the first partition, the other end of the framework groove extends to the first groove edge, and the handle groove is arranged on the second groove edge.
Preferably, the second partition includes a second planar stage and a positioning step, the positioning step is higher than the second planar stage, the second planar stage and the positioning step form a structure copying the second specification wafer clamp, the second specification wafer clamp is placed on the second planar stage, and the positioning step is used for abutting against an edge part of the second specification wafer clamp.
Preferably, the positioning step comprises a first positioning step and a second positioning step, and the first positioning step and the second positioning step are respectively arranged at two adjacent corners arranged along the long axis direction of the base body.
Preferably, the first plane positioning step and the second positioning step are both triangular, and a clamping part for positioning the second specification wafer clamp is formed between the first positioning step and the second positioning step.
According to the technical scheme, at least two partitions are arranged on the base body, so that at least two wafer clamps with different specifications and sizes can be correspondingly placed. Compared with the prior art, when the wafer clamp base disclosed by the embodiment of the utility model is used for working, the wafer clamp base does not need to be frequently replaced, and one wafer clamp base can be suitable for more than 2 wafer clamps with different specification sizes, so that the cost is effectively reduced, and the production efficiency is greatly improved.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required to be used in the description of the embodiments or the prior art are briefly introduced below, and it is obvious that the drawings in the following description are only embodiments of the present utility model, and other drawings can be obtained according to the provided drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic perspective view of a wafer chuck base according to an embodiment of the present utility model;
FIG. 2 is a schematic top view of a wafer chuck base according to an embodiment of the present utility model;
FIG. 3 is a schematic diagram of a front view of a wafer chuck base according to an embodiment of the present utility model;
FIG. 4 is a schematic diagram of a left-hand configuration of a wafer chuck base according to an embodiment of the present utility model;
FIG. 5 is a schematic cross-sectional view of the structure of FIG. 2 taken along the direction A-A;
fig. 6 is a schematic cross-sectional view of fig. 2 in the direction B-B.
Wherein, each part name is as follows:
100. a base body; 200. a first partition; 201. a first planar stage; 202. a skeleton groove; 203. a handle groove; 204. a buckle groove; 300. a second partition; 301. a second planar stage; 302. a first positioning step; 303. and a second positioning step.
Detailed Description
For a better understanding of the present utility model, reference is made to fig. 1 to 6, for a further detailed description of the present utility model, taken in conjunction with the accompanying drawings and detailed description.
The wafer clamp base disclosed by the embodiment of the utility model comprises a base body 100 and at least two partitions arranged on the base body 100, wherein the different partitions are respectively used for placing wafer clamps with different specifications.
Since at least two partitions are disposed on the base body 100, at least two wafer clamps with different sizes can be correspondingly placed. Compared with the prior art, when the wafer clamp base disclosed by the embodiment of the utility model is used for working, the wafer clamp base does not need to be frequently replaced, and one wafer clamp base can be suitable for more than 2 wafer clamps with different specification sizes, so that the cost is effectively reduced, and the production efficiency is greatly improved.
The embodiment of the present utility model does not specifically limit the arrangement form of each different partition, wherein different partitions may be sequentially arranged at different positions of the base body 100, and each partition is spatially independent on the base body 100, and of course, each partition may also adopt other arrangement modes of other structures, so long as the structure meeting the use requirement of the present utility model is within the protection scope of the present utility model.
When the different partitions are sequentially arranged at different positions of the base body 100, and the different partitions are spatially independent on the base body 100, the above arrangement mode can lead to the volume increase of the base body 100 and the practicality is poor, although the arrangement mode can also be applied to wafer clamps with various specifications and sizes.
As a preferred embodiment, the wafer chuck base disclosed in the embodiments of the present utility model preferably has different sections nested. By the arrangement, the volume of the base body 100 can be greatly reduced, and the base body is applicable to wafer clamps with different specifications and sizes, and cost is effectively reduced.
The specific number of partitions in the embodiment of the present utility model is not limited, and those skilled in the art can design the partition according to actual needs, and the embodiment of the present utility model is described in detail below by taking two partitions as an example.
Referring to fig. 1 to fig. 2, the partitions disclosed in the embodiments of the present utility model include a first partition 200 and a second partition 300, wherein the area of the first partition 200 is smaller than that of the second partition 300, the first partition 200 is disposed in the second partition 300, and the first partition 200 is lower than the second partition 300;
the wafer chuck includes a first specification wafer chuck and a second specification wafer chuck, the first partition 200 is used for placing the first specification wafer chuck, and the second partition 300 is used for placing the second specification wafer chuck.
So configured, the first sub-section 200 is embedded within the second sub-section 300, and the location where the second sub-section 300 meets the first sub-section 200 constitutes a step of the first sub-section 200 for positioning the first specification wafer chuck.
The specific structure of the base body 100 is not limited in the embodiment of the present utility model, and the structure meeting the use requirement of the embodiment of the present utility model is within the protection scope of the present utility model.
As a preferred embodiment, the base body 100 disclosed in the embodiment of the present utility model has a rectangular parallelepiped structure, wherein the first partition 200 and the second partition 300 are both disposed along the long axis direction of the base body 100.
The first partition 200 is configured to be contoured to the first specification wafer chuck.
Specifically, the first partition 200 includes a first planar carrier 201, a skeleton groove 202, and a handle groove 203, where the first planar carrier 201 is used for placing a main body of the first specification wafer chuck, the skeleton groove 202 is used for matching with a skeleton of the first specification wafer chuck, the handle groove 203 is used for matching with a handle of the first specification wafer chuck, the first planar carrier 201 and the handle groove 203 are in the same horizontal plane, and the skeleton groove 202 is lower than the first planar carrier 201.
When the first specification wafer clamp is placed in the first partition 200, the main body of the first specification wafer clamp is attached to the first plane carrier 201, the framework of the first specification wafer clamp is placed in the framework groove 202, and the handle of the first specification wafer clamp is placed in the handle groove 203.
Because each wafer chuck is provided with a buckle in a protruding state, in order to avoid tilting of the wafer chuck and enable the wafer chuck to keep a flat state in the first partition 200 or the second partition 300, the wafer chuck base disclosed in the embodiment of the utility model further comprises a buckle groove 204 arranged in the first partition 200, wherein the buckle groove 204 is a through groove, and thus, when the wafer chuck of the first specification is arranged on the first plane carrier 201, the buckle of the wafer chuck of the first specification is arranged in the buckle groove 204, so that effective positioning of the wafer chuck of the first specification can be realized.
It should be noted that, the fastening slot 204 includes a first slot edge and a second slot edge, where the first slot edge and the second slot edge are opposite, one end of the skeleton slot 202 extends to the edge of the first partition 200, the other end of the skeleton slot 202 extends to the first slot edge, and the handle slot 203 is disposed on the second slot edge.
The above structure is set according to the structure of the first specification wafer chuck, when the first specification wafer is placed in the first partition 200, the main body of the first specification wafer chuck is placed on the first plane carrier 201, the framework of the first specification wafer chuck is placed in the framework groove 202, the handle of the first specification wafer chuck is placed in the handle groove 203, and the buckle of the first specification wafer chuck is placed in the buckle groove 204. So configured, the first sub-section 200 can enable positioning of the first specification wafer chuck.
The specific structure of the second partition 300 is not limited in this embodiment, and any structure meeting the use requirements of the present utility model is within the scope of the present utility model.
As a preferred embodiment, the second partition 300 disclosed in the embodiment of the present utility model includes a second planar stage 301 and a positioning step, the positioning step is higher than the second planar stage 301, and the second planar stage 301 and the positioning step form a structure contoured to the second specification wafer chuck.
The second specification wafer clamp is placed on the second plane carrier 301, and the positioning step is used for abutting against the edge portion of the second specification wafer clamp. So configured, the second section 300 can enable positioning of the second specification wafer chuck.
The positioning step disclosed by the embodiment of the utility model needs to be arranged according to the specific shape of the abutting part of the wafer clamp with the second specification, so that a person skilled in the art can select the specific shape and structure of the positioning step according to actual needs.
As a specific embodiment, the positioning steps disclosed in the embodiments of the present utility model include a first positioning step 302 and a second positioning step 303, where the first positioning step 302 and the second positioning step 303 are respectively disposed at two adjacent corners disposed along the long axis direction of the base body 100.
Wherein, first location step 302 and second location step 303 are triangle-shaped, form the joint portion that is used for carrying out the location to second specification wafer anchor clamps between first location step 302 and the second location step 303.
When the second specification wafer chuck is placed in the second partition 300, the main body of the second specification wafer chuck is placed on the second plane carrier 301 and covers the first plane carrier 201, the buckle of the second specification wafer chuck is placed in the buckle groove 204, and the first positioning step 302 and the second positioning step 303 are respectively abutted with the edge part of the second specification wafer chuck. By the arrangement, the second specification wafer clamp can be effectively positioned.
It should be noted that, the space of the fastening groove 204 is large enough to accommodate the fastening of the wafer chuck of the first specification, and also accommodate the fastening of the wafer chuck of the second specification.
The specific heights of the first planar stage 201, the second planar stage 301 and the positioning step are not limited in the embodiment of the present utility model, so long as the structures meeting the use requirements of the present utility model are within the scope of the present utility model, and those skilled in the art can select according to actual needs.
As a preferred embodiment, the height of the first planar stage 201 disclosed in the embodiment of the present utility model is preferably 1mm-3mm lower than the height of the second planar stage 301, and the height of the second planar stage 301 is preferably 5mm-9mm lower than the height of the positioning step.
In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
Unless specifically stated or limited otherwise, the terms "mounted," "connected," and "coupled" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present utility model. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the utility model. Thus, the present utility model is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (7)
1. The wafer clamp base is characterized by comprising a base body and at least two partitions arranged on the base body, wherein different partitions are respectively used for placing wafer clamps with different specifications;
the different partitions are embedded on the base body;
the partitions comprise a first partition and a second partition, the area of the first partition is smaller than that of the second partition, the first partition is embedded in the second partition, and the first partition is lower than the second partition;
the wafer clamp comprises a first specification wafer clamp and a second specification wafer clamp, the first partition is used for placing the first specification wafer clamp, and the second partition is used for placing the second specification wafer clamp;
the first partition is arranged in a profiling way with the first specification wafer clamp;
the first partition comprises a first plane carrying platform, a framework groove and a handle groove, wherein the first plane carrying platform is used for placing a main body of the first specification wafer clamp, the framework groove is used for being matched with a framework of the first specification wafer clamp, the handle groove is used for being matched with a handle of the first specification wafer clamp, the first plane carrying platform and the handle groove are in the same horizontal plane, and the framework groove is lower than the first plane carrying platform.
2. The wafer chuck base of claim 1, wherein different ones of said partitions are disposed at different locations of said base body, respectively, and wherein different ones of said partitions are spatially independent on said base body.
3. The wafer chuck base of claim 1, wherein the base body is a rectangular parallelepiped structure, and the first and second partitions are disposed along a long axis direction of the base body.
4. The wafer chuck base of claim 1, further comprising a snap groove disposed in the first section, the snap groove being a through groove, the snap groove comprising a first groove side and a second groove side, the first groove side being disposed opposite the second groove side;
one end of the framework groove extends to the edge of the first partition, the other end of the framework groove extends to the first groove edge, and the handle groove is arranged on the second groove edge.
5. The wafer chuck base of claim 1, wherein the second section includes a second planar stage and a locating step, the locating step being higher than the second planar stage, the second planar stage and the locating step forming a contoured configuration with the second gauge wafer chuck, the second gauge wafer chuck being disposed on the second planar stage, the locating step being for abutting an edge portion of the second gauge wafer chuck.
6. The wafer chuck base as set forth in claim 5, wherein the positioning steps include a first positioning step and a second positioning step, the first positioning step and the second positioning step being disposed at two adjacent corners disposed along a long axis direction of the base body, respectively.
7. The wafer chuck base of claim 6, wherein the first and second positioning steps are triangular in shape, and a clamping portion for positioning the second specification wafer chuck is formed between the first and second positioning steps.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320696530.9U CN219575608U (en) | 2023-03-31 | 2023-03-31 | Wafer clamp base |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320696530.9U CN219575608U (en) | 2023-03-31 | 2023-03-31 | Wafer clamp base |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219575608U true CN219575608U (en) | 2023-08-22 |
Family
ID=87660359
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320696530.9U Active CN219575608U (en) | 2023-03-31 | 2023-03-31 | Wafer clamp base |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219575608U (en) |
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2023
- 2023-03-31 CN CN202320696530.9U patent/CN219575608U/en active Active
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