CN219543449U - Integrated circuit processing surface stamping device - Google Patents
Integrated circuit processing surface stamping device Download PDFInfo
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- CN219543449U CN219543449U CN202320522564.6U CN202320522564U CN219543449U CN 219543449 U CN219543449 U CN 219543449U CN 202320522564 U CN202320522564 U CN 202320522564U CN 219543449 U CN219543449 U CN 219543449U
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- integrated circuit
- stamping device
- circuit processing
- processing surface
- stamping
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Abstract
The utility model provides an integrated circuit processing surface stamping device, which comprises: the surface mounting of workstation has the promotion frame, and coupling assembling sets up in the surface that promotes the frame, and the rotating assembly sets up in coupling assembling's below, and the rotating assembly includes the connection pad, and a plurality of recesses have been seted up on the surface of connection pad, and the inside of recess is provided with the telescopic link, is provided with the rotating member between telescopic link and the recess, and the one end of telescopic link is connected with circular block, and circular block's bottom is connected with stamping die main part, and integrated circuit board main part sets up in the surface of workstation. According to the integrated circuit processing surface stamping device, the connecting component is arranged on the surface of the pushing frame and matched with the rotating component, so that when different stamping die main bodies are replaced, the rotating adjustment can be performed through the movable rod and the connecting disc, the existing fixing mode of the bolt can be replaced, single person operation can be realized, and convenience in replacement is improved.
Description
Technical Field
The utility model relates to the field of integrated circuit board processing, in particular to an integrated circuit processing surface stamping device.
Background
An integrated circuit board is a carrier on which integrated circuits are mounted. However, the integrated circuit board is often taken on, and the integrated circuit board is mainly composed of silica gel, so that the integrated circuit board is generally green.
The present integrated circuit board can carry out stamping operation in processing procedure, need use stamping device when present integrated circuit board carries out stamping operation, the patent application that the publication number that proposes in the prior art is CN218428792U, it is through the workstation, the hourglass silo, the spout bearing plate, the mounting panel, first threaded rod, the grip block, the gag lever post, a support, the cylinder, the connecting plate, stamping die and the cooperation of material receiving case use, can be high-efficient quick change different stamping module according to the production needs, and can collect the crushed aggregates under the punching press, need not shut down and collect, labour saving and time saving, very big improvement stamping efficiency, but present stamping die need be changed through pulling a plurality of bolt that have the spring when changing, and use a plurality of bolt that have the spring to need many people to carry out cooperation operation, can lead to the change operation inconvenience of mould.
Accordingly, there is a need for an integrated circuit processing surface stamping apparatus that solves the above-mentioned problems.
Disclosure of Invention
The utility model provides an integrated circuit processing surface stamping device, which solves the problems that when the existing stamping die is replaced, a plurality of bolts with springs are required to be pulled for replacing the stamping die, and a plurality of bolts with springs are required to be matched for operation, so that the replacement operation of the die is inconvenient.
In order to solve the above technical problems, the present utility model provides an integrated circuit processing surface stamping device, comprising:
the surface of the workbench is provided with a pushing frame;
the connecting component is arranged on the surface of the pushing frame;
the rotary component is arranged below the connecting component and comprises a connecting disc, a plurality of grooves are formed in the surface of the connecting disc, telescopic rods are arranged in the grooves, rotary pieces are arranged between the telescopic rods and the grooves, one end of each telescopic rod is connected with a circular block, and the bottoms of the circular blocks are connected with a stamping die main body;
the integrated circuit board main body is arranged on the surface of the workbench.
Preferably, the connecting assembly comprises a fixed ring, one side of the fixed ring is connected with a connecting rod, and one end of the connecting rod is connected with a connecting ring.
Preferably, a movable rod is arranged in the connecting ring, and the bottom end of the movable rod is rotationally connected with the central position of the surface of the connecting disc.
Preferably, a limit bolt is arranged on one side of the surface of the telescopic rod.
Preferably, a communicating block is arranged on one side of the connecting disc, and a fixing piece is arranged on one side of the bottom of the pushing frame.
Preferably, a disassembling component is arranged between the telescopic rod and the connecting disc, the disassembling component comprises a disassembling sleeve, a disassembling block is arranged in the disassembling sleeve, and a threaded bolt is arranged on the surface of the disassembling sleeve.
Compared with the related art, the integrated circuit processing surface stamping device provided by the utility model has the following beneficial effects:
the utility model provides an integrated circuit processing surface stamping device, wherein a connecting component is arranged on the surface of a pushing frame and matched with a rotating component to be used conveniently when different stamping die main bodies are replaced, the rotating adjustment can be carried out through a movable rod and a connecting disc, the existing fixing mode of a bolt can be replaced, single person operation can be realized, and convenience in replacement is improved.
Drawings
FIG. 1 is a schematic diagram of a first embodiment of an integrated circuit processing surface stamping apparatus according to the present utility model;
FIG. 2 is an enlarged schematic view of portion A shown in FIG. 1;
FIG. 3 is a schematic diagram of a second embodiment of an integrated circuit processing surface stamping apparatus according to the present utility model;
fig. 4 is an enlarged schematic view of a portion B shown in fig. 3.
Reference numerals in the drawings: 1. a workbench, a 2, a pushing frame,
3. a connecting component 31, a fixed ring 32, a connecting rod 33, a connecting ring 34 and a movable rod,
4. the rotating component, 41, the connecting disc, 42, the groove, 43, the telescopic rod, 44, the rotating piece, 45, the round block, 46, the stamping die main body, 47, the communicating block, 48 and the limit bolt,
5. a fixing part 6, an integrated circuit board main body,
7. disassembly component 71, disassembly sleeve 72, disassembly block 73 and screw bolt.
Detailed Description
The utility model will be further described with reference to the drawings and embodiments.
First embodiment
Referring to fig. 1 and fig. 2 in combination, fig. 1 is a schematic structural diagram of a first embodiment of an integrated circuit processing surface stamping device according to the present utility model; fig. 2 is an enlarged schematic view of a portion a shown in fig. 1. An integrated circuit tooling surface stamping apparatus comprising:
a workbench 1, wherein a pushing frame 2 is arranged on the surface of the workbench 1;
a connection assembly 3, wherein the connection assembly 3 is arranged on the surface of the pushing frame 2;
the rotating assembly 4 is arranged below the connecting assembly 3, the rotating assembly 4 comprises a connecting disc 41, a plurality of grooves 42 are formed in the surface of the connecting disc 41, telescopic rods 43 are arranged in the grooves 42, rotating pieces 44 are arranged between the telescopic rods 43 and the grooves 42, one end of each telescopic rod 43 is connected with a circular block 45, and the bottom of each circular block 45 is connected with a stamping die main body 46;
the use of the rotating member 44 is convenient for carrying out angle adjustment to the telescopic rod 43, and when the stamping die main body 46 is not used, the telescopic rod 43 can be rotated to be in a vertical state with the connecting disc 41, so that the influence can be reduced when the stamping die main body 46 is not used, the use of the telescopic rod 43 is convenient for carrying out left and right position adjustment to the stamping die main body 46, and the circular block 45 with the stamping die main body 46 is convenient for being in contact connection with the pushing frame 2 for fixation.
An integrated circuit board main body 6, wherein the integrated circuit board main body 6 is arranged on the surface of the workbench 1.
The connecting assembly 3 comprises a fixed ring 31, one side of the fixed ring 31 is connected with a connecting rod 32, and one end of the connecting rod 32 is connected with a connecting ring 33.
When the pushing frame 2 drives the stamping die main body 46 to move downwards, the movable rod 34 is driven to move downwards in the connecting ring 33.
The fixed ring 31 is sleeved on the surface of the pushing frame 2, a stop block is connected to the top end of the connecting rod 32, the connecting rod 32 can be prevented from falling off in the connecting ring 33 by using the stop block, and the connecting ring 33 and the movable rod 34 can move up and down along with the stamping die main body 46 and the pushing frame 2.
The inside of the connection ring 33 is provided with a movable rod 34, and the bottom end of the movable rod 34 is rotatably connected with the center position of the surface of the connection disc 41.
A limit bolt 48 is arranged on one side of the surface of the telescopic rod 43.
The working principle of the integrated circuit processing surface stamping device provided by the utility model is as follows:
when the stamping die main body 46 is needed to be replaced, the round block 45 with the stamping die main body 46 is driven to rotate through the rotating piece 44 and the telescopic rod 43 in the groove 42 until the telescopic rod 43 rotates to be flush with the connecting disc 41, the telescopic rod 43 and the connecting disc 41 are connected through the limiting bolt 48, after the telescopic rod 43 is fixed, the round block 45 with the stamping die main body 46 is pulled to move, and when the round block 45 moves, the communication block 47 is driven to move to a specified position, and then the connection between the fixing piece 5 and the communication block 47 is used.
Compared with the related art, the integrated circuit processing surface stamping device provided by the utility model has the following beneficial effects:
the utility model provides an integrated circuit processing surface stamping device, wherein a connecting component 3 is arranged on the surface of a pushing frame 2 and matched with a rotating component 4 to be used, so that when different stamping die main bodies 46 are replaced, the rotating adjustment can be carried out through a movable rod 34 and a connecting disc 41, the existing bolt fixing mode can be replaced, single person operation can be realized, and convenience in replacement can be improved.
Second embodiment
Referring to fig. 3 and 4 in combination, an integrated circuit processing surface stamping device according to a first embodiment of the present utility model is provided. The second embodiment is merely a preferred manner of the first embodiment, and implementation of the second embodiment does not affect the implementation of the first embodiment alone.
Specifically, the second embodiment of the present utility model provides an integrated circuit processing surface stamping device, which is different in that a disassembling assembly 7 is disposed between the telescopic rod 43 and the connecting disc 41, the disassembling assembly 7 includes a disassembling sleeve 71, a disassembling block 72 is disposed inside the disassembling sleeve 71, and a threaded bolt 73 is disposed on the surface of the disassembling sleeve 71.
The disassembly block 72 is connected to one side of the circular block 45, and the surface of the disassembly block 72 and the inner wall of the disassembly sleeve 71 are provided with matched threads.
The working principle of the integrated circuit processing surface stamping device provided by the utility model is as follows:
when the stamping die main body 46 is disassembled and replaced, the threaded bolt 73 on the surface of the disassembling sleeve 71 is taken out, and after the threaded bolt 73 is taken out, the disassembling block 72 is driven to be separated from the disassembling sleeve 71 by rotating the circular block 45.
Compared with the related art, the integrated circuit processing surface stamping device provided by the utility model has the following beneficial effects:
the utility model provides an integrated circuit processing surface stamping device, wherein a dismounting assembly 7 is arranged between a telescopic rod 43 and a connecting disc 41, so that a stamping die main body 46 can be conveniently dismounted and replaced.
The foregoing description is only illustrative of the present utility model and is not intended to limit the scope of the utility model, and all equivalent structures or equivalent processes or direct or indirect application in other related technical fields are included in the scope of the present utility model.
Claims (6)
1. An integrated circuit processing surface stamping device, comprising:
the surface of the workbench is provided with a pushing frame;
the connecting component is arranged on the surface of the pushing frame;
the rotary component is arranged below the connecting component and comprises a connecting disc, a plurality of grooves are formed in the surface of the connecting disc, telescopic rods are arranged in the grooves, rotary pieces are arranged between the telescopic rods and the grooves, one end of each telescopic rod is connected with a circular block, and the bottoms of the circular blocks are connected with a stamping die main body;
the integrated circuit board main body is arranged on the surface of the workbench.
2. The integrated circuit machining surface stamping device of claim 1, wherein the connecting assembly comprises a fixed ring, one side of the fixed ring is connected with a connecting rod, and one end of the connecting rod is connected with a connecting ring.
3. The integrated circuit processing surface punching device according to claim 2, characterized in that a movable lever is provided inside the connection ring, and a bottom end of the movable lever is rotatably connected with a center position of the land surface.
4. The integrated circuit machining surface stamping device of claim 1, wherein one side of the telescopic rod surface is provided with a limit stop.
5. The integrated circuit processing surface punching device as set forth in claim 1, wherein one side of the land is provided with a communicating block, and one side of the pushing frame bottom is provided with a fixing member.
6. The integrated circuit machining surface stamping device of claim 1, wherein a disassembly assembly is provided between the telescopic rod and the connecting disc, the disassembly assembly comprises a disassembly sleeve, a disassembly block is arranged inside the disassembly sleeve, and a threaded bolt is arranged on the surface of the disassembly sleeve.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320522564.6U CN219543449U (en) | 2023-03-17 | 2023-03-17 | Integrated circuit processing surface stamping device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320522564.6U CN219543449U (en) | 2023-03-17 | 2023-03-17 | Integrated circuit processing surface stamping device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219543449U true CN219543449U (en) | 2023-08-18 |
Family
ID=87705661
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320522564.6U Active CN219543449U (en) | 2023-03-17 | 2023-03-17 | Integrated circuit processing surface stamping device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219543449U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117444055A (en) * | 2023-11-22 | 2024-01-26 | 广东奥金精密科技有限公司 | Automatic stamping device of spring production |
-
2023
- 2023-03-17 CN CN202320522564.6U patent/CN219543449U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117444055A (en) * | 2023-11-22 | 2024-01-26 | 广东奥金精密科技有限公司 | Automatic stamping device of spring production |
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