CN219533317U - Detection equipment for large-plate wafer - Google Patents
Detection equipment for large-plate wafer Download PDFInfo
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- CN219533317U CN219533317U CN202320239745.8U CN202320239745U CN219533317U CN 219533317 U CN219533317 U CN 219533317U CN 202320239745 U CN202320239745 U CN 202320239745U CN 219533317 U CN219533317 U CN 219533317U
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- wafer
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- pressing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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Abstract
A large-plate wafer detection device; the supporting plate component is used for bearing and fixing the large-plate wafer and has a reset function after being pressed down; the supporting plate moving assembly is used for realizing X-axis movement of the large-plate wafer; the pressing component is used for pressing the large plate wafer and imaging; the wafer probe is arranged right below the pressing component and is used for connecting with a wafer PAD test point to realize a test function; the workbench is used for supporting equipment and axially positioning the large-plate wafer; the support plate assembly is precisely fixed on the support plate moving assembly through the support plate positioning sliding block, the support plate moving assembly axially moves on the sliding rail through the support plate positioning sliding block, and the sliding rail is arranged at the upper end and the lower end of the wafer probe; the supporting plate moving assembly is used for positioning the position of the large plate wafer through the positioning assembly and the positioning hole of the workbench; the pressing component is fixed at the middle end of the device, after the large-plate wafer is fixed at the corresponding position, the pressing plate is pressed onto the large-plate wafer through a push-pull rod of the pressing component, and the PAD test point at the bottom of the large-plate wafer is contacted with the wafer probe.
Description
Technical Field
The utility model relates to the field of capacitive sensors, in particular to detection equipment for a large-plate wafer.
Background
In the production process of fingerprint sensors, the fingerprint sensors are usually concentrated on a large-plate wafer, and after all the fingerprint sensors on the large-plate wafer are produced, each fingerprint sensor needs to be detected, and the good products, the good products and the bad products of the fingerprint sensors are distinguished. The traditional detection method is to detect PAD detection sites on the fingerprint sensor one by one through equipment, so that the detection time is long, and in the long-time detection process, the manual operation easily causes error leakage detection.
Disclosure of Invention
In order to realize the mass inspection of large-plate wafers, improve the inspection efficiency and avoid the error leakage detection caused by manual inspection of the wafers, the utility model adopts the following technical scheme:
the equipment for detecting the large-plate wafer comprises a supporting plate assembly, a supporting plate moving assembly, a pressing assembly, a wafer probe and a workbench;
the supporting plate component is mainly used for bearing and fixing a large-plate wafer and has a reset function after being pressed down; the support plate component comprises a wafer support plate and a spring support plate, the spring support plate is arranged under the wafer support plate, the spring support plate and the support plate component are connected into a whole through guide columns in a penetrating way, springs are arranged on the guide columns, one ends of the springs are abutted against the support plate component, and the other ends of the springs are abutted against the spring support plate;
the supporting plate moving assembly is mainly used for realizing X-axis movement of a large-plate wafer; the supporting plate moving assembly comprises a supporting plate positioning sliding block and two sliding rails, and the position of the wafer supporting plate is fixed after the supporting plate positioning sliding block is detachably connected with the supporting plate assembly; the wafer supporting plate comprises a supporting plate positioning slide block, an X axial positioning assembly, a workbench, two slide rails, a wafer supporting plate and a wafer supporting plate, wherein the supporting plate positioning slide block is arranged on the slide rails and slides on the slide rails;
the pressing component is mainly used for pressing the large-plate wafer and imaging; the pressing component comprises a bracket, a push-pull rod, a guide post, a horizontal support plate and a fake finger pressing block; the support is arranged beside the wafer supporting plate, a push-pull rod is arranged at the top end of the horizontal supporting plate, and is connected with the fake finger pressing block after penetrating through the horizontal supporting plate through the guide post, and the fake finger pressing block is positioned right above the wafer supporting plate;
the wafer probe is mainly used for connecting with a wafer PAD test point to realize a test function; the wafer probe is arranged on the workbench and is arranged right below the wafer supporting plate;
the workbench is mainly used for supporting equipment and axially positioning a large-plate wafer.
The support plate assembly is precisely fixed on the support plate moving assembly through the support plate positioning sliding block, the support plate moving assembly axially moves on the sliding rail through the support plate positioning sliding block, and the sliding rail is arranged at the upper end and the lower end of the wafer probe; the supporting plate moving assembly positions the corresponding positions of the large plate wafers through the X-axis positioning assembly and the positioning holes of the workbench; the pressing component is fixed at the middle end of the device, after the large-plate wafer is fixed at the corresponding position, the pressing plate is pressed onto the large-plate wafer through a push-pull rod of the pressing component, and the PAD test point at the bottom of the large-plate wafer is contacted with the wafer probe.
The pressing assembly further comprises a plurality of rubber pressure heads arranged on each pressing strip of the two pressing strips, the plurality of rubber pressure heads are distributed at equal intervals and on the same straight line, the two pressing strips are symmetrically arranged on two sides of the fake finger pressing block, rubber pressure head grooves corresponding to the positions of the rubber pressure heads are formed in the wafer supporting plates, and the rubber pressure heads are arranged in the rubber pressure head grooves.
The wafer supporting plate is clamped in the supporting plate positioning sliding block which is -shaped, and the supporting plate positioning sliding block is arranged on the sliding rail; the X-axis positioning assembly is a positioning clamp needle, the positioning clamp needle is arranged on the supporting plate positioning slide block along the vertical direction, a plurality of positioning holes are formed in the workbench, and the positioning holes are distributed along the sliding direction of the sliding rail and correspond to the positions of the large-plate wafer test points.
The workbench is provided with a plurality of positioning holes, the positioning holes are distributed along the sliding direction of the sliding rail, and the positioning clamp pins are inserted into the positioning holes to limit the positions of the large-plate wafers on the sliding rail.
The wafer supporting plate is provided with a large plate wafer groove, the large plate wafer is arranged in the large plate wafer groove, the large plate wafer groove is provided with a plurality of test holes, the test holes correspond to PAD test point positions at the bottom of the large plate wafer one by one, the rotary lock catch is arranged on the wafer supporting plate, and the rotary lock catch is used for locking and fixing the large plate wafer.
In summary, the utility model has the following advantages: the device can realize simultaneous testing of a plurality of wafers, namely 8 wafers at most, and has simple detection operation process and low equipment cost.
Drawings
FIG. 1 is a schematic diagram of a large-plate wafer inspection apparatus;
FIG. 2 is a right side view of a large plate wafer inspection apparatus;
FIG. 3 is a schematic diagram of a large plate wafer;
FIG. 4 is an enlarged schematic view of the partial structure of FIG. 1A;
FIG. 5 is a left side view of a large plate wafer inspection apparatus;
FIG. 6 is a schematic view of the structure of a tray in a large-plate wafer inspection apparatus;
reference numerals:
1, a large plate wafer; a 101PAD test point;
2 a pallet assembly; 201 test wells; 202 large plate wafer grooves; 203 rotating the lock catch; 204 spring pallets; 205 guide posts; 206 wafer pallet;
3, a supporting plate positioning sliding block; 301 positioning a card pin;
4, positioning holes;
5, pressing down the assembly; 501 a horizontal support plate; 502 a bracket; 503 guide posts; 504 rubber indenter; 505 layering; 506 a push-pull rod;
6, a workbench;
7, a wafer probe;
8, sliding rails;
9 artificial finger press block
Detailed Description
The utility model is further described below with reference to fig. 1 to 6.
The detection equipment for the large-plate wafer comprises a supporting plate assembly 2, a supporting plate moving assembly, a pressing assembly 5, a wafer probe 7 and a workbench 6;
the supporting plate component 2 is used for bearing and fixing the large-plate wafer 1 and has a reset function after being pressed down; the supporting plate component 2 comprises a wafer supporting plate 206, a spring supporting plate and a rotary lock catch 203, a large plate wafer groove 202 is formed in the supporting plate, the large plate wafer 1 is arranged in the large plate wafer groove 202, a plurality of test holes 201 are formed in the large plate wafer groove 202, the test holes 201 correspond to PAD test point positions at the bottom of the large plate wafer 1 one by one, the rotary lock catch 203 is arranged on the supporting plate, and the rotary lock catch 203 locks and fixes the large plate wafer 1, so that the functions of bearing and locking and fixing the large plate wafer 1 are achieved. The spring support plate 204 is arranged right below the wafer support plate, the spring support plate 204 and the wafer support plate 206 are connected into a whole through guide columns in a penetrating way, springs are installed on the guide columns 205, one ends of the springs are abutted against the wafer support plate 206, and the other ends of the springs are abutted against the spring support plate 204.
The quality of the large-plate wafer 1 can be detected after the wafer probe 7 is connected with the PAD detection site 101 at the bottom of the large-plate wafer, the wafer probe 7 is installed on the workbench 6, and the wafer probe 7 is arranged under the pressing component 5;
in order to realize the detection of the contact between the supporting plate component 2 and the wafer probe 7 below and the reset function after the pressing of the supporting plate component 2, a pressing component 5 is arranged, wherein the pressing component 5 comprises a horizontal supporting plate 501, a bracket 502, a guide pillar 503, a rubber pressing head 504, a pressing strip 505, a push-pull rod 506 and a fake finger pressing block 9, the bracket 502 is arranged beside the wafer supporting plate 206, the push-pull rod 506 is arranged at the top end of the horizontal supporting plate 501, and the push-pull rod 506 penetrates through the horizontal supporting plate 501 through the guide pillar 503 and is connected with the fake finger pressing block 9, and the fake finger pressing block 9 is positioned right above the wafer supporting plate 206; the rubber pressure head 504, the pressing bar 505 and the artificial finger pressing block 9 are lifted and pressed down by pushing and pulling back and forth through the push-pull rod 506; the supporting plate assembly 2 is assembled with the guide post 205 and the spring through the spring supporting plate 204 and the supporting plate, and the elastic function of the spring is utilized to realize the reset function of the supporting plate after being pressed; namely, the pressing component 5 presses down to enable the large-plate wafer 1 and the supporting plate to press down, the push-pull rod 506 is pushed to the bottom, the PAD test point 101 at the bottom of the large-plate wafer 1 is contacted with the wafer probe 7, the equipment starts to detect, the push-pull rod 506 is pulled to reset after the detection is finished, and the large-plate wafer 1 and the supporting plate are lifted up again to reset under the condition of no stress due to the spring, and are not contacted with the wafer probe 7 any more. The fake finger pressing block 9 is provided with a fake finger, and the fake finger is pressed down to the top surface of the large-plate crystal dome to start testing and drawing. Because the area of the large-plate wafer 1 is large, in order to uniformly bear force when the large-plate wafer 1 is pressed down, a pressing bar assembly is arranged on the pressing bar assembly 5, and the pressing bar assembly comprises 2 long pressing bars 505 and a plurality of rubber pressing heads 504. The plurality of rubber pressure heads 504 are fixedly arranged on the pressing strips 505 at equal intervals and distributed on the same straight line, the two pressing strips 505 are symmetrically arranged on two sides of the fake finger pressing block 9, the wafer supporting plate 206 is provided with rubber pressure head grooves corresponding to the positions of the rubber pressure heads 504, and the rubber pressure heads 504 are arranged in the rubber pressure head grooves.
The pressing fixation and the uniform stress of the transverse side edges of the large-plate wafer are realized.
The pressing component 5 presses the large-plate wafer 1 down, so that detection of the PAD test points 101 of a group of fingerprint sensors at the bottom of the large-plate wafer is completed, and in order to enable the pallet component 2 to move to realize detection of the PAD test points 101 of a next group of fingerprint sensors in the large-plate wafer, a pallet moving component is arranged to move the pallet component 2 and further move the large-plate wafer. The pallet moving assembly comprises 4 pallet positioning slide block assemblies 3 and two groups of slide rails 8; each group of sliding rails 8 are arranged on the workbench 6, two sliding rails are symmetrically distributed on two sides of the wafer supporting plate respectively, wherein the supporting plate positioning sliding block assembly 3 is -shaped, the spring supporting plate and the supporting plate moving assembly are clamped in the supporting plate positioning sliding block assembly 3, and the supporting plate positioning sliding block assembly 10 is arranged on the sliding rails of the sliding rails 8. In order to limit the position of the pallet positioning slide block assembly 3 on the slide rail 8, the positioning clamp needle 301 is mounted on the pallet positioning slide block assembly 3, the workbench 6 is provided with a plurality of positioning holes 4, the positioning holes 4 are distributed along the sliding direction of the slide rail 8 and correspond to the positions of the test points of the large-plate wafer, and the positioning clamp needle 301 is inserted into the positioning hole 4 to limit the position of the pallet positioning slide block assembly 3 on the slide rail 8.
The working flow of the device is as follows: the large-plate wafer is placed in a large-plate wafer groove, the large-plate wafer is locked and fixed through a rotary lock catch, a supporting plate and a spring supporting plate 503 are clamped in a supporting plate positioning sliding block assembly 10 in a positioning assembly, the supporting plate positioning sliding block assembly 10 slides on a sliding rail 8, when the position of a positioning hole 4 is reached, a positioning clamping needle 301 is inserted into the positioning hole 4 to finish positioning, a push-pull rod 506 is pushed to enable a pressing bar 505 assembly and a fake finger pressing block 9 to be pressed on the large-plate wafer, after the push-pull rod 506 is pressed to the bottom, a PAD test point of the large-plate wafer 1 is contacted with a wafer probe 7 to start testing, after the testing is finished, the push-pull rod 506 is lifted, then the positioning clamping needle 301 is pulled out to slide an X-axis positioning assembly 3 to the next positioning hole 4, and the positioning clamping needle 301 is inserted into the hole to start testing of a next group of PAD test sites; repeating the above operation until all PAD test sites are tested.
In summary, the utility model has the following advantages: the device can realize simultaneous testing of a plurality of wafers, namely 8 wafers at most, and has simple detection operation process and low equipment cost.
It is to be understood that the foregoing detailed description of the utility model is merely illustrative of the utility model and is not limited to the embodiments of the utility model. It will be understood by those of ordinary skill in the art that the present utility model may be modified or substituted for elements thereof to achieve the same technical effects; as long as the use requirement is met, the utility model is within the protection scope of the utility model.
Claims (5)
1. The detection equipment for the large-plate wafer is characterized by comprising a supporting plate assembly, a supporting plate moving assembly, a pressing assembly, a wafer probe and a workbench;
the support plate assembly comprises a wafer support plate and a spring support plate, the spring support plate is arranged under the wafer support plate, the spring support plate and the support plate assembly are connected into a whole through a guide post in a penetrating way, a spring is installed on the guide post, one end of the spring is abutted against the support plate assembly, and the other end of the spring is abutted against the spring support plate;
the supporting plate moving assembly comprises a supporting plate positioning sliding block and two sliding rails, and the supporting plate positioning sliding block is connected with the wafer supporting plate and used for the position of the wafer supporting plate; the support plate positioning slide block is arranged on the slide rail and slides on the slide rail, an X axial positioning component is arranged on the support plate positioning slide block, the X axial positioning component is connected with the workbench and then limits the position of the support plate positioning slide block, the two slide rails are arranged on the workbench, and the two slide rails are symmetrically distributed on two sides of the wafer support plate respectively;
the pressing component comprises a bracket, a push-pull rod, a guide post, a horizontal support plate and a fake finger pressing block; the support is erected beside the wafer supporting plate, a push-pull rod is arranged at the top end of the horizontal supporting plate, the push-pull rod penetrates through the horizontal supporting plate through a guide pillar and then is connected with the fake finger pressing block, and the fake finger pressing block is positioned right above the wafer supporting plate;
the wafer probe is arranged on the workbench and arranged right below the wafer supporting plate and used for connecting with a wafer PAD test point to realize a test function.
2. The device for detecting the large-plate wafer according to claim 1, wherein the pressing assembly further comprises two pressing strips, a plurality of rubber pressing heads are arranged on each pressing strip, the plurality of rubber pressing heads are distributed at equal intervals and on the same straight line, the two pressing strips are symmetrically arranged on two sides of the fake finger pressing block, rubber pressing head grooves corresponding to the positions of the rubber pressing heads are formed in the wafer supporting plate, and the rubber pressing heads are arranged in the rubber pressing head grooves.
3. The large-plate wafer detection device according to claim 1, wherein the supporting plate positioning slide block is -shaped, the wafer supporting plate is clamped in the supporting plate positioning slide block, and the supporting plate positioning slide block is mounted on the sliding rail; the X-axis positioning assembly is a positioning clamp needle, the positioning clamp needle is arranged on the supporting plate positioning slide block along the vertical direction, a plurality of positioning holes are formed in the workbench, and the positioning holes are distributed along the sliding direction of the sliding rail and correspond to the positions of the large-plate wafer test points.
4. The apparatus for inspecting a large wafer as set forth in claim 3, wherein the table is provided with a plurality of positioning holes, the plurality of positioning holes are distributed along the sliding direction of the sliding rail, and the positioning pins are inserted into the positioning holes to define the position of the large wafer on the sliding rail.
5. The device for detecting a large-plate wafer according to claim 1, wherein the wafer supporting plate is provided with a large-plate wafer groove, the large-plate wafer is arranged in the large-plate wafer groove, the large-plate wafer groove is provided with a plurality of test holes, the test holes are in one-to-one correspondence with PAD test point positions at the bottom of the large-plate wafer, the rotating lock catch is mounted on the wafer supporting plate, and the rotating lock catch is used for locking and fixing the large-plate wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320239745.8U CN219533317U (en) | 2023-02-17 | 2023-02-17 | Detection equipment for large-plate wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320239745.8U CN219533317U (en) | 2023-02-17 | 2023-02-17 | Detection equipment for large-plate wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219533317U true CN219533317U (en) | 2023-08-15 |
Family
ID=87644724
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320239745.8U Active CN219533317U (en) | 2023-02-17 | 2023-02-17 | Detection equipment for large-plate wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219533317U (en) |
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2023
- 2023-02-17 CN CN202320239745.8U patent/CN219533317U/en active Active
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