CN219554113U

CN219554113U - Conductor bundle and substrate connected with the same

Info

Publication number: CN219554113U
Application number: CN202320674777.0U
Authority: CN
Inventors: 陆杰
Original assignee: Panasonic New Energy Wuxi Co ltd
Current assignee: Panasonic New Energy Wuxi Co ltd
Priority date: 2023-03-31
Filing date: 2023-03-31
Publication date: 2023-08-18
Anticipated expiration: 2033-03-31

Abstract

Provided are a wire harness and a substrate to which the wire harness is connected. The wire harness (100) is used for connecting to a substrate (200) and is provided with a plurality of wires which are mutually parallel, the plurality of wires comprise at least one 1 st wire (110) and at least one 2 nd wire (120) which is different in function from the at least one 1 st wire (110) and different in length, and the at least one 1 st wire (110) and the at least one 2 nd wire (120) are connected to the substrate (200) in a manner that respective connection points (210, 220) are mutually staggered in a wire connecting direction.

Description

Conductor bundle and substrate connected with the same

Technical Field

The present utility model relates to a wire harness and a substrate to which the wire harness is connected.

Background

With the development of electronic technology, there is a wide demand for connecting a wire harness including positive and negative electrode wires to a circuit substrate at the time of assembly of electronic products or the like. In particular, as highly integrated Printed Circuit Board (PCB) pads are widely used, it is often necessary to bond a wire bundle including a large number of wires to a plurality of pads on the pads.

In the prior art, it is common to use a plurality of pads arranged in a line on a pad, and to weld wire bundles having the same length to the plurality of pads. However, because the lengths of the wire bundles and the positions of the bonding pads are consistent, the bonding wires are easy to be displaced during bonding, and the communication is abnormal or power cannot be supplied.

In this regard, in the prior art, the color of the plurality of wires having different functions is often used to distinguish between them, so as to prevent the misplacement of the wires. However, in the case where the number of wires of the wire harness and the number of pads on the bonding pad are numerous, erroneous soldering is not effectively avoided.

Disclosure of Invention

In view of the above, the inventors of the present utility model have made intensive studies and as a result have found a novel wire harness and a substrate to which the wire harness is connected, in which a plurality of wires are connected to the substrate so as to have different lengths from each other and so as to be staggered with each other, so that the corresponding wires cannot be soldered to other positions and can be soldered only to corresponding positions at the time of wire soldering, thereby preventing the problem of wire soldering errors.

The technical scheme of the utility model is as follows.

The utility model provides a wire bundle for connecting to a substrate, which is characterized in that the wire bundle is provided with a plurality of wires which are mutually parallel, the plurality of wires comprise at least one 1 st wire and at least one 2 nd wire which has different roles and different lengths from the at least one 1 st wire, and the at least one 1 st wire and the at least one 2 nd wire are connected to the substrate in a manner that respective connection points are mutually staggered by a distance in a wire connection direction.

Preferably, in the wire bundle, colors of the at least one 1 st wire and the at least one 2 nd wire are different from each other.

Preferably, in the wire bundle, the at least one 1 st wire and the at least one 2 nd wire are a positive electrode wire and a negative electrode wire, respectively.

Preferably, in the wire bundle, the plurality of wires further includes at least one 3 rd wire having a different length and a different action from the at least one 1 st wire and the at least one 2 nd wire, the at least one 3 rd wire being connected to the substrate in such a manner that a connection point thereof is offset from the at least one 1 st wire and the at least one 2 nd wire by a distance in a wire connection direction.

Preferably, in the wire bundle, the at least one 3 rd wire is a signal wire.

Preferably, in the wire harness, the plurality of wires are connected to the substrate as a printed circuit board by soldering.

The present utility model also provides a substrate to which a wire harness is connected, wherein the wire harness has a plurality of wires juxtaposed with each other, the plurality of wires including at least one 1 st wire and at least one 2 nd wire having a different function from the at least one 1 st wire and a different length, the substrate having a plurality of connection points to be connected by the plurality of wires, the connection points to be connected to the at least one 1 st wire and the connection points to be connected to the at least one 2 nd wire being offset from each other by a pitch in a wire connection direction.

Thus, according to the wire bundle and the substrate connected with the wire bundle, the lengths of different wires are different and the wires are staggered, so that the problem of wire connection errors is effectively prevented.

Drawings

Fig. 1 is a plan view schematically showing a wire harness 100 according to an embodiment of the present utility model.

Fig. 2 is a plan view schematically showing a substrate 200 according to an embodiment of the present utility model.

Fig. 3 is a plan view schematically showing one embodiment of the present utility model after the harness 100 is connected to the substrate 200.

Fig. 4 is a plan view schematically showing a wire harness 100A according to another embodiment of the present utility model.

Fig. 5 is a plan view schematically showing another embodiment of the present utility model after the wiring harness 100A is connected to the substrate 200A.

Detailed Description

Hereinafter, embodiments of the present utility model will be described with reference to the drawings. However, in the embodiments described below, various limitations technically preferable for the implementation of the present utility model are added. Accordingly, the scope of the technology of the present disclosure is not limited to the following embodiments and examples. The size, shape, and proportional relation in the example of the drawing are merely illustrative, and are not specific. In the drawings, the same components as those in the embodiments are denoted by the same reference numerals, and overlapping description thereof is omitted.

Fig. 1 is a plan view schematically showing a wire harness 100 according to an embodiment of the present utility model. As shown in fig. 1, the wire harness 100 has a plurality of wires (5 wires in the drawing) arranged in parallel to each other, each of the plurality of wires being a conductive metal wire for electrically connecting two kinds of devices, and has a bare metal wire and an insulating outer layer provided outside the bare metal wire. Wherein at the leading end of the wire, there is a columnar or sheet-like tab protruding from the insulating outer layer to the outside.

Wherein the plurality of wires of the wire bundle 100 have different functions. For example, there is at least one 1 st wire 110 (3 in the drawing) as a positive wire for electrically connecting with a positive electrode of a power supply, and at least one 2 nd wire 120 (2 in the drawing) as a negative wire for electrically connecting with a negative electrode of the power supply. The number of 1 st conductors 110 and 2 nd conductors 120 in the illustration is only an example, and may be changed according to the requirements of the electric equipment. In addition, although an example in which a plurality of wires are arranged in a line in the same plane is illustrated in the drawings, in actual cases, a plurality of wires may be clustered so as not to be located in the same plane.

Wherein, at least one 1 st wire 110 has a 1 st length, and at least one 2 nd wire 120 has a 2 nd length different from the 1 st length, respectively. Therefore, the positive electrode lead and the negative electrode lead with different functions can be conveniently distinguished. In the present embodiment, the 1 st length is smaller than the 2 nd length, but may be the opposite. In addition, at least one 1 st wire 110 has, for example, a red insulating outer layer, and at least one 2 nd wire 120 has, for example, a black insulating outer layer, which are different from each other in color, except for the length.

In electrically connecting the wire harness 100 to the substrate, a plurality of wires in the wire harness 100 are soldered to corresponding pads on the substrate, for example, by an operator, depending on the type of wire. In the present embodiment, the joint of the wire harness 100 and the solder joint on the substrate 200 are welded to each other, but the connection method is not limited to welding, and may be, for example, terminal connection. In the case of terminal connection, the joint of the harness 100 is connected to the substrate 200 by, for example, a metal post or an elastic mechanism.

Fig. 2 is a plan view schematically showing a substrate 200 according to an embodiment of the present utility model. The substrate 200 is, for example, a Printed Circuit Board (PCB) having a plurality of pads thereon, the plurality of pads including pads for electrically connecting with the plurality of wires in the wire bundle 100, respectively.

In the prior art, welding spots on a printed circuit board for connecting with a positive electrode lead and a negative electrode lead are arranged in a straight line, and an operator identifies the corresponding relationship between the welding spots and the positive electrode and the negative electrode by identifying markers such as color marks on the welding spots. In contrast, the substrate 200 of the present embodiment is configured such that at least one 1 st connection point 210 for soldering with at least one 1 st wire 110 and at least one 2 nd connection point 220 for soldering with at least one 2 nd wire 120 are offset from each other by a distance in the wire connection direction according to the difference in length between at least one 1 st wire 110 and at least one 2 nd wire 120. In the illustration, since the 1 st wire 110 is shorter than the 2 nd wire 120, the 1 st connection point 210 is closer to the end of the substrate 200 in the wire connection direction than the 2 nd connection point 220.

Fig. 3 is a plan view schematically showing one embodiment of the present utility model after the harness 100 is connected to the substrate 200. As shown in fig. 3, since the lengths of the 1 st wire 110 and the 2 nd wire 120 correspond to the positions of the 1 st connection point 210 and the 2 nd connection point 220, wires with different actions are not easily welded to other positions and are easily welded to corresponding positions during wire welding, so that the problem of wire welding errors is effectively prevented, and the working efficiency of operators is greatly improved.

In the above embodiment, the explanation has been made taking the example in which the at least one 1 st wire 110 and the at least one 2 nd wire 120 correspond to the positive electrode wire and the negative electrode wire, respectively, but the roles of the wires having different lengths in the wire bundle are not limited thereto, and the at least one 1 st wire 110 and the at least one 2 nd wire 120 may be wires that perform other roles instead of the positive electrode wire and the negative electrode wire. The positive electrode lead and the negative electrode lead may be provided with leads that serve other functions.

In this regard, fig. 4 is a plan view schematically showing a wire harness 100A according to another embodiment of the present utility model. In fig. 4, the wire bundle 100A has at least one 3 rd wire 130 as a signal wire in addition to at least one 1 st wire 110 as a positive electrode wire and at least one 2 nd wire 120 as a negative electrode wire. The function of the at least one 3 rd conductive line 130 is not limited to the signal line, and may be a thermosensitive line for circuit protection or the like. As shown in fig. 4, the 1 st wire 110, the 2 nd wire 120, and the 3 rd wire 130 are different in length. In addition, the 3 rd conductive line 130 is different from the 1 st conductive line 110 and the 2 nd conductive line 120, for example, and has a white insulating outer layer.

Fig. 5 is a plan view schematically showing another embodiment of the present utility model after the wiring harness 100A is connected to the substrate 200A. As shown in fig. 5, the substrate 200 is to be staggered from each other in a wire connection direction by at least one 1 st connection point 210 for soldering with at least one 1 st wire 110, at least one 2 nd connection point 220 for soldering with at least one 2 nd wire 120, and at least one 3 rd connection point 230 for soldering with at least one 3 rd wire 130, corresponding to the difference in length of at least one 1 st wire 110, at least one 2 nd wire 120, and at least one 3 rd wire 130. Therefore, more than three wires with different functions can not be welded to other positions and can only be welded to corresponding positions during wire welding, so that the problem of wire welding errors is effectively prevented, and the working efficiency of operators is greatly improved.

In addition, the plurality of wires in the wire bundle may have 4 or more functions, so that the 4 or more wires have 4 or more different lengths, respectively.

The present utility model can be variously omitted, substituted or modified within a range not departing from the gist of the present utility model. These embodiments and modifications are included in the scope and gist of the utility model, and are included in the utility model described in the claims and their equivalents.

Claims

1. A wire harness for connection to a substrate, characterized in that,

the wire bundle has a plurality of wires juxtaposed with each other, the plurality of wires including at least one 1 st wire and at least one 2 nd wire having a different function and a different length from the at least one 1 st wire,

the at least one 1 st wire and the at least one 2 nd wire are connected to the substrate in such a manner that respective connection points are staggered from each other by a pitch in a wire connection direction.

2. A wire harness as claimed in claim 1, wherein,

the at least one 1 st wire and the at least one 2 nd wire are different from each other in color.

3. A wire harness as claimed in claim 2, wherein,

the at least one 1 st wire and the at least one 2 nd wire are a positive electrode wire and a negative electrode wire, respectively.

4. A wire harness as claimed in claim 3, wherein,

the plurality of wires further includes at least one 3 rd wire having a different length and different function from the at least one 1 st wire and the at least one 2 nd wire,

the at least one 3 rd wire is connected to the substrate in such a manner that its connection point is offset from the at least one 1 st wire and the at least one 2 nd wire by a distance in the wire connection direction.

5. A wire harness as claimed in claim 4, wherein,

the at least one 3 rd conductive line is a signal line.

6. The wire harness according to any one of claims 1 to 5, wherein,

the plurality of wires are connected to the substrate as a printed circuit board by soldering.

7. A substrate to which a wire harness is connected, characterized in that,

the substrate has a plurality of connection points connected by the plurality of wires, and the connection point connected to the at least one 1 st wire and the connection point connected to the at least one 2 nd wire are offset from each other by a pitch in a wire connection direction.