CN219561791U - Asynchronous double-light-path laser etching device - Google Patents
Asynchronous double-light-path laser etching device Download PDFInfo
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- CN219561791U CN219561791U CN202320184255.2U CN202320184255U CN219561791U CN 219561791 U CN219561791 U CN 219561791U CN 202320184255 U CN202320184255 U CN 202320184255U CN 219561791 U CN219561791 U CN 219561791U
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Abstract
The utility model relates to the technical field of laser processing, and provides an asynchronous double-light-path laser etching device which comprises a processing platform, a supporting piece, an X-axis driving assembly, a first light-path system and a second light-path system, wherein the first light-path system is connected with the processing platform; the processing platform is used for bearing a workpiece; the supporting piece is arranged at intervals with the upper surface of the processing platform; the X-axis driving assembly, the first optical path system and the second optical path system are all arranged on the supporting piece, the X-axis driving assembly comprises a first X-axis driving piece and a second X-axis driving piece, and the first optical path system and the second optical path system are respectively and electrically connected with the first X-axis driving piece and the second X-axis driving piece; the first X-axis driving piece is used for driving the first light path system to move along the X-axis, and the second X-axis driving piece is used for driving the second light path system to move along the X-axis; the first optical path system and the second optical path system are used for etching the workpiece. The two optical path systems of the asynchronous double-optical path laser etching device are respectively and independently controlled, so that the idle time of laser processing can be reduced, and the processing efficiency is improved.
Description
Technical Field
The utility model relates to the technical field of laser processing, in particular to an asynchronous double-light-path laser etching device.
Background
In the production process of the capacitive touch module, silver paste etching and ITO film etching are mainly adopted as etching methods, and in equipment for screen printing of a capacitive screen, no matter in silver paste screen printing or ITO film etching, a yellow light process and a laser beam etching technology are generally adopted, wherein the yellow light process needs to design a circuit diagram through a computer, then a drawing is exported and a film is exported, screen printing, exposure, development and the like are carried out after the film is exported, the steps are more, the film needs to be re-provided for each model change, the change is troublesome and the period is longer, only the silver paste screen printing or ITO film etching can be independently carried out, the consumption is more, and the cost investment is too high; the laser beam etching technology can be directly led into a drawing designed by a computer, a laser and an optical path scanning device are controlled to directly carry out laser direct writing, and compared with a yellow light process, the laser beam etching technology has the advantages that the width of laser single processing is limited to 120mm x120 mm-170 mm x170mm, an ITO circuit needs to be processed first and then a silver paste circuit needs to be processed in the single width, and in order to realize large-scale laser etching processing, the circuit needs to be spliced and processed for multiple times in blocks, so that the processing efficiency is lower.
At present, the maximum width of the laser precision etching technology can reach 1600mmx2750mm, the patterns are more and more complex due to the fact that the width of the laser precision etching technology is larger and larger, the laser processing of the capacitive touch module is generally processed in a light path scanning mode, in order to ensure that the focusing light spot of processing is controlled to be 25-35 mu m, the processing range of each time can only be controlled to be 120-170 mm, and then the large-width processing is performed in a splicing mode. In summary, the laser etching apparatus employing the single optical path scanning apparatus has the following drawbacks: the processed breadth is smaller, and only one workpiece can be processed, so that the speed is slower, and the processing efficiency is low.
Accordingly, in order to solve the above-mentioned problems, the present utility model proposes a novel laser etching apparatus.
Disclosure of Invention
Based on the above description, the utility model provides an asynchronous double-light-path laser etching device, which aims to solve the problem that the laser etching device in the prior art has smaller processed breadth and can only process one workpiece, so that the processing efficiency is low.
The technical scheme for solving the technical problems is as follows:
the utility model provides an asynchronous double-light-path laser etching device, which comprises: the device comprises a processing platform, a supporting piece, an X-axis driving assembly, a first light path system and a second light path system;
the processing platform is used for bearing a workpiece to be processed;
the supporting piece is arranged at intervals with the upper surface of the processing platform;
the X-axis driving assembly, the first optical path system and the second optical path system are all arranged on the supporting piece, the X-axis driving assembly comprises a first X-axis driving piece and a second X-axis driving piece, and the first optical path system and the second optical path system are respectively and electrically connected with the first X-axis driving piece and the second X-axis driving piece;
the first X-axis driving piece is used for driving the first light path system to move along an X-axis, and the second X-axis driving piece is used for driving the second light path system to move along the X-axis; and the first optical path system and the second optical path system are both used for etching the workpiece.
On the basis of the technical scheme, the utility model can be improved as follows.
Further, the asynchronous double-light-path laser etching device further comprises a Y-axis driving assembly;
the Y-axis driving assembly is arranged on the upper surface of the processing platform, the supporting piece is arranged on the Y-axis driving assembly, and the extending direction of the supporting piece is perpendicular to the moving direction of the Y-axis driving piece; the Y-axis driving assembly is used for driving the first optical path system and the second optical path system to move along the Y-axis direction.
Further, the Y-axis driving assembly comprises a first Y-axis driving piece and a second Y-axis driving piece;
the first Y-axis driving piece and the second Y-axis driving piece are respectively arranged on two sides of the processing platform;
the two ends of the supporting piece are respectively arranged on the first Y-axis driving piece and the second Y-axis driving piece, and the first Y-axis driving piece and the second Y-axis driving piece are used for driving the supporting piece to move along the Y-axis direction so as to drive the first optical path system and the second optical path system to move along the Y-axis direction.
Further, the first optical path system and the second optical path system are the same, and each of them includes: a laser emitter, a scanning galvanometer and a focusing field lens;
the laser transmitter is used for generating a laser beam; the scanning galvanometer is connected with the laser emitter and is used for outputting scanning laser; the focusing field lens is connected with the scanning galvanometer and is used for converging the scanning laser.
Further, the first optical path system and the second optical path system further include an optical path shaping member;
the optical path shaping piece is arranged between the laser emitter and the scanning galvanometer and is used for shaping the laser beam.
Further, the first optical path system and the second optical path system further comprise a protective cover;
the protective cover is covered on the laser emitter, the light path shaping piece, the scanning galvanometer and the focusing field lens.
Further, the first optical path system and the second optical path system further comprise a visual positioning member;
the visual positioning piece is arranged on one side of the focusing field lens and is used for acquiring the position information of the workpiece.
Further, the first optical path system and the second optical path system further comprise a dust removal component;
the dust removal component is arranged at the bottom of the focusing field lens and is used for collecting and removing dust generated by laser etching.
Further, the asynchronous double-light path laser etching device further comprises a base; the processing platform is arranged on the base.
Further, the asynchronous double-light path laser etching device further comprises a controller;
the controller is arranged on the base; the controller is electrically connected with the X-axis driving assembly, the Y-axis driving assembly, the first optical path system and the second optical path system and used for controlling the operation of the X-axis driving assembly, the Y-axis driving assembly, the first optical path system and the second optical path system.
Compared with the prior art, the technical scheme of the utility model has the following beneficial technical effects:
the asynchronous double-light-path laser etching device comprises a processing platform, a supporting piece, an X-axis driving component, a first light-path system and a second light-path system, wherein the X-axis driving component comprises a first X-axis driving piece and a second X-axis driving piece, the first light-path system is electrically connected with the first X-axis driving piece, the first X-axis driving piece can drive the first light-path system to move along an X-axis, and the first light-path system is used for etching a workpiece; the second optical path system is electrically connected with the second X-axis driving piece, the second X-axis driving piece can drive the second optical path system to move along the X-axis, the second optical path system is also used for etching the workpiece, and the first X-axis driving piece and the second X-axis driving piece can independently drive the corresponding optical path systems, so that asynchronous scanning etching of the first optical path system and the second optical path system on the workpiece is realized. Compared with the prior art, the asynchronous double-light-path laser etching device provided by the utility model adopts the separated double-light-path scanning system, the two light-path systems are respectively controlled by the two X-axis driving parts, and the two X-axis driving parts are mutually noninterfered during working, so that the idle time of laser processing can be effectively reduced, and the processing efficiency of the laser etching device is greatly improved.
Drawings
FIG. 1 is a schematic diagram of the overall structure of an asynchronous dual-path laser etching apparatus according to an embodiment of the present utility model;
FIG. 2 is a schematic view of the partial structure at A in FIG. 1;
FIG. 3 is a schematic illustration of a laser etching pattern suitable for an asynchronous dual-path laser etching apparatus according to an embodiment of the present utility model;
in the drawings, the list of components represented by the various numbers is as follows:
1. a processing platform; 2. a support; 3. an X-axis driving assembly; 31. a first X-axis driving member; 32. a second X-axis driving member; 4. a Y-axis drive assembly; 41. a first Y-axis driving member; 42. a second Y-axis drive; 5. a first optical path system; 51. a laser emitter; 52. scanning a vibrating mirror; 53. a focusing field lens; 54. an optical path shaping member; 55. a protective cover; 56. a visual positioning member; 57. a dust removal assembly; 6. a second optical path system; 7. a base; 8. a controller; 9. a silver paste layer; 10. an ITO pattern layer.
Detailed Description
In order that the utility model may be readily understood, a more complete description of the utility model will be rendered by reference to the appended drawings. Embodiments of the utility model are illustrated in the accompanying drawings. This utility model may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
In describing embodiments of the present utility model, it should be noted that, unless explicitly stated and limited otherwise, the terms "coupled," "coupled," and "connected" should be construed broadly, and may be either a fixed connection, a removable connection, or an integral connection, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the above terms in embodiments of the present utility model will be understood in detail by those of ordinary skill in the art.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present specification, the description with reference to the term "particular example" or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the embodiments of the utility model. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.
Embodiments of the present utility model will be described in further detail with reference to fig. 1 to 3 and examples, which are provided to illustrate the present utility model but not to limit the scope of the present utility model.
As shown in fig. 1, an embodiment of the present utility model provides an asynchronous dual optical path laser etching apparatus, including: the device comprises a processing platform 1, a support 2, an X-axis driving assembly 3, a first optical path system 5 and a second optical path system 6.
The processing platform 1 is used for bearing a workpiece to be processed.
The support 2 is spaced from the upper surface of the processing platform 1.
The X-axis driving assembly 3, the first optical path system 5 and the second optical path system 6 are all arranged on the supporting piece 2, the X-axis driving assembly 3 comprises a first X-axis driving piece 31 and a second X-axis driving piece 32, and the first optical path system 5 and the second optical path system 6 are respectively and electrically connected with the first X-axis driving piece 31 and the second X-axis driving piece 32.
Wherein, the first X-axis driving element 31 is used for driving the first optical path system 5 to move along the X-axis, and the second X-axis driving element 32 is used for driving the second optical path system 6 to move along the X-axis; the first optical path system 5 and the second optical path system 6 are used for etching the workpiece.
Specifically, as shown in fig. 1, the asynchronous dual-optical-path laser etching apparatus provided in the embodiment of the present utility model includes a processing platform 1, a support 2, an X-axis driving assembly 3, a first optical path system 5, and a second optical path system 6, where the upper surface of the processing platform 1 is used for placing and fixing a workpiece to be processed, and the support 2 is disposed above the processing platform 1 and is used for providing support for the X-axis driving assembly 3, the first optical path system 5, and the second optical path system 6, and in a specific example, the support 2 may be a marble Dan Hengliang.
The first optical path system 5 and the second optical path system 6 are disposed toward the processing platform 1 for etching the workpiece on the processing platform 1.
The X-axis driving assembly 3 is composed of a first X-axis driving piece 31 and a second X-axis driving piece 32, the first optical path system 5 is electrically connected with the first X-axis driving piece 31, the first X-axis driving piece 31 can drive the first optical path system 5 to move along the X-axis, and the first optical path system 5 is used for etching a workpiece.
The second optical path system 6 is electrically connected to the second X-axis driving element 32, and the second X-axis driving element 32 can drive the second optical path system 6 to move along the X-axis, and the second optical path system 6 is also used for etching the workpiece.
The first X-axis driving member 31 and the second X-axis driving member 32 can independently drive the corresponding optical path systems, so that asynchronous scanning etching of the first optical path system 5 and the second optical path system 6 on the workpiece is realized.
Compared with the prior art, the asynchronous double-light-path laser etching device provided by the embodiment of the utility model adopts the separated double-light-path scanning system, the two light-path systems are respectively controlled by the two X-axis driving parts, and the two X-axis driving parts are mutually noninterfere during working, so that the idle time of laser processing can be effectively reduced, and the processing efficiency of the laser etching device is greatly improved.
In an alternative embodiment, in order to facilitate the installation of the processing platform 1 and ensure the stability of the processing platform 1 in the etching process, as shown in fig. 1, the asynchronous dual-optical path laser etching device further comprises a base 7; the processing platform 1 is arranged on the base 7.
In a specific example, the base 7 may be composed of a marble slab disposed on the frame, a frame surrounding the frame and the marble slab, and a shell disposed at the upper surface of the marble slab, and the processing slab 1.
In an alternative embodiment, in order to enable the first optical path system 5 and the second optical path system 6 to move in the Y-axis direction, the asynchronous dual optical path laser etching apparatus further includes a Y-axis driving assembly 4 as shown in fig. 1.
The upper surface of processing platform 1 is located to Y axle drive assembly 4, and support piece 2 is located on the Y axle drive assembly 4, and the extending direction of support piece 2 sets up with Y axle drive piece's direction of movement is perpendicular, and Y axle drive assembly 4 sets up along the length direction of processing platform 1 promptly, and support piece 2 sets up on the Y axle drive assembly 4 along the width direction of processing platform 1.
The Y-axis driving assembly 4 is configured to drive the support member 2 connected thereto to move along the Y-axis direction, and further drive the first optical path system 5 and the second optical path system 6 disposed on the support member 2 to move along the Y-axis direction.
Further, as shown in fig. 1, the Y-axis driving assembly 4 includes a first Y-axis driving member 41 and a second Y-axis driving member 42.
The first Y-axis driving member 41 and the second Y-axis driving member 42 are disposed on both sides of the processing platform 1.
The two ends of the supporting piece 2 are respectively arranged on the first Y-axis driving piece 41 and the second Y-axis driving piece 42, and the first Y-axis driving piece 41 and the second Y-axis driving piece 42 are used for driving the supporting piece 2 to move along the Y-axis direction so as to drive the first optical path system 5 and the second optical path system 6 to move along the Y-axis direction.
In an alternative embodiment, the first optical path system 5 and the second optical path system 6 are identical, as shown in fig. 2, each comprising: a laser emitter 51, a scanning galvanometer 52 and a focusing field lens 53.
The laser emitter 51 is for generating a laser beam; the scanning galvanometer 52 is connected with the laser transmitter 51, and the scanning galvanometer 52 is used for outputting scanning laser; the focusing field lens 53 is connected to the scanning galvanometer 52, and the focusing field lens 53 is used for converging scanning laser light.
Further, the first optical path system 5 and the second optical path system 6 further include an optical path shaper 54.
As shown in fig. 2, an optical path shaping member 54 is provided between the laser emitter 51 and the scanning galvanometer 52, and the optical path shaping member 54 is configured to shape the laser beam, that is, to adjust the size of the laser beam generated by the laser emitter 51, so as to obtain laser light satisfying the condition.
In an alternative embodiment, to protect the components in the optical system, as shown in fig. 2, the first optical system 5 and the second optical system 6 further include a protection cover 55, where the protection cover 55 covers the laser transmitter 51, the optical path shaping member 54, the scanning galvanometer 52, and the focusing field lens 53.
It should be noted that: for convenience of illustration, the shield 55 of the first optical path system is omitted in the drawing, but it is understood that since the two optical path systems are identical, the two shields 55 are also identical.
In an alternative embodiment, in order to more accurately etch the workpiece, and ensure etching accuracy, as shown in fig. 2, the first optical path system 5 and the second optical path system 6 further include a visual positioning member 56; the visual positioning piece 56 is arranged on one side of the focusing field lens 53, and the visual positioning piece 56 is used for acquiring the position information of the workpiece.
In an alternative embodiment, to further improve the etching quality and etching efficiency, as shown in fig. 2, the first optical path system 5 and the second optical path system 6 further include a dust removing assembly 57.
The dust removing component 57 is arranged at the bottom of the focusing field lens 53, and the dust removing component 57 is used for collecting and removing dust generated by laser etching.
In an alternative embodiment, the asynchronous dual path laser etching apparatus further comprises a controller 8.
The controller 8 is arranged on the base 7; the controller 8 is electrically connected with the X-axis driving assembly 3, the Y-axis driving assembly 4, the first optical path system 5 and the second optical path system 6, and is used for controlling the operation of the X-axis driving assembly 3, the Y-axis driving assembly 4, the first optical path system 5 and the second optical path system 6.
Specifically, when the asynchronous dual-optical-path laser etching device works, the controller 8 can automatically calculate data blocks and optimal processing paths according to data of the imported image file, and automatically control processing data matched with the first optical path system 5 and the second optical path system 6 according to a calculation result, in the processing process, the controller 8 can control the first optical path system 5 and the second optical path system 6 to move in two dimension directions of an X axis and a Y axis, wherein the distance between the first optical path system 5 and the second optical path system 6 in the X axis can be freely adjusted, so that the setting can reduce idle time for processing the two optical path systems to the greatest extent, and further the etching efficiency of the asynchronous dual-optical-path laser etching device is improved.
In order to further explain the technical effects of the asynchronous dual-optical path laser etching device provided by the embodiment of the utility model, a specific example is used for explaining:
as shown in fig. 3, taking an 86 inch laser etched pattern file as an example, the pattern file is divided into 8 columns and 13 rows, and the pattern layer is divided into a silver paste pattern layer 9 and an ITO pattern layer 10, so that the silver paste pattern layer 9 is generally processed for a long time.
Taking the first row as an example in fig. 3, the measurement time t1=21 seconds, t2=21.5 seconds, t3=21.5 seconds, t4=30 seconds, t5=31 seconds, t6=40 seconds, t7=43 seconds, and t8=68 seconds.
The time measurement for each data block is shown in table 1:
TABLE 1 etching time for each segment of the workpiece
Taking synchronous dual-oscillating mirrors as an example in the prior art, the actions of each row are to process by taking 1+2, 3+4, 5+6 and 7+8 as a combination, and then the time taken for the first row processing is t2+t4+t6+t8=21.5+30+40+68=159.5 seconds.
The etching time of each row of Shan Zhenjing, synchronous double-vibrating mirror and X-axis asynchronous double-vibrating mirror on the workpiece is calculated, and the calculation results are shown in table 2:
table 2 etching times for three optical path systems
| Shan Zhenjing | Synchronous double vibrating mirror | Asynchronous double vibrating mirror | |
| 1 | 282.5 | 159.5 | 151 |
| 2 | 118.8 | 81.3 | 62.3 |
| 3 | 118.8 | 81.3 | 62.3 |
| 4 | 118.8 | 81.3 | 62.3 |
| 5 | 118.8 | 81.3 | 62.3 |
| 6 | 138.6 | 101.1 | 72 |
| 7 | 103.2 | 65.7 | 46.5 |
| 8 | 138.6 | 101.1 | 72 |
| 9 | 118.8 | 81.3 | 62.3 |
| 10 | 118.8 | 81.3 | 62.3 |
| 11 | 118.8 | 81.3 | 62.3 |
| 12 | 118.8 | 81.3 | 62.3 |
| 13 | 282.5 | 159.5 | 151 |
As can be seen from the comparison, the etching efficiency of the asynchronous dual-optical-path laser etching device provided by the embodiment of the utility model is better than that of the Shan Zhenjing etching device and the synchronous dual-galvanometer etching device, wherein the etching efficiency of the asynchronous dual-optical-path laser etching device is improved by about 25% compared with that of the synchronous dual-galvanometer etching device, so that it can be illustrated that the asynchronous dual-optical-path laser etching device provided by the embodiment of the utility model has higher processing efficiency compared with the prior art.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present utility model, and are not limiting; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present utility model.
Claims (10)
1. An asynchronous dual path laser etching apparatus, comprising: the device comprises a processing platform, a supporting piece, an X-axis driving assembly, a first light path system and a second light path system;
the processing platform is used for bearing a workpiece to be processed;
the supporting piece is arranged at intervals with the upper surface of the processing platform;
the X-axis driving assembly, the first optical path system and the second optical path system are all arranged on the supporting piece, the X-axis driving assembly comprises a first X-axis driving piece and a second X-axis driving piece, and the first optical path system and the second optical path system are respectively and electrically connected with the first X-axis driving piece and the second X-axis driving piece;
the first X-axis driving piece is used for driving the first light path system to move along an X-axis, and the second X-axis driving piece is used for driving the second light path system to move along the X-axis; and the first optical path system and the second optical path system are both used for etching the workpiece.
2. The asynchronous dual path laser etching apparatus of claim 1 further comprising a Y-axis drive assembly;
the Y-axis driving assembly is arranged on the upper surface of the processing platform, the supporting piece is arranged on the Y-axis driving assembly, and the extending direction of the supporting piece is perpendicular to the moving direction of the Y-axis driving assembly; the Y-axis driving assembly is used for driving the first optical path system and the second optical path system to move along the Y-axis direction.
3. The asynchronous dual path laser etching apparatus of claim 2 wherein the Y-axis drive assembly comprises a first Y-axis drive and a second Y-axis drive;
the first Y-axis driving piece and the second Y-axis driving piece are respectively arranged on two sides of the processing platform;
the two ends of the supporting piece are respectively arranged on the first Y-axis driving piece and the second Y-axis driving piece, and the first Y-axis driving piece and the second Y-axis driving piece are used for driving the supporting piece to move along the Y-axis direction so as to drive the first optical path system and the second optical path system to move along the Y-axis direction.
4. The asynchronous dual path laser etching apparatus of claim 1 wherein the first and second optical path systems are identical, each comprising: a laser emitter, a scanning galvanometer and a focusing field lens;
the laser transmitter is used for generating a laser beam; the scanning galvanometer is connected with the laser emitter and is used for outputting scanning laser; the focusing field lens is connected with the scanning galvanometer and is used for converging the scanning laser.
5. The asynchronous dual path laser etching apparatus of claim 4 wherein the first and second optical path systems further comprise optical path shaping elements;
the optical path shaping piece is arranged between the laser emitter and the scanning galvanometer and is used for shaping the laser beam.
6. The asynchronous dual path laser etching apparatus of claim 5 wherein the first and second optical path systems further comprise a shield;
the protective cover is covered on the laser emitter, the light path shaping piece, the scanning galvanometer and the focusing field lens.
7. The asynchronous dual path laser etching apparatus of claim 4 wherein the first and second optical path systems further comprise a visual positioning element;
the visual positioning piece is arranged on one side of the focusing field lens and is used for acquiring the position information of the workpiece.
8. The asynchronous dual path laser etching apparatus of claim 4 wherein the first and second optical path systems further comprise a dust removal assembly;
the dust removal component is arranged at the bottom of the focusing field lens and is used for collecting and removing dust generated by laser etching.
9. The asynchronous dual path laser etching apparatus of claim 2, further comprising a pedestal; the processing platform is arranged on the base.
10. The asynchronous dual path laser etching apparatus of claim 9, further comprising a controller;
the controller is arranged on the base; the controller is electrically connected with the X-axis driving assembly, the Y-axis driving assembly, the first optical path system and the second optical path system and used for controlling the operation of the X-axis driving assembly, the Y-axis driving assembly, the first optical path system and the second optical path system.
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