CN219562456U - Deburring device for semiconductor processing - Google Patents
Deburring device for semiconductor processing Download PDFInfo
- Publication number
- CN219562456U CN219562456U CN202320329757.XU CN202320329757U CN219562456U CN 219562456 U CN219562456 U CN 219562456U CN 202320329757 U CN202320329757 U CN 202320329757U CN 219562456 U CN219562456 U CN 219562456U
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- CN
- China
- Prior art keywords
- semiconductor
- mounting plates
- sliding blocks
- semiconductor processing
- connecting rod
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Landscapes
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
The utility model discloses a deburring device for semiconductor processing, which comprises two longitudinally arranged mounting plates, wherein the two mounting plates are arranged in parallel, sliding rails are respectively arranged on the opposite inner walls between the two mounting plates, two sliding blocks are respectively arranged on each sliding rail, the two sliding blocks are in one group, springs are arranged between each group of sliding blocks, connecting rods are arranged between the sliding blocks of different groups, clamping plates are arranged on the inner sides of the connecting rods, semiconductors are placed between the clamping plates, a pair of polishing rollers are also arranged between the mounting plates and are positioned on the upper side and the lower side of the semiconductors, the polishing rollers are driven by motors, eccentric wheels are arranged on any side of the mounting plates in a left-right mode, the eccentric wheels are driven by motors, and driving arms are hinged between the eccentric wheels and the connecting rods. The rotating eccentric wheel drives the driving arm to do left-right reciprocating motion, so that the semiconductor can be driven to do left-right reciprocating motion, and then the semiconductor can be polished and deburred up and down by being matched with the upper and lower polishing rollers, so that the processing efficiency is improved.
Description
Technical Field
The utility model relates to the technical field of semiconductors, in particular to a deburring device for semiconductor processing.
Background
The processed surface of the semiconductor product has more burrs, and a deburring process is generally required to be added, and comprises manual deburring and automatic deburring; however, the manual deburring process is slower in speed and cannot meet the production requirement; when the existing automatic deburring is used for deburring a semiconductor, the workpiece of the semiconductor needs to be turned over to deburr the two sides of the semiconductor, so that a rotating link is added, and the machining efficiency is low.
Disclosure of Invention
The utility model aims to overcome the defects and shortcomings of the prior art and provides a deburring device for semiconductor processing.
In order to achieve the above purpose, the utility model adopts the following technical scheme: a burring device for semiconductor processing, its innovation point lies in: including two mounting panels that vertically set up, and two mounting panel parallel arrangement, and set up the slide rail on the relative inner wall between the two respectively, and all set up two sliders on every slide rail, and these two sliders are a set of, and set up the spring between every group slider, and set up the connecting rod between the slider of different groups, the inboard of connecting rod sets up splint, place the semiconductor between splint and the splint, still set up a pair of grinding roller between the mounting panel, the grinding roller is located the upper and lower both sides of semiconductor, the grinding roller adopts motor drive, arbitrary one side sets up the eccentric wheel about the mounting panel, the eccentric wheel adopts motor drive, adopt the actuating arm to articulate between eccentric wheel and the connecting rod.
Further, elastic protruding points are arranged in the clamping grooves of the clamping plates.
Further, a rectangular integrated structure is formed between the connecting rod and the spring.
After the structure is adopted, the utility model has the beneficial effects that:
the utility model has simple structure, reasonable design and convenient use; the rotating eccentric wheel drives the driving arm to do left-right reciprocating motion, so that the semiconductor can be driven to do left-right reciprocating motion, and then the semiconductor can be polished up and down to remove burrs by being matched with the upper and lower polishing rollers, and the semiconductor does not need to be overturned, so that the processing efficiency is improved.
Drawings
FIG. 1 is a schematic top view of the present utility model;
fig. 2 is a schematic diagram of a front view structure of the present utility model.
Reference numerals illustrate:
1 mounting plate, 2 slide rails, 3 slide blocks, 4 springs, 5 connecting rods, 6 clamping plates, 7 grinding rollers, 8 eccentric wheels and 9 driving arms.
Detailed Description
The utility model is further described below with reference to the accompanying drawings.
In order to make the objects, technical solutions and advantages of the present utility model more apparent, the present utility model will be further described in detail below with reference to the accompanying drawings and detailed description. It should be understood that the detailed description is presented by way of example only and is not intended to limit the utility model.
Referring to fig. 1-2, a deburring device for semiconductor processing comprises two mounting plates 1 which are longitudinally arranged, wherein the two mounting plates 1 are arranged in parallel, sliding rails 2 are respectively arranged on opposite inner walls between the two mounting plates, two sliding blocks 3 are respectively arranged on each sliding rail 2, the two sliding blocks 3 are in a group, springs 4 are arranged between each group of sliding blocks 3, connecting rods 5 are arranged between the sliding blocks 3 in different groups, clamping plates 6 are arranged on the inner sides of the connecting rods 5, semiconductors (not shown in the drawing) are placed between the clamping plates 6 and the clamping plates, a pair of polishing rollers 7 are further arranged between the mounting plates 1, the polishing rollers 7 are positioned on the upper side and the lower side of the semiconductors, motor driving is adopted for the polishing rollers 7, eccentric wheels 8 are arranged on any side of the left side and the right side of the mounting plates 1, motor driving is adopted for the eccentric wheels 8, and 9 driving arms 9 are adopted for hinging between the eccentric wheels 8 and the connecting rods 5. Specifically, the left and right sides of semiconductor are clamped in the clamping plate 6 respectively, are fixed through the springs 4, and after the fixation is completed, the grinding roller 7 and the eccentric wheel 8 are opened respectively, and the eccentric wheel 8 rotates to drive the driving arm 9 to move left and right, so that the semiconductor is driven to reciprocate left and right, and then the semiconductor is matched with the grinding roller 7 up and down, so that the semiconductor can be ground up and down for deburring, the semiconductor does not need to be overturned, and the processing efficiency is improved.
In this embodiment, elastic protruding points are provided in the clamping grooves of the clamping plate 6. The splint 6 adopts the rubber material, integrated into one piece, and elasticity bump can improve the increase friction to improve the clamping force.
In this embodiment, a rectangular integrated structure is formed between the link 5 and the spring 4, and the semiconductor is moved in the left-right direction.
The foregoing is merely illustrative of the present utility model and not restrictive, and other modifications and equivalents thereof may occur to those skilled in the art without departing from the spirit and scope of the present utility model.
Claims (3)
1. A deburring device for semiconductor processing, characterized in that: including two mounting panels that vertically set up, and two mounting panel parallel arrangement, and set up the slide rail on the relative inner wall between the two respectively, and all set up two sliders on every slide rail, and these two sliders are a set of, and set up the spring between every group slider, and set up the connecting rod between the slider of different groups, the inboard of connecting rod sets up splint, place the semiconductor between splint and the splint, still set up a pair of grinding roller between the mounting panel, the grinding roller is located the upper and lower both sides of semiconductor, the grinding roller adopts motor drive, arbitrary one side sets up the eccentric wheel about the mounting panel, the eccentric wheel adopts motor drive, adopt the actuating arm to articulate between eccentric wheel and the connecting rod.
2. A deburring apparatus for semiconductor processing as claimed in claim 1, wherein: elastic protruding points are arranged in clamping grooves of the clamping plates.
3. A deburring apparatus for semiconductor processing as claimed in claim 1, wherein: and a rectangular integrated structure is formed between the connecting rod and the spring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320329757.XU CN219562456U (en) | 2023-02-27 | 2023-02-27 | Deburring device for semiconductor processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320329757.XU CN219562456U (en) | 2023-02-27 | 2023-02-27 | Deburring device for semiconductor processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219562456U true CN219562456U (en) | 2023-08-22 |
Family
ID=87664759
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320329757.XU Active CN219562456U (en) | 2023-02-27 | 2023-02-27 | Deburring device for semiconductor processing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219562456U (en) |
-
2023
- 2023-02-27 CN CN202320329757.XU patent/CN219562456U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |