CN219574595U

CN219574595U - Substrate supporting mechanism and substrate baking device

Info

Publication number: CN219574595U
Application number: CN202320726803.XU
Authority: CN
Inventors: 高日凯
Original assignee: LG Display Optoelectronics Technology China Co Ltd
Current assignee: LG Display Optoelectronics Technology China Co Ltd
Priority date: 2023-04-04
Filing date: 2023-04-04
Publication date: 2023-08-22
Anticipated expiration: 2033-04-04

Abstract

The utility model discloses a substrate supporting mechanism and a substrate baking device. Wherein, base plate supporting mechanism includes supporting seat and a plurality of supporting pin, and its characterized in that, the supporting seat is including bottom plate and the heat insulating board of superpose in proper order, and the bottom plate is installed in the bottom of toasting the chamber, and the heat insulating board setting is deviating from one side of toasting the chamber bottom at the bottom plate, and a plurality of supporting pin interval distributions, the lower extreme of supporting pin is installed on the bottom plate, and the upper end of supporting pin passes the heat insulating board and bulge in the upper side of heat insulating board for with base plate butt. The top of the supporting pin is arranged to be abutted with the substrate, and the supporting pin is used for supporting the substrate; the bottom plate provides support and fixed action for the supporting pin, sets up the heat insulating board at the upper surface of bottom plate, separates heat conduction effectively to on the bottom plate, prevents to lead to the risk that the supporting pin collapses down because the bottom plate is heated the deformation, is favorable to keeping all supporting pin tops all to be located the coplanar, reduces the base plate damage.

Description

Substrate supporting mechanism and substrate baking device

Technical Field

The present utility model relates to the field of display panel processing technologies, and in particular, to a substrate supporting mechanism and a substrate baking device including the same.

Background

When glass is processed (for example, photolithography processing, etc.), it is necessary to clean the glass to remove foreign matters such as dust on the surface of the glass, so that the foreign matters do not affect the processing quality of the glass, and the cleaned glass is baked by a baking device to dry the surface of the glass.

Referring to fig. 1, the baking apparatus includes a baking chamber 100 ', a first opening (not shown) and a second opening (not shown) are respectively opened at opposite sides of the baking chamber 100', and a support rail 400 ', a heat generating part 300', and a substrate support mechanism 200 'are respectively provided inside the baking chamber 100'. The two support slide rails 400 ' are respectively arranged at two opposite sides of the bottom of the baking cavity 100 ' at intervals, and the length of the support slide rail 400 ' extends from the first opening to the second opening. The substrate supporting mechanism 200 ' comprises a supporting plate 1 ' and a plurality of supporting pins 2 ' protruding from the top of the supporting plate 1 ', wherein the supporting pins 2 ' are distributed at intervals and used for being abutted against the lower surface of glass, two opposite ends of the supporting plate 1 ' are slidably arranged on two supporting slide rails 400 ', and a heating component 300 ' is arranged above the supporting pins 2 ' at intervals and used for heating the glass. The robot sends the glass to be dried into the baking chamber 100 ' from the first opening and places the glass on the support pins 2 ', closes the first opening and the second opening, and after the heating component 300 ' heats and dries the moisture on the surface of the glass, the robot takes out the glass from the first opening again, when the baking chamber 100 ' needs cleaning, the support plate 1 ' slides on the support slide rail 400 ' towards the second opening, and the substrate support mechanism 200 ' is taken out from the second opening.

However, such a substrate support mechanism 200' has the following disadvantages: the support plate 1 ' is made of metal and is easy to deform under heating, and the deformation of the support plate 1 ' can cause the collapse of part of the support pins 2 ', so that the upper end parts of the support pins 2 ' are not on the same plane, and when the glass is placed on the support pins 2 ', the glass is easy to break.

Disclosure of Invention

The utility model aims at: provided is a substrate support mechanism which can prevent a support pin from collapsing and prevent a substrate from being damaged.

Another object of the utility model is: provided is a substrate baking device capable of reducing the risk of substrate breakage.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

in one aspect, a substrate supporting mechanism is provided, including supporting seat and a plurality of supporting pin, its characterized in that, the supporting seat is including bottom plate and the heat insulating board of superpose in proper order, the bottom plate is installed in the bottom of toasting the chamber, the heat insulating board sets up the bottom plate deviates from toasting one side of chamber bottom, a plurality of supporting pin interval distribution, the lower extreme of supporting pin is installed on the bottom plate, the upper end of supporting pin passes the heat insulating board and protruding in the upper side of heat insulating board is used for with the base plate butt.

As a preferable scheme of the substrate supporting mechanism, the device further comprises a heat reflecting plate which is overlapped on one side of the heat insulating plate, which is far away from the bottom plate, wherein the supporting pin penetrates through the heat insulating plate and the heat reflecting plate, and the upper end of the supporting pin protrudes out of one side of the heat reflecting plate, which is far away from the heat insulating plate

As a preferable scheme of the substrate supporting mechanism, the heat insulation plate is provided with a plurality of first through holes in a penetrating mode, the first through holes are distributed at intervals, the heat reflection plate is provided with a plurality of second through holes in a penetrating mode, the second through holes are distributed at intervals, the first through holes are opposite to the second through holes one by one, and the upper ends of the supporting pins penetrate through the first through holes and the second through holes.

As a preferable mode of the substrate supporting mechanism, the aperture of the first through hole and the aperture of the second through hole are both larger than the outer diameter of the supporting pin.

As a preferable scheme of the substrate supporting mechanism, the bottom plate is bonded with the heat insulation plate through bonding glue;

and/or the heat reflecting plate is adhered to the heat insulating plate through adhesive.

As a preferable scheme of the substrate supporting mechanism, one of the bottom plate and the heat insulation plate is provided with a first positioning groove, and the other is provided with a first positioning protrusion which is in plug-in fit with the first positioning groove;

and/or one of the heat insulation plate and the heat reflection plate is provided with a second positioning groove, and the other one of the heat insulation plate and the heat reflection plate is provided with a second positioning protrusion which is in plug-in fit with the second positioning groove.

As a preferable mode of the substrate supporting mechanism, the supporting pin is detachably connected with the bottom plate through a screw structure.

As a preferable scheme of the substrate supporting mechanism, the upper side surface of the bottom plate is concavely provided with a threaded hole, the supporting pin comprises a pin body and a threaded column arranged at the lower end of the pin body, the threaded column is screwed in the threaded hole, and the pin body penetrates through the heat insulation plate and the heat reflection plate.

As a preferable scheme of the substrate supporting mechanism, a bottom of the baking cavity is provided with a sliding rail in a protruding mode, the length of the sliding rail extends along a first direction, and the bottom plate is arranged on the sliding rail in a sliding mode.

On the other hand, still provide a base plate baking equipment, including toasting the chamber, toast the intracavity portion and be provided with slide rail and heating element, the slide rail protrusion sets up toast the diapire in chamber, heating element sets up toast the top in chamber.

The beneficial effects of the utility model are as follows: the top of the supporting pin is arranged to be abutted with the substrate, and the supporting pin is used for supporting the substrate; the bottom plate provides support and fixed action for the supporting pin, sets up the heat insulating board at the upper surface of bottom plate, separates heat conduction effectively to on the bottom plate, prevents to lead to the risk that the supporting pin collapses down because the bottom plate is heated the deformation, is favorable to keeping all supporting pin tops all to be located the coplanar, reduces the base plate damage.

Drawings

The utility model is described in further detail below with reference to the drawings and examples.

Fig. 1 is a sectional view of a related art toasting device.

Fig. 2 is a cross-sectional view of a baking apparatus according to an embodiment of the present utility model.

Fig. 3 is a cross-sectional view of a substrate support mechanism according to another embodiment of the utility model.

Fig. 4 is a cross-sectional view of a substrate support mechanism according to yet another embodiment of the present utility model.

Fig. 5 is a structural view of a base plate, a heat insulating plate and a heat reflecting plate according to still another embodiment.

Fig. 6 is a structural view of a base plate, a heat insulating plate and a heat reflecting plate of still another embodiment.

Fig. 7 is a structural view of a support pin in another embodiment.

In fig. 1:

100' a baking cavity; 200', a substrate supporting mechanism; 300' and a heat generating component; 400' and supporting slide rails;

1', a supporting plate; 2', supporting pin.

Fig. 2 to 7:

100. a baking chamber; 200. a substrate supporting mechanism; 300. a heat generating component; 400. a slide rail;

1. a bottom plate; 101. a first positioning groove; 102. a threaded hole; 2. a heat insulating plate; 201. a first through hole; 202. a first positioning protrusion; 203. a second positioning groove; 3. a heat reflection plate; 301. a second through hole; 302. a second positioning protrusion; 4. a support pin; 401. a pin body; 402. a threaded column; 5. and (5) adhesive glue.

Detailed Description

Advantages and features of the present utility model and methods of accomplishing the same may become apparent with reference to the following detailed description of embodiments taken in conjunction with the accompanying drawings. However, the present utility model is not limited to the embodiments disclosed below, but may be embodied in various different forms, which are provided only for the purpose of completing the disclosure of the present utility model and fully understanding the scope of the present utility model by those skilled in the art, and the present utility model is limited only by the scope of the claims. Like reference numerals denote like constituent elements throughout the specification.

Hereinafter, the present utility model will be described in detail with reference to the accompanying drawings.

As shown in fig. 2, the substrate baking device provided by the utility model comprises a baking cavity 100, wherein a slide rail 400, a heating component 300 and a substrate supporting mechanism 200 are arranged in the baking cavity 100, the slide rail 400 is convexly arranged on the bottom wall of the baking cavity 100, the heating component 300 is arranged on the top of the baking cavity 100, and the substrate supporting mechanism 200 is arranged on the slide rail 400.

Wherein, base plate supporting mechanism 200 includes supporting seat and a plurality of supporting pin 4, the supporting seat is including bottom plate 1 and the heat insulating board 2 of superpose in proper order, the bottom plate 1 is installed in the bottom of toasting chamber 100, heat insulating board 2 sets up in the one side that bottom plate 1 deviates from toasting chamber 100 bottom, a plurality of supporting pin 4 interval distribution, heat insulating board 2 sets up the upside at bottom plate 1, the downside of bottom plate 1 is installed on the slide rail 400 of toasting chamber 100 bottom, the lower extreme of supporting pin 4 is installed on bottom plate 1, the upper end of supporting pin 4 passes heat insulating board 2 and the protrusion is in the upside of heat insulating board 2, the upper end of supporting pin 4 is used for with the lower surface butt of base plate. In this embodiment, the substrate is a glass plate, the heating component 300 is disposed above the substrate supporting mechanism 200, the heating component 300 is mounted on the top of the baking chamber 100, and the substrate is baked by heating the heating component 300, so that the surface of the substrate is dried. The top of the supporting pin 4 is arranged to be abutted with the substrate, and the supporting pin 4 provides supporting function for the substrate; the bottom plate 1 provides supporting and fixing effect for the supporting pin 4, and the heat insulating plate 2 is arranged on the upper surface of the bottom plate 1, so that heat conduction to the bottom plate 1 is effectively blocked, the risk of the supporting pin 4 collapsing down due to the heated deformation of the bottom plate 1 is prevented, the upper ends of all the supporting pins 4 are kept on the same plane, and the damage of a substrate is reduced.

Referring to fig. 2 to 6, the substrate supporting mechanism 200 further includes a heat reflecting plate 3 stacked on a side of the heat insulating plate 2 facing away from the base plate 1, the supporting pins 4 pass through the heat insulating plate 2 and the heat reflecting plate 3, and upper ends of the supporting pins 4 protrude from a side of the heat reflecting plate 3 facing away from the heat insulating plate 2. The heat reflecting plate 3 can reflect the heat radiated to the heat insulating plate 2 upwards, so that the heat is far away from the bottom plate 1, and the heat insulating effect on the bottom plate 1 is further improved. In addition, since the substrate is supported above the heat reflecting plate 3 by the support pins 4, heat is reflected upward by the heat reflecting plate 3, so that heat acts on the substrate, and the surface drying speed of the substrate is increased.

In an embodiment, referring to fig. 4 and 5, the heat insulation board 2 is provided with a plurality of first through holes 201 in a penetrating manner, the plurality of first through holes 201 are distributed at intervals, the heat reflection board 3 is provided with a plurality of second through holes 301 in a penetrating manner, the plurality of second through holes 301 are distributed at intervals, the first through holes 201 are opposite to the second through holes 301 one by one, and the upper ends of the supporting pins 4 penetrate through the first through holes 201 and the second through holes 301. The first through hole 201 and the second through hole 301 are mainly reserved for the passing of the supporting pin 4, and when the method is implemented, the heat insulation board 2 and the heat reflection board 3 can be firstly processed and molded, and the bottom board 1, the heat insulation board 2, the heat reflection board 3 and the supporting pin 4 are assembled.

In order to facilitate the passage of the support pin 4 from the first through hole 201 and the second through hole 301, the aperture of the first through hole 201 and the aperture of the second through hole 301 are both larger than the outer diameter of the support pin 4. In this example, the aperture size of the first through hole 201 and the aperture size of the second through hole 301 are D1, the outer diameter size of the supporting pin 4 is D2,1mm is less than or equal to D1-D2 is less than or equal to 3mm, and the difference between D2 and D1 is set within this range, so that the through holes have enough space to pass through the supporting pin 4, and at the same time, the heat insulation performance of the base plate 1 is prevented from being reduced due to the overlarge gap between the hole wall of the through hole and the supporting pin 4.

In other embodiments, the support pins 4 may be embedded in the heat insulating plate 2 and the heat reflecting plate 3.

In this embodiment, referring to fig. 3, the base plate 1 is adhered to the heat insulation plate 2 by the adhesive 5, and/or the heat reflection plate 3 is adhered to the heat insulation plate 2 by the adhesive 5. The base plate 1, the heat insulation plate 2 and the heat reflection plate 3 are combined into a whole through the adhesive 5, the base plate supporting mechanism 200 is arranged in front of the baking cavity 100, and the base plate 1, the heat insulation plate 2 and the heat reflection plate 3 cannot be separated when the base plate supporting mechanism 200 is carried.

In another embodiment, the support pins 4 are detachably connected to the base plate 1 by a screw structure, so that the support pins 4 are mounted on the base plate 1.

Further, referring to fig. 4, 5 and 7, the upper side surface of the base plate 1 is concavely provided with a screw hole 102, the support pin 4 includes a pin body 401 and a screw column 402 provided at the lower end of the pin body 401, the screw column 402 is screwed in the screw hole 102, and the pin body 401 passes through the heat insulation plate 2 and the heat reflection plate 3. When the support pin 4 is assembled with the base plate 1, the screw column 402 is directly screwed into the screw hole 102, and no assembly tool is required.

In one embodiment, referring to fig. 6, one of the base plate 1 and the heat insulation plate 2 is provided with a first positioning groove 101, and the other is provided with a first positioning protrusion 202, and the first positioning protrusion 202 is in plug-in fit with the first positioning groove 101. One of the heat insulating plate 2 and the heat reflecting plate 3 is provided with a second positioning groove 203, the other is provided with a second positioning protrusion 302, and the second positioning protrusion 302 is in plug-in fit with the second positioning groove 203. In the case that the heat insulating plate 2 and the heat reflecting plate 3 are both provided with through holes, the positioning protrusions are inserted into the positioning grooves so that the first through holes 201, the second through holes 301 and the threaded holes 102 are opposite.

In this example, referring to fig. 6, a first positioning groove 101 is provided on the upper side of the base plate 1, and a first positioning protrusion 202 is provided on the lower side of the heat insulating plate 2; the second positioning groove 203 is provided on the upper side of the heat insulating plate 2, and the second positioning protrusion 302 is provided on the lower side of the heat reflecting plate 3. Preferably, two first positioning protrusions 202 are arranged on the heat insulating plate 2, the two first positioning protrusions 202 are distributed at intervals, two second positioning protrusions 302 are arranged on the heat reflecting plate 3, the two second positioning protrusions 302 are distributed at intervals, the first positioning protrusions 202 are in one-to-one correspondence with the first positioning grooves 101, and the second positioning protrusions 302 are in one-to-one correspondence with the second positioning grooves 203.

Wherein, the baking chamber 100 is provided with a first opening (not shown) and a second opening (not shown) at two ends of the first direction, and the first opening and the second opening can be plugged by plugging plates. After the substrate outside is sent into the baking cavity 100 from the first opening by the manipulator and placed in the supporting pin 4, the substrate is taken out from the first opening by the manipulator after the substrate is baked in the baking cavity 100. When it is necessary to view the inside of the bake chamber 100 or to clean the bake chamber 100, the substrate support mechanism 200 is taken out of the second opening. In this embodiment, referring to fig. 2, the bottom of the baking chamber 100 is provided with a sliding rail 400 in a protruding manner, the length of the sliding rail 400 extends along the first direction, and the bottom plate 1 is slidably disposed on the sliding rail 400, so that the substrate supporting mechanism 200 is conveniently taken out from the second opening by sliding the bottom plate 1 on the sliding rail 400.

Further, at least two slide rails 400 are provided, the at least two slide rails 400 are spaced along a second direction, the second direction is perpendicular to the first direction, and the bottom plate 1 is simultaneously abutted against all the slide rails 400. Through at least two slide rails 400 simultaneously with bottom plate 1 butt, both be favorable to keeping the equilibrium of bottom plate 1, prevent that bottom plate 1 atress is uneven to take place the slope, also be favorable to dispersing the atress of bottom plate 1, prevent that bottom plate 1 from warping.

In this example, two slide rails 400 are provided.

Preferably, three slide rails 400 are provided, and the three slide rails 400 are spaced apart along the second direction.

The first direction in this specification is the length direction of the baking chamber 100; the second direction is the width direction of the toasting cavity 100, i.e. the Y direction in fig. 2.

According to the substrate baking device, the bottom plate 1 of the substrate supporting mechanism 200 is arranged on the sliding rail 400 in a sliding manner, the bottom plate 1 provides supporting and fixing functions for the supporting pins 4, the heat insulation plate 2 is arranged on the upper surface of the bottom plate 1, heat conduction to the bottom plate 1 is effectively prevented, the supporting pins 4 are prevented from collapsing due to the fact that the bottom plate 1 is deformed by heating, the upper ends of all the supporting pins 4 are kept on the same plane, and the risk of substrate breakage is effectively reduced.

Although the embodiments of the present utility model have been described above with reference to the accompanying drawings, the present utility model is not limited to the above embodiments, but may be manufactured in various forms, and it will be understood by those skilled in the art that the present utility model may be embodied in other specific forms without changing the technical spirit or essential features of the present utility model. Accordingly, it should be understood that the above-described embodiments are illustrative in all respects and not restrictive.

Claims

1. The utility model provides a base plate supporting mechanism, includes supporting seat and a plurality of supporting pin, its characterized in that, the supporting seat is including bottom plate and the heat insulating board of superpose in proper order, the bottom plate is installed in the bottom of toasting the chamber, the heat insulating board sets up the bottom plate deviates from toasting one side of chamber bottom, a plurality of supporting pin interval distribution, the lower extreme of supporting pin is installed on the bottom plate, the upper end of supporting pin pass the heat insulating board and protrusion in the upper side of heat insulating board is used for with base plate butt.

2. The substrate support mechanism of claim 1, further comprising a heat reflecting plate superposed on a side of the heat shield facing away from the base plate, the support pin passing through the heat shield and the heat reflecting plate, and an upper end of the support pin protruding from a side of the heat reflecting plate facing away from the heat shield.

3. The substrate supporting mechanism according to claim 2, wherein the heat shield plate is provided with a plurality of first through holes penetrating therethrough, the plurality of first through holes are spaced apart, the heat reflecting plate is provided with a plurality of second through holes penetrating therethrough, the plurality of second through holes are spaced apart, the first through holes are in one-to-one facing relation with the second through holes, and the upper ends of the supporting pins penetrate through the first through holes and the second through holes.

4. The substrate support mechanism of claim 3, wherein the aperture of the first through hole and the aperture of the second through hole are each larger than the outer diameter of the support pin.

5. The substrate support mechanism of claim 2, wherein the base plate is bonded to the heat shield by a bonding adhesive;

6. The substrate support mechanism of claim 2, wherein one of the base plate and the heat shield is provided with a first positioning groove, and the other is provided with a first positioning protrusion, the first positioning protrusion being in plug-fit with the first positioning groove;

7. The substrate support mechanism of claim 1, wherein the support pins are removably coupled to the base plate by a threaded structure.

8. The substrate supporting mechanism according to claim 7, wherein the upper side of the base plate is concavely provided with a screw hole, the supporting pin includes a pin body and a screw post provided at a lower end of the pin body, the screw post is screwed in the screw hole, and the pin body passes through the heat insulating plate and the heat reflecting plate.

9. The substrate support mechanism of any one of claims 1 to 8, wherein a bottom of the bake chamber is provided with a rail protruding, a length of the rail extending along a first direction, and the bottom plate is slidably disposed on the rail.

10. The substrate baking device comprises a baking cavity, wherein a sliding rail and a heating component are arranged in the baking cavity, the sliding rail is arranged on the bottom wall of the baking cavity in a protruding mode, and the heating component is arranged at the top of the baking cavity.